CN105813404A - In-hole machining method for circuit board, and circuit board light guide element manufactured through in-hole machining method - Google Patents
In-hole machining method for circuit board, and circuit board light guide element manufactured through in-hole machining method Download PDFInfo
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- CN105813404A CN105813404A CN201410853173.8A CN201410853173A CN105813404A CN 105813404 A CN105813404 A CN 105813404A CN 201410853173 A CN201410853173 A CN 201410853173A CN 105813404 A CN105813404 A CN 105813404A
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Abstract
The invention discloses an in-hole machining method for a circuit board, and a circuit board light guide element manufactured through the in-hole machining method. The method comprises the steps: providing a circuit board, wherein the circuit board is provided with a through hole wall and a cover layer on the through hole wall, and the cover layer defines a through hole through surrounding, and comprises a preset removal part; inserting the light guide element into a through hole of the circuit board, wherein the tail end part of the light guide element is provided with a reflection surface; adjusting the preset removal part of the cover layer into a region formed through the orthographic projection of the reflection surface on the through hole wall; emitting a laser beam towards the through hole of the circuit board, enabling the laser beam to be transmitted to the reflection surface of the light guide element, and enabling the laser beam to be steered to the preset removal part of the cover layer through the reflection surface of the light guide element, and removing at least a part of the preset removal part of the cover layer. In addition, the invention also provides the circuit board manufactured through the in-hole machining method, and the used light guide element.
Description
Technical field
The relevant a kind of circuit board of the present invention, and it is particularly in the hole of a kind of circuit board processing method and made circuit board thereof.
Background technology
Referring to shown in Fig. 1, it is custom circuit plate 100a, includes an a plate 1a and conductive layer 2a.Wherein, above-mentioned plate 1a is formed with a perforation 11a, and be mostly formed in plate 1a at least one in sunken cord road 12a, conductive layer 2a be then formed on the hole wall of above-mentioned perforation 11a.But, it is make streaming current I that the custom circuit plate 100a design of above-mentioned Fig. 1 will make current distributingAWith a delayed current IB, say, that due to delayed current IBSunken cord in entrance road 12a time point can with make streaming current IASunken cord in entrance and between the time point of road 12a, produce time difference, so order be transferred in the sunken cord signal of road 12a be unable to maintain that its integrity.
Accordingly, existing improvement mode is to carry out back drill (backdrilling) at Fig. 1 shownschematically custom circuit plate 100a, uses the circuit board 100a structure formed as shown in Figure 2.In more detail, through the step of back drill, form boring 13a at conductive layer 2a and remove with the position that will need not be used to, reduce loss electric current IBGeneration, and then keep signal integrity.Furthermore, circuit board intensive porose area (as: near ball bar structure of arrays), above-mentioned back drill mode easily make especially adjacent boring 13a hypotelorism or connect and cause signal transmission Quality Down.Accordingly, the mode of above-mentioned back drill has its limitation to exist, and is likely to result in the impact being unfavorable for the follow-up research and development of circuit board.
Then, can improving of the above-mentioned disappearance of the present inventor's thoughts, is that spy concentrates on studies and coordinates the utilization of scientific principle, finally proposes the present invention that is a kind of reasonable in design and that be effectively improved above-mentioned disappearance.
Summary of the invention
The embodiment of the present invention is in that to provide processing method and made circuit board thereof in the hole of a kind of circuit board, can effectively improve the limitation that the back drill mode of custom circuit plate is produced.
Processing method in the hole of the embodiment of the present invention a kind of circuit board of offer, including: a circuit board is provided；Wherein, this circuit board is formed with a perforation hole wall, and this circuit board has the cover layer being formed on this perforation hole wall, and this cover layer surrounds and defines a through hole, and this cover layer includes a predetermined removal position；The light-guide device that one external form corresponds roughly to this through hole inserts the through hole of this circuit board；Wherein, a terminal part of this light-guide device being placed in this through hole is provided with a reflecting surface；The predetermined removal position of this cover layer is adjusted to this reflecting surface orthographic projection within the region that this perforation hole wall is formed；And launch a laser beam towards the through hole of this circuit board, this laser beam is made to be transferred on the reflecting surface of this light-guide device, and make this laser beam turn to the predetermined removal position being radiated at this cover layer via the reflecting surface of this light-guide device, and then remove this cover layer at least part of predetermined removal position.
