CN105820506B - A kind of preparation method of epoxy resin/silicon nitride composite material - Google Patents
A kind of preparation method of epoxy resin/silicon nitride composite material Download PDFInfo
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- CN105820506B CN105820506B CN201610221954.4A CN201610221954A CN105820506B CN 105820506 B CN105820506 B CN 105820506B CN 201610221954 A CN201610221954 A CN 201610221954A CN 105820506 B CN105820506 B CN 105820506B
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 53
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 53
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910052581 Si3N4 Inorganic materials 0.000 title claims abstract description 33
- 239000002131 composite material Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 28
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 9
- -1 p-aminophenyl epoxide Chemical class 0.000 claims abstract description 9
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 6
- 239000012467 final product Substances 0.000 claims abstract description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 13
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000010992 reflux Methods 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 5
- 229910003978 SiClx Inorganic materials 0.000 claims description 5
- 238000013019 agitation Methods 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 claims description 4
- 150000002118 epoxides Chemical class 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 2
- IDGUHHHQCWSQLU-UHFFFAOYSA-N ethanol;hydrate Chemical compound O.CCO IDGUHHHQCWSQLU-UHFFFAOYSA-N 0.000 claims description 2
- 229960001124 trientine Drugs 0.000 claims description 2
- 238000011049 filling Methods 0.000 abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 17
- 235000019441 ethanol Nutrition 0.000 description 11
- 238000012986 modification Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000002041 carbon nanotube Substances 0.000 description 7
- 229910021393 carbon nanotube Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229910021389 graphene Inorganic materials 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 235000019439 ethyl acetate Nutrition 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical class CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of preparation method of epoxy resin/silicon nitride composite material, and nano-silicon nitride is modified using new alkoxy three (p-aminophenyl epoxide) zirconate, it is modified washed, dried, milled processed；Modified silicon nitride is added in epoxy resin solidifying system again and is cured, to obtain the final product.The thermal conductivity factor of composite material of the present invention improves 44.2% compared with the thermal conductivity factor of pure epoxy resin EP, and the dosage of the modified nano-silicon nitride of heat filling is low, is only the 0.5 6% of epoxy resin quality.
Description
Technical field
The present invention relates to a kind of preparation method of LED encapsulation heat-conducting resin, especially a kind of epoxy resin/silicon nitride is multiple
The preparation method of condensation material.
Background technology
Epoxy resin (Epoxy Resin, EP) has that cementability is high, shrinking percentage is low, heat resistance is high, good manufacturability and price
Low advantage, therefore it is widely used in the encapsulation of electronic component.But the thermal conductivity of EP is bad, cause EP encapsulating materials
Poor radiation, so as to influence the service life of electronic product, has been difficult in adapt to the fast development of encapsulation technology.
In order to improve the thermal conductivity of epoxy resin encapsulating material, at present researcher's most study be select graphene or
Carbon nanotubes is as heat filling, but graphene or carbon nanotubes higher price, and needs in preparation process to use oxygen
Strong oxidizing property, corrosive chemical reagent used in graphite, treatment process are more complicated.
The content of the invention
In order to solve epoxy resin encapsulating material of the prior art using graphene or carbon nanotubes as heat filling
The deficiency brought, there is provided a kind of preparation method of epoxy resin/silicon nitride composite material, it uses modified nano-silicon nitride
As heat filling, the thermal conductivity of material is improved, and the price of nano-silicon nitride is far below graphene and carbon nanotubes, changes
Property process and aftertreatment technology it is more simple and convenient than graphite, without using the strong oxygen used in graphite oxide in preparation process
The property changed, corrosive chemical reagent.
The present inventor is innovated on the basis of conventional thermal conductive filler, has used modified nano-silicon nitride as heat conduction
Filler, for improving the heat conductivility of epoxy resin, but since Nano powder of silicon nitride has higher surface energy, is polymerizeing
It is dispersed poor in thing.In order to which silicon nitride can be evenly dispersed in resin system and is kept well with basis material
Compatibility, researcher carry out surface modification to it, improve the hot property and other performances of composite material.
Technical solution
A kind of preparation method of epoxy resin/silicon nitride composite material, includes the following steps：
(1) preparation of modified silicon nitride
Take new alkoxy three (p-aminophenyl epoxide) zirconate to be uniformly mixed with solvent at 55-65 DEG C, then add and receive
Rice silicon nitride, and magnetic agitation reflux 20-30h is carried out at 65-85 DEG C, obtained reflux system is centrifuged, and
With absolute ethyl alcohol centrifuge washing, finally obtained material is dried, is ground.
