CN105813377A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN105813377A CN105813377A CN201610299062.6A CN201610299062A CN105813377A CN 105813377 A CN105813377 A CN 105813377A CN 201610299062 A CN201610299062 A CN 201610299062A CN 105813377 A CN105813377 A CN 105813377A
- Authority
- CN
- China
- Prior art keywords
- ennation
- printed substrate
- mainboard
- substrate according
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The invention provides a printed circuit board. The printed circuit board comprises a mainboard, wherein an installation surface and a bottom surface are arranged on the mainboard, the installation surface is used for installing a component, bonding pads are arranged on the bottom surface, a power supply layer and a grounding layer are arranged between the installation surface and the bottom surface and are isolated from each other, and an extension body is further arranged on the printed circuit board, is connected with the grounding layer and extends to one side, far away from the installation surface, of the bottom surface. With the adoption of the above scheme, the extension body connected with a conductive layer is designed, thus, heat of the conductive layer can be dissipated through the extension body, a better cooling effect is achieved, and the printed circuit board can bear more components with higher density.
Description
Technical field
The present invention relates to PCB field, in particular, a kind of printed substrate.
Background technology
PCB(PrintedCircuitBoard, printed substrate) it is important electronic unit, it is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Owing to it is to adopt electron printing to make, therefore it is referred to as circuit " printing " plate or circuit " printing " plate.After electronic equipment adopts printed board, concordance due to similar printed board, thus avoiding the mistake of artificial wiring, and the automatic plug-in mounting of electronic devices and components or attachment, automatic tin soldering can be realized, automatically detect, ensure that the quality of electronic equipment, improve labor productivity, reduce cost, and be easy to maintenance.
But, how PCB is carried out innovative design, is still the technical issues that need to address.
Summary of the invention
The technical problem to be solved is to provide a kind of new printed substrate.
Technical scheme is as follows: a kind of printed substrate, it includes mainboard；Described mainboard is provided with installed surface and bottom surface, and described installed surface is used for mounting related components, and described bottom surface is provided with pad, arranges bus plane and the ground plane of mutually insulated between described installed surface and described bottom surface；Also setting up ennation, described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.
Preferably, described bottom surface arranges multiple described pad, and described ennation electrically connects setting with at least one described pad of described bottom surface.
Preferably, described ennation connects the ground wire of described printed substrate.
Preferably, described printed substrate is additionally provided with the first insulation net being coated with described ennation, is used for isolating described ennation.
Preferably, the screening area of described insulation net is less than 0.5 square millimeter.
Preferably, described printed substrate arranges multiple described ennation.
Preferably, described printed substrate is additionally provided with the second insulation net being coated with whole described ennations, is used for isolating whole described ennation.
Preferably, described ennation is cylinder, prism or pyramid.
Preferably, the height of described ennation is less than 1 centimetre.
Preferably, described ennation is flake, and its thickness is less than 100 microns.
Adopting such scheme, the present invention is by designing the ennation being connected with conductive layer so that the heat of conductive layer can be distributed by ennation, thus having reached better radiating effect so that printed substrate can carry the greater number components and parts that density is bigger.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of one embodiment of the invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail, the following examples can combine use, and, the available various forms of the present invention realizes, it is not limited to this specification each specific embodiment described, it is provided that the purpose of these embodiments is that the disclosure is more thoroughly readily appreciated all sidedly.Needing further exist for illustrating, when a certain structure is fixed on another structure, including this structure being directly or indirectly fixed on this another structure, or this structure being fixed on this another structure by other intermediate structures one or more.When a structure connects another structure, including this structure being directly or indirectly connected to this another structure, or this structure is connected to this another structure by other intermediate structures one or more.Further, described "and/or" include " with " with the two kinds possible embodiment of "or".
One example of the present invention is, as it is shown in figure 1, a kind of printed substrate, it includes mainboard；Described mainboard is provided with installed surface 100 and bottom surface 200, and described installed surface is used for mounting related components, and described bottom surface is provided with pad, arranges bus plane 300 and the ground plane 500 of mutually insulated between described installed surface and described bottom surface；Also setting up ennation 600, described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.Insulating barrier 400 it is provided with between bus plane and ground plane.
