CN105826485A - Flexible environmentally sensitive electronic device package - Google Patents
Flexible environmentally sensitive electronic device package Download PDFInfo
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- CN105826485A CN105826485A CN201510489470.3A CN201510489470A CN105826485A CN 105826485 A CN105826485 A CN 105826485A CN 201510489470 A CN201510489470 A CN 201510489470A CN 105826485 A CN105826485 A CN 105826485A
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- pliability
- electronic element
- sensitive electronic
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- environmental sensitive
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- 230000007613 environmental effect Effects 0.000 claims description 76
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- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
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- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 238000005401 electroluminescence Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
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- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a flexible environment sensitive electronic element package, which comprises a flexible electronic element, a thin film packaging layer and a sealing structure. The film packaging layer covers the flexible electronic element, and the sealing structure covers the film packaging layer and the flexible electronic element. The sealing structure comprises a first part and a second part, wherein the first part covers the flexible electronic element and the thin film packaging layer, and the second part covers the first part. The Young's modulus of the second portion is between 0 and 100MPa, while the Young's modulus of the first portion is greater than that of the second portion, and the thickness of the first portion is less than that of the second portion.
Description
Technical field
The present invention relates to a kind of pliability environmental sensitive electronic element encapsulation, and particularly relate to a kind of pliability environmental sensitive electronic element encapsulation that can take into account flexural property and vapor barrier properties.
Background technology
Along with in electronic product, element design is increasingly accurate, the demand for the barrier ability of aqueous vapor/oxygen promotes the most therewith.As a example by organic electroluminescent element, owing to organic electroluminescent element is the most sensitive with the infiltration of oxygen for aqueous vapor, existing encapsulation technology is typically with thin-film encapsulation layer (thinfilmencapsulation, TFE), organic electroluminescent element is packaged, to guarantee that organic electroluminescent element is not easily susceptible to aqueous vapor and penetrates into oxygen and then affect its characteristic by comprehensive sealing structure (sealingadhesive), gas barrier layer (gasbarrierfilm) and cover plate.Sealing structure can use hot-setting adhesive, hot-setting adhesive has preferably vapor barrier properties, but when hot-setting adhesive is applied to the encapsulation of pliability organic electroluminescent element, pliability organic electroluminescent element after encapsulation is to take off on hard substrate, and stress produced by hot-setting adhesive can cause pliability organic electroluminescent element to damage.Additionally, the flexural property of hot-setting adhesive is the best, it is unfavorable for the flexure of pliability organic electroluminescent element.
Holding above-mentioned, how pliability organic electroluminescent element, when encapsulation, takes into account flexural property, vapor barrier properties with processing technology convenience, actually one of emphasis the most leaved for development at present.
Summary of the invention
It is an object of the invention to provide a kind of pliability environmental sensitive electronic element encapsulation, to solve the problems referred to above.
For reaching above-mentioned purpose, the present invention provides a kind of pliability environmental sensitive electronic element encapsulation, and it includes a pliable electronic component, a thin-film encapsulation layer and a sealing structure.Thin-film encapsulation layer covers pliable electronic component, sealing structure cover film encapsulated layer and pliable electronic component, sealing structure includes a Part I and a Part II, and Part I covers pliable electronic component and thin-film encapsulation layer, and Part II covers Part I.The young's modulus of Part II is between 0 to 100MPa, and the young's modulus of Part I is more than the young's modulus of Part II, and the thickness of Part I is less than the thickness of Part II.
For the present invention can be become apparent, special embodiment below, and coordinate appended by accompanying drawing be described in detail below.
Accompanying drawing explanation
Figure 1A to Fig. 1 G is the Making programme schematic diagram of the pliability environmental sensitive electronic element encapsulation of first embodiment of the invention；
Fig. 2 A and Fig. 2 B is respectively upper schematic diagram and the generalized section of the pliability environmental sensitive electronic element encapsulation of second embodiment of the invention；
Fig. 3 A and Fig. 3 B is respectively upper schematic diagram and the generalized section of the pliability environmental sensitive electronic element encapsulation of third embodiment of the invention；
Fig. 4 A and Fig. 4 B is respectively upper schematic diagram and the generalized section of the pliability environmental sensitive electronic element encapsulation of fourth embodiment of the invention；
Fig. 5 A to Fig. 5 E is respectively the generalized section of different sealing structure.
