CN105845206A - Flat cable used for computer display - Google Patents
Flat cable used for computer display Download PDFInfo
- Publication number
- CN105845206A CN105845206A CN201610185530.7A CN201610185530A CN105845206A CN 105845206 A CN105845206 A CN 105845206A CN 201610185530 A CN201610185530 A CN 201610185530A CN 105845206 A CN105845206 A CN 105845206A
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- CN
- China
- Prior art keywords
- copper foil
- flat cable
- foil layer
- insulating barrier
- computer monitor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/0045—Cable-harnesses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0861—Flat or ribbon cables comprising one or more screens
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- Insulated Conductors (AREA)
Abstract
The invention relates to a flat cable used for a computer display, and belongs to the computer connecting line technology field. The flat cable used for the computer display comprises a plurality of conductors, which are arranged at certain intervals; and an insulation layer, which is disposed on the peripheries of the conductors in a covered manner. The plurality of conductors and the insulation layer are used to form a cable main body, and the conductors comprises two grounding conductors disposed on the end parts, and a plurality of signal transmission conductors disposed between the two grounding conductors. The outer part of the cable main body is provided with a copper foil layer, and an insulation covering layer used for covering the copper foil layer. The grounding conductors are electrically connected with the copper foil layer, and the oxidation treatment of the copper foil layer can be carried out. The flat cable used for the computer display is advantageous in that the flexibility is good, and the shielding performance can be improved, and the electromagnetic leakage can be effectively prevented, and therefore the requirements of the display on the miniaturization performance, the thinning performance, and the flexibility performance can be satisfied.
Description
Technical field
The present invention relates to the technical field of computer connecting wires, show for computer it is more particularly related to a kind of
The flat cable of device and preparation technology thereof.
Background technology
Flat flexible cable, generally by insulant and very thin tin plating flat copper wire, by the novel number of pressing
According to cable, there is the advantage such as softness, flexible, thickness is thin, volume is little, connection is simple, convenient disassembly.Can arbitrarily select wire
Number and spacing, make line more convenient, greatly reduces the volume of electronic product, reduces production cost, improves production efficiency, the suitableeest
It is used together in the signal transmission cable between electronic equipment or circuit board, is especially suitable for being applied to complexity and/or narrow space
And bend or the place of warpage.
As shown in CN101494096A, flexible cable can be laid with multiple be arrangeding in parallel generally according to being actually needed
Wire, and the spacing between wire is little；Although being arranged such so that line is convenient, reduce the volume of electronic product, but
Between parallel wire, noise can be overlapped mutually, consequently, it is possible to disturb the data transmission carried out in described wire；Additionally when flat
During flexible cable transmission signal, the electromagnetic wave of relative high frequency can be produced, other electronic device is also resulted in electromagnetic interference, for this
In prior art as shown in CN101494096A as, by conductive fabric by conductive pressure sensitive adhesive be attached to around wire exhausted
On edge material, this structure not only operates complexity.
Therefore, for drawbacks described above, it is necessary to above-mentioned technical pattern is improved, to make up the deficiencies in the prior art.
Summary of the invention
In order to solve technical problem present in prior art, it is an object of the invention to provide and a kind of show for computer
The flat cable of device.
In order to realize the foregoing invention purpose of the present invention, the invention provides techniques below scheme:
A kind of flat cable for computer monitor, has multiple conductors the most arranged in parallel and covers in institute
Stating the insulating barrier formed around multiple conductor, the plurality of conductor and insulating barrier and form cable stock, described conductor includes two
The individual earth lead being positioned at end, and multiple signal transmission wire between described earth lead, it is characterised in that: described
Cable stock is outside equipped with copper foil layer, and covers the insulating cover of described copper foil layer, and described earth lead is with described
Copper foil layer is electrically connected with, and described copper foil layer is through oxidation processes.
Wherein, at least one end face of described earth lead does not covers described insulating barrier, and this at least one end face with
Described copper foil layer is electrically connected with.