Such as, a kind of printed substrate, it includes mainboard；Described mainboard is provided with installed surface and bottom surface, for instance, described mainboard is lamina, and its one side is for externally display or shows or is installed on the installed surface above installation site, and another side is externally do not show or toward the bottom surface of installation site；Described installed surface is used for mounting related components, and described bottom surface is provided with pad, arranges bus plane and the ground plane of mutually insulated between described installed surface and described bottom surface.Pad is namely for the grommet of welding component pin.And for example, described installed surface and described bottom surface are provided with pad.Described pad connects described bus plane or described ground plane, for instance, at least one described pad connects described bus plane, and, at least one described pad connects described ground plane.
And for example, described mainboard is doubling plate or multi-layer sheet, and its one side is for externally display or shows or is installed on above installation site, and for described installed surface, another side is externally do not show or toward the bottom surface of installation site；At least one of which conductive layer is set between described installed surface and described bottom surface；Conductive layer includes bus plane and ground plane.It is provided with interval, for instance a plate between each layer conductive layer；Such as, arranged by described spacer insulator between each layer conductive layer.And for example, arranging at least one of which bus plane and at least one of which ground plane between described installed surface and described bottom surface, each layer bus plane is electrically connected to each other, and each layer ground plane is electrically connected to each other, arbitrary described bus plane is arranged with the insulation of each described ground plane, and arbitrary described ground plane is arranged with the insulation of each described bus plane.
Such as, described printed substrate includes mainboard；Described mainboard is provided with installed surface and bottom surface.Such as, described printed substrate also sets up ennation, and described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.So, by designing the ennation being connected with ground plane so that the heat of ground plane can be distributed by ennation, thus having reached better radiating effect so that printed substrate can carry the greater number components and parts that density is bigger.Such as, described ground plane and each described ennation are wholely set, and namely the extended each described ennation of described ground plane extremely described bottom surface is away from the side of described installed surface；And for example, having more grounded layers, in each described ennation, some described ennations and one layer of ground plane are wholely set, and some described ennations and another layer of ground plane are wholely set, by that analogy.And for example, having ground plane described in three layers, in each described ennation, some described ennations and ground floor ground plane are wholely set, and some described ennations and second layer ground plane are wholely set, and remain described ennation and are wholely set with third layer ground plane.
In order to realize heat-transfer effect better, it is preferred that described bottom surface arranges multiple described pad, and described ennation electrically connects setting with at least one described pad of described bottom surface.And/or, described ennation connects the ground wire of described printed substrate.Such as, pad described in the one of each described ennation and described bottom surface is connected setting, and and for example, each described pad of described bottom surface connects ennation described in respectively.Such as, in each described ennation, each described ennation be at least connected with described bottom surface one described in pad, and each described pad of described bottom surface connects ennation described in.Described connection, connects including contact or wire, as such, it is possible to the heat of pad is dispelled the heat by ennation.Preferably, described bottom surface arranges multiple described pad, and wherein some described pads are the ground pad for ground connection, and namely it connects ground wire；Described ennation is connected setting with at least one described ground pad of described bottom surface.Such as, in each described ennation, each described ennation be at least connected with described bottom surface one described in ground pad, and each described ground pad of described bottom surface connects ennation described in.And for example, described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.And for example, described ground pad is connected with described ground plane.
In order to avoid conduction or appearance are unexpected, it is preferred that described printed substrate is additionally provided with the first insulation net being coated with described ennation, is used for isolating described ennation.Preferably, the screening area of described insulation net is less than 0.5 square millimeter.In order to realize heat-transfer effect better, it is preferred that described printed substrate arranges multiple described ennation.Preferably, described printed substrate is additionally provided with the second insulation net being coated with whole described ennations, is used for isolating whole described ennation.And for example, described printed substrate also sets up the second insulation net for isolating whole described ennation, and each described ennation is each passed through a grid of described second insulation net.Having such as, array arranges some described ennations, and isolates whole described ennations by described second insulation net.Such as, described second insulation net has " well " glyph grid, and described ennation is four prisms cylinder, and its cross section is slightly less than the grid of described second insulation net, so that each described ennation is each passed through a grid of described second insulation net.