(2) preparation of composite material
Epoxy resin is heated to 55-65 DEG C, the ethanol solution of modified silicon nitride is then added, is mixed at 55-65 DEG C equal
It is even, and 1-2h is stirred in 75-85 DEG C, curing agent is added after being then cooled to 55-65 DEG C, injection molding is placed on vacuum tank exhaust, so
After cured, to obtain the final product.
In step (1), the dosage of new alkoxy three (p-aminophenyl epoxide) zirconate is the 40- of nano-silicon nitride
70wt%.
In step (2), the epoxy resin is bisphenol A type epoxy resin, epoxide equivalent 210-240g/eq.
In step (2), the additive amount of modified silicon nitride is the 0.5-6% of epoxy resin quality.
In step (2), the additive amount of curing agent accounts for the 1-6wt% of epoxy resin.
Further, in step (1), the solvent be selected from dimethylformamide (DMF), acetone, formamide, methyl formate or
Any one in ethyl acetate.
Further, in step (1), the dosage of solvent is calculated by 35-45ml solvents/g silicon nitrides.
Further, in step (1), the rotating speed of the centrifugally operated is 10000-12000r/min.
Further, in step (1), the drying process is：Prior to 50-60 DEG C air blast drying, then the vacuum at 55-65 DEG C
Dry 8-12h.
Further, in step (2), the concentration of the ethanol solution of modified silicon nitride is modified silicon nitride/10-14ml second for 1g
Alcohol.
Further, in step (2), the dosage of the ethanol solution of modified silicon nitride is molten for the ethanol of 3-20mL modification silicon nitrides
Liquid/10g epoxy resin.
Further, in step (2), the curing agent is in 2-ethyl-4-methylimidazole, ethylenediamine or triethylene tetramine
Any one.
Further, in step (2), curing operation flow is：70℃/1h+90℃/1h+120℃/1.5h+150℃/
1.5h。
Beneficial effect：The thermal conductivity factor of composite material of the present invention improves compared with the thermal conductivity factor of pure epoxy resin EP
44.2%, and the dosage of the modified nano-silicon nitride of heat filling is low, is only the 0.5-6% of epoxy resin quality.
Embodiment
In following embodiments, the epoxy resin of use is bisphenol A type epoxy resin, epoxide equivalent 210-240g/eq,
New (p-aminophenyl epoxide) zirconate of alkoxy three using Nanjing Neng De new material technologies Co., Ltd ZCA-N97.
Embodiment 1
(1) preparation of modified silicon nitride
Take 0.1010g ZCA-N97 to be uniformly mixed with 60mL solvent DMFs at 60 DEG C, then add 2.0015g nanometers of nitrogen
SiClx, and magnetic agitation reflux 24h is carried out at 80 DEG C, obtained reflux system is centrifuged, and use absolute ethyl alcohol
Centrifuge washing 3 times, finally dries obtained material in 55 DEG C of air blast, then 12h is dried in vacuo at 60 DEG C, grinds 30min.
(2) preparation of composite material
By epoxy resin 29.56g, then oil bath heating adds ethanol solution (the 1g modification nitrogen of modified silicon nitride to 60 DEG C
SiClx：13mL ethanol) 10mL, it is uniformly mixed at 60 DEG C, and 2h are stirred in 80 DEG C, curing agent 2- is added after being then cooled to 55 DEG C
Ethyl -4-methylimidazole 0.8878g, injection molding are placed on vacuum tank exhaust 1.5h, then cure by following technique：70℃/1h+90
DEG C/1h+120 DEG C/1.5h+150 DEG C/1.5h, up to epoxy resin/modification silicon nitride composite material.
Embodiment 2
(1) preparation of modified silicon nitride
Take 0.5023g ZCA-N97 to be uniformly mixed with 300mL solvent DMFs at 60 DEG C, then add 3.0115g nanometers of nitrogen
SiClx, and magnetic agitation reflux 24h is carried out at 80 DEG C, obtained reflux system is centrifuged, and use absolute ethyl alcohol
Centrifuge washing 4 times, finally dries obtained material in 60 DEG C of air blast, then 12h is dried in vacuo at 60 DEG C, grinds 30min.