Symbol description
100,100', 100 ", 100 " ': pliability environmental sensitive electronic element encapsulate
110: pliable electronic component
112: flexible base plate
114: environmental sensitive electronic element
GB1: the first barrier layer
120: thin-film encapsulation layer
122,124,126: thin film
130,130a, 130', 130 ", 130 " ': sealing structure
132,132': Part I
134,134': Part II
136,136': sidewall barrier structure
GB2: the second barrier layer
C: pliability cover plate
Detailed description of the invention
First embodiment
Figure 1A to Fig. 1 G is the Making programme schematic diagram of the pliability environmental sensitive electronic element encapsulation of first embodiment of the invention.Refer to Figure 1A and Figure 1B, first, a hard substrate SUB1 forms a pliable electronic component 110.In the present embodiment, hard substrate SUB1 for example, glass substrate or other possess the substrate of good mechanical strength, and pliable electronic component 110 includes flexible base plate 112 and an environmental sensitive electronic element 114, wherein environmental sensitive electronic element 114 is configured on flexible base plate 112.nullThe material of flexible base plate 110 includes glass、Metal forming (metalfoil)、Plastic material or polymeric material，Such as pi (polyimide,PI)、Pi and inorganic mixture (hybridPI)、Polyethylene terephthalate (Polyethyleneterephthalate,PET)、Polyether sulfone (Polyethersulfone,PES)、Polyacrylate (polyacrylate,PA)、PEN (Polyethylenenaphthalatc,PEN)、Merlon (polycarbonate,PC)、Poly-field ice alkene (polynorbornene,PNB)、PolyEtherImide (polyetherimide,PEI)、Polyether-ether-ketone (polyetheretherketone,PEEK)、Cyclic olefin polymer (Cycloolefinpolymer,COP)、Polymethyl methacrylate (PMMA)、Glass-fiber reinforced plastic substrate (GlassFiberReinforcedPlastic,GFRP)、Carbon fiber-reinforced polymer composite (CarbonFiberReinforcedPolymer,CFRP) etc..For example, environmental sensitive electronic element 114 can be organic electroluminescent element or other are for the electronic component of aqueous vapor Yu oxygen sensitive.Aforesaid organic electroluminescent element e.g. organic electro-luminescent display or organic electroluminescence light source, the present embodiment does not limit the kenel of environmental sensitive electronic element 114.
In order to promote the vapor barrier properties of flexible base plate 112, the present embodiment optionally can make one first barrier layer GB1 before environmental sensitive electronic element 114 makes on flexible base plate 112.Now, the first barrier layer GB1 of part can be distributed between environmental sensitive electronic element 114 and flexible base plate 112.First barrier layer GB1 can be by single thin film or the lamination being made up of plural layers, and the present embodiment does not limit the number of plies and the composition material of the first barrier layer GB1.Hold above-mentioned, when the first barrier layer GB1 is the lamination being made up of plural layers, first barrier layer GB1 is e.g. alternately stacked constituted lamination by organic film and inorganic thin film, and certainly, the first barrier layer GB1 can also be to be stacked, by multilamellar inorganic thin film, the lamination constituted.When the first barrier layer GB1 is the lamination being made up of multilamellar inorganic thin film stacking, the first barrier layer GB1 has good vapor barrier properties and is relatively easy on manufacturing, and for example, the first barrier layer GB1 can be the lamination that silicon nitride is alternately stacked with silicon oxide.The aqueous vapor penetrance of the first barrier layer GB1 is not higher than 10-2g/m2Day, the most not higher than 10-6g/m2·Day。
Then refer to Fig. 1 C, after the environmental sensitive electronic element 114 that completes, flexible base plate 112 forms a thin-film encapsulation layer 120 with overlay environment sensitive electronic components 114.In the present embodiment, thin-film encapsulation layer 120 includes that the inorganic thin film 122,124,126 that multilamellar is stacked with, aforesaid inorganic thin film 122,124,126 include silicon nitride film and silicon oxide carbide (SiOC) thin film being alternately stacked.But, the present embodiment does not limit the number of plies and the material of inorganic thin film 122,124,126, and in other embodiments, thin-film encapsulation layer 120 includes organic film or the inorganic thin film of single or multiple lift, it is also possible to be combinations of the above.For example, inorganic material includes aluminium sesquioxide (Al2O3), silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy) or silicon oxide carbide (SiOC)；Organic material includes Parylene (parylene) or acrylic acid (acrylic).This field tool usually intellectual is when making suitable change according to actual design requirement.
