CN105827216A - Device and method of automatically matching radio frequency impedance - Google Patents
Device and method of automatically matching radio frequency impedance Download PDFInfo
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- CN105827216A CN105827216A CN201610151688.2A CN201610151688A CN105827216A CN 105827216 A CN105827216 A CN 105827216A CN 201610151688 A CN201610151688 A CN 201610151688A CN 105827216 A CN105827216 A CN 105827216A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/28—Impedance matching networks
- H03H11/30—Automatic matching of source impedance to load impedance
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Abstract
The invention provides a device and a method of automatically matching radio frequency impedance. The automatic radio frequency impedance matching device comprises a first vacuum capacitor, a second vacuum capacitor, a first vacuum capacitor position signal transmitter, a second vacuum capacitor position signal transmitter, a single chip microcomputer, a first vacuum capacitor driving mechanism, a second vacuum capacitor driving mechanism, a power meter and a power signal transmitter. Through comparing sizes of reflection power of plasma loads before and after polar plate positions of the first vacuum capacitor and the second vacuum capacitor are adjusted in real time, the optimal value, that is, the minimal reflection power value, and corresponding polar plate positions of the first vacuum capacitor and the second vacuum capacitor are stored, the single chip microcomputer can instantly update a mathematical model, quick plasma load matching can be realized, overload of a radio frequency power supply can be avoided, and the optimized memory configuration is realized.
Description
Technical field
The present invention relates to microelectronics technology, based on historical data base optimal data and use univariate search technique particularly to one, update RF impedance automatic matching device and the method for historical data base optimal data mode simultaneously.
Background technology
In semiconductor preparing process, plasma is needed to realize stability contorting to ensure stablizing of preparation process.Existing plasma radiofrequency impedance matching network is mainly made up of two vacuum capacitances, and vacuum capacitance can adjust to change capacitance manually.Before plasma starter, due to the impedance of unpredictable load (plasma), therefore there will be load impedance and vacuum capacitance impedance mismatch, make the stability of plasma be difficult to control to.Existing solution is after plasma starter, the method using matched load manually, adjusts impedance and the load impedance of vacuum capacitance.But, this method of Matching and modification manually implements relatively difficult, and the optimum position that vacuum capacitance impedance is mated with load impedance is extremely difficult to；Meanwhile, mate manually and also cannot predict the impedance of load so that the speed of matched load is slow, match time is long, easily causes plasma unstable, and then affects technical process.
Summary of the invention
nullIn order to solve the problems such as the unpredictable optimum impedance point position of existing coupling RF impedance，The invention provides a kind of RF impedance automatic matching device one RF impedance automatic matching device，Including: the first vacuum condenser、Second vacuum condenser、First vacuum condenser position signalling transmitter、Second vacuum condenser position signalling transmitter、Single-chip microcomputer、First vacuum condenser drive mechanism、Second vacuum condenser drive mechanism、Energy meter and power signal transmitter，Wherein，Described first、The outfan of the second vacuum capacitance is respectively with described first、The input of the second vacuum condenser position signalling transmitter connects，Described first、The outfan of the second vacuum capacitance position signalling transmitter input with described single-chip microcomputer respectively is connected，The outfan of described single-chip microcomputer is respectively with described first、The input of the second vacuum condenser drive mechanism connects，Described first、The outfan of the second vacuum condenser drive mechanism is respectively with described first、The input of the second vacuum condenser connects，The input of described energy meter and first、The outfan of the second vacuum condenser connects，The outfan of described energy meter is connected with the input of described power signal transmitter，The outfan of described power signal transmitter is connected with the input of described single-chip microcomputer.
Preferably, also include showing control panel, be connected with the outfan of described single-chip microcomputer.
Preferably, also include inductance, connect with described first, second vacuum condenser, and be connected with the input of described energy meter.
Preferably, described first, second vacuum capacitance position signalling transmitter all includes absolute position encoder, axis connecting rod, and described absolute position encoder is connected by the outfan of described axis connecting rod with described first, second vacuum condenser.
