CN105801171B - Product made from the method and use this method of a kind of diamond for preparing overlay coating controlled thickness - Google Patents
Product made from the method and use this method of a kind of diamond for preparing overlay coating controlled thickness Download PDFInfo
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- CN105801171B CN105801171B CN201410854411.7A CN201410854411A CN105801171B CN 105801171 B CN105801171 B CN 105801171B CN 201410854411 A CN201410854411 A CN 201410854411A CN 105801171 B CN105801171 B CN 105801171B
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- 238000000576 coating method Methods 0.000 title claims abstract description 145
- 239000011248 coating agent Substances 0.000 title claims abstract description 144
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 115
- 239000010432 diamond Substances 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 title claims abstract description 72
- 238000012545 processing Methods 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 claims abstract description 30
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 241000446313 Lamella Species 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 7
- 230000001590 oxidative effect Effects 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 claims description 5
- 229910039444 MoC Inorganic materials 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 238000000498 ball milling Methods 0.000 claims description 5
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910003470 tongbaite Inorganic materials 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000003763 carbonization Methods 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 5
- 239000000047 product Substances 0.000 description 26
- 239000002131 composite material Substances 0.000 description 18
- 239000000843 powder Substances 0.000 description 18
- 239000007789 gas Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 4
- UDKYUQZDRMRDOR-UHFFFAOYSA-N tungsten Chemical compound [W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W][W] UDKYUQZDRMRDOR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
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- 150000002500 ions Chemical class 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- ZEMPKEQAKRGZGQ-AAKVHIHISA-N 2,3-bis[[(z)-12-hydroxyoctadec-9-enoyl]oxy]propyl (z)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(O)CCCCCC)COC(=O)CCCCCCC\C=C/CC(O)CCCCCC ZEMPKEQAKRGZGQ-AAKVHIHISA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
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Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The present invention relates to a kind of method for the diamond for preparing overlay coating controlled thickness, methods described comprises the following steps：(1) the diamond D of an overlay coating is provided, wherein, the diamond D of the overlay coating includes diamond and is incorporated into the overlay coating C of the diamond surface；(2) the diamond D of the overlay coating is carried out into high-temperature process causes the coating micro-crack or micro-damage occur；(3) diamond of the overlay coating through step (2) high-temperature process is subjected to the processing that comes off, the thinned diamond of overlay coating thickness is made.The invention also discloses the product prepared using methods described.Methods described processing equipment is simple, and preparation technology is simple, quick.
Description
Technical field
The present invention relates to diamond composite field, more particularly to a kind of side for controlling diamond surface thickness of coating
Product made from method and use this method.
Background technology
At present, during diamond tool is applied to machine tool market and heat-conductive composite material market, due to gold
Bond strength between hard rock and metal or hard alloy substrate is low, therefore generally requires in diamond surface plating compound layer
Or alloy-layer, in this process, the control of thickness of coating is particularly important in some high-end applications occasions.
It is strong to improve the combination between diamond and metal such as in diamond-metal heat-conducting composite preparation process
Degree, strong carbide element layer is often introduced between diamond and metal.Existing more excellent technique is in bortz powder body surface
Face coating, but thickness of coating height can cause the interface resistance between diamond and metal larger, influence the thermal conductivity of composite,
Therefore need to be controlled diamond powder surface thickness of coating.
During such as preparing skive after diamond powder surface coating, it is also desirable to diamond surface coating
Thickness is controlled.Blocked up diamond surface coating can cause the bond strength between diamond or matrix due to ectocine
Decline, and blocked up diamond surface coating can influence the technological factors such as follow-up plating.Therefore, diamond powder surface coating
The control of thickness turns into a big restraining factors prepared by precision instrument.
Prior art controls diamond surface coating often through the improvement to technique in diamond surface galvanization process
Thickness, this technological means generally requires to devote a tremendous amount of time and cost could meet to require.
In summary, in above-mentioned two field, there is an urgent need to develop the diamond that a kind of technique is simple, cost reduces at present
Overlay coating method for controlling thickness.
The content of the invention
It is an object of the invention to provide a kind of processing equipment is simple, preparation technology is simple, quick diamond surface plating
Layer method for controlling thickness.
