CN105802107A - High-temperature-resisting and creep-resisting electron carrier band sheet and preparation method thereof - Google Patents

High-temperature-resisting and creep-resisting electron carrier band sheet and preparation method thereof Download PDF

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Publication number
CN105802107A
CN105802107A CN201610197240.4A CN201610197240A CN105802107A CN 105802107 A CN105802107 A CN 105802107A CN 201610197240 A CN201610197240 A CN 201610197240A CN 105802107 A CN105802107 A CN 105802107A
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resin
temperature
creep
intermediate layer
sheet material
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CN201610197240.4A
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Chinese (zh)
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CN105802107B (en
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窦红荣
谢清龙
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Shaoguan Gaoxin Plastic Products Co ltd
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Guangdong Ditong New Material Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/141—Feedstock

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses a high-temperature-resisting and creep-resisting electron carrier band sheet which is formed by compounding an upper surface layer, a middle layer and a lower surface layer.The high-temperature-resisting and creep-resisting electron carrier band sheet is characterized in that the middle layer is composed of, by mass, 70.2-90.5% of HIPS resin, 5-25% of PPO resin, 2-4% of SEBS-g-MAH, 1-2% of SMA resin, 1-3% of black masterbatch, 0.2-0.3% of antioxidant and 0.3-0.5% of composite processing agent.A certain amount of the PPO resin is added to form a new middle layer formula, so that the temperature resistance of the electron carrier band sheet is effectively improved.Experiments prove that compared with a traditional electron carrier band sheet, the temperature resistance of the prepared electron carrier band sheet is improved by 10 DEG C or above, so that a wider stamping molding temperature range is provided for customers, and the sheet will not be punched or cracked in the stamping molding process in a die cavity.Meanwhile, the prepared electron carrier band sheet also has good creep resistance, the sheet is stable in size after being subjected to stamping molding in the die cavity, and leakage will not happen after the sheet is sealed with an upper sealing belt.