Preferably, described first vacuum condenser drive mechanism, the second vacuum condenser drive mechanism are motor.
nullThe present invention also provides for a kind of RF impedance automatic matching method，The RF impedance automatic matching device used includes the first vacuum condenser、Second vacuum condenser、First vacuum condenser position signalling transmitter、Second vacuum condenser position signalling transmitter、Single-chip microcomputer、First vacuum condenser drive mechanism、Second vacuum condenser drive mechanism、Energy meter and power signal transmitter，Comprise the steps: global data scanning step，Described single-chip microcomputer sends drive command to described first、Second vacuum condenser drive mechanism，Described first、Second vacuum condenser drive mechanism drives described first、The pole plate of the second vacuum condenser moves，Described first、Second vacuum condenser position signalling transmitter is by described first、The polar plate position information of the second vacuum condenser is sent to described single-chip microcomputer，Simultaneously，Described power signal transmitter by gathered by described energy meter with described first、The reflection power value of the plasma load that the polar plate position of the second vacuum condenser is corresponding is sent to described single-chip microcomputer，Until completing the whole scan of the polar plate position of the polar plate position to the first vacuum capacitance capacitor and the second vacuum condenser；History optimal location determines step, the polar plate position of described first, second vacuum condenser and the reflection power value of plasma load are combined by described single-chip microcomputer, form data base to store, and the minimum first, second vacuum condenser polar plate position of the reflection power value that obtains plasma load is as history optimal location；RF impedance based on historical data coupling step, described single-chip microcomputer is using described history optimal location as control point, movement instruction is sent to described first, second vacuum condenser drive mechanism, the pole plate making described first, second vacuum condenser moves to described history optimal location, it is achieved RF impedance mates；And, RF impedance based on real time data coupling step, described single-chip microcomputer uses univariate search technique, obtains the polar plate position of described first, second vacuum condenser of the reflection power value minimum of real-time plasma load as real-time optimal location, it is achieved RF impedance mates.
Preferably, also include: database update step, the reflection power of described real-time optimal location and plasma load is updated to described data base.
Preferably, also include: start detecting step, detect whether history of existence global data, the most then it is directly entered described global data scanning step, if existing, then points out and whether open global data scan function, if selecting it is, then enter described global data scanning step, if you select No, then enter described RF impedance based on historical data coupling step.
Preferably, the step that described single-chip microcomputer uses univariate search technique to obtain real-time optimal location includes: described single-chip microcomputer sends movement instruction to described first vacuum condenser drive mechanism, described first vacuum condenser drive mechanism drives the pole plate of described first vacuum condenser to move along the former direction of motion from history optimal location, if the reflection power of described plasma load becomes big, the most described single-chip microcomputer sends the instruction stopping and changing the direction of motion to described first vacuum condenser drive mechanism；Described single-chip microcomputer sends movement instruction to described second vacuum condenser drive mechanism, described second vacuum condenser drive mechanism drives the pole plate of described second vacuum condenser to move along the former direction of motion from history optimal location, if the reflection power of plasma load becomes big, the most described single-chip microcomputer sends the instruction stopping and changing the direction of motion to described second vacuum condenser drive mechanism；And, whether the reflection power value of described single-chip microcomputer plasma load stops threshold value less than coupling judges, if the judgment is Yes, then terminates, if the judgment is No, then and repeat the above steps.
Preferably, described coupling stops threshold value and is set to carry out before RF impedance Auto-matching the 5%～10% of the reflection power value of plasma load.
Accompanying drawing explanation
Fig. 1 is the functional block diagram of RF impedance automatic matching device.
Fig. 2 is another functional block diagram of RF impedance automatic matching device.
Fig. 3 represents the first vacuum condenser position signalling structure of transmitter schematic diagram and annexation with the first vacuum condenser thereof.
Fig. 4 is the flow chart of RF impedance automatic matching method.
Fig. 5 is the flow chart using univariate search technique to obtain real-time optimal location.
Fig. 6 is another flow chart of RF impedance automatic matching method.
Fig. 7 is the flow chart that RF impedance automatic matching method includes an embodiment of start detecting step.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, it is to be understood that, specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.Described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
In describing the invention, it is to be understood that term term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include one or more this feature.