It is preferred that this cover layer is a conductive layer；In the step launching this laser beam towards the through hole of this circuit board, continue to launch this laser beam, until the predetermined removal position of this conductive layer is completely removed, and make this conductive layer form two conductive parts being separated from each other.
It is preferred that this cover layer includes a conductive layer and a shielding layer, this conductive layer is formed on this perforation hole wall, and this shielding layer is formed on this conductive layer and surrounds and defines this through hole；In the step launching this laser beam towards the through hole of this circuit board, continue to launch this laser beam, until the predetermined removal position of this shielding layer is completely removed, so that outside the predetermined removal position of this conductive layer is exposed to；The predetermined removal position of this conductive layer is etched, so that this conductive layer forms two conductive parts being separated from each other with an etching solution.
The embodiment of the present invention separately provides more than one to state in the hole of circuit board the circuit board made by processing method, including: a perforation hole wall；And a conductive layer, it is formed on this perforation hole wall, and this conductive layer is formed with the breach making this perforation hole wall of part expose, and this conductive layer is separated into two conductive parts through this breach.
In sum, processing method in the hole of the circuit board that the embodiment of the present invention provides, it can pass through and utilize coordinating of light-guide device and laser beam, and be processed in the perforation of circuit board, processing mode and made circuit board in a kind of hole different from the past of offer is provided, and then overcomes the limitation commonly using back drill mode.
For enabling feature and the technology contents being further understood that the present invention, refer to the detailed description below in connection with the present invention and accompanying drawing, but these illustrate that with institute's accompanying drawings be only for the present invention is described, but not the interest field of the present invention is done any restriction.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of custom circuit plate.
Fig. 2 is the schematic diagram after the custom circuit plate processing in Fig. 1.
Fig. 3 be circuit board of the present invention hole in the step S101 schematic diagram of processing method first embodiment.
Fig. 4 be circuit board of the present invention hole in step S102 and the step S103 schematic diagram of processing method first embodiment.
Fig. 5 be circuit board of the present invention hole in the step S104 schematic diagram of processing method first embodiment.
Fig. 6 be circuit board of the present invention hole in the step S105 schematic diagram of processing method first embodiment.
Fig. 7 be circuit board of the present invention hole in the step S104 ' schematic diagram of processing method first embodiment.
Fig. 8 be circuit board of the present invention hole in the step S201 schematic diagram of processing method first embodiment.
Fig. 9 be circuit board of the present invention hole in step S202 and the step S203 schematic diagram of processing method first embodiment.
Figure 10 be circuit board of the present invention hole in the step S204 schematic diagram of processing method first embodiment.
Figure 11 be circuit board of the present invention hole in the step S205 schematic diagram of processing method first embodiment.
Figure 12 be circuit board of the present invention hole in the step S206 schematic diagram of processing method first embodiment.
Figure 13 be circuit board of the present invention hole in the step S204 ' schematic diagram of processing method first embodiment.
Detailed description of the invention
[first embodiment]
Referring to Fig. 3 to Fig. 7, it is the first embodiment of the present invention, and what need to first illustrate is, correlated measure that the present embodiment correspondence pattern is mentioned and external form, only in order to specifically describe embodiments of the present invention, in order to understand its content, and be not used to the interest field of the limitation present invention.
