CN105810523A - Heat element structure of releaser of circuit breaker - Google Patents
Heat element structure of releaser of circuit breaker Download PDFInfo
- Publication number
- CN105810523A CN105810523A CN201610389543.6A CN201610389543A CN105810523A CN 105810523 A CN105810523 A CN 105810523A CN 201610389543 A CN201610389543 A CN 201610389543A CN 105810523 A CN105810523 A CN 105810523A
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- CN
- China
- Prior art keywords
- thermal element
- element body
- heat element
- bimetal leaf
- root
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H71/00—Details of the protective switches or relays covered by groups H01H73/00 - H01H83/00
- H01H71/10—Operating or release mechanisms
- H01H71/12—Automatic release mechanisms with or without manual release
- H01H71/14—Electrothermal mechanisms
- H01H71/16—Electrothermal mechanisms with bimetal element
- H01H71/164—Heating elements
Abstract
The invention discloses a heat element structure of a releaser of a circuit breaker, and belongs to the technical field of molded case circuit breakers.The heat element structure comprises a heat element body and a bimetal sheet.Heat can be generated by the heat element body when currents flow through the heat element body, and can be detected by the bimetal sheet, the heat element body is electrically connected with a circuit conductor of the circuit breaker, and a bimetal sheet root of the bimetal sheet is connected with a heat element body root of the heat element body in an adhesion manner.The heat element structure has the advantages that the problem of influence on action characteristics of existing bimetal sheets due to mechanical connection modes including welding, riveting and threaded connection in the prior art can be solved; requirements on flexible selectivity in actual production procedures can be met; adhesion connection is excellent in correction, accordingly, batch loss due to welding and riveting errors in the prior art can be prevented, resource wastage can be prevented, and the heat element structure is economically efficient; the heat element structure is favorable for improving the assembly consistency and increasing the characteristic detection qualification rate.
Description
Technical field
The invention belongs to breaker of plastic casing technical field, be specifically related to the thermal element structure of a kind of circuit breaker release.
Background technology
As is known in the industry, chopper be a kind of not only can close, carry and cut-off the electric current under normal loop but also can close, carrying cut-off the switching device of electric current under abnormal loop condition within the time of regulation.The major function of electrical apparatus release is: the period internal trigger tripgear of regulation after the overcurrent rated current scope beyond chopper and use and automatically cut off faulty circuit, dangerous to avoid damaging even initiation fire with electric line and relevant device.
In the structural system of the thermal element of circuit breaker release, why the application of bimetal leaf relatively has typicality, it is because utilizing its intrinsic heated bending (also referred to as " deformation ") and produces thrust (such as triggering the physical characteristic that electrical apparatus release is threaded off) and carry out the difference that the caloric value of discriminating cut-out faulty circuit is different from the caloric value of normal circuit, and this physical characteristic based on bimetal leaf, when respective circuit breakers product standard allows, change the serial relation of bimetal leaf and chopper return conductors, the protection requirement to different protection features can be met.
Aforesaid thermal element structure includes thermal element body and bimetal leaf (also referred to as " bimetallic element ", as follows), thermal element body and aforesaid chopper return conductors electrical ties, bimetal leaf and this mates of thermal element.The coupled structure of bimetal leaf and thermal element body mainly has three kinds: one to be direct-heating type structure；Two is indirect heating type structure；Three is compound-heating structure.In aforesaid three kinds of structures, coordinating of bimetal leaf and thermal element body commonly used is welded, riveted joint and threaded in any one.
The thermal element structure chart of the circuit breaker release that Fig. 1 show in prior art, bimetal leaf 2 including the thermal element body 1 and detection heat that produce heat when flowing through electric current, the base portion (bottom shown in Fig. 1) of bimetal leaf 2 and thermal element body 1 realizes physical connection (being namely mechanically connected) with aforementioned chopper return conductors 3 three by welding manner, specifically, thermal element body root 11 solid welding of the bimetal leaf root 21 of bimetal leaf 2 side towards thermal element body 1 and thermal element body 1, and the bimetal leaf electricity root 21 of bimetal leaf 2 is towards side and chopper return conductors 3 solid welding of chopper return conductors 3.Although the thermal element structure of the circuit breaker release of this form disclosure satisfy that the functional requirement that applicant is mentioned above, but owing to have employed welding, thus there is following shortcoming: one, due in welding process bimetallic sector-meeting because of welding time shock heating and produce certain change in physical properties, even there is differential annealing situation, thus the acting characteristic of bimetal leaf is produced impact；They are two years old, owing to thermal element body 1, bimetal leaf 2 and chopper return conductors 3 three show as permanent connection, thus once mistake weldering occur or being unsatisfactory for the situation that welding quality requires, then process only as scrap because (dismemberent) cannot be dismantled, cause the wasting of resources on the one hand, increase manufacturing cost on the other hand；They are three years old; owing to the quality of welding is relevant to parts properties of materials; again owing to the specification of thermal element body 1 and bimetal leaf 2 is that needed for reaching chopper with the form of variation combination, protection feature requires; therefore the quality of welding quality can affect product quality equally; they are four years old; owing to have employed welding, thus not only efficiency is low, and needs to consume the auxiliary material (solder) of welding.