Further illustrate technical scheme below in conjunction with the accompanying drawings and by detailed description of the invention.According to an aspect of the present invention, it is provided that a kind of RF impedance automatic matching device.Figure 1 illustrates the functional block diagram of RF impedance automatic matching device, including: first vacuum condenser the 101, second vacuum condenser the 102, first vacuum condenser position signalling transmitter the 103, second vacuum condenser position signalling transmitter 104, single-chip microcomputer the 105, first vacuum condenser drive mechanism the 106, second vacuum condenser drive mechanism 107, energy meter 108 and power signal transmitter 109.
Wherein, the outfan of the first vacuum capacitance 101 and the input of the first vacuum capacitance position signalling transmitter 103 connect, and the outfan of the second vacuum capacitance 102 and the input of the second vacuum capacitance position signalling transmitter 104 connect.
The outfan of the first vacuum capacitance position signalling transmitter 103 is connected with the input of single-chip microcomputer 105, and the outfan of the second vacuum capacitance position signalling 104 transmitter is connected with the input of single-chip microcomputer 105.
The outfan of single-chip microcomputer 105 and the input of the first vacuum condenser drive mechanism 106 and the second vacuum condenser drive mechanism 107 connect.
The outfan of the first vacuum condenser drive mechanism 106 and the input of the first vacuum condenser 101 connect, and the outfan of the second vacuum condenser drive mechanism 107 and the input of the second vacuum condenser 102 connect.
The input of energy meter 108 and the outfan of the first vacuum condenser 101 and the second vacuum condenser 102 connect, the outfan of energy meter 108 is connected with the input of power signal transmitter 109, and the outfan of power signal transmitter 109 is connected with the input of single-chip microcomputer 105.
Preferably, RF impedance automatic matching device also includes showing that control panel, display control panel are connected with the outfan of single-chip microcomputer 105.Display control panel is for the real-time polar plate position showing first vacuum condenser the 101, second vacuum condenser 102 and the reflection power value of plasma load, and controls the first vacuum condenser drive mechanism 106 and the unlatching of the second vacuum condenser drive mechanism 107 or stopping by the human-computer interaction interface on display control panel.
In another embodiment of the invention, RF impedance automatic matching device also includes inductance 110, connects with the first vacuum condenser 101 and the second vacuum condenser 102, and is connected with the input of energy meter 108, as in figure 2 it is shown, for plasma load Matching and modification when wide variation.
In any of the above-described embodiment, preferably, first vacuum capacitance position signalling transmitter 103 includes absolute position encoder 1000, axis connecting rod 1001, absolute position encoder 1000 is connected with the outfan of the first vacuum condenser 101 by axis connecting rod 1001, figure 3 illustrates the first vacuum position signal transmitting device structural representation and annexation with the first vacuum condenser thereof.Equally, the second vacuum capacitance position signalling transmitter 104 also includes that absolute position encoder 1000, axis connecting rod 1001, absolute position encoder 1000 are connected with the outfan of the second vacuum condenser 102 by axis connecting rod 1001.Wherein, absolute position encoder such as can select 10 circle encoders, for recording the polar plate position of vacuum condenser.
In any of the above-described embodiment, the first vacuum condenser drive mechanism 106 and the second vacuum condenser drive mechanism 107 such as can select motor.
According to a further aspect in the invention, it is provided that a kind of RF impedance automatic matching method, specifically, as shown in Figure 4, it is achieved by the steps of.
nullGlobal data scanning step S1，Single-chip microcomputer 105 sends drive command to the first vacuum condenser drive mechanism 106 and the second vacuum condenser drive mechanism 107，First vacuum condenser drive mechanism 106 and the second vacuum condenser drive mechanism 107 drive the pole plate of the first vacuum condenser 101 and the second vacuum condenser 102 to move respectively，The polar plate position information of the first vacuum condenser 101 and the second vacuum condenser 102 is sent to single-chip microcomputer 105 by the first vacuum condenser position signalling transmitter 103 and the second vacuum condenser position signalling transmitter 104 respectively，Simultaneously，The reflection power value of plasma load corresponding for the polar plate position with the polar plate position of the first vacuum condenser 101 and the second vacuum condenser 102 gathered by energy meter 108 is sent to single-chip microcomputer 105 by power signal transmitter 109.