Processing method in the hole of the present embodiment a kind of circuit board of offer, and for ease of understanding, the present embodiment is for a unit area of circuit board, and the sectional view of each step of arranging in pairs or groups is described.Wherein, consult corresponding to each step graphic time, and please optionally consider the graphic of other steps in the lump in light of actual conditions.And as follows about the step general description of processing method in the hole of the present embodiment circuit board:
Step S101: as shown in Figure 3 a, it is provided that circuit board 100；Wherein, circuit board 100 is formed with a perforation hole wall 1, and circuit board 100 has the cover layer 2 being formed on perforation hole wall 1.Cover layer 2 surrounds and defines the rounded through hole of a nodal section 21, and cover layer 2 surrounds definition and has one first opening 211 and one second opening 212 being positioned at through hole 21 two opposite sides；And described cover layer 2 includes predetermined removal position 221 (in the present embodiment, the central part of above-mentioned predetermined removal position 221 substantially cover layer 2).
In more detail, described cover layer 2 is a conductive layer 22 in the present embodiment, therefore in the description below, cover layer 2 directly represents with conductive layer 22, and the predetermined thickness that the thickness of above-mentioned conductive layer 22 is required when practical application less than circuit board 100.Described conductive layer 22 is preferably the layers of copper after black brown, uses and is beneficial in subsequent step and absorbs laser beam and be prone to be etched and remove.
In addition, described circuit board 100 can be laminated plates, that is circuit board 100 has a plate body (figure slightly) of several layer stack and gluing appoints the colloid (figure is slightly) of two-phase reactor pallet body, the at least one of which plate body of foregoing circuit plate 100 is formed with at least one conducting wire (figure is slightly), in order to the use as signal transmission.Wherein, described plate body is usually formed with the prepreg bed of material (PreimpregnatedMaterial), dividing according to different reinforcing materials, the prepreg bed of material can be the materials such as glass fibre prepreg (Glassfiberprepreg), carbon fibre initial rinse material (Carbonfiberprepreg), epoxy resin (Epoxyresin).But, plate body can also be formed with soft board material, say, that plate body major part is by polyester material (Polyester, PET) or polyimide resin (Polyimide, PI) formed without containing glass fibre, carbon fiber etc..But, the material of plate body is not limited by embodiments of the present invention.
Step S102: as shown in Figure 4, inserts through hole 21 by a light-guide device 200 via the first opening 211 of circuit board 100；Wherein, above-mentioned light-guide device 200 includes a generally cylindrical body 201 and the terminal part 202 extended from body 201 ora terminalis (body 201 top edge as shown in Figure 4) one.The external form of above-mentioned body 201 corresponds to through hole 21, that is, it is identical that body 201 is perpendicular to through hole 21 cross sectional shape that the cross sectional shape of its long axis direction substantially plugs with it, use after making light-guide device 200 insert through hole 21, body 201 side surface of light-guide device 200 can substantially and present between conductive layer 22 gapless arrange.Furthermore, the terminal part 202 of described light-guide device 200 is placed in through hole 21 and sets (setting as plated) a cone shape reflecting surface 203.
In more detail, the terminal part 202 of described light-guide device 200 is cone in the present embodiment, the maximum gauge of terminal part 202 be not more than (as: be substantially equal to) diameter of body 201, and terminal part 202 is to be extended to form to be gradually reduced the mode of diameter along the long axis direction of body 201 by body 201 ora terminalis.Furthermore, described reflecting surface 203 is the outer surface in above-mentioned end portion 202 and is preferably smooth minute surface, uses the effect reaching fully reflective laser beam.
Step S103: as shown in Figure 4, adjusts the predetermined removal position 221 of above-mentioned conductive layer 22 to reflecting surface 203 orthographic projection within the region that perforation hole wall 1 is formed.In more detail, through mobile light-guide device 200 or circuit board 100, to adjust the relative position of both light-guide device 200 or circuit board 100, and then the predetermined removal position 221 of conductive layer 22 is made to be positioned at the outside of reflecting surface 203.
Step S104: as shown in Figure 5, a laser beam 301 is launched towards the through hole 21 of circuit board 100 with a laser equipment 300, and laser beam 301 is incident to the through hole 21 of circuit board 100 via the second opening 212, laser beam 301 is made to be transferred on the reflecting surface 203 of light-guide device 200, use and make via the reflecting surface 203 of light-guide device 200 laser beam 301 turn to the predetermined removal position 221 being radiated at conductive layer 22 radially, and then remove the predetermined removal position 221 of conductive layer 22.Wherein, described laser equipment 300 persistently launches laser beam 301, until the predetermined removal position 221 of above-mentioned conductive layer 22 is completely removed, uses and makes conductive layer 22 form two conductive parts 222 being separated from each other.