Description

A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material and preparation method thereof
Technical field
The present invention relates to electronic packaging carrier band, particularly relate to a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet Material and preparation method thereof.
Background technology
Electronic carrier tape sheet material is the package packing supplies of Electronics Factory's daily life of a family.Electronics producer is using electronic carrier tape Die cavity punch forming need to be carried out, in order to pack various electronic component during sheet material.But in die cavity punch forming process Often there is perforated phenomenon in middle meeting, thus causes sheet material to be scrapped.
Show through lot of experiment validation: electronic carrier tape sheet material occurs perforation during die cavity punch forming Reason substantially have following several: 1) temperature tolerance of electronic carrier tape sheet material itself is poor, 2) electronic carrier tape sheet material Elongation at break not enough, 3) punch-forming mold design is unreasonable, 4) electronic carrier tape sheet surface has fiber crops Point etc..
Summary of the invention
For problems of the prior art, it is an object of the invention to provide a kind of heat resistance good, The electronic carrier tape sheet material that shrinkage factor is low.
For reaching object above, the present invention adopts the following technical scheme that.
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material, by upper epidermis, intermediate layer and layer compound and Become, it is characterised in that described intermediate layer is made up of following component by mass percentage: HIPS resin 70.2-90.5%, PPO resin 5-25%, SEBS-g-MAH2-4%, SMA resin 1-2%, black masterbatch 1-3%, Antioxidant 0.2-0.3%, composite auxiliary for processing 0.3-0.5%.
As with improvement, described intermediate layer is made up of following component by mass percentage: HIPS resin 73.2%, PPO resin 18%, SEBS-g-MAH4%, SMA resin 2%, black masterbatch 2%, antioxidant 0.3%, Composite auxiliary for processing 0.5%.
As with improvement, described intermediate layer is made up of following component by mass percentage: HIPS resin 84.5%, PPO resin 8%, SEBS-g-MAH2%, SMA resin 2%, black masterbatch 3%, antioxidant 0.2%, Composite auxiliary for processing 0.3%.
As with improvement, described upper epidermis is consistent with the component of described layer, the most all It is made up of following component: HIPS resin 66.5-76.5%, SBS resin 3-5%, conductive carbon black 20-28%, anti- Oxygen agent 0.2%, composite auxiliary for processing 0.3%.
As with improvement, described upper epidermis is made up of following component by mass percentage: HIPS resin 70.5%, SBS resin 5%, conductive carbon black 24%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
The present invention also provides for a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet manufacturing process, it is characterised in that It is used for preparing the high-temperature resistant and creep-resistant electronic carrier tape sheet material as described in any one in claim 1-5, including Following steps:
1) pelletize, pours twin screw pelletize into after each component high-speed mixer mix homogeneously in intermediate layer Machine is extruded into granule, prepares intermediate layer raw material；The engine speed of dual-screw pelletizer is 350 ± 5 revs/min, The rotating speed of feeding machine is 70 ± 5 revs/min, and operating temperature controls at 230-280 DEG C；Each by upper and lower top layer Pour dual-screw pelletizer into after component high-speed mixer mix homogeneously and be extruded into granule, prepare upper and lower top layer Raw material；The engine speed of dual-screw pelletizer is 380 ± 5 revs/min, and the rotating speed of feeding machine is 85 ± 5 revs/min Clock, operating temperature controls at 200-260 DEG C.
2) it is dried, by intermediate layer feed particles, upper epidermis feed particles, layer feed particles respectively Put into oven for drying；The drying time of intermediate layer feed particles is 90 ± 2 minutes, dries temperature and controls 80-90℃；The drying time of upper and lower top layer feed particles is 90 ± 2 minutes, dries temperature and controls at 90 ± 2 DEG C.
3) sheet material extrusion, by intermediate layer feed particles and the upper and lower top layer feed particles difference of drying Insert feeder, by two extruders through three layers of composite sheet of same die extrusion, the extrusion temperature in intermediate layer Degree is for 210-260 DEG C, and the extrusion temperature on upper and lower top layer is 200-260 DEG C.
As with improvement, described high-speed mixer is SHR-300A type high-speed mixer.
As with improvement, described dual-screw pelletizer is Φ 50 double screw extruder.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention, by adding the Interlayer Formulation of a certain amount of PPO resin combination Cheng Xin, is effectively improved electricity The heat resistance of sub-carrier sheet.Experiments verify that, utilize the electronic carrier tape sheet material that the present invention prepares with traditional Utilize general purpose polystyrene material prepare electronic carrier tape sheet material compare, its heat resistance improve more than 10 DEG C, Making client have the broadest punch forming temperature range, during die cavity punch forming, sheet material will not Perforation, fracture.Meanwhile, the electronic carrier tape sheet material utilizing the present invention to prepare also has good creep resistance, Sheet material, after die cavity punch forming, will not occur blank problem after dimensionally stable, with cover tape sealing.
Detailed description of the invention
The essence of the present invention, the tool to the present invention below it is more fully understood that for convenience of those skilled in the art Body embodiment is described in detail.
Embodiment one
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material, by upper epidermis, intermediate layer and layer compound and Become.