In order to realize heat-transfer effect better, it is preferred that described ennation is cylinder, prism or pyramid.And/or, the height of described ennation is less than 1 centimetre.Or, described ennation is flake, and its thickness is less than 100 microns.Such as, arranging multiple flake ennation, each flake ennation interval is arranged.And for example, the ennation that multiple height is 0.5 to 0.8 centimetre is set.Such as, array arranges multiple described ennation.
In order to obtain better radiating effect, for instance, it is additionally provided with fan, is used for accelerating heat loss through convection.Preferably, it is additionally provided with the wind guide tank of the air outlet connecting described fan, for controlling the air-out direction of described fan so that heat loss through convection effect is higher.Such as, the air-out groove mouthpiece of described wind guide tank has rectangular shape or annular shape, for instance form " a returning " font, it is preferred that the air-out notch of described wind guide tank is arranged at the marginal position of described mainboard or arranges near the marginal position of described mainboard.Such as, the air-out notch of described wind guide tank is arranged at the marginal position of the described bottom surface of described mainboard or the marginal position setting near the described bottom surface of described mainboard.
In order to realize the design of stereosopic printing wiring board, and more components and parts are set to form stereo circuit structure, for instance, described printed substrate also sets up bending structure, described bending structure includes side plate and kink, and described side plate is fixed on described mainboard by described kink.So, by designing the bending structure being fixed on mainboard, define the stereosopic printing wiring board being easily achieved, such that it is able to arrange various components and parts on mainboard and side plate, this stereosopic printing wiring board basis is advantageously implemented further innovative design.
Such as, described kink is compliant member, for instance, described kink is rubber part；And for example, a part for described kink is compliant member, for instance, a part for described kink is rubber part；Such as, described kink includes intermediate structure and both ends structure, and end construction is compliant member, for instance it is rubber part.And/or, described bending structure also includes the extension for dispelling the heat.Such as, described printed substrate is metal core board, and the bending of described metal core board is arranged, and a part is described mainboard, and a part is described side plate, and part is described kink therebetween.Such as, described printed substrate is aluminum central layer or copper core plate.And for example, the metal-cored extension dew of described metal core board is put, and forms described extension.And for example, the metal-cored extension dew of described metal core board is put and has some breach, forms some described extensions, each discontinuous setting of described extension.
In order to avoid interfering or contact between each onboard components and parts, for instance, described side plate forms 80 ~ 120 degree of angles with described mainboard.Preferably, described side plate forms 90 ~ 100 degree of angles with described mainboard.Such as, described side plate forms an angle of 90 degrees with described mainboard.
For the ease of manufacturing, it is preferred that described bending structure is one-body molded with described mainboard.Such as, plate body bending being designed, a part is described mainboard, and a part is described side plate, and part is described kink therebetween.In order to avoid interfering or contact between each onboard components and parts, it is preferred that described kink is arc or L-shaped.Such as, described kink is arc and its radian is 1 to 1.35.For adapting to innovation and the manufacture of various industrialization product, it is preferred that arrange bending structure described in two groups.And for example, bending structure described in a group is only set.And for example, bending structure described in four groups is set.
For the ease of manufacturing, it is preferred that described mainboard is rectangle.Preferably, bending structure described in two groups is respectively arranged at the both sides that described mainboard is adjacent.Or, bending structure described in two groups is respectively arranged at the both sides that described mainboard is relative.Preferably, bending structure described in two groups is symmetrical arranged.