(2) preparation of composite material
By epoxy resin 28.5673g, then oil bath heating adds ethanol solution (the 1g modifications of modified silicon nitride to 60 DEG C
Silicon nitride：12mL ethanol) 20mL, it is uniformly mixed at 60 DEG C, and 2.5h are stirred in 80 DEG C, add and cure after being then cooled to 60 DEG C
Agent 2-ethyl-4-methylimidazole 0.8588g, injection molding are placed on vacuum tank exhaust 2h, then cure by following technique：70℃/1h+
90 DEG C/1h+120 DEG C/1.5h+150 DEG C/1.5h, up to epoxy resin/modification silicon nitride composite material.
Embodiment 3
(1) preparation of modified silicon nitride
Take 0.3023g ZCA-N97 to be uniformly mixed with 180mL solvent ethyl acetates at 60 DEG C, then add 2.6815g
Nano-silicon nitride, and magnetic agitation reflux 24h is carried out at 70 DEG C, obtained reflux system is centrifuged, and use nothing
Water-ethanol centrifuge washing 4 times, finally dries obtained material in 60 DEG C of air blast, then is dried in vacuo 12h at 60 DEG C, grinding
40min。
(2) preparation of composite material
By epoxy resin 56.82g, then oil bath heating adds ethanol solution (the 1g modification nitrogen of modified silicon nitride to 60 DEG C
SiClx：14mL ethanol) 8mL, it is uniformly mixed at 60 DEG C, and 3h are stirred in 80 DEG C, curing agent 2- is added after being then cooled to 65 DEG C
Ethyl -4-methylimidazole 0.8648g, injection molding are placed on vacuum tank exhaust 2h, then cure by following technique：70℃/1h+90
DEG C/1h+120 DEG C/1.5h+150 DEG C/1.5h, up to epoxy resin/modification silicon nitride composite material.
Comparative example 1
It is added to using carbon nanotubes in epoxy resin and prepares composite material, in technical process and parameter and embodiment 1
Step (2) is similar, and modified silicon nitride therein simply is changed to carbon nanotubes.
Comparative example 2
It is added to using KH550 (3- aminopropyl triethoxysilanes) modified graphite oxide in epoxy resin and prepares composite wood
Material, technical process and parameter are similar with the step (2) in embodiment 1, and modified silicon nitride therein simply is changed to KH550 is modified
Graphite oxide.
Performance test
Epoxy resin made from embodiment 1-3/modification silicon nitride composite material carries out to the test of heat conductivility, and with it is pure
Epoxy resin and comparative example 1, the heat conductivility of comparative example 2 are contrasted, and are tested limited using Xiangtan, Hunan Province double happiness instrument
Company DRL-III type heat conduction coefficient testers, and measured with the uniform coating composite materials surface of heat-conducting silicone grease.
Test result see the table below：
| Thermal conductivity factor W/ (mK), | |
| Embodiment 1 | 0.4471 |
| Embodiment 2 | 0.4460 |
| Embodiment 3 | 0.4437 |
| Pure epoxy resin | 0.31 |
| Comparative example 1 | 0.3536 |
| Comparative example 2 | 0.3504 |
As can be seen from the above table, compared with pure epoxy resin, the thermal conductivity factor of composite material of the invention improves 44%,
With the composite material prepared with identical technique addition carbon nanotubes into epoxy resin and with KH550 (three second of 3- aminopropyls
Oxysilane) modified graphite oxide is added to the composite material prepared in epoxy resin and compares, and thermal conductivity factor has by a relatively large margin
Raising.
Claims (9)
1. a kind of preparation method of epoxy resin/silicon nitride composite material, it is characterised in that include the following steps：
(1) preparation of modified silicon nitride
Take new alkoxy three (p-aminophenyl epoxide) zirconate to be uniformly mixed with solvent at 55-65 DEG C, then add nanometer nitrogen
SiClx, and magnetic agitation reflux 20-30h is carried out at 65-85 DEG C, obtained reflux system is centrifuged, and use nothing
Obtained material, is finally dried, grinds by water-ethanol centrifuge washing；
(2) preparation of composite material
Epoxy resin is heated to 55-65 DEG C, the ethanol solution of modified silicon nitride is then added, is uniformly mixed at 55-65 DEG C, and
1-2h is stirred in 75-85 DEG C, curing agent is added after being then cooled to 55-65 DEG C, injection molding is placed on vacuum tank exhaust, then carries out
Cure, to obtain the final product；
In step (1), the dosage of new alkoxy three (p-aminophenyl epoxide) zirconate is the 40-70wt% of nano-silicon nitride；
In step (2), the epoxy resin is bisphenol A type epoxy resin, epoxide equivalent 210-240g/eq；
In step (2), the additive amount of modified silicon nitride is the 0.5-6% of epoxy resin quality；
In step (2), curing operation flow is：70℃/1h+90℃/1h+120℃/1.5h+150℃/1.5h.