The thermal element structure chart of the another form of circuit breaker release that Fig. 2 show in prior art, including thermal element body 1 and bimetal leaf 2, the bimetal leaf root 21 of bimetal leaf 2 is riveted by rivet 211 and thermal element body 1.This structure can avoid the quality fluctuation of shock heating initiation electrical apparatus release when welding for Fig. 1 welding adopted, but there is following shortcoming: one, when adopting rivet 211 to rivet, rivet 211, bimetal leaf 2 and thermal element body 1 can produce riveting pressure, specifically, at riveting location, bimetal leaf 2 can be produced bigger local pressure by rivet 211；Thus affecting the action effect of the heated bending deformation of bimetal leaf 2；They are two years old, owing to thermal element body 1, bimetal leaf 2 etc. are by the impact of crudy, thus the planarization at riveted joint position produces difference, and then bimetal leaf 2 is after staking easily around riveted joint fulcrum bending, thus affecting circuit breaker characteristic detection concordance fluctuation, say, that affect accuracy of detection；Its three, equally exist aforementioned welding second point shortcoming.
Now analyze in the way of bimetal leaf adopts heating indirectly with thermal element body: analyze from the physical connection reliability perspectives between part: welding optimum, riveted joint is taken second place, threaded worst.From processes angle analysis: spiral marking connection efficiency optimization, riveted joint is taken second place, and welds worst.Analyze from part efficiency of assembling: threaded to relate to operation minimum, but joint efficiency is low and is difficult to ensure that with quality of connection (bond strength) concordance, weld and compare high with the parts efficiency of assembling after riveted joint, but once there is mistake in riveted joint, welding, faulty part and the loss that causes is big.Additionally adopt the residual stress that all can there is processing in the bimetal element after the processing of these three connected mode; residual stress records due to bad measurement; so the concordance of the overload protection characteristics inspection of chopper can produce diversity; add product adjustment, amount of testing; undoubtedly that production efficiency is unfavorable, in a disguised form add production cost.
It addition, chopper is in the design process, due to the diversity that the designing and calculating to heat generation characteristic is relatively larger with physical presence.And transship long delay protection exactly make use of the protection feature of electric current-heat realize protection.According to the different current specification that chopper is protected, the bimetal leaf of the thermal element and different size that generally require different resistivity carry out coupling realize characteristic protection.This just need to do substantial amounts of different tests, in order to verifies which bi-material coupling of employing is only rational situation.According to the mode of riveted joint or welding, this undoubtedly can problem on generation efficiency.In the process that conventional batch produces, if material is wrong, causes bimetal piece to be riveted with thermal element body and weld generation mispairing it is possible to scrap in batch.Further, owing to the processing in riveted joint, welding process makes bimetal leaf there occurs deformation, causing into platform examination and test of products qualification rate low, such problem not only causes part loss to have an effect on normal production.
Can being seen in the technical information of thermal element structure in disclosed Chinese patent literature, as CN204905192U recommendation has " the Thermal protection mechanism of a kind of chopper ", thermal element body and bimetal leaf have employed riveted joint (description the 0019th to 0022 section)；And for example CN20405524U is provided with " thermal element assembly ", its technical scheme includes: thermal element body, thermal element body include fixture and movable part, fixture is hinged with movable part, and thermal element body abuts with bimetal leaf, and movable part is connected with bimetal leaf sliding.It is technically characterized in that: make that bimetal leaf is hinged with movable part all the time in BENDING PROCESS to be contacted, by movable part, the heat of thermal element body is passed to bimetal leaf, to reduce the temperature ladder height between thermal element body and bimetal leaf, improve the reliability of acting characteristic.From this patent specification content, owing to movable part and bimetal leaf, thermal element body form the relation of mutually hinged assembling, thus say from engineering significance, there is between movable part and bimetal leaf the anxiety of jam between jam and movable part and thermal element body in this version.