Wherein, described intermediate layer is made up of following component by mass percentage: (HI high impact is strong for HIPS resin Degree polystyrene resin) 70.2%, PPO resin (polyphenylene oxide resin) 21%, SEBS-g-MAH (maleic acid Acid anhydride graft phenylethene-ethylene-butadiene-styrene copolymer) 4%, (phenylethylene-maleic anhydride is common for SMA resin Polymers) 2%, black masterbatch 2%, antioxidant 0.3%, composite auxiliary for processing 0.5%.
Described upper epidermis is consistent with the component of described layer, the most all by following component group Become: HIPS resin (high impact polystyrene resin) 66.5%, SBS resin (styrene-butadiene-benzene Ethylene triblock copolymer) 5%, conductive carbon black 28%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
During actual preparation, carry out as follows:
Following steps:
1) intermediate layer material pelletize, pours into after each component high-speed mixer mix homogeneously in intermediate layer Dual-screw pelletizer is extruded into granule, prepares intermediate layer raw material；The engine speed of dual-screw pelletizer is 350 ± 5 revs/min, the rotating speed of feeding machine is 70 ± 5 revs/min, and operating temperature controls at 230-280 DEG C.
2) skin-material pelletize, will fall after each component high-speed mixer mix homogeneously on upper and lower top layer Enter dual-screw pelletizer and be extruded into granule, prepare upper and lower top layer raw material；The engine speed of dual-screw pelletizer Being 380 ± 5 revs/min, the rotating speed of feeding machine is 85 ± 5 revs/min, and operating temperature controls at 200-260 DEG C.
3) it is dried, by intermediate layer feed particles, upper epidermis feed particles, layer feed particles respectively Put into oven for drying；The drying time of intermediate layer feed particles is 90 ± 2 minutes, dries temperature and controls 80-90℃；The drying time of upper and lower top layer feed particles is 90 ± 2 minutes, dries temperature and controls at 90 ± 2 DEG C.
4) sheet material extrusion, by intermediate layer feed particles and the upper and lower top layer feed particles difference of drying Insert feeder, by two extruders through three layers of composite sheet of same die extrusion, the extrusion temperature in intermediate layer Degree is for 210-260 DEG C, and the extrusion temperature on upper and lower top layer is 200-260 DEG C.
In the present embodiment, SHR-300A high-speed mixer selected by described high-speed mixer.Described twin screw Comminutor Φ 50 double screw extruder, this equipment is easy to producer to be needed excellent to screw combinations further according to self Change so that material is fully dispersed.
Embodiment two
A kind of high-temperature resistant and creep-resistant its structure of electronic carrier tape sheet material that the present embodiment provides and component and enforcement Example one is basically identical, and difference is:
One, described intermediate layer is made up of following component by mass percentage: HIPS resin 90.5%, PPO Resin 5%, SEBS-g-MAH2%, SMA resin 1%, black masterbatch 1%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Two, described upper epidermis, layer are the most all made up of following component: HIPS resin 76.5%, SBS resin 3%, conductive carbon black 20%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Embodiment three
A kind of high-temperature resistant and creep-resistant its structure of electronic carrier tape sheet material that the present embodiment provides and component and enforcement Example one is basically identical, and difference is:
One, described intermediate layer is made up of following component by mass percentage: HIPS resin 73.2%, PPO Resin 18%, SEBS-g-MAH4%, SMA resin 2%, black masterbatch 2%, antioxidant 0.3%, composite auxiliary for processing 0.5%.
Two, described upper epidermis, layer are the most all made up of following component: HIPS resin 70.5%, SBS resin 5%, conductive carbon black 24%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Embodiment four
A kind of high-temperature resistant and creep-resistant its structure of electronic carrier tape sheet material that the present embodiment provides and component and enforcement Example one is basically identical, and difference is:
One, described intermediate layer is made up of following component by mass percentage: HIPS resin 84.5%, PPO Resin 8%, SEBS-g-MAH2%, SMA resin 2%, black masterbatch 3%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Two, described upper epidermis, layer are the most all made up of following component: HIPS resin 68.5%, SBS resin 4%, conductive carbon black 27%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Embodiment five
A kind of high-temperature resistant and creep-resistant its structure of electronic carrier tape sheet material that the present embodiment provides and component and enforcement Example one is basically identical, and difference is:
One, described intermediate layer is made up of following component by mass percentage: HIPS resin 80.5%, PPO Resin 12%, SEBS-g-MAH4%, SMA resin 2%, black masterbatch 1%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Two, described upper epidermis, layer are the most all made up of following component: HIPS resin 73.5%, SBS resin 4%, conductive carbon black 22%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Contrast experiment
With existing electronic carrier tape sheet material with utilize the embodiment of the present invention one to prepare to embodiment five Electronic carrier tape sheet material carries out performance test comparison, and test result is as shown in table 1.
Table 1. performance comparison table
From table 1 it follows that utilize the electronic carrier tape sheet material that the present invention prepares, its highest stamping resistance becomes Type temperature is higher than traditional electronic carrier tape sheet material more than 10 DEG C, and its shrinkage factor is also below traditional electronic carrier tape sheet Material, has the most prominent resistance to elevated temperatures and creep resistance.
The essence of the present invention has been described in detail by above detailed description of the invention, but can not come with this Protection scope of the present invention is limited.It should be evident that under the enlightenment of essence of the present invention, this technology Field those of ordinary skill also can carry out many improvement and modification, it should be noted that these improve and modify All fall within the claims of the present invention.

