CN105802157A - High-temperature release film and production technology thereof - Google Patents
High-temperature release film and production technology thereof Download PDFInfo
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- CN105802157A CN105802157A CN201610317172.0A CN201610317172A CN105802157A CN 105802157 A CN105802157 A CN 105802157A CN 201610317172 A CN201610317172 A CN 201610317172A CN 105802157 A CN105802157 A CN 105802157A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/04—Homopolymers or copolymers of ethene
- C08J2423/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2477/06—Polyamides derived from polyamines and polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/066—LDPE (radical process)
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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- Fluid Mechanics (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a high-temperature release film and a production technology thereof. The high-temperature release film is formed by combining two outer films and a middle film, wherein each outer film comprises an upper layer and a lower layer; the middle film is arranged between the upper outer film and the outer film; the outer film is prepared from the following components by mass fractions: 68-72% of PBT polybutylene terephthalate, 23-27% of PA66 polyamide resin, and 5% of compatilizer; the middle film is prepared from the following components by mass fractions: 78%-82% of PBT polybutylene terephthalate and 18%-22% of LDPE low-density polyethylene; the thicknesses of the upper film, the lower film and the middle film in the high-temperature release film are 30% of total thickness of the release film respectively; and the thickness of the middle film is 40% of total thickness of the release film. The release film disclosed by the invention has the characteristics of high temperature resistance, good release effect, no pollution in the laminating process and the like through reasonable distribution of the components and grasp of the technology; the qualified rate of an FPC flexible circuit board is effectively improved; the cost is reduced; and meanwhile, the clean production requirements of the FPC flexible circuit board are met, and the application prospect is wide.
Description
Technical field
The present invention relates to the auxiliary apparatus field that flexible PCB produces, particularly relate to a kind of high temperature mould release membrance suitable in flexible PCB production and production technology thereof.
Background technology
Flexible circuit board, also known as " FPC flexible board ", the printed circuit made with flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess.Such as it can free bend, winding, folding, can require arbitrarily to arrange according to space layout, and arbitrarily move at three dimensions and stretch, thus reaching components and parts assembling and the integration of wire connection.Utilize FPC flexible board can be substantially reduced the volume of electronic product, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction；Therefore, FPC flexible board is widely used on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.
At FPC flexible PCB in stitching operation, the mould release membrance of use determines the quality of lamination, and the most important processing procedure of lamination Ye ShiFPCBan factory；Therefore choosing of mould release membrance is very crucial, mould release membrance used wants high temperature resistant difficult deformation of cutting, and flatness is good, release effective.
In order to realize function above, presently relevant mould release membrance product not exclusively possesses function above, and common practices is at the one layer very thin silica gel mould release of the surface even spread of mould release membrance, in use can produce silicone oil and precipitate out, pollute circuit board；And abroad Related product carries out blockade on new techniques and expensive.
Summary of the invention
For above-mentioned Problems existing, present invention aim at providing a kind of effective, free of contamination high temperature mould release membrance suitable in flexible PCB production of bonding processes high temperature resistant, release and production technology thereof.
In order to achieve the above object, the technical solution used in the present invention is as follows: a kind of high temperature mould release membrance, described high temperature mould release membrance is combined by two-layer adventitia and one layer of interlayer film, and described adventitia includes upper and lower two-layer, and interlayer film is arranged between upper and lower two-layer adventitia.
In adventitia of the present invention, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 68～72%, PA66 polyamide 23～27%, compatilizer 5%.
The PBT polybutylene terephthalate (PBT) of the present invention is the condensation polymer of p-phthalic acid and 1,4-butanediol；It is those semi-crystalline materials, has extraordinary chemical stability, mechanical strength, electrical insulation characteristics and heat stability；Because of PBT good fluidity in the molten state, viscosity is low, and " curtain coating " phenomenon easily occurs；Therefore technical scheme is selected PBT as base material.PBT has high-fire resistance, and its fusion temperature is 225～275 DEG C；If to PBT by modified, its hot strength, bending strength are enhanced about more than once, and heat distortion temperature is greatly improved；Can long-term work at 140 DEG C.
The PA66 polyamide of the present invention is the general name of the high polymer in macromolecular main chain repetitive containing amide group；PA66 has higher fusing point in polyamide material, and it is a kind of semi-crystal-crystalline material, also can keep stronger strength and stiffness at higher temperature, heat-resist, can use of long-term phase at 150 DEG C.
In interlayer film of the present invention, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 78～82%, LDPE Low Density Polyethylene 18～22%.