In order to avoid the stress between environmental sensitive electronic element 114 and the thin-film encapsulation layer 120 of absorption pliable electronic component 110, the present embodiment optionally can make soft layer (not illustrating), to promote the reliability of pliable electronic component 110 between environmental sensitive electronic element 114 and thin-film encapsulation layer 120.Herein, the material of soft layer can be selected for easily the material of delamination (delamination) occurred by stress effect, to discharge the stress between environmental sensitive electronic element 114 and thin-film encapsulation layer 120.The material of soft layer e.g. organic small molecule material (Smallmolecularmaterials), organic oligomerization compound (Oligomers), organic-inorganic metal deposition material or inorganic, metal oxide material etc. altogether.The molecular weight of above-mentioned organic micromolecule compound is about between 10g/mol to 2, between 000g/mol, such as three (8-hydroxyquinoline) aluminum (tris (8-hydroxyquinoline)-aluminum, Alq3), N, N '-bis-(naphthalene-1-base)-N, N '-diphenylbenzidine (N, N '-di (naphthalene-1-yl)-N, N '-diphenyl-benzidine, or phthalocyanine mantoquita (Phthalocyaninecoppercomplex, CuPc) NPB).The molecular weight of organic oligomer is about between 500g/mol to 3, between 000g/mol, as to styrene oligomer (Phenylenevinyleneoligomers), fluorenes oligomer (Fluoreneoligomers).Organic-inorganic metal deposition material altogether can be deposited with altogether such as aforementioned organic materials and metal material and obtain, and the molecular weight of organic-inorganic metal deposition material altogether is about between 3g/mol to 500g/mol.In other words, aforesaid soft layer not only can suitably discharge the stress between environmental sensitive electronic element 114 and thin-film encapsulation layer 120, more can the position that is released of proof stress.
Refer to Fig. 1 D and Fig. 1 E, after completing the making of thin-film encapsulation layer 120, be subsequently formed a sealing structure 130 with cover film encapsulated layer 120 and pliable electronic component 110.Herein, pliable electronic component 110, thin-film encapsulation layer 120 the most tentatively constitute a pliability environmental sensitive electronic element encapsulation 100 with sealing structure 130.In the present embodiment, sealing structure 130 includes Part I 132 and a Part II 134, Part I 132 comprehensively covers pliable electronic component 110 and thin-film encapsulation layer 120, and Part II 134 covers Part I 132, wherein the young's modulus of Part II 134 is between 0 to 100MPa, and the young's modulus of Part I 132 is more than the young's modulus of Part II 134, and the thickness of Part I 132 is less than the thickness of Part II 134.In the present embodiment, the young's modulus of Part I 132 is between 50MPa to 1000MPa, and in the embodiment that other are feasible, the young's modulus of Part I 132 is between 50MPa to 3000MPa.For example, the thickness of Part I 132 is between 1 micron to 10 micron, and the thickness of Part II 134 is between 5 microns to 25 microns.Herein, can have between Part I 132 and Part II 134 in sealing structure 130 between the Part I 132 in obvious interface, or sealing structure 130 and Part II 134 and produce with the presence of phenomenon (without obvious interface) mixed slightly mutually.In other embodiments, Part I 132 in sealing structure 130 has the high young's modulus material (such as hot-setting adhesive) of higher component ratio and the low young's modulus material (such as pressure-sensing glue) of relatively low component ratio, Part II 134 then has the high young's modulus material (such as hot-setting adhesive) of relatively low component ratio and the high young's modulus material (such as pressure-sensing glue) of relatively low component ratio, and the component ratio of the high young's modulus material in sealing structure 130 is successively decreased in a thickness direction.In one embodiment, sealing structure 130 is by suitably controlling the degree of heating or suitably controlling the degree of photocuring so that the young's modulus of sealing structure 130 occurs the change of gradually layer in the thickness direction thereof.It should be noted that the sealing structure 130 of the present embodiment is except can be integrated in the packaging manufacturing process of pliability environmental sensitive electronic element making as Fig. 1 D and Fig. 1 E, it is also possible to complete in advance (as shown in Figure 5A).