Wherein, the thickness of described copper foil layer is 10 ~ 50 μm, and preferably 10 ~ 30 μm, in the present invention when described copper foil layer
Thickness reach to can reach during more than 10 μm satisfied shield effectiveness, thus for economical reasons by described copper foil layer
Thickness is more preferably 10 ~ 15 μm.In order to give the associativity excellent with described insulating barrier, described Copper Foil is through comprising oxidation step
Surface process.
Wherein, in oxidizing solution, the Copper Foil after processing being carried out oxidation processes, described oxidizing solution is by 2-mercaptan
Base imidazoline, BTA, tetraethoxysilane, hydrogen peroxide, carbonate and water composition.Specifically, in the present invention,
Described oxidizing solution by the 2-mercapto imidazoline of 0.05 ~ 1.0wt%, the BTA of 0.01 ~ 0.10wt%, 0.50 ~
The tetraethoxysilane of 1.50wt%, the hydrogen peroxide of 1.0 ~ 20.0wt%, the carbonate of 1.0 ~ 10.0wt%, and the water group of surplus
Become.
Wherein, described copper foil layer for described cable stock provide electromagnetic shielding with prevent external electromagnetic signal interference and
The leakage of the electromagnetic wave produced by described conductor in suppression data transmission procedure.
Wherein, described insulating barrier is polybutylene terephthalate (PBT) (PBT) resin insulating barrier, polyphenylene sulfide (PPS) tree
Fat insulating barrier, polyethylene terephthalate (PET) resin insulating barrier or vistanex insulating barrier etc..
Compared with prior art, the method have the advantages that
The flat cable for computer monitor of the present invention is the most flexible good but also improves shielding and effectively prevents electromagnetism
Leakage such that it is able to meet the miniaturization of display, slimming even flexibility requirement.
Accompanying drawing explanation
Fig. 1 is the floor map of the flat cable for computer monitor of the present invention.
Fig. 2 is the cross sectional representation that the flat cable of Fig. 1 is crosscutting along A-A direction.
Detailed description of the invention
Flat cable for computer monitor of the present invention, generally include have be arranged on insulant in many
The cable stock of individual conductor, described insulant covers around the plurality of conductor and then forms the insulation of described cable stock
Layer.Described conductor includes two earth leads being positioned at end, and multiple signal transmission between described earth lead is led
Line.In the present invention, Copper Foil is attached on the insulating barrier of cable stock and makes the two combine closely by pressing, and without using
Adhesive glue etc. bond, and have passed through oxidation and Passivation Treatment for this most described Copper Foil.In the present invention, copper is passed through
The metallic shielding structure that layers of foil is formed, the electromagnetism that can not only prevent external electromagnetic signal from producing the signal in transmitting procedure is done
Disturb, but also can effectively suppress the electromagnetic wave leakage produced by conductor in signals transmission.
As shown in Figure 1-2, the flat cable for computer monitor provided by an embodiment of the invention
Structural representation.In this embodiment, described flexible cable mainly includes by insulant 1 with for transmitting the conductor of signal
The cable stock formed, described conductor arranges with many forms arranged side by side, and described conductor is usually used as holding wire and ground connection
Line uses, and described conductor such as can use annealed copper wire or tin plating annealed copper wire, and it can have circle, square or rectangle or base
This cross sectional shape in the form of sheets.As it is shown in figure 1, described conductor includes two earth leads 2 being positioned at end, and multiple it is positioned at institute
State the signal transmission wire 3 between earth lead 2.Described insulant covers and forms insulating barrier 2 around described conductor, and
One end surface of the most described earth lead 2 is not covered by described insulant, certainly as selection its two
Individual end all can not be covered by described insulant, but described signal transmission wire 3 covers in described insulant.As
Exemplarily, described insulant can be such as polyester material, polybutylene terephthalate (PBT) (PBT) resin insulating barrier,
Polyethylene terephthalate (PET) resin, can also select polyphenylene sulfide (PPS) resin insulating barrier in addition.Such as Fig. 1 institute
Showing, the two ends of described conductor are not covered to facilitate by insulant and are electrically connected to device, and the expose portion of described end conductor is
An anti-oxidation step of going forward side by side improves the electric property of its grafting, and the surface of its end can have antioxidation concurrently with plated with gold etc. and lead
The most excellent thin layer.Although as it is shown in figure 1, wire therein is side by side multiple, but according to concrete application or finally use
On the way, it may include more or less of conductor, if additionally needing described conductor can also be arranged to plurality of rows of form.