For above-mentioned prior art, it is necessary to rational modification in addition, do useful design for this applicant and defined technical scheme described below.
Summary of the invention
The task of the present invention is in that to provide one not only can to ensure overload long delay protection characteristic but also can simplify structure, and meets Automated assembly and hand assembled requires and uses the thermal element structure of the selective flexibly circuit breaker release embodied in production process simultaneously.
The task of the present invention is performed by, a kind of thermal element structure of circuit breaker release, bimetal leaf including the thermal element body and detection heat that produce heat when flowing through electric current, thermal element body electrically connects with chopper return conductors, the bimetal leaf root of bimetal leaf is connected with the thermal element body root of thermal element body, and described bimetal leaf root is connected for bonding connection with described thermal element body root.
In a specific embodiment of the present invention, the bimetal leaf root of described bimetal leaf passes through conductive adhesion layer and the described thermal element body root side bonding connection towards bimetal leaf towards the side of described thermal element body.
In another specific embodiment of the present invention, described conductive adhesion layer is high temperature resistant conductive bond oxidant layer.
In another specific embodiment of the present invention, described high temperature resistant conductive bond oxidant layer is graphite conductive adhesive, silver conductive adhesive or Signa Gel.
One of technique effect of technical scheme provided by the invention, due to the bonding connection that on-mechanical connects that has been connected by by bimetal leaf base portion with thermal element body base, thus avoid the impact causing the acting characteristic on bimetal leaf in prior art because adopting welding, riveted joint or threaded mechanical connection manner；Two, owing to bonding connection is for the strong adaptability of Automated assembly and hand assembled, thus the flexible selectivity requirement in actual production process can be met；Four, due to bonding connection have good can corrective, thus be avoided that and be possible not only to the batch loss that the welding in prior art, riveted joint mistake cause prevent the wasting of resources, and economy can be embodied；Five, be conducive to improving the qualification rate of concordance and the Characteristics Detection of assembling.
Accompanying drawing explanation
Fig. 1 is the thermal element structure chart of the circuit breaker release in prior art.
Fig. 2 is the thermal element structure chart of the another form of circuit breaker release in prior art.
Fig. 3 is the embodiment figure of the thermal element structure of circuit breaker release of the present invention.
Detailed description of the invention
Embodiment 1:
Refer to Fig. 3, illustrate that the thermal element body 1 producing heat when flowing through electric current of the thermal element structural system belonging to circuit breaker release and a bimetal leaf 2(of detection heat also can claim bimetallic element, as follows), thermal element body 1 electrically connects with the chopper return conductors 3 shown in Fig. 3, the bimetal leaf root 21(bimetal leaf root 21 of bimetal leaf 2 can be regarded as bottom or the lower end of bimetal leaf 2, as follows) can be regarded as bottom or the lower end of thermal element body 1 with the thermal element body root 11(thermal element body root 11 of thermal element body 1, as follows) it is connected.
As the technical essential of technical scheme provided by the invention, in the present embodiment, the connected mode being connected with aforementioned thermal element body root 11 by aforementioned bimetal leaf root 21 adopts bonding connection.Specifically, also can claim conductive bond oxidant layer towards the side of thermal element 1 by conductive adhesion layer 4(by the bimetal leaf root 21 of bimetal leaf 2) with the thermal element body root 11 side bonding connection towards bimetal leaf 2.
When actual assembling, first conductive adhesion layer 4 is attached to the bimetal leaf root 21 side towards thermal element body 1, first conductive adhesion layer 4 can also be attached to the thermal element body root 11 side towards bimetal leaf 2, again bimetal leaf root 21 and thermal element body root 11 are reclined, so that the side in opposite directions of bimetal leaf root 21 and thermal element body root 11 realizes electrical connection, connect owing to this connection belongs to on-mechanical, thus relative to the welding of prior art, riveted joint, will not produce in conjunction with stress between bimetal leaf 2 and thermal element body 1, will not produce to manufacture deformation to electrical apparatus release, both manufacturing cost can have been reduced, manufacture efficiency can be improved again.
In the present embodiment, aforesaid conductive adhesion layer 4 is high temperature resistant conductive bond oxidant layer, and preferably employs graphite conductive adhesive and serve as high temperature resistant conductive bond oxidant layer.