In order to be conducive to innovative design and be easy to manufacture, for instance, described printed substrate also sets up splice plate, and described mainboard has splice bits, and described splice plate has stitching section, and described splice plate is fixed on the described splice bits of described mainboard by described stitching section.So, by designing the splice plate being fixed on mainboard, improve the autgmentability of printed substrate, at plane space or solid space, mainboard can be carried out splicing to extend, such that it is able to arrange various components and parts on mainboard and splice plate, extend at this on printed wire plate base and be advantageously implemented further innovative design.
In order to realize various splicing design, it is preferred that described splice plate and described mainboard are generally aligned in the same plane.Or, described splice plate forms 60 ~ 150 degree of angles with described mainboard.Such as, described splice plate forms 80 ~ 100 degree of angles with described mainboard.Such as, described splice plate forms an angle of 90 degrees with described mainboard.For the ease of realizing quick and effectively splicing, it is preferred that described stitching section is spirally connected or snapping is fixed on described splice bits.Or, described stitching section interference fit is fixed on described splice bits.
In order to obtain the convenient performance of splicing better and improve the alternative of splicing, it is preferred that described splice plate has multiple described stitching section, and described mainboard arranges the described splice bits of multiple correspondence.Preferably, described printed substrate arranges two described splice plates.Preferably, two described splice plates are symmetrical arranged relative to described mainboard.Preferably, described printed substrate arranges splice plate described at least three, and described mainboard splices multiple described splice plate respectively.
For reaching illuminating effect, for instance, it is additionally provided with LED, forms a LED light device.Such as, described LED is arranged at described installed surface and is connected at least one described pad.Preferably, multiple described LED is set.
In order to reach good illuminating effect, it is preferred that multiple described LED arrange line by line.Such as, multiple described LED are arranged as two row.Or, multiple described LED are arranged as three row.
In order to reach good brightness of illumination, it is preferred that described LED is high-powered LED lamp.For avoiding light excessively to concentrate, it is preferred that the light-emitting area of described high-powered LED lamp is provided with diffusing structure, and described diffusing structure is fixed on described installed surface.Such as, described diffusing structure is writing board shape.And/or, described diffusing structure is part spherical in shape.And/or, described diffusing structure arranges some waveform grooves, and each described waveform groove is asymmetric and non-interconnected is arranged.Such as, unordered some waveform grooves are set；And for example, each described waveform groove arranges inlay in some Part-spherical.And for example, each described waveform groove is annular.And for example, each described waveform groove is increased radioactivity.As such, it is possible to reach good light scatter effect.
In order to avoid light direct irradiation, improve dispersion effect, it is preferred that described LED light device also sets up lampshade, and its cover sets described mainboard.In order to improve radiating effect, it is preferred that described lampshade arranges thermal vias.Such as, described lampshade arranges multiple described thermal vias.Such as, described thermal vias is circular or cylindrical.And/or, described lampshade arranges heat radiation groove.Preferably, described lampshade arranges multiple described heat radiation groove.Such as, described heat radiation groove is strip or prismatic.
In order to avoid light direct irradiation, improve dispersion effect, it is preferred that described lampshade arranges scattering layer.Preferably, described scattering layer has some cavity body.Such as, described cavity body is not vacuum, has gas inside it；And for example, described cavity body is that injected gas body is formed.Such as, described gas is air or nitrogen.Preferably, described cavity body is randomly provided.Or, described cavity body is uniformly arranged.So, both improved dispersion effect, and be easy to again produce.
For the ease of installing, it is preferred that described LED light device also sets up support, and described mainboard is fixed on described support.Preferably, described support arranges mounting groove, and described mounting groove is fixed in described mainboard grafting.Such as, described support arranges pair of parallel described mounting groove.
For ease of fixing splice plate, it is preferred that described support is extended supporting construction also, described supporting construction is away from the described splice plate of the fixing connection in end of described support.Such as, described splice plate is fixedly attached to few two described supporting constructions.Preferably, described LED light device arranges multiple described splice plate, and described support is extended multiple supporting construction also, and each described supporting construction is fixing connects splice plate described in.Preferably, described supporting construction has the inner cavity of hollow.Preferably, described supporting construction is spirally connected with described splice plate away from the end of described support.Preferably, described supporting construction is away from end and the described splice plate grafting of described support.
