CN105828264A - Loudspeaker module - Google Patents
Loudspeaker module Download PDFInfo
- Publication number
- CN105828264A CN105828264A CN201610340407.8A CN201610340407A CN105828264A CN 105828264 A CN105828264 A CN 105828264A CN 201610340407 A CN201610340407 A CN 201610340407A CN 105828264 A CN105828264 A CN 105828264A
- Authority
- CN
- China
- Prior art keywords
- lower cover
- upper cover
- speaker module
- cover
- placing trough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The invention discloses a loudspeaker module. The loudspeaker module comprises an upper cover and a lower cover. A monomer is arranged in a mounting cavity which is composed of the upper cover and the lower cover; an FPCB (Flexible Printed Circuit Board) placing groove is arranged at one side of the lower cover; the placing groove is communicated with the mounting cavity through an entrance; the upside of the entrance is open; the FPCB after being wholly placed in the placing groove in a vertical manner is connected with the monomer; and the upper cover is provided with a limiting plate which corresponds to the entrance. Through the improvement, external shape design of an original loudspeaker module product can be kept, the assembling space can be enlarged, difficulty in operation can be reduced, and the yield of products can be increased.
Description
Technical field
The present invention relates to a kind of speaker module, the FPCB mounting structure being specifically related in speaker module.
Background technology
Speaker module (SPK) of the prior art, structure as shown in Figure 1 and Figure 2, is provided with monomer 2 including among the installation cavity that upper cover 1, lower cover 4, upper cover 1 and lower cover 4 combination are formed, and being connected with monomer 2 has FPCB3 (flexible PCB).In order to install FPCB3, lower cover 4 side is provided with placing trough 4-2, placing trough 4-2 and is connected with aforementioned installation cavity by gateway.In order to form a complete installation cavity, the housing of lower cover 4 remains one section of limiting plate 4-1 above this gateway, and one end of FPCB3 is inserted from gateway and is connected with monomer 2 among aforementioned installation cavity.
Owing to the combination of upper cover 1, lower cover 4 uses ultrasonic bonding, speaker module (SPK) has non-dismountable maintenance characteristic, the yields of FPCB3 determines the yields of speaker module, if FPCB3 existing defects, whole module will be caused to lose effectiveness and to become waste product, cause cost waste.
In speaker module (SPK) structure of the prior art, the shape of placing trough 4-2 adapts to FPCB3, size is narrow and small, after aforementioned installation cavity is inserted in gateway below limiting plate 4-1, the one end of FPCB3, just can be completely installed in placing trough 4-2.Existence due to limiting plate 4-1, installation process easily bumps against FPCB3, FPCB3 is caused to damage, and the FPCB3 designed can not arbitrarily change structure, because this can affect the preset function of speaker module, the function of speaker module and installation environment determine shape of product simultaneously and can not make an amendment again, cause the defects such as longer, cost waste in man-hour the most further.
Summary of the invention
For the problems referred to above of the prior art, it is an object of the invention to provide a kind of speaker module, have adjusted the FPCB mounting structure in speaker module, improve and convenience is installed, improve conforming product rate, reduce production cost.
To achieve these goals, the present invention is by the following technical solutions:
A kind of speaker module, including upper cover, lower cover, it is provided with monomer among the installation cavity that upper cover and lower cover combination are formed, described lower cover side is provided with FPCB placing trough, described placing trough is connected with described installation cavity by gateway, described gateway is arranged above open, and described more than FPCB under type entirety is connected with described monomer after putting in described placing trough, described on cover corresponding described setup of entrances and exits limited location plate.
Further, described upper cover and lower cover use buckle and draw-in groove clamping combination, described buckle and draw-in groove to arrange along the combination limit of described upper cover and lower cover, be separately positioned on upper cover and under cover.
Further, described buckle and draw-in groove are distributed in the whole combination limit of described upper cover and lower cover.
Further, described buckle and draw-in groove are some groups, and the combination limit along described upper cover and lower cover is arranged.
Further, the edge of described gateway, the edge of the corresponding described gateway of described limiting plate are disposed as arc edge.
Further, the edge at described placing trough upper opening is set to arc edge.
Further, described FPCB places in described placing trough after being connected with monomer.
The speaker module using said structure to arrange has the advantage that
The present invention makes the assembling mode of FPCB change by changing section structure, original insert the placement that lower cover structure is changed on vertical direction.Lower cover portion separation structure (that is: limiting plate) is transferred to upper cover, keeps and client's 3D Design consistency.
The structure of the present invention avoids when employee installs FPCB and is damaged, and simplifies operation easier, improves production efficiency, adds company competitiveness.
The structure operation space of the present invention increases, and Assembly Action simplifies, and operational risk reduces, and improves product reliability.
Accompanying drawing explanation
Fig. 1 is the exploded view of speaker module in prior art；
Fig. 2 is the axonometric chart of speaker module in prior art；
Fig. 3 is the partial enlarged view of Fig. 2；
Fig. 4 is the axonometric chart of speaker module of the present invention；
Fig. 5 is the partial enlarged view of Fig. 4.
In figure: 1. upper cover；1-1. limiting plate；2. monomer；3.FPCB；4. lower cover；4-1. limiting plate；4-2. placing trough.
Detailed description of the invention
In order to make the object, technical solutions and advantages of the present invention clearer, describe the present invention with specific embodiment below in conjunction with the accompanying drawings.