As in figure 2 it is shown, there is copper foil layer 4 insulating barrier 1 of described cable stock outer connection by pressing, and further
Described copper foil layer 4, in order to not use binding agent also to keep the caking property between described copper foil layer 4 and insulating barrier 1, described Copper Foil
Layer have passed through oxidation and Passivation Treatment；And described copper foil layer provides electromagnetic shielding to prevent external electromagnetic from believing for described cable stock
Number interference and suppress the leakage of the electromagnetic wave produced in data transmission procedure by described conductor.In the present invention when described copper
Paper tinsel is indulged the thickness of covering and is reached to can reach during more than 10 μm shielding requirements, thus for economical reasons by described copper foil layer
Thickness be preferably 10 ~ 15 μm, its thickness can certainly be chosen as more than 15 μm certainly, and its thickness can reach 50 μ
M, the effect not only revealed shielding or suppression signal when thickness reaches more than 50 μm is not notable, and may result in cable
Flexible reduce thus the most preferred.Owing at least one end surface of described earth lead is not covered by insulant, thus
Described earth lead can be formed good in electrical contact with described Copper Foil.The most described copper foil layer 4 periphery also sets up
Have cover layer 5, described cover layer 5, can be such as insulating exterior sheath its can form reinforcement structure, contribute to each parts
Keep in the assembled condition, and provide mechanics to protect, in addition can also the internal shield such as retained water steam and oxidizing gas knot
The erosion of structure.The flat cable for computer monitor of the present invention does not use binding agent to improve flexibility and enhances screen
Cover performance, reduce the loss of cable transmission, and improve the safety of signal transmission, there is good transmission characteristic；And
And disclosure satisfy that the miniaturization of computer monitor, slimming even flexibility requirement.
About copper foil layer
In the present invention, the Copper Foil that described copper foil layer uses is through oxidation processes, to improve the caking property of itself and insulating barrier, thus
Without the most additionally applying adhesive glue or binding agent.Before carrying out oxidation processes, if copper foil surface be attached with greasy dirt, Organic substance with
And first oxide-film etc. can carry out ungrease treatment, and activation processing can also be carried out alternatively with by the oxide-film of copper foil surface
The pretreatment removed；The most pretreated Copper Foil is carried out oxidation processes.About the method for defat, such as can be by having
The alkaline aqueous solutions such as machine solvent or sodium hydroxide are carried out.For the ease of comparing, as exemplarily, use table in the present invention
Surface roughness be 0.2 μm electrolytic copper foil as process object, this electrolytic copper foil is carried out in sodium hydrate aqueous solution alkali
Wash, wash subsequently；Then in dilute sulfuric acid, carry out activation processing.After pretreatment, in oxidizing solution to process after
Copper Foil carries out oxidation processes, and described oxidizing solution is by 2-mercapto imidazoline, BTA, tetraethoxysilane, peroxide
Change hydrogen, carbonate and water composition.Specifically, in the present invention, described oxidizing solution is by the 2-mercapto of 0.05 ~ 1.0wt%
Imidazoline, the BTA of 0.01 ~ 0.10wt%, the tetraethoxysilane of 0.50 ~ 1.50wt%, the peroxide of 1.0 ~ 20.0wt%
Change hydrogen, the carbonate of 1.0 ~ 10.0wt%, and the water composition of surplus.The temperature of oxidation processes is preferably 20 ~ 90 DEG C, further
It is preferably 30 ~ 80 DEG C, most preferably 30 ~ 60 DEG C；The process time is 10 ~ 60 minutes, and the time is preferably 10 ~ 30 minutes.