In one embodiment, Part I 132 in sealing structure 130 is to meet the glue material that aforementioned young's modulus limits with thickness, the e.g. solidification temperature hot-setting adhesive less than or equal to 120 degree, and the Part II 134 in sealing structure 130 is to meet the glue material that aforementioned young's modulus limits with thickness, e.g. pressure-sensing glue.Herein, Part I 132 (such as hot-setting adhesive) has preferably vapor barrier properties, and Part II 134 (such as pressure-sensing glue) then has preferably stress buffer ability and flexural property.In other words, the sealing structure 130 that the present embodiment is used can take into account flexural property and the vapor barrier properties of pliability environmental sensitive electronic element encapsulation 100.For example, the material of the Part I 132 in aforesaid sealing structure 130 includes epoxy resin (Epoxyresin), urea resin (Urearesin), tripolycyanamide (Melamine), phenolic resin (Phenolresin) etc., and the material of the Part II 134 in aforesaid sealing structure 130 includes acryl (Acrylics), butyl rubber (Butylrubber), ethylene/vinyl acetate copolymer (ethylene-vinylacetate), nitrile (nitriles), silicone rubber (siliconrubber), styrene block copolymer (styreneblockcopolymer) etc..Additionally, environmental sensitive electronic element 114 the most active environment sensitive electronic display elements or passive type environment sensitive electronic display elements, the most active environment sensitive electronic display elements e.g. active matrix Organic Light Emitting Diode (ActiveMatrixOrganicLightEmittingDiode, or active matrix electrophoretic display (ActiveMatrixElectrophoreticDisplay AM-OLED), AM-EPD), it is commonly called as Electronic Paper, or active matrix liquid crystal display (ActiveMatrixLiquidCrystalDisplay, AM-LCD).Passive type environment sensitive electronic display elements the most e.g. passive matrix formula organic electroluminescent element (PassiveMatrixOLED, or super-twisted nematic liquid crystal display (SuperTwistedNematicLiquidCrystalDisplay, STN-LCD) PM-OLED).
In the present embodiment, when the thickness of Part I 132 is the least, when pliability environmental sensitive electronic element encapsulation 100 is taken off from hard substrate SUB1, the stress (normal stress and shear stress) between stress (normal stress and shear stress) and thin-film encapsulation layer 120 and the Part I 132 between thin-film encapsulation layer 120 and environmental sensitive electronic element 114 is the least.When the thickness of Part II 134 is the biggest, the stress (normal stress and shear stress) between stress (normal stress and shear stress) and thin-film encapsulation layer 120 and the Part I 132 between thin-film encapsulation layer 120 and environmental sensitive electronic element 114 is the least.In addition, when Part I 132 and Part II 134 young's modulus more hour, then the stress (normal stress and shear stress) between stress (normal stress and shear stress) and thin-film encapsulation layer 120 and the Part I 132 between thin-film encapsulation layer 120 and pliable electronic component 110 is the least.
If outermost thin film 126 is silicon nitride film in thin-film encapsulation layer 120, the permeation pathway of water oxygen is formed owing to this silicon nitride film 126 easily produces connection loosing when high temperature, now, Part I 132 (such as hot-setting adhesive) directly contacts the loosening phenomenon that can improve silicon nitride film 126 with silicon nitride film 126, to guarantee that thin-film encapsulation layer 120 and sealing structure 130 are not likely to produce the permeation pathway of water oxygen, and then guarantee the vapor barrier properties of thin-film encapsulation layer 120 and sealing structure 130.