In the present embodiment, such as respectively the distance between the pole plate of first vacuum condenser the 101, second vacuum condenser 102 can be divided into 11 parts, respectively with C10～C110, C20～C210Sequentially labelling each position.Single-chip microcomputer 105 sends movement instruction to first vacuum condenser drive mechanism the 106, second vacuum condenser drive mechanism 107, the first vacuum condenser drive mechanism 106 is made to drive the pole plate of the first vacuum condenser 101, the second vacuum condenser drive mechanism 107 to drive the pole plate of the second vacuum condenser 102 to C10, C20Position, and record the reflection power value of the plasma load that this position is gathered by energy meter 108.Scanning sequency the most first keeps the polar plate position of the first vacuum condenser 101 constant, by the polar plate position of the second vacuum condenser 102 by C20Sequentially move to C210, record the reflection power value of position respectively, afterwards, by the polar plate position of the first vacuum condenser 101 along moving to position C11, repeat above-mentioned scanning process, by that analogy, until the polar plate position of the first vacuum condenser 101 moves to C110, the polar plate position of the second vacuum condenser 102 moves to C210, record the reflection power value of this position, complete whole scan.We will obtain a data set as follows after having scanned:
These are only exemplary illustration, but the present invention is not limited to this, distance between first, second vacuum condenser pole plate can also be divided into tens or up to a hundred parts the most as required, or can also be the length of pole plate or width are divided into equal proportion many parts, or can also be the segmentation etc. of inequality proportion, in a word, as long as can realize distinguishing first, second vacuum condenser pole plate location by segmentation.Alternatively, it is also possible to first drive the first vacuum condenser, keeping the invariant position of the second vacuum condenser, after the pole plate of the first vacuum condenser travels through each cut-point, the polar plate position of the second vacuum condenser being moved to next cut-point, until completing whole scan.It is of course also possible to be other suitable modes, as long as be capable of the whole scan of the polar plate position of the polar plate position to the first vacuum condenser and the second vacuum condenser.
History optimal location determines step S2, the reflection power value of the first vacuum condenser 101 and the position of the second vacuum condenser 102 and plasma load is combined by single-chip microcomputer 105, form data base to store, and obtain the first vacuum condenser 101 of the reflection power value minimum of plasma load and the pole plate location of the second vacuum condenser 102 as history optimal location.
RF impedance based on historical data coupling step S3, single-chip microcomputer 105 is using above-mentioned history optimal location as control point, movement instruction is sent to the first vacuum condenser drive mechanism 106 and the second vacuum condenser drive mechanism 107, make the pole plate of the first vacuum condenser 101 and the pole plate of the second vacuum condenser 102 move to above-mentioned history optimal location, thus realize RF impedance coupling.
RF impedance based on real time data coupling step S4, single-chip microcomputer 105 uses univariate search technique, when obtaining the reflection power value minimum of real-time plasma load, the pole plate location of the first vacuum condenser 101 and the second vacuum condenser 102 is as real-time optimal location, it is achieved RF impedance mates.
Wherein, single-chip microcomputer 105 uses univariate search technique to obtain the step of real-time optimal location, as it is shown in figure 5, specifically include: step S41, single-chip microcomputer 105 sends movement instruction to the first vacuum condenser drive mechanism 106；Step S42, the first vacuum condenser drive mechanism 106 drives the pole plate of the first vacuum condenser 101 to move along the former direction of motion from history optimal location；Step S43, whether the reflection power of single-chip microcomputer 105 plasma load increases judges, if the judgment is Yes, then enters step S44, if the judgment is No, then returns step S41；Step S44, single-chip microcomputer 105 sends the instruction stopping and changing the direction of motion to the first vacuum condenser drive mechanism 106；Step S45, single-chip microcomputer 105 sends movement instruction to the second vacuum condenser drive mechanism 107；Step S46, the second vacuum condenser drive mechanism 107 drives the pole plate of the second vacuum condenser 102 to move along the former direction of motion from history optimal location；Step S47, whether the reflection power of single-chip microcomputer 105 plasma load increases judges, if the judgment is Yes, then enters step S48, if the judgment is No, then returns step S45；Step S48, single-chip microcomputer 105 sends the instruction stopping and changing the direction of motion to the second vacuum condenser drive mechanism 107；And step S49, whether the reflection power value of single-chip microcomputer 105 plasma load stops threshold value less than coupling judges, if the judgment is Yes, then terminates coordinate rotation, if the judgment is No, then repeat the above steps.Wherein, coupling stop threshold value such as can being set to the plasma load before carrying out RF impedance Auto-matching reflection power value 5%～10%.Can certainly be set according to the actual requirements by user.