LDPE Low Density Polyethylene in the present invention is with ethylene for monomer, under the high pressure of 98.0～294MPa, is initiator with oxygen or organic peroxide, the polymer of aggregated gained；It is the waxy solid resin that a kind of milky is translucent, and nontoxic, softening point is relatively low；Exceeding softening point namely to melt, its heat sealability, moulding processability are fine, and flexibility is good, and toughness, lower temperature resistance are fine.
In high temperature mould release membrance of the present invention the 30% of the thickness of upper and lower two-layer adventitia respectively mould release membrance gross thickness, the thickness of interlayer film is the 40% of mould release membrance gross thickness.
Compatilizer of the present invention is AX8900 resin, and described AX8900 resin is the terpolymer of ethylene, acrylic acid methyl ester., glycidyl methacrylate three；The AX8900 resin of the present invention utilizes high-pressure free radical polymerization technique to be fabricated by, and it is mainly used in PBT, PET, PC, PA and PBT/PC, PET/PC, uses as toughness reinforcing compatilizer；PET impact property can be modifiied, to PA66 toughening modifying.
The production technology of high temperature mould release membrance of the present invention, described production technology includes following operating procedure:
1) putting in high-speed mixer according to its mass ratio of component each in adventitia is mixed 3 times, incorporation time is 3min/ time, double screw extruder is adopted to carry out melt blending, temperature controls at 270 DEG C, screw speed is 280r/min, by the shearing of screw rod, mixing, tie rod pelletizing, standby after outer membrane granule is dried 3 hours with 140 DEG C in dehydrator；
2) putting in high-speed mixer according to its mass ratio of component each in interlayer film being mixed 3 times, incorporation time is 3min/ time, seals after preserving standby；
3) combination of three extruders and casting machine is adopted to produce, wherein extruder A and extruder C is used for carrying adventitia, extruder B is used for carrying interlayer film, the product of three extruder extrusions carries out the outer compound of film by the T-shaped mould of high temperature, then in casting machine, carry out three-layer co-extruded molding, cooling and stretching, finally by adjusting screw speed and tension adjustment, draw the product that thickness is 60～90 μm.
It operates in detail: first open the screw rod of extruder A and C, die cavity is rinsed, and opens the screw rod of extruder B, after die orifice face is smooth, open follow-up each driving drum, carry out wearing film according to Fig. 2 after die orifice face is complete；At this moment rubber roll 5 temperature controls at 30 DEG C, and format roll 6 temperature controls at 50 DEG C, and chill roll 7,8 temperature controls at 150 DEG C；Process should be observed calibrator curve, by adjusting screw speed and tension adjustment, draw the product that thickness is 60～90 μm；Face flatness can adjust bolt by die orifice and carry out leveling.
Raw materials for production PBT in adventitia of the present invention and interlayer film, needs dried before use, dry 2.5～3.5h, the humidity < 0.03% of dried raw material PBT at the temperature of 110～120 DEG C.
Raw materials for production PA66 in adventitia of the present invention, needs dried before use, by its dried 4～6h in the hot-air of 85 DEG C.
In the production process of step 3) of the present invention, the screw rod heating-up temperature of extruder A and extrusion C is 260～270 DEG C, and the temperature that casting machine collaborates device is 245～255 DEG C, and the temperature of T-shaped mould is 235～240 DEG C.
It is an advantage of the current invention that: the mould release membrance of the present invention stresses release effect operation mainly for partially flexible circuit board pressing process and uses；Wherein in adventitia, PBT is the most tough and tensile thermoplastic, the easy casting film-forming of its good fluidity, and its temperature tolerance, mechanical strength are high, and modifiying by polyamide, it is a little more prominent；And PA66 fusing point is high, at high temperature excellent intensity and rigidity, it is to avoid bonding processes is bonding with other materials, the interpolation of fibre resin, and its performance improves further, and increases its stability；PBT, PA66 can be made better to merge by compatilizer；Internal layer mainly utilizes the flexibility of LDPE, it is ensured that the pliability of thin film, and carry out adhesion by PBT molecule contained by internal layer and adventitia PBT molecule, ideally form monofilm.
The mould release membrance of the present invention has effective, the feature such as bonding processes is pollution-free high temperature resistant, release by the control of component reasonable distribution and technique, it is effectively improved the qualification rate of FPC flexible PCB and reduces cost, meet the cleaning Production requirement of FPC flexible PCB, extensive market simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation sketch of the mould release membrance of the present invention；
Fig. 2 is the device connection figure in the production technology of the present invention.