Embodiment 1
In the present embodiment, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then in concentration
Carrying out activation processing in the dilute sulfuric acid of 5wt%, the activation processing time is 10 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution is by the 2-mercapto imidazoline of 0.05wt%, the benzo three of 0.01wt%
Nitrogen azoles, the tetraethoxysilane of 1.0wt%, the hydrogen peroxide of 5.0wt%, the sodium carbonate of 5.0wt%, and the water composition of surplus.Oxidation
The temperature processed is 60 DEG C, and the process time is 15 minutes.
Embodiment 2
In the present embodiment, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then in concentration
Carrying out activation processing in the dilute sulfuric acid of 5wt%, the activation processing time is 10 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution is by the 2-mercapto imidazoline of 1.0wt%, benzo three nitrogen of 0.05wt%
Azoles, the tetraethoxysilane of 0.50wt%, the hydrogen peroxide of 10.0wt%, the sodium carbonate of 5.0wt%, and the water composition of surplus.Oxidation
The temperature processed is 40 DEG C, and the process time is 10 minutes.
Embodiment 3
In the present embodiment, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then in concentration
Carrying out activation processing in the dilute sulfuric acid of 5wt%, the activation processing time is 10 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution is by the 2-mercapto imidazoline of 0.10wt%, the benzo three of 0.02wt%
Nitrogen azoles, the tetraethoxysilane of 0.50wt%, the hydrogen peroxide of 1.0wt%, the sodium carbonate of 10.0wt%, and the water composition of surplus.Oxygen
The temperature that change processes is 50 DEG C, and the process time is 30 minutes.
Embodiment 4
In the present embodiment, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then 1wt%'s
Carrying out activation processing in hydrofluoric acid aqueous solution, the activation processing time is 5 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution is by the 2-mercapto imidazoline of 0.05wt%, the benzo three of 0.01wt%
Nitrogen azoles, the tetraethoxysilane of 1.0wt%, the hydrogen peroxide of 5.0wt%, the sodium carbonate of 5.0wt%, and the water composition of surplus.Oxidation
The temperature processed is 60 DEG C, and the process time is 15 minutes.
Embodiment 5
In the present embodiment, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then 1wt%'s
Carrying out activation processing in hydrofluoric acid aqueous solution, the activation processing time is 5 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution is by the 2-mercapto imidazoline of 1.0wt%, benzo three nitrogen of 0.08wt%
Azoles, the tetraethoxysilane of 0.50wt%, the hydrogen peroxide of 10.0wt%, the sodium carbonate of 5.0wt%, and the water composition of surplus.Oxidation
The temperature processed is 40 DEG C, and the process time is 10 minutes.
Embodiment 6
In the present embodiment, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then 1wt%'s
Carrying out activation processing in hydrofluoric acid aqueous solution, the activation processing time is 5 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution is by the 2-mercapto imidazoline of 0.10wt%, the benzo three of 0.01wt%
Nitrogen azoles, the tetraethoxysilane of 0.50wt%, the hydrogen peroxide of 1.0wt%, the sodium carbonate of 10.0wt%, and the water composition of surplus.Oxygen
The temperature that change processes is 50 DEG C, and the process time is 30 minutes.
Comparative example 1
In this comparative example, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then in concentration
Carrying out activation processing in the dilute sulfuric acid of 5wt%, the activation processing time is 10 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution is by the 2-mercapto imidazoline of 0.10wt%, the benzo three of 0.01wt%
Nitrogen azoles, the tetraethoxysilane of 0.50wt%, the hydrogen peroxide of 1.0wt%, and the water composition of surplus.The temperature of oxidation processes is 50
DEG C, the process time is 30 minutes.