Embodiment 1
It is one of embodiment of the present invention as shown in Figure 4, Figure 5, in this embodiment, a kind of speaker module, being provided with monomer 2 including among the installation cavity that upper cover 1, lower cover 4, upper cover 1 and lower cover 4 combination are formed, lower cover 4 side is provided with FPCB3 placing trough 4-2, placing trough 4-2 is connected with installing cavity by gateway, gateway is arranged above open, and more than FPCB3 under type entirety is put into after in placing trough 4-2 and is connected with monomer 2, corresponding setup of entrances and exits limited location plate 1-1 on upper cover 1.
By above-mentioned improvement, the external shape of original speaker module product can be kept to design, increase assembling space, reduce operation easier, improve the yields of product.
Due to the restriction of unrestricted position plate 1-1, FPCB3 can place in placing trough 4-2 after being connected with monomer 2, facilitate assembling.
In this embodiment, upper cover 1 and lower cover 4 still can use ultrasonic bonding.
Embodiment 2
In this embodiment, upper cover and lower cover use buckle and draw-in groove clamping combination (not shown), buckle and draw-in groove to arrange along the combination limit of upper cover and lower cover, be separately positioned on upper cover and under cover.
Such design, buckle and draw-in groove specifically can be used to be distributed in the whole combination limit of upper cover and lower cover.
Can also use such design, buckle and draw-in groove is some groups, and the combination limit along upper cover and lower cover is arranged.
Embodiment 3
In this embodiment, the edge of gateway, the edge of limiting plate correspondence gateway are disposed as arc edge (not shown).
Edge at placing trough upper opening is set to arc edge (not shown).
By the design of arc edge, can preferably reduce the probability of the FPCB that wounds, it is easier to place FPCB, improve the yields of product further.
The foregoing is only embodiments of the present invention, be not intended to limit protection scope of the present invention.All made within the spirit and principles in the present invention any modification, equivalent substitution and improvement, extension etc., be all contained in protection scope of the present invention.
Claims (7)
1. a speaker module, including upper cover, lower cover, it is provided with monomer among the installation cavity that upper cover and lower cover combination are formed, described lower cover side is provided with FPCB placing trough, it is characterized in that, described placing trough is connected with described installation cavity by gateway, and described gateway is arranged above open, described more than FPCB under type entirety is connected with described monomer after putting in described placing trough, described on cover corresponding described setup of entrances and exits limited location plate.
Speaker module the most according to claim 1, it is characterised in that described upper cover and lower cover use buckle and draw-in groove clamping combination, described buckle and draw-in groove to arrange along the combination limit of described upper cover and lower cover, be separately positioned on upper cover and under cover.
Speaker module the most according to claim 2, it is characterised in that described buckle and draw-in groove are distributed in the whole combination limit of described upper cover and lower cover.
Speaker module the most according to claim 2, it is characterised in that described buckle and draw-in groove are some groups, the combination limit along described upper cover and lower cover is arranged.
Speaker module the most according to claim 1, it is characterised in that the edge of the corresponding described gateway of the edge of described gateway, described limiting plate is disposed as arc edge.
Speaker module the most according to claim 1, it is characterised in that the edge at described placing trough upper opening is set to arc edge.
Speaker module the most according to claim 1, it is characterised in that described FPCB places in described placing trough after being connected with monomer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610340407.8A CN105828264A (en) | 2016-05-20 | 2016-05-20 | Loudspeaker module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610340407.8A CN105828264A (en) | 2016-05-20 | 2016-05-20 | Loudspeaker module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105828264A true CN105828264A (en) | 2016-08-03 |
Family
ID=56530161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610340407.8A Withdrawn CN105828264A (en) | 2016-05-20 | 2016-05-20 | Loudspeaker module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105828264A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070010966A (en) * | 2005-07-20 | 2007-01-24 | 삼성전자주식회사 | Speaker module for portable terminal |
| CN201204675Y (en) * | 2008-05-16 | 2009-03-04 | 瑞声声学科技(常州)有限公司 | FPC connection type electro-acoustic transducer |
| CN101435929A (en) * | 2007-11-13 | 2009-05-20 | 胜华科技股份有限公司 | LCD device and frame |
| CN202799027U (en) * | 2012-07-31 | 2013-03-13 | 歌尔声学股份有限公司 | Loudspeaker module |
| CN203840537U (en) * | 2014-05-13 | 2014-09-17 | 歌尔声学股份有限公司 | Loudspeaker module set |
| CN204180225U (en) * | 2014-10-21 | 2015-02-25 | 汉得利（常州）电子股份有限公司 | Split buckling type vehicle loud speaker |
| CN104811856A (en) * | 2015-04-29 | 2015-07-29 | 歌尔声学股份有限公司 | Loudspeaker module |
-
2016
- 2016-05-20 CN CN201610340407.8A patent/CN105828264A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070010966A (en) * | 2005-07-20 | 2007-01-24 | 삼성전자주식회사 | Speaker module for portable terminal |
| CN101435929A (en) * | 2007-11-13 | 2009-05-20 | 胜华科技股份有限公司 | LCD device and frame |
| CN201204675Y (en) * | 2008-05-16 | 2009-03-04 | 瑞声声学科技(常州)有限公司 | FPC connection type electro-acoustic transducer |
| CN202799027U (en) * | 2012-07-31 | 2013-03-13 | 歌尔声学股份有限公司 | Loudspeaker module |
| CN203840537U (en) * | 2014-05-13 | 2014-09-17 | 歌尔声学股份有限公司 | Loudspeaker module set |
| CN204180225U (en) * | 2014-10-21 | 2015-02-25 | 汉得利（常州）电子股份有限公司 | Split buckling type vehicle loud speaker |
| CN104811856A (en) * | 2015-04-29 | 2015-07-29 | 歌尔声学股份有限公司 | Loudspeaker module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
|
| COR | Change of bibliographic data | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160803 |
|
| WW01 | Invention patent application withdrawn after publication |