Wherein, a upper strata adventitia, b interlayer film, c lower floor adventitia, 1 extruder A screw rod, 2 extruder B screw rods, 3 extruder C screw rods, 4T mould, 5 rubber rolls, 6 format rolls, 7 chill roll A, 8 chill roll B, 9 calibrators, 10 tensioners, 11 reels.
Detailed description of the invention
Illustrate that the present invention is described in further detail with detailed description of the invention below in conjunction with accompanying drawing.
If no special instructions, the raw materials for production mentioned in following example of the present invention and plant equipment are convenient source commercially available on the market and plant equipment.
Embodiment 1: a kind of high temperature mould release membrance as shown in Figure 1, in its adventitia, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 68%, PA66 polyamide 27%, AX8900 resin 5%；In its interlayer film, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 78%, LDPE Low Density Polyethylene 22%；In described high temperature mould release membrance the 30% of the thickness of upper and lower two-layer adventitia respectively mould release membrance gross thickness, the thickness of interlayer film is the 40% of mould release membrance gross thickness.
Embodiment 2: a kind of high temperature mould release membrance as shown in Figure 1, in its adventitia, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 72%, PA66 polyamide 23%, AX8900 resin 5%；In its interlayer film, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 82%, LDPE Low Density Polyethylene 18%；In described high temperature mould release membrance the 30% of the thickness of upper and lower two-layer adventitia respectively mould release membrance gross thickness, the thickness of interlayer film is the 40% of mould release membrance gross thickness.
Embodiment 3: a kind of high temperature mould release membrance as shown in Figure 1, in its adventitia, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 70%, PA66 polyamide 25%, AX8900 resin 5%；In its interlayer film, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 80%, LDPE Low Density Polyethylene 20%；In described high temperature mould release membrance the 30% of the thickness of upper and lower two-layer adventitia respectively mould release membrance gross thickness, the thickness of interlayer film is the 40% of mould release membrance gross thickness.
Embodiment 4: as illustrated in fig. 1 and 2, the production technology of a kind of high temperature mould release membrance, described production technology includes following operating procedure:
1) by the raw materials for production PBT in adventitia of the present invention and interlayer film, dried is needed before use, dry 2.5～3.5h, the humidity < 0.03% of dried raw material PBT at the temperature of 110～120 DEG C.
2) by the raw materials for production PA66 in adventitia, dried is needed before use, by its dried 4～6h in the hot-air of 85 DEG C.
3) putting in high-speed mixer according to its mass ratio of component each in adventitia is mixed 3 times, incorporation time is 3min/ time, double screw extruder is adopted to carry out melt blending, temperature controls at 270 DEG C, screw speed is 280r/min, by the shearing of screw rod, mixing, tie rod pelletizing, standby after outer membrane granule is dried 3 hours with 140 DEG C in dehydrator；
4) putting in high-speed mixer according to its mass ratio of component each in interlayer film being mixed 3 times, incorporation time is 3min/ time, seals after preserving standby.
5) combination of three extruders and casting machine is adopted to produce, wherein extruder A and extruder C is used for carrying adventitia, extruder B is used for carrying interlayer film, the product of three extruder extrusions carries out the outer compound of film by the T-shaped mould of high temperature, then in casting machine, carry out three-layer co-extruded molding, cooling and stretching, finally by adjusting screw speed and tension adjustment, draw the product that thickness is 60～90 μm；Wherein the screw rod heating-up temperature of extruder A and extrusion C is 260～270 DEG C, and the temperature that casting machine collaborates device is 245～255 DEG C, and the temperature of T-shaped mould is 235～240 DEG C.
Adopting above-mentioned formula and method, the performance parameter of the high temperature mould release membrance finally given is as shown in the table:
。
Embodiment 5: formula contrast test；When process conditions and formula consumption are constant, each component in the formula of the present invention being carried out contrast test, the result obtained is as shown in the table:
As seen from the above table: in the adventitia of the present invention and intermediate layer, the heat resistance of product is made a difference by the content of PBT, when its content too much or less time, the final temperature tolerance of product declines, and the ratio of the interlayer film thickness in product and mould release membrance gross thickness, affect the off-type force of final products, when its thickness proportion changes, the final off-type force of product can to a certain extent, and other combination properties of product can change.
Embodiment 6: method contrast test；Formula in adopting embodiment 3, when other process conditions variablees are constant, carries out contrast test to the parameter in the production technology of the present invention, and the result obtained is as shown in the table:
As seen from the above table: whether raw material carries out drying and processing, and the flow casting molding of final products, presentation quality impact is very big；The temperature of interflow device affects the melted of plastics and plays a role, and causes that the fusing point of moulding of final products changes.