Should be noted that, due to laser beam 301 intensity that reflecting surface 203 reflects, be from away from body 201 towards body 201 direction (that is, reflecting surface 203 top to direction, bottom by Fig. 5) successively decrease gradually weak, so that away from corresponding to reflecting surface 203 position of body 201 to predetermined removal position 221 part will first be completely removed, and then persistently corrode perforation hole wall 1, until corresponding to reflecting surface 203 position in adjacent body portion 201 to predetermined removal position 221 be completely removed.Accordingly, after predetermined removal position 221 is completely removed, perforation hole wall 1 will form a circular recess 11, and the degree of depth of above-mentioned recess 11 is from little by little reducing towards body 201 direction away from body 201.
A bit, above-mentioned steps is to form, for conductive layer 22, two conductive parts 222 being separated from each other to supplementary notes, but is not excluded for forming over conductive layer 22 conductive part (figure is slightly) being separated from each other of two or more.For example, after this step S104, one of them conductive part 222 at above-mentioned two conductive parts 222 is additionally provided with a predetermined removal position (figure is slightly), then repeat to implement above-mentioned steps S102 to step S104, conductive layer 22 can be made to form three conductive parts being separated from each other (figure is slightly).
Step S105: as shown in Figure 6, at least one enforcement plating of described two conductive parts 222, to form a supplement conductive layer 3；Wherein, the material of above-mentioned supplement conductive layer 3 is the same as the material of described conductive layer 22, and the gross thickness augmenting both conductive layer 3 conductive parts accompanying with it 222 is the predetermined thickness that circuit board 100 is required in use.
Should be noted that, the conductive part 222 being only above in figure 6 in the present embodiment implements plating for example, but is not precluded within above-mentioned two conductive parts 222 and implements plating simultaneously, or the conductive part 222 being only positioned below in figure 6 implements plating.
After implementing the step S101 to step S105 of the above, circuit board 100 as shown in Figure 6 can be completed, but when practical application, each step is not excluded for substituting with reasonable change aspect.For example, as it is shown in fig. 7, the conversion step S104 ' that this is step S104, wherein, light-guide device 200 is transparent light conductor, and light-guide device 200 terminal part 202 is in coniform groove.Therefore, laser equipment 300 is to be incident in light-guide device 200 by laser beam 301, and then is transferred to the reflecting surface 203 of light-guide device 200.
Additionally, when the aperture of through hole 21 is excessive, laser equipment 300 can be rotated with the central axis of light-guide device 200 for axle center, the laser beam 301 that laser equipment 300 sends is made to be irradiated on reflecting surface 203 along circular track.Furthermore, when the aperture of through hole 21 is less, light-guide device 200 may be used without the component such as optical fiber.
Separately, though it is for above-mentioned that the light-guide device 200 of the present embodiment constructs, but also can require according to designer and be changed.For example, in another embodiment not illustrated, the terminal part of described light-guide device can form the reflecting surface of PDX, and reaches, through the mode rotating light-guide device, the effect that reflecting surface is circular mode and reflects laser beam.
Then, following the explanation of a structure technology feature will be done for the circuit board 100 shown in Fig. 6.Wherein, owing to many structures are mentioned in above-mentioned manufacture method, therefore, part something in common is then no longer repeated.Described circuit board 100 includes a perforation hole wall 1, be formed on perforation hole wall 1 a conductive layer 22, namely it is formed at a supplement conductive layer 3 at least part of conductive layer.Wherein, above-mentioned conductive layer 22 is formed with the breach 223 making part perforation hole wall 1 expose, and conductive layer 22 is separated into two conductive parts 222 through breach 223, and described supplement conductive layer 3 is then formed at least one of above-mentioned two conductive parts 222.