In the first aspect of the present invention, there is provided a kind of method for the diamond for preparing overlay coating controlled thickness, including
Following steps：
(1) the diamond D of an overlay coating is provided, wherein, the diamond D of the overlay coating includes diamond and combination
In the overlay coating C of the diamond surface；The overlay coating C includes the first coating C1 and the second coating C2；Described first
Coating C1 is located between the diamond and the second coating C2；
The first coating C1 is carbide lamella, is selected from the group：Tungsten carbide, chromium carbide, molybdenum carbide, titanium carbide or its group
Close；
The second coating C2 is carbide formers layer or its alloy-layer, is selected from the group：Tungsten, chromium, molybdenum, titanium or its combination；
The thickness of the first coating C1 is c1, and the thickness of the second coating C2 is c2；
(2) the diamond D of the overlay coating is subjected to high-temperature process so that split the second coating C2 parts
Line；
(3) diamond of the overlay coating through step (2) high-temperature process is subjected to the processing that comes off, comes off described second
Coating C2 to target thickness c2 ', the thinned diamond D ' of overlay coating thickness is made, wherein 0≤c2 ' ＜ c2.
In another preference, second cladding portion or whole come off.
In another preference, the high-temperature process includes following steps：The diamond D of the overlay coating is placed in place
Reason temperature is 200~1500 DEG C and processing atmosphere is in the reacting furnace of non-oxidizing atmosphere.
In another preference, the treatment temperature is preferably 300~1000 DEG C, is more preferably 650~850 DEG C.
In another preference, after the diamond D of the overlay coating is put into reacting furnace at room temperature, heating reaction furnace
To treatment temperature.
In another preference, the rate of heat addition be 5~100 DEG C/min, preferably 5~50 DEG C/min, more preferably
Ground is 5~20 DEG C/min.
In another preference, the diamond D of the overlay coating is incubated at processing temperatures.
In another preference, the soaking time is 1~200 minute, and preferably 1~120 minute, be more preferably 5
~120 minutes.
In another preference, the diamond D of the overlay coating is cooled after isothermal holding.
In another preference, the rate of temperature fall be 5~100 DEG C/min, preferably 5~50 DEG C/min, more preferably
Ground is 5~20 DEG C/min.
In another preference, reacting furnace Temperature fall after soaking time is reached.
In another preference, the overlay coating C coats the diamond completely.
In another preference, the non-oxidizing atmosphere is selected from the group：Vacuum, inert gas, reducing gas or its group
Close.
In another preference, the vacuum of the vacuum is 10-4Pa~106Pa。
In another preference, the inert gas is selected from the group：Helium, argon gas or its combination.
In another preference, the reducing gas is selected from：Hydrogen, ammonia or its combination.
In another preference, the non-oxidizing atmosphere is to be passed through reducing gas under vacuo, it is preferable that the reduction
Gas is hydrogen.
In another preference, the reacting furnace is vacuum carbon tube furnace.
In another preference, the processing that comes off is selected from the group：Supersound process, ball-milling treatment, vibration or its combination.
In another preference, the medium of the processing that comes off is selected from the group：Water, ethanol.
In another preference, time of the processing that comes off is 1~100 minute, preferably 1~50 minute, more preferably
Ground is 1~20 minute.
In another preference, the before processing that comes off also comprises the following steps：By step (2) gained through high-temperature process
The diamond D of overlay coating crosses the processing of 30~300 mesh sieves respectively.
In another preference, the mesh screen mesh number is followed successively by：30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, 300 mesh.
In another preference, the high-temperature process and the processing cycle progress that comes off, until the second coating C2 thickness
Reach target thickness c2 '.
In another preference, the cycle-index of the circulation is 1~50 time
In another preference, come off processing before the high-temperature process described in progress.
In another preference, after methods described is handled, it is 1- that degree (c2 '/c2), which is thinned, in the thickness of overlay coating
95%, preferably 10-70%, it is more preferably 10-50%.
In the second aspect of the present invention, there is provided a kind of product prepared using first aspect present invention methods described, institute
Stating product includes diamond and is incorporated into the overlay coating C ' of the diamond surface, wherein, the overlay coating C ' includes the
One coating C1 ' and the second coating C2 '；The first coating C1 ' is located between the diamond and the second coating C2 '；
The first coating C1 ' is carbide lamella, is selected from the group：Tungsten carbide, chromium carbide, molybdenum carbide, titanium carbide or its group
Close；
The second coating C2 ' is carbide formers layer or its alloy-layer, is selected from the group：Tungsten, chromium, molybdenum, titanium or its group
Close；
The thickness of the first coating C1 ' is c1 ', and the thickness of the second coating C2 ' is c2 ', the overlay coating C '
Thickness be c '.
In another preference, the diamond and the first coating C1 ' are combined by being chemically bonded.
In another preference, the overlay coating C ' coats the diamond completely.
In another preference, the diamond is shaped as powdery, bulk, sheet or membranaceous.
In another preference, the diamond is natural or is to be generated through high temperature, high pressure or chemical vapor deposition.
In another preference, the