Comparative example 2
In this comparative example, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then in concentration
Carrying out activation processing in the dilute sulfuric acid of 5wt%, the activation processing time is 10 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution is by the BTA of 0.01wt%, the tetraethoxy-silicane of 0.50wt%
Alkane, the hydrogen peroxide of 1.0wt%, the sodium carbonate of 10.0wt%, and the water composition of surplus.The temperature of oxidation processes is 50 DEG C, processes
Time is 30 minutes.
Comparative example 3
In this comparative example, use surface roughness be 0.2 μm, thickness be that the electrolytic copper foil of 10 μm carries out the process of following surface,
This electrolytic copper foil is carried out alkali cleaning in the sodium hydrate aqueous solution that concentration is 10wt%, washes subsequently；Then in concentration
Carrying out activation processing in the dilute sulfuric acid of 5wt%, the activation processing time is 10 minutes.After pretreatment, to process in oxidizing solution
After Copper Foil carry out oxidation processes, described oxidizing solution by 6-dithio octyl amino-1,3,5-triazines-2 of 0.10wt%,
4-bis-mercaptan, the BTA of 0.01wt%, the tetraethoxysilane of 0.50wt%, the hydrogen peroxide of 1.0wt%, and surplus
Water forms.The temperature of oxidation processes is 50 DEG C, and the process time is 30 minutes.
The Copper Foil sample that embodiment 1-6 and comparative example 1-3 are processed, temperature be 180 DEG C, pressure be the bar of 1.5MPa
Carry out pressing under part with PBT resin, PET resin, PPS resin, pressing processes 2 hours, then measures between Copper Foil and resin
Adhesion (peel strength), result is as shown in table 1.
Table 1 adhesion (unit N/mm)
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Comparative example 1 | Comparative example 2 | Comparative example 3 | |
| PBT | 0.83 | 0.87 | 0.83 | 0.82 | 0.85 | 0.86 | 0.33 | 0.26 | 0.33 |
| PET | 0.85 | 0.87 | 0.85 | 0.81 | 0.86 | 0.85 | 0.31 | 0.23 | 0.31 |
| PPS | 0.78 | 0.80 | 0.81 | 0.82 | 0.86 | 0.82 | 0.33 | 0.19 | 0.31 |
For the ordinary skill in the art, it should be understood that can without departing from the scope of the present disclosure, can
To use equivalent or equivalent transformation form to implement above-described embodiment.Protection scope of the present invention is not limited to specific embodiment party
The specific embodiment of formula part, as long as no the embodiment of disengaging invention essence, should be understood as at application claims
Protection domain within.
Claims (8)
1., for a flat cable for computer monitor, there are multiple conductors the most arranged in parallel and cover
The insulating barrier formed around the plurality of conductor, the plurality of conductor and insulating barrier form cable stock, and described conductor includes
Two earth leads being positioned at end, and multiple signal transmission wire between described earth lead, it is characterised in that: institute
State cable stock and be outside equipped with copper foil layer, and cover the insulating cover of described copper foil layer, and described earth lead and institute
Stating copper foil layer to be electrically connected with, described copper foil layer is through oxidation processes.
Flat cable for computer monitor the most according to claim 1, it is characterised in that: described earth lead is extremely
A few end face does not covers described insulating barrier, and this at least one end face is electrically connected with described copper foil layer.
Flat cable for computer monitor the most according to claim 1, it is characterised in that: the thickness of described copper foil layer
It is 10 ~ 50 μm.
Flat cable for computer monitor the most according to claim 3, it is characterised in that: right in oxidizing solution
Copper Foil after process carries out oxidation processes, and described oxidizing solution is by 2-mercapto imidazoline, BTA, tetraethoxy-silicane
Alkane, hydrogen peroxide, carbonate and water composition.
Flat cable for computer monitor the most according to claim 4, it is characterised in that: described oxidizing solution by
The 2-mercapto imidazoline of 0.05 ~ 1.0wt%, the BTA of 0.01 ~ 0.10wt%, the tetraethoxy-silicane of 0.50 ~ 1.50wt%
Alkane, the hydrogen peroxide of 1.0 ~ 20.0wt%, the carbonate of 1.0 ~ 10.0wt%, and the water composition of surplus.