[the second embodiment]
Referring to Fig. 8 to Figure 13, it is the second embodiment of the present invention, and what need to first illustrate is, correlated measure that the present embodiment correspondence pattern is mentioned and external form, only in order to specifically describe embodiments of the present invention, in order to understand its content, and be not used to the interest field of the limitation present invention.
The present embodiment also provides processing method in the hole of a kind of circuit board, and itself and first embodiment something in common then repeat no more.And as follows about the step general description of processing method in the hole of the present embodiment circuit board:
Step S201: as shown in Figure 8 a, it is provided that circuit board 100；Wherein, circuit board 100 is formed with a perforation hole wall 1, and circuit board 100 has the cover layer 2 being formed on perforation hole wall 1.Cover layer 2 surrounds and defines the rounded through hole of a nodal section 21, and above-mentioned cover layer 2 surrounds definition and has one first opening 211 and one second opening 212 being positioned at through hole 21 two opposite sides；And cover layer 2 includes predetermined removal position 221,231 (in the present embodiment, the central part of above-mentioned predetermined removal position 221,231 substantially cover layer 2).
In more detail, described cover layer 2 is conductive layer 22 and a shielding layer 23 in the present embodiment, and conductive layer 22 is formed on perforation hole wall 1, and shielding layer 23 is formed on conductive layer 22 and surrounds and defines above-mentioned through hole 21.Wherein, above-mentioned conductive layer 22 is preferably layers of copper and its thickness is the predetermined thickness that circuit board 100 is required when practical application, and described shielding layer 23 is preferably and is suitable to absorb laser beam and be prone to the material being removed, for instance be organic material (such as resin) or metal material (such as stannum).
Step S202 a: as it is shown in figure 9, light-guide device 200 is inserted through hole 21 via the first opening 211 of circuit board 100；Wherein, above-mentioned light-guide device 200 includes a generally cylindrical body 201 and the terminal part 202 extended from body 201 ora terminalis (body 201 top edge as shown in Figure 9) one.The external form of above-mentioned body 201 corresponds to through hole 21, that is, it is identical that body 201 is perpendicular to through hole 21 cross sectional shape that the cross sectional shape of its long axis direction substantially plugs with it, use after making light-guide device 200 insert through hole 21, body 201 side surface of light-guide device 200 can substantially and present between shielding layer 23 gapless arrange.Furthermore, the terminal part 202 of described light-guide device 200 is placed in through hole 21 and sets (setting as plated) a cone shape reflecting surface 203.Should be noted that, the light-guide device 200 of the present embodiment constructs and substantially constructs identical with the light-guide device 200 of first embodiment.
Step S203: as it is shown in figure 9, the predetermined removal position 221,231 of above-mentioned cover layer 2 is adjusted to reflecting surface 203 orthographic projection within the region that perforation hole wall 1 is formed.In more detail, through mobile light-guide device 200 or circuit board 100, to adjust the relative position of both light-guide device 200 or circuit board 100, and then the predetermined removal position 231 of shielding layer 23 is made to be positioned at the outside of reflecting surface 203.
Step S204: as shown in Figure 10, a laser beam 301 is launched towards the through hole 21 of circuit board 100 with a laser equipment 300, and laser beam 301 is incident to the through hole 21 of circuit board 100 via the second opening 212, laser beam 301 is made to be transferred on the reflecting surface 203 of light-guide device 200, use and make via the reflecting surface 203 of light-guide device 200 laser beam 301 turn to the predetermined removal position 231 being radiated at shielding layer 23 radially, and then remove the predetermined removal position 231 of shielding layer 23.Wherein, laser equipment 300 persistently launches laser beam 301, until the predetermined removal position 231 of shielding layer 23 is completely removed, makes shielding layer 23 be formed with a breach 232, and outside the predetermined removal position 221 of above-mentioned conductive layer 22 is exposed to via above-mentioned breach 232.