Embodiment 2:
Only using high temperature resistant conductive bond oxidant layer instead silver conductive adhesive, all the other are all with the description to embodiment 1.
Embodiment 3:
Only using high temperature resistant conductive bond oxidant layer instead Signa Gel, all the other are all with the description to embodiment 1.
In sum, technical scheme provided by the invention compensate for the shortcoming in prior art, completes invention task, has cashed the technique effect referred in the superincumbent technique effect hurdle of applicant faithfully.
Claims (4)
1.A kind of thermal element structure of circuit breaker release, bimetal leaf (2) including the thermal element body (1) and detection heat that produce heat when flowing through electric current, thermal element body (1) electrically connects with chopper return conductors (3), the bimetal leaf root (21) of bimetal leaf (2) is connected with thermal element body root (11) of thermal element body (1), it is characterised in that described bimetal leaf root (21) is connected for bonding connection with described thermal element body root (11).
2.The thermal element structure of circuit breaker release according to claim 1, it is characterised in that the bimetal leaf root (21) of described bimetal leaf (2) passes through conductive adhesion layer (4) and described thermal element body root (11) the side bonding connection towards bimetal leaf (2) towards the side of described thermal element body (1).
3.The thermal element structure of circuit breaker release according to claim 2, it is characterised in that described conductive adhesion layer (4) is high temperature resistant conductive bond oxidant layer.
4.The thermal element structure of circuit breaker release according to claim 3, it is characterised in that described high temperature resistant conductive bond oxidant layer is graphite conductive adhesive, silver conductive adhesive or Signa Gel。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610389543.6A CN105810523A (en) | 2016-06-02 | 2016-06-02 | Heat element structure of releaser of circuit breaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610389543.6A CN105810523A (en) | 2016-06-02 | 2016-06-02 | Heat element structure of releaser of circuit breaker |
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| Publication Number | Publication Date |
|---|---|
| CN105810523A true CN105810523A (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610389543.6A Pending CN105810523A (en) | 2016-06-02 | 2016-06-02 | Heat element structure of releaser of circuit breaker |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613648A (en) * | 2022-03-22 | 2022-06-10 | 浙江泰嘉和电器有限公司 | Conductive system on circuit breaker |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE399002A (en) * | ||||
| GB1130660A (en) * | 1965-12-07 | 1968-10-16 | Danfoss As | Improvements in or relating to bimetal switches |
| CN201327800Y (en) * | 2009-03-31 | 2009-10-14 | 上海电科博耳电器开关有限公司 | Alarm non-tripping device |
| CN101770906A (en) * | 2008-12-31 | 2010-07-07 | Ls产电株式会社 | Trip device |
| CN103065887A (en) * | 2013-01-09 | 2013-04-24 | 浙江天正电气股份有限公司 | Delayed tripping device of disconnector |
| CN204067262U (en) * | 2014-09-13 | 2014-12-31 | 乐清市贝瑞姆电气有限公司 | A kind of breaker of plastic casing supporter |
| CN205789806U (en) * | 2016-06-02 | 2016-12-07 | 常熟开关制造有限公司(原常熟开关厂） | The thermal element structure of circuit breaker release |
-
2016
- 2016-06-02 CN CN201610389543.6A patent/CN105810523A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE399002A (en) * | ||||
| GB1130660A (en) * | 1965-12-07 | 1968-10-16 | Danfoss As | Improvements in or relating to bimetal switches |
| CN101770906A (en) * | 2008-12-31 | 2010-07-07 | Ls产电株式会社 | Trip device |
| CN201327800Y (en) * | 2009-03-31 | 2009-10-14 | 上海电科博耳电器开关有限公司 | Alarm non-tripping device |
| CN103065887A (en) * | 2013-01-09 | 2013-04-24 | 浙江天正电气股份有限公司 | Delayed tripping device of disconnector |
| CN204067262U (en) * | 2014-09-13 | 2014-12-31 | 乐清市贝瑞姆电气有限公司 | A kind of breaker of plastic casing supporter |
| CN205789806U (en) * | 2016-06-02 | 2016-12-07 | 常熟开关制造有限公司(原常熟开关厂） | The thermal element structure of circuit breaker release |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613648A (en) * | 2022-03-22 | 2022-06-10 | 浙江泰嘉和电器有限公司 | Conductive system on circuit breaker |
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Application publication date: 20160727 |