Further, embodiments of the invention also include, each technical characteristic of the various embodiments described above, the printed substrate being mutually combined formation or the illuminator with described printed substrate or have the LED light device of described printed substrate.
It should be noted that above-mentioned each technical characteristic continues to be mutually combined, form various embodiments not enumerated above, be accordingly to be regarded as the scope that description of the present invention is recorded；Further, for those of ordinary skills, it is possible to improved according to the above description or convert, and all these improve and conversion all should belong to the protection domain of claims of the present invention.
Claims (10)
1. a printed substrate, it is characterised in that include mainboard；
Described mainboard is provided with installed surface and bottom surface, and described installed surface is used for mounting related components, and described bottom surface is provided with pad, arranges bus plane and the ground plane of mutually insulated between described installed surface and described bottom surface；
Also setting up ennation, described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.
2. printed substrate according to claim 1, it is characterised in that described bottom surface arranges multiple described pad, and described ennation electrically connects setting with at least one described pad of described bottom surface.
3. printed substrate according to claim 2, it is characterised in that described ennation connects the ground wire of described printed substrate.
4. printed substrate according to claim 1, it is characterised in that described printed substrate is additionally provided with the first insulation net being coated with described ennation, is used for isolating described ennation.
5. printed substrate according to claim 4, it is characterised in that the screening area of described insulation net is less than 0.5 square millimeter.
6. printed substrate according to claim 1, it is characterised in that described printed substrate arranges multiple described ennation.
7. printed substrate according to claim 6, it is characterised in that described printed substrate is additionally provided with the second insulation net being coated with whole described ennations, is used for isolating whole described ennation.
8. printed substrate according to claim 1, it is characterised in that described ennation is cylinder, prism or pyramid.
9. printed substrate according to claim 8, it is characterised in that the height of described ennation is less than 1 centimetre.
10. printed substrate according to claim 1, it is characterised in that described ennation is flake, and its thickness is less than 100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610299062.6A CN105813377A (en) | 2016-05-09 | 2016-05-09 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610299062.6A CN105813377A (en) | 2016-05-09 | 2016-05-09 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105813377A true CN105813377A (en) | 2016-07-27 |
Family
ID=56456439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610299062.6A Pending CN105813377A (en) | 2016-05-09 | 2016-05-09 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105813377A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050046011A1 (en) * | 2003-07-07 | 2005-03-03 | Board Of Regents, The University Of Texas System | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| CN1725930A (en) * | 2005-04-15 | 2006-01-25 | 杭州华为三康技术有限公司 | Printed circuit board |
| CN101322450A (en) * | 2006-06-16 | 2008-12-10 | 香港应用科技研究院有限公司 | IC packages with internal heat dissipation structures |
| CN204349040U (en) * | 2015-02-07 | 2015-05-20 | 杭州神弓电子实业有限公司 | Binding post |
| CN205657909U (en) * | 2016-05-09 | 2016-10-19 | 江苏大泽包装有限公司 | A printed circuit board |
-
2016
- 2016-05-09 CN CN201610299062.6A patent/CN105813377A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050046011A1 (en) * | 2003-07-07 | 2005-03-03 | Board Of Regents, The University Of Texas System | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
| CN1725930A (en) * | 2005-04-15 | 2006-01-25 | 杭州华为三康技术有限公司 | Printed circuit board |
| CN101322450A (en) * | 2006-06-16 | 2008-12-10 | 香港应用科技研究院有限公司 | IC packages with internal heat dissipation structures |
| CN204349040U (en) * | 2015-02-07 | 2015-05-20 | 杭州神弓电子实业有限公司 | Binding post |
| CN205657909U (en) * | 2016-05-09 | 2016-10-19 | 江苏大泽包装有限公司 | A printed circuit board |
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Application publication date: 20160727 |
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