Refer to Fig. 1 F, in order to promote the vapor barrier properties of the aforementioned pliability environmental sensitive electronic element encapsulation 100 including pliable electronic component 110, thin-film encapsulation layer 120 and sealing structure 130 further, the present embodiment can be optionally in sealing structure 130 (i.e. Part II 134) upper formation one second barrier layer GB2 and pliability cover plate C, so that sealing structure 130 is between pliable electronic component 110 and pliability cover plate C.Specifically, sealing structure 130 is between thin-film encapsulation layer 120 and pliability cover plate C.In one embodiment, the second barrier layer GB2 and the first barrier layer GB1 can be identical material, and pliability cover plate C and flexible base plate 112 can be identical material.
Refer to Fig. 1 G, after completing the making of sealing structure the 130, second barrier layer GB2 and pliability cover plate C, pliability environmental sensitive electronic element encapsulation 100 is taken off from hard substrate SUB1.During pliability environmental sensitive electronic element encapsulation 100 is taken off, sealing structure 130 owing to being used includes vapor barrier properties preferably Part I 132 and flexural property preferably Part II 134, therefore sealing structure 130 is in addition to having good vapor barrier properties, the pliability environmental sensitive electronic element encapsulation 100 of the present embodiment can be taken off under normal temperature condition from hard substrate SUB1, and is effectively improved processing technology yield.
According to analog result, when pliability environmental sensitive electronic element encapsulation 100 at normal temperature condition under take off from hard substrate SUB1 time, if using hot-setting adhesive as sealing structure 130, then the normal stress that the interface between environmental sensitive electronic element 114 and thin-film encapsulation layer 120 is suffered is bigger with shear stress；When pliability environmental sensitive electronic element encapsulation 100 at normal temperature condition under take off from hard substrate SUB1 time, if using pressure-sensing glue as sealing structure 130, then the normal stress that the interface between environmental sensitive electronic element 114 and thin-film encapsulation layer 120 is suffered is less with shear stress；When pliability environmental sensitive electronic element encapsulation 100 at normal temperature condition under take off from hard substrate SUB1 time, if by the sealing structure 130 (as a example by combined type hot-setting adhesive and pressure-sensing glue) of the present embodiment, then the interface between environmental sensitive electronic element 114 and sealing structure 130 is suffered normal stress and shear stress are between both.
Second embodiment
Fig. 2 A and Fig. 2 B is respectively upper schematic diagram and the generalized section of the pliability environmental sensitive electronic element encapsulation of second embodiment of the invention.Refer to Fig. 2 A and Fig. 2 B, the pliability environmental sensitive electronic element encapsulation 100' of the present embodiment is similar with the encapsulation 100 of the pliability environmental sensitive electronic element of first embodiment, it is in place of the two Main Differences: the Part I 132 for example, hot-setting adhesive of sealing structure 130', and the Part II 134' for example, fluid of sealing structure 130'.In the present embodiment, the highest surface tension fluid of aforesaid fluid, high viscosity fluid or low moisture absorption fluid (such as silicone oil).Additionally, sealing structure 130' in the pliability environmental sensitive electronic element encapsulation 100' of the present embodiment can farther include a sidewall barrier structure 136, this sidewall barrier structure 136 is configured on Part I 132, and is embedded in Part II 134'.The sidewall barrier structure 136 of the present embodiment, in addition to having good vapor barrier properties, more standby limits Part II 134'(fluid) function of flow range.It should be noted that sealing structure 130' of the present embodiment is except being integrated in the packaging manufacturing process of pliability environmental sensitive electronic element making, it is also possible to complete in advance (as shown in Figure 5 B).
3rd embodiment
Fig. 3 A and Fig. 3 B is respectively upper schematic diagram and the generalized section of the pliability environmental sensitive electronic element encapsulation of third embodiment of the invention.Refer to Fig. 3 A and Fig. 3 B, the pliability environmental sensitive electronic element encapsulation 100 of the present embodiment " similar with the pliability environmental sensitive electronic element of the second embodiment encapsulation 100', be in place of the two Main Differences: pliability environmental sensitive electronic element encapsulates 100 " in sidewall barrier structure 136' be simultaneously embedded in sealing structure 130 " Part I 132 and Part II 134' in.It should be noted that Part II 134' mentioned in the present embodiment does not limit must be fluid, and this Part II 134' may be used without nonfluid.