2. the preparation method of epoxy resin/silicon nitride composite material as claimed in claim 1, it is characterised in that step (2)
In, the additive amount of curing agent accounts for the 1-6wt% of epoxy resin.
3. the preparation method of epoxy resin/silicon nitride composite material as claimed in claim 1, it is characterised in that step (1)
In, the solvent is selected from any one in dimethylformamide (DMF), acetone, formamide, methyl formate or ethyl acetate.
4. the preparation method of epoxy resin/silicon nitride composite material as claimed in claim 1, it is characterised in that step (1)
In, the dosage of solvent is calculated by 35-45ml solvents/g silicon nitrides.
5. the preparation method of epoxy resin/silicon nitride composite material as claimed in claim 1, it is characterised in that step (1)
In, the rotating speed of the centrifugally operated is 10000-12000r/min.
6. the preparation method of epoxy resin/silicon nitride composite material as claimed in claim 1, it is characterised in that step (1)
In, the drying process is：Prior to 50-60 DEG C air blast drying, then it is dried in vacuo 8-12h at 55-65 DEG C.
7. the preparation method of epoxy resin/silicon nitride composite material as claimed in claim 1, it is characterised in that step (2)
In, the concentration of the ethanol solution of modified silicon nitride is modified silicon nitride/10-14ml ethanol for 1g.
8. the preparation method of epoxy resin/silicon nitride composite material as claimed in claim 1, it is characterised in that step (2)
In, the dosage of the ethanol solution of modified silicon nitride is modified ethanol solution/10g epoxy resin of silicon nitride for 3-20mL.
9. the preparation method of epoxy resin/silicon nitride composite material as claimed in claim 1, it is characterised in that step (2)
In, any one of the curing agent in 2-ethyl-4-methylimidazole, ethylenediamine or triethylene tetramine.
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|---|---|---|---|---|
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| CN101550264A (en) * | 2009-04-30 | 2009-10-07 | 苏州生益科技有限公司 | Resin matching fluid used for metal foil laminated board |
| CN103224692A (en) * | 2013-05-09 | 2013-07-31 | 江门市道生工程塑料有限公司 | Filled polymer based heat conductive plastic and preparation method thereof |
| CN103642202A (en) * | 2013-12-16 | 2014-03-19 | 湖南省映鸿科技有限公司 | Ceramic powder modified polyurethane/epoxy resin interpenetrating network elastomer |
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2016
- 2016-04-11 CN CN201610221954.4A patent/CN105820506B/en active Active
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|---|---|---|---|---|
| CN101423651A (en) * | 2007-11-02 | 2009-05-06 | 中国船舶重工集团公司第七二五研究所 | Process for preparing low temperature, high heat conducting and electrical insulation epoxy resin nano composite material |
| CN101550264A (en) * | 2009-04-30 | 2009-10-07 | 苏州生益科技有限公司 | Resin matching fluid used for metal foil laminated board |
| CN103224692A (en) * | 2013-05-09 | 2013-07-31 | 江门市道生工程塑料有限公司 | Filled polymer based heat conductive plastic and preparation method thereof |
| CN103642202A (en) * | 2013-12-16 | 2014-03-19 | 湖南省映鸿科技有限公司 | Ceramic powder modified polyurethane/epoxy resin interpenetrating network elastomer |
| CN105175993A (en) * | 2015-07-27 | 2015-12-23 | 桂林理工大学 | Preparation method for hybrid filling composite castable with high thermal conductivity |
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| Title |
|---|
| 氮化硅/环氧复合电子基板材料制备及性能;沈源 等;《热固性树脂》;20070131;第22卷(第1期);16-19 * |
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