Step S205: as shown in figure 11, etches the predetermined removal position 221 of described conductive layer 22 with an etching solution, uses and makes conductive layer 22 form two conductive parts 222 being separated from each other.And etching in the process of conductive layer 22 at above-mentioned etching solution, the predetermined part removed beyond position 221 of conductive layer 22, it is subjected to the covering protection of shielding layer 23, and then avoids being etched liquid and etched.
A bit, above-mentioned steps is to form, for conductive layer 22, two conductive parts 222 being separated from each other to supplementary notes, but is not excluded for forming over conductive layer 22 conductive part (figure is slightly) being separated from each other of two or more.For example, after this step S203, remaining shielding layer 23 is additionally provided with a predetermined removal position (figure is slightly), then repeat to implement above-mentioned steps S202 and step S203, shielding layer 23 can be made separately to be formed with a breach (figure is slightly), continue and implement step S204, conductive layer 22 can be made to form three conductive parts being separated from each other (figure is slightly).
Step S206: as shown in figure 12, after conductive layer 22 forms two conductive parts 222 being separated from each other, removes shielding layer 23.
After implementing the step S201 to step S206 of the above, circuit board 100 as shown in figure 12 can be completed, but when practical application, each step is not excluded for substituting with reasonable change aspect.For example, as shown in figure 13, this is the conversion step S204 ' of step S204, and wherein, described light-guide device 200 is transparent light conductor, and the terminal part 202 of light-guide device 200 is in coniform groove.Therefore, laser equipment 300 is to be incident in light-guide device 200 by laser beam 301, and then is transferred to the reflecting surface 203 of light-guide device 200.
Then, following the explanation of a structure technology feature will be done for the circuit board 100 shown in Figure 12.Wherein, owing to many structures are mentioned in above-mentioned manufacture method, therefore, part something in common is then no longer repeated.Described circuit board 100 includes a perforation hole wall 1 and the conductive layer 22 being formed on perforation hole wall 1.Wherein, above-mentioned conductive layer 22 is formed with the breach 223 making part perforation hole wall 1 expose, and conductive layer 22 is separated into two conductive parts 222 through breach 223.
[the possible effect of the embodiment of the present invention]
In sum, processing method in the hole of the circuit board that the embodiment of the present invention provides, it is through utilizing coordinating of light-guide device and laser beam, and be processed in the perforation of circuit board, so that the conductive layer on the perforation hole wall of circuit board can be separated into two conductive parts, processing mode and made circuit board in a kind of hole different from the past of offer is provided, and then overcomes the limitation commonly using back drill mode.
Furthermore, owing to the conductive layer on the perforation hole wall of circuit board can be separated into several conductive part, and above-mentioned conductive part can be each provided with the function of conducting, uses and reaches save processing cost and increase the effect of wiring density.
The foregoing is only the preferably possible embodiments of the present invention, its scope of the claims being also not used to limit to the present invention, all equalizations done according to the present patent application the scope of the claims change and modify, and all should belong to the covering scope of the present invention.
[symbol description]
[known]
100a circuit board
1a plate
11a perforation
Sunken cord in 12a road
13a holes
2a conductive layer
IAMake streaming current
IBLoss electric current
[embodiment of the present invention]
100 circuit boards
1 perforation hole wall
11 recesses
2 cover layers
21 through holes
211 first openings
212 second openings
22 conductive layers
221 predetermined removal positions
222 conductive parts
223 breach
23 shielding layers
231 predetermined removal positions
232 breach
3 supplement conductive layers
200 light-guide devices
201 bodies
202 terminal parts
203 reflectings surface
300 laser equipment
301 laser beams.
Claims (9)
1. processing method in the hole of a circuit board, it is characterised in that including:
One circuit board is provided；Wherein, this circuit board is formed with a perforation hole wall, and this circuit board has the cover layer being formed on this perforation hole wall, and this cover layer surrounds and defines a through hole, and this cover layer includes a predetermined removal position；
The light-guide device that one external form corresponds roughly to this through hole inserts the through hole of this circuit board；Wherein, a terminal part of this light-guide device being placed in this through hole is provided with a reflecting surface；
The predetermined removal position of this cover layer is adjusted to this reflecting surface orthographic projection within the region that this perforation hole wall is formed；And
A laser beam is launched towards the through hole of this circuit board, this laser beam is made to be transferred on the reflecting surface of this light-guide device, and make this laser beam turn to the predetermined removal position being radiated at this cover layer via the reflecting surface of this light-guide device, and then remove this cover layer at least part of predetermined removal position.