Being only presently preferred embodiments of the present invention it should be noted that above-mentioned, be not used for limiting protection scope of the present invention, combination in any made on the basis of above-described embodiment or equivalents belong to protection scope of the present invention.
Claims (6)
1. a high temperature mould release membrance, it is characterised in that described high temperature mould release membrance is combined by two-layer adventitia and one layer of interlayer film, and described adventitia includes upper and lower two-layer, and interlayer film is arranged between upper and lower two-layer adventitia；
In described adventitia, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 68～72%, PA66 polyamide 23～27%, compatilizer 5%；
In described interlayer film, the mass fraction of each component is as follows: PBT polybutylene terephthalate (PBT) 78～82%, LDPE Low Density Polyethylene 18～22%；
In described high temperature mould release membrance the 30% of the thickness of upper and lower two-layer adventitia respectively mould release membrance gross thickness, the thickness of interlayer film is the 40% of mould release membrance gross thickness.
2. high temperature mould release membrance according to claim 1, it is characterised in that described compatilizer is AX8900 resin, described AX8900 resin is the terpolymer of ethylene, acrylic acid methyl ester., glycidyl methacrylate three.
3. the production technology of once high temperature mould release membrance as claimed in claim 1, it is characterised in that described production technology includes following operating procedure:
1) putting in high-speed mixer according to its mass ratio of component each in adventitia is mixed 3 times, incorporation time is 3min/ time, double screw extruder is adopted to carry out melt blending, temperature controls at 270 DEG C, screw speed is 280r/min, by the shearing of screw rod, mixing, tie rod pelletizing, standby after outer membrane granule is dried 3 hours with 140 DEG C in dehydrator；
2) putting in high-speed mixer according to its mass ratio of component each in interlayer film being mixed 3 times, incorporation time is 3min/ time, seals after preserving standby；
3) combination of three extruders and casting machine is adopted to produce, wherein extruder A and extruder C is used for carrying adventitia, extruder B is used for carrying interlayer film, the product of three extruder extrusions carries out the outer compound of film by the T-shaped mould of high temperature, then in casting machine, carry out three-layer co-extruded molding, cooling and stretching, finally by adjusting screw speed and tension adjustment, draw the product that thickness is 60～90 μm.
4. the production technology of high temperature mould release membrance according to claim 3, it is characterized in that, raw materials for production PBT in described adventitia and interlayer film, need dried before use, dry 2.5～3.5h, the humidity < 0.03% of dried raw material PBT at the temperature of 110～120 DEG C.
5. the production technology of high temperature mould release membrance according to claim 3, it is characterised in that the raw materials for production PA66 in described adventitia, needs dried before use, by its dried 4～6h in the hot-air of 85 DEG C.
6. the production technology of high temperature mould release membrance according to claim 3, it is characterized in that, in the production process of described step 3), the screw rod heating-up temperature of extruder A and extrusion C is 260～270 DEG C, and the temperature that casting machine collaborates device is 245～255 DEG C, and the temperature of T-shaped mould is 235～240 DEG C.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273959A (en) * | 2016-08-11 | 2017-01-04 | 厦门新旺新材料科技有限公司 | Three layers of resistance glue mould release membrance |
| CN109760377A (en) * | 2018-11-22 | 2019-05-17 | 江苏大学 | A kind of high release is without compound release film of silicon and preparation method thereof |
| CN111993708A (en) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN115011277A (en) * | 2022-08-09 | 2022-09-06 | 宁波长阳科技股份有限公司 | PBT release film and preparation method and application thereof |
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| CN103144391A (en) * | 2013-03-15 | 2013-06-12 | 厦门新旺新材料科技有限公司 | Composite polyester and nylon release film |
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| US4869864A (en) * | 1987-04-08 | 1989-09-26 | Polyplastics Co., Ltd. | Method of manufacturing polybutylene terephthalate resin films |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273959A (en) * | 2016-08-11 | 2017-01-04 | 厦门新旺新材料科技有限公司 | Three layers of resistance glue mould release membrance |
| CN109760377A (en) * | 2018-11-22 | 2019-05-17 | 江苏大学 | A kind of high release is without compound release film of silicon and preparation method thereof |
| CN111993708A (en) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN111993708B (en) * | 2019-05-27 | 2023-12-05 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN115011277A (en) * | 2022-08-09 | 2022-09-06 | 宁波长阳科技股份有限公司 | PBT release film and preparation method and application thereof |
| CN115011277B (en) * | 2022-08-09 | 2022-11-15 | 宁波长阳科技股份有限公司 | PBT release film and preparation method and application thereof |
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