Additionally, the sealing structure 130 of the present embodiment " except making can be integrated in the packaging manufacturing process of pliability environmental sensitive electronic element, it is also possible to complete in advance (as shown in Figure 5 C).
4th embodiment
Fig. 4 A and Fig. 4 B is respectively upper schematic diagram and the generalized section of the pliability environmental sensitive electronic element encapsulation of fourth embodiment of the invention.Refer to Fig. 4 A and Fig. 4 B, the pliability environmental sensitive electronic element encapsulation 100 of the present embodiment " ' encapsulate 100 with the pliability environmental sensitive electronic element of the 3rd embodiment " similar, it is in place of the two Main Differences: the sealing structure 130 of the present embodiment " ' there is different structure.In detail, the sealing structure 130 of the present embodiment " ' in; Part I 132' includes that multiple pattern (as shown in the left side of Fig. 4 A) or separated from one another has the continuous pattern (as shown in the right side of Fig. 4 A) of basket dummy section, with locality cover film encapsulated layer 120.For example, aforesaid pattern can be strip pattern or blocky.Additionally, Part I 132' is coated with by Part II 134', and Part I 132' do not extend to pliability environmental sensitive electronic element encapsulation 100 " ' side.It should be noted that the sealing structure 130 of the present embodiment " ' except making can be integrated in the packaging manufacturing process of pliability environmental sensitive electronic element, it is also possible to complete in advance (as shown in Figure 5 D).Except above-mentioned Fig. 5 A (first embodiment) to the sealing structure 130 described in Fig. 5 D (the 4th embodiment), 130', 130 ", 130 " ', the present invention may be used without sealing structure 130a as depicted in Fig. 5 E.
Owing to Part I 132 (such as hot-setting adhesive) includes multiple pattern separated from one another, and between pattern and pattern, maintain an interval, therefore, pliability environmental sensitive electronic element can be encapsulated 100 " ' take off from hard substrate under normal temperature condition.Furthermore, sealing structure 130 " ' Part I 132 there is patterning, contribute to increase pliability environmental sensitive electronic element encapsulation 100 " ' flexural property.
Based on above-mentioned, owing to the embodiment of the present invention uses the encapsulating material with multiple different young's modulus as sealing structure, flexural property and the vapor barrier properties of the encapsulation of pliability environmental sensitive electronic element therefore can be taken into account.In addition, the encapsulation of pliability environmental sensitive electronic element can be taken off in the case of room temperature from hard substrate by the embodiment of the present invention, accordingly, the embodiment of the present invention pliability environmental sensitive electronic element encapsulation manufacture method can reduce processing technology needed for time and reduce processing technology cost.
Although disclosing the present invention in conjunction with above example; but it is not limited to the present invention; any art has usually intellectual; without departing from the spirit and scope of the present invention; a little change and retouching can be made, therefore protection scope of the present invention should be with being as the criterion that the claim enclosed is defined.
Claims (20)
1. a pliability environmental sensitive electronic element encapsulation, including:
Pliable electronic component；
Thin-film encapsulation layer, covers this pliable electronic component；And
Sealing structure, cover this pliable electronic component and this thin-film encapsulation layer, this sealing structure includes Part I and Part II, this Part I covers this pliable electronic component and this thin-film encapsulation layer, this Part II covers this Part I, wherein the young's modulus of this Part II is between 0 to 100MPa, and the young's modulus of this Part I is more than the young's modulus of this Part II, and the thickness of this Part I is less than the thickness of this Part II.
2. pliability environmental sensitive electronic element encapsulation as claimed in claim 1, wherein this pliable electronic component includes:
Flexible base plate；And
Environmental sensitive electronic element, is configured on this flexible base plate；And
First barrier layer, is configured on this flexible base plate, and wherein this first barrier layer of part is distributed between this environmental sensitive electronic element and this flexible base plate.