Preferably, in another embodiment of the invention, as shown in Figure 6, also include database update step S5, the reflection power of real-time optimal location and plasma load is updated to data base.
Preferably, in any of the above-described embodiment of the present invention, also include the detecting step S6 that starts shooting, device power starts, detecting whether history of existence global data, if not existing, being then directly entered global data scanning step S1, if existing, then pointing out and whether open global data scan function, if selecting being, then enter global data scanning step S1, if you select No, then RF impedance based on historical data coupling step S3 is entered.Figure 7 illustrates the flow chart of one of them embodiment.
According to the present invention, can by compare in real time the polar plate position of first, second vacuum condenser before adjustment with adjust after the reflection power size of plasma load, and the polar plate position of first, second vacuum condenser of the value of optimal storage i.e. reflection power value minimum and correspondence, so that monolithic function immediate updating load mathematical model, and find the Optimum Matching point of load in advance, the foundation of vacuum capacitance size is adjusted in this, as next time before starting, it is achieved thereby that the Rapid matching of plasma load.
The present invention utilizes the optimal value information of plasma reflection power historical data to determine the vacuum capacitance direction of motion, not by phase signal, the interference of frequency signal, makes adapter the most automatically to adjust and matches with plasma load, and speed is fast, degree of accuracy is high, make load stabilization in control.
It addition, radio-frequency power supply can be avoided to transship according to the present invention.Owing to the present invention uses the historical data optimal value of plasma reflection power directly to carry out decision-making, coupling not only speed of getting up is fast, and can be more rapidly by not match point, it is possible to protection radio-frequency power supply nonoverload.
It addition, the optimization collocation of internal memory can be realized according to the present invention.Make the data near match point more detailed owing to updating historical data optimal value near match point, modulate more accurate, rather than history data store amount at match point is little, internal memory is made to obtain optimized configuration: the place data amount needing storage information is big, it is not necessary to the place data amount of storage information is little.
The above; being only the detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, any those familiar with the art is in the technical scope that the invention discloses; the change that can readily occur in or replacement, all should contain within protection scope of the present invention.
Claims (10)
1. a RF impedance automatic matching device, it is characterised in that
Including:
First vacuum condenser, the second vacuum condenser, the first vacuum condenser position signalling transmitter, the second vacuum condenser position signalling transmitter, single-chip microcomputer, the first vacuum condenser drive mechanism, the second vacuum condenser drive mechanism, energy meter and power signal transmitter
Wherein, described first, the outfan of the second vacuum capacitance is respectively with described first, the input of the second vacuum condenser position signalling transmitter connects, described first, the outfan of the second vacuum capacitance position signalling transmitter input with described single-chip microcomputer respectively is connected, the outfan of described single-chip microcomputer is respectively with described first, the input of the second vacuum condenser drive mechanism connects, described first, the outfan of the second vacuum condenser drive mechanism is respectively with described first, the input of the second vacuum condenser connects, the input of described energy meter and first, the outfan of the second vacuum condenser connects, the outfan of described energy meter is connected with the input of described power signal transmitter, the outfan of described power signal transmitter is connected with the input of described single-chip microcomputer.
RF impedance automatic matching device the most according to claim 1, it is characterised in that
Also include showing control panel, be connected with the outfan of described single-chip microcomputer.
RF impedance automatic matching device the most according to claim 1, it is characterised in that
Also include:
Inductance, connects with described first, second vacuum condenser, and is connected with the input of described energy meter.
4. according to the RF impedance automatic matching device according to any one of claims 1 to 3, it is characterised in that
Described first, second vacuum capacitance position signalling transmitter all includes absolute position encoder, axis connecting rod, and described absolute position encoder is connected by the outfan of described axis connecting rod with described first, second vacuum condenser.