Flat cable for computer monitor the most according to claim 5, it is characterised in that: the temperature of oxidation processes is
20 ~ 90 DEG C, the process time is 10 ~ 60 minutes.
Flat cable for computer monitor the most according to claim 1, it is characterised in that: described copper foil layer is described
Cable stock provides electromagnetic shielding to prevent the interference of external electromagnetic signal and to suppress in data transmission procedure by described conductor
The leakage of the electromagnetic wave produced.
Flat cable for computer monitor the most according to claim 1, it is characterised in that: described insulating barrier is for poly-right
Benzene dicarboxylic acid butanediol ester (PBT) resin insulating barrier, polyphenylene sulfide (PPS) resin insulating barrier, polyethylene terephthalate
(PET) resin insulating barrier or vistanex insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610185530.7A CN105845206B (en) | 2016-03-29 | 2016-03-29 | For the flat cable of computer monitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610185530.7A CN105845206B (en) | 2016-03-29 | 2016-03-29 | For the flat cable of computer monitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105845206A true CN105845206A (en) | 2016-08-10 |
| CN105845206B CN105845206B (en) | 2018-05-18 |
Family
ID=56584097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610185530.7A Expired - Fee Related CN105845206B (en) | 2016-03-29 | 2016-03-29 | For the flat cable of computer monitor |
Country Status (1)
| Country | Link |
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| CN (1) | CN105845206B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039120A (en) * | 2017-04-24 | 2017-08-11 | 郑州云海信息技术有限公司 | A kind of cable |
| WO2020187091A1 (en) * | 2019-03-20 | 2020-09-24 | 海信视像科技股份有限公司 | Ffc cable and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86103910A (en) * | 1986-06-02 | 1987-12-16 | 中国科学院金属腐蚀与防护研究所 | Surface passivation treatment method for copper and copper alloy |
| CN1344134A (en) * | 2000-09-21 | 2002-04-10 | 麦克德米德有限公司 | Method for increasing adhesion property of macromolecular material and metal surface |
| CN1674759A (en) * | 2000-07-27 | 2005-09-28 | 索尼化学株式会社 | Method for producing wiring board |
| CN101494096A (en) * | 2008-01-25 | 2009-07-29 | 莱尔德电子材料(深圳)有限公司 | Shielding flat flexible cable |
| CN203673854U (en) * | 2013-12-25 | 2014-06-25 | 博硕科技(江西)有限公司 | Flat cable |
-
2016
- 2016-03-29 CN CN201610185530.7A patent/CN105845206B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86103910A (en) * | 1986-06-02 | 1987-12-16 | 中国科学院金属腐蚀与防护研究所 | Surface passivation treatment method for copper and copper alloy |
| CN1674759A (en) * | 2000-07-27 | 2005-09-28 | 索尼化学株式会社 | Method for producing wiring board |
| CN1344134A (en) * | 2000-09-21 | 2002-04-10 | 麦克德米德有限公司 | Method for increasing adhesion property of macromolecular material and metal surface |
| CN101494096A (en) * | 2008-01-25 | 2009-07-29 | 莱尔德电子材料(深圳)有限公司 | Shielding flat flexible cable |
| CN203673854U (en) * | 2013-12-25 | 2014-06-25 | 博硕科技(江西)有限公司 | Flat cable |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039120A (en) * | 2017-04-24 | 2017-08-11 | 郑州云海信息技术有限公司 | A kind of cable |
| WO2020187091A1 (en) * | 2019-03-20 | 2020-09-24 | 海信视像科技股份有限公司 | Ffc cable and electronic device |
| CN111724930A (en) * | 2019-03-20 | 2020-09-29 | 海信视像科技股份有限公司 | FFC cable and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105845206B (en) | 2018-05-18 |
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