3. pliability environmental sensitive electronic element encapsulation as claimed in claim 1, wherein this thin-film encapsulation layer includes multilamellar inorganic thin film, and those inorganic thin films cover this environmental sensitive electronic element.
4. pliability environmental sensitive electronic element encapsulation as claimed in claim 3, wherein the outermost layer of those inorganic thin films is silicon nitride film, and this silicon nitride film directly contacts with this Part I of this sealing structure.
5. pliability environmental sensitive electronic element encapsulation as claimed in claim 1, wherein this Part I of this sealing structure includes hot-setting adhesive, and this Part II of this sealing structure includes pressure-sensing glue.
6. pliability environmental sensitive electronic element encapsulation as claimed in claim 1, wherein this Part I of this sealing structure includes hot-setting adhesive, and this Part II of this sealing structure includes fluid.
7. pliability environmental sensitive electronic element encapsulation as claimed in claim 1, wherein this sealing structure also includes:
Sidewall barrier structure, is configured on this Part I.
8. pliability environmental sensitive electronic element encapsulation as claimed in claim 1, wherein the thickness of this Part I is between 1 micron to 10 micron, and the thickness of this Part II is between 5 microns to 25 microns.
9. pliability environmental sensitive electronic element encapsulation as claimed in claim 1, wherein this thin-film encapsulation layer of the comprehensive covering of this Part I.
10. pliability environmental sensitive electronic element encapsulation as claimed in claim 1, wherein this Part I includes that multiple pattern separated from one another or has the continuous pattern of basket dummy section, covers this thin-film encapsulation layer with locality.
11. pliability environmental sensitive electronic element as claimed in claim 1 encapsulation, also include:
Soft layer, is configured between this pliable electronic component and this thin-film encapsulation layer.
12. pliability environmental sensitive electronic element as claimed in claim 1 encapsulation, also include:
Pliability cover plate, covers this sealing structure, and wherein this sealing structure is between this pliable electronic component and pliability cover plate；And
Second barrier layer, is configured between this pliability cover plate and this sealing structure.
13. pliability environmental sensitive electronic element as claimed in claim 1 encapsulation, wherein the young's modulus of this Part I is between 50MPa to 3000MPa.
14. 1 kinds of sealing structures, be suitable to be covered on a pliable electronic component, this sealing structure includes Part I and Part II, this Part I covers this pliable electronic component, this Part II covers this Part I, wherein the young's modulus of this Part II is between 0 to 100MPa, and the young's modulus of this Part I is more than the young's modulus of this Part II, and the thickness of this Part I is less than the thickness of this Part II.
15. sealing structures as claimed in claim 14, wherein this Part I includes hot-setting adhesive, and this Part II includes pressure-sensing glue.
16. sealing structures as claimed in claim 14, wherein this Part I of this sealing structure includes hot-setting adhesive, and this Part II of this sealing structure includes fluid.
17. sealing structures as claimed in claim 14, wherein the thickness of this Part I is between 1 micron to 10 micron, and the thickness of this Part II is between 5 microns to 25 microns.
18. sealing structures as claimed in claim 14, wherein this Part I includes that multiple pattern separated from one another or has the continuous pattern of basket dummy section.
19. sealing structures as claimed in claim 14, also include a sidewall barrier structure, around this Part II.
20. sealing structures as claimed in claim 14, wherein the young's modulus of this Part I is between 50MPa to 3000MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/003,803 US9847509B2 (en) | 2015-01-22 | 2016-01-22 | Package of flexible environmental sensitive electronic device and sealing member |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562106234P | 2015-01-22 | 2015-01-22 | |
| US62/106,234 | 2015-01-22 | ||
| TW104115559A TWI656672B (en) | 2015-01-22 | 2015-05-15 | Package of flexible environmental sensitive device |
| TW104115559 | 2015-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105826485A true CN105826485A (en) | 2016-08-03 |
| CN105826485B CN105826485B (en) | 2018-08-31 |
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Effective date of registration: 20220411 Address after: 26, 1 song Chi Road, Xinyi District, Taipei, Taiwan, China Patentee after: HANNSTAR DISPLAY Corp. Address before: Hsinchu County, Taiwan, China Patentee before: Industrial Technology Research Institute |