5. according to the RF impedance automatic matching device described in claim 4, it is characterised in that
Described first vacuum condenser drive mechanism, the second vacuum condenser drive mechanism are motor.
6. a RF impedance automatic matching method, the RF impedance automatic matching device used includes the first vacuum condenser, the second vacuum condenser, the first vacuum condenser position signalling transmitter, the second vacuum condenser position signalling transmitter, single-chip microcomputer, the first vacuum condenser drive mechanism, the second vacuum condenser drive mechanism, energy meter and power signal transmitter, it is characterized in that
Comprise the steps:
Global data scanning step, described single-chip microcomputer sends drive command to described first, second vacuum condenser drive mechanism, described first, second vacuum condenser drive mechanism drives described first, the pole plate of the second vacuum condenser moves, described first, second vacuum condenser position signalling transmitter is by described first, the polar plate position information of the second vacuum condenser is sent to described single-chip microcomputer, simultaneously, described power signal transmitter by gathered by described energy meter with described first, the reflection power value of the plasma load that the polar plate position of the second vacuum condenser is corresponding is sent to described single-chip microcomputer, until completing the whole scan of the polar plate position of the polar plate position to the first vacuum capacitance capacitor and the second vacuum condenser；
History optimal location determines step, the polar plate position of described first, second vacuum condenser and the reflection power value of plasma load are combined by described single-chip microcomputer, form data base to store, and the minimum first, second vacuum condenser polar plate position of the reflection power value that obtains plasma load is as history optimal location；
RF impedance based on historical data coupling step, described single-chip microcomputer is using described history optimal location as control point, movement instruction is sent to described first, second vacuum condenser drive mechanism, the pole plate making described first, second vacuum condenser moves to described history optimal location, it is achieved RF impedance mates；And,
RF impedance based on real time data coupling step, described single-chip microcomputer uses univariate search technique, obtain the polar plate position of described first, second vacuum condenser of the reflection power value minimum of real-time plasma load as real-time optimal location, it is achieved RF impedance mates.
RF impedance automatic matching method the most according to claim 6, it is characterised in that
Also include database update step, the reflection power of described real-time optimal location and plasma load is updated to described data base.
8. according to the RF impedance automatic matching method described in claim 6 or 7, it is characterised in that before described global data scanning step, also include:
Start detecting step, detect whether history of existence global data, if it is empty, then it is directly entered described global data scanning step, if existing, then points out and whether open global data scan function, if selecting it is, then enter described global data scanning step, if you select No, then enter described RF impedance based on historical data coupling step.
9. according to the RF impedance automatic matching method described in claim 6 or 7, it is characterised in that
The step that described single-chip microcomputer uses univariate search technique to obtain real-time optimal location includes:
Described single-chip microcomputer sends movement instruction to described first vacuum condenser drive mechanism, described first vacuum condenser drive mechanism drives the pole plate of described first vacuum condenser to move along the former direction of motion from history optimal location, if the reflection power of described plasma load becomes big, the most described single-chip microcomputer sends the instruction stopping and changing the direction of motion to described first vacuum condenser drive mechanism；
Described single-chip microcomputer sends movement instruction to described second vacuum condenser drive mechanism, described second vacuum condenser drive mechanism drives the pole plate of described second vacuum condenser to move along the former direction of motion from history optimal location, if the reflection power of plasma load becomes big, the most described single-chip microcomputer sends the instruction stopping and changing the direction of motion to described second vacuum condenser drive mechanism；And,
Whether the reflection power value of described single-chip microcomputer plasma load stops threshold value less than coupling judges, if the judgment is Yes, then terminates, if the judgment is No, then and repeat the above steps.
RF impedance automatic matching method the most according to claim 9, it is characterised in that
Described coupling stops threshold value and is set to carry out before RF impedance Auto-matching the 5%～10% of the reflection power value of plasma load.
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| CN110400734B (en) * | 2018-04-24 | 2022-02-01 | 新动力等离子体株式会社 | Automatic matching method for virtual resistor |
| CN112994416A (en) * | 2021-04-25 | 2021-06-18 | 成都沃特塞恩电子技术有限公司 | Power output method, power output device, electronic equipment and storage medium |
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