Claims (8)

1. a high-temperature resistant and creep-resistant electronic carrier tape sheet material, is composited by upper epidermis, intermediate layer and layer, its Being characterised by, described intermediate layer is made up of following component by mass percentage: HIPS resin 70.2-90.5%, PPO resin 5-25%, SEBS-g-MAH2-4%, SMA resin 1-2%, black masterbatch 1-3%, antioxidant 0.2-0.3%, composite auxiliary for processing 0.3-0.5%.
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material the most according to claim 1, it is characterised in that described Intermediate layer is made up of following component by mass percentage: HIPS resin 73.2%, PPO resin 18%, SEBS-g-MAH4%, SMA resin 2%, black masterbatch 2%, antioxidant 0.3%, composite auxiliary for processing 0.5%.
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material the most according to claim 1, it is characterised in that described Intermediate layer is made up of following component by mass percentage: HIPS resin 84.5%, PPO resin 8%, SEBS-g-MAH2%, SMA resin 2%, black masterbatch 3%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material the most according to claim 1, it is characterised in that described Upper epidermis is consistent with the component of described layer, is the most all made up of following component: HIPS resin 66.5-76.5%, SBS resin 3-5%, conductive carbon black 20-28%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material the most according to claim 4, it is characterised in that described Upper epidermis is made up of following component by mass percentage: HIPS resin 70.5%, SBS resin 5%, conductive carbon Black 24%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
6. a high-temperature resistant and creep-resistant electronic carrier tape sheet manufacturing process, it is characterised in that it is used for preparing such as right Require the high-temperature resistant and creep-resistant electronic carrier tape sheet material described in any one in 1-5, comprise the steps:
1) pelletize, is extruded into pouring dual-screw pelletizer into after each component high-speed mixer mix homogeneously in intermediate layer Granule, prepares intermediate layer raw material；The engine speed of dual-screw pelletizer is 350 ± 5 revs/min, feeding machine Rotating speed is 70 ± 5 revs/min, and operating temperature controls at 230-280 DEG C；
It is extruded into granule by pouring dual-screw pelletizer into after each component high-speed mixer mix homogeneously on upper and lower top layer, Prepare upper and lower top layer raw material；The engine speed of dual-screw pelletizer is 380 ± 5 revs/min, turning of feeding machine Speed is 85 ± 5 revs/min, and operating temperature controls at 200-260 DEG C；
2) it is dried, intermediate layer feed particles, upper epidermis feed particles, layer feed particles are respectively put into baking oven Dry；The drying time of intermediate layer feed particles is 90 ± 2 minutes, dries temperature and controls at 80-90 DEG C；Upper, The drying time of layer feed particles is 90 ± 2 minutes, dries temperature and controls at 90 ± 2 DEG C；
3) sheet material extrusion, is respectively implanted feeding by intermediate layer feed particles and the upper and lower top layer feed particles of drying Machine, by two extruders through three layers of composite sheet of same die extrusion, the extrusion temperature in intermediate layer is 210-260 DEG C, the extrusion temperature on upper and lower top layer is 200-260 DEG C.
Preparation method the most according to claim 6, it is characterised in that described high-speed mixer is SHR-300A Type high-speed mixer.
Preparation method the most according to claim 6, it is characterised in that described dual-screw pelletizer is Φ 50 couples Screw extruder.
CN201610197240.4A 2016-03-31 2016-03-31 A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material and preparation method thereof Active CN105802107B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113956562A (en) * 2021-12-10 2022-01-21 东莞市诺义包装材料有限公司 Electronic component carrier tape sheet and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002264272A (en) * 2002-01-15 2002-09-18 Denki Kagaku Kogyo Kk Conductive composite plastic sheet and molding
CN1585698A (en) * 2001-11-16 2005-02-23 电气化学工业株式会社 Sheet
CN1646625A (en) * 2002-01-07 2005-07-27 电气化学工业株式会社 Electroconductive resin composition
CN101475721A (en) * 2009-01-13 2009-07-08 浙江三和塑料有限公司 Antistatic plastic for SMT carrier band, and preparation and use thereof
CN104893223A (en) * 2015-06-18 2015-09-09 青岛海信电器股份有限公司 Electronic equipment casing material and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1585698A (en) * 2001-11-16 2005-02-23 电气化学工业株式会社 Sheet
CN1646625A (en) * 2002-01-07 2005-07-27 电气化学工业株式会社 Electroconductive resin composition
JP2002264272A (en) * 2002-01-15 2002-09-18 Denki Kagaku Kogyo Kk Conductive composite plastic sheet and molding
CN101475721A (en) * 2009-01-13 2009-07-08 浙江三和塑料有限公司 Antistatic plastic for SMT carrier band, and preparation and use thereof
CN104893223A (en) * 2015-06-18 2015-09-09 青岛海信电器股份有限公司 Electronic equipment casing material and preparation method thereof

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
于守武等: "《高分子材料改性——原理及技术》", 31 May 2015, 知识产权出版社 *
王钰等: "《塑料改性实用技术与应用》", 30 June 2014, 印刷工业出版社 *
邓如生: "《共混改性工程塑料》", 30 June 2003, 化学工业出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113956562A (en) * 2021-12-10 2022-01-21 东莞市诺义包装材料有限公司 Electronic component carrier tape sheet and preparation method thereof

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