2. processing method in the hole of circuit board according to claim 1, wherein, this cover layer is a conductive layer；In the step launching this laser beam towards the through hole of this circuit board, continue to launch this laser beam, until the predetermined removal position of this conductive layer is completely removed, and make this conductive layer form two conductive parts being separated from each other.
3. processing method in the hole of circuit board according to claim 2, wherein, after this conductive layer forms this two conductive part being separated from each other, at least one enforcement plating of this two conductive part, to form a supplement conductive layer；Wherein, the gross thickness of both conductive parts that this supplement conductive layer is accompanying with it is a predetermined thickness.
4. processing method in the hole of circuit board according to claim 3, wherein, the material of this conductive layer is same as the material of this supplement conductive layer.
5. processing method in the hole of circuit board according to claim 1, wherein, this cover layer includes a conductive layer and a shielding layer, and this conductive layer is formed on this perforation hole wall, and this shielding layer is formed on this conductive layer and surrounds and defines this through hole；In the step launching this laser beam towards the through hole of this circuit board, continue to launch this laser beam, until the predetermined removal position of this shielding layer is completely removed, so that outside the predetermined removal position of this conductive layer is exposed to；The predetermined removal position of this conductive layer is etched, so that this conductive layer forms two conductive parts being separated from each other with an etching solution.
6. processing method in the hole of circuit board according to claim 5, wherein, the thickness of this conductive layer is a predetermined thickness；After this conductive layer forms this two conductive part being separated from each other, remove this shielding layer.
7. processing method in the hole of circuit board according to any one of claim 1 to 6, wherein, this terminal part of this light-guide device is cone, and this cover layer surrounds definition and has one first opening and one second opening that are positioned at this through hole two opposite sides；This light-guide device is the through hole inserting this circuit board via this first opening, and this laser beam is the through hole being incident to this circuit board via this second opening.
8. processing method in the hole of circuit board according to any one of claim 1 to 6, wherein, this light-guide device is transparent light conductor, and this light-guide device terminal part is coniform groove；This laser beam is incident in this light-guide device, and then is transferred to the reflecting surface of this light-guide device.
9. circuit board made by processing method in the hole of the circuit board described in a basis such as claim 2 or 5, it is characterised in that including:
One perforation hole wall；And
One conductive layer, it is formed on this perforation hole wall, and this conductive layer is formed with the breach making this perforation hole wall of part expose, and this conductive layer is separated into two conductive parts through this breach.
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| CN201410853173.8A CN105813404B (en) | 2014-12-31 | 2014-12-31 | Processing method and its made circuit board light-guide device in the hole of circuit board |
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| CN201410853173.8A CN105813404B (en) | 2014-12-31 | 2014-12-31 | Processing method and its made circuit board light-guide device in the hole of circuit board |
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| CN105813404B CN105813404B (en) | 2018-07-06 |
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| WO2019003016A1 (en) * | 2017-06-28 | 2019-01-03 | International Business Machines Corporation | Forming conductive vias using a light guide |
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| CN110710339A (en) * | 2017-06-28 | 2020-01-17 | 国际商业机器公司 | Forming conductive vias with light guides |
| GB2579456A (en) * | 2017-06-28 | 2020-06-24 | Ibm | Forming conductive vias using a light guide |
| US10712664B2 (en) | 2017-06-28 | 2020-07-14 | International Business Machines Corporation | Forming conductive vias using a light guide |
| GB2579456B (en) * | 2017-06-28 | 2022-01-26 | Ibm | Forming conductive vias using a light guide |
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| CN105813404B (en) | 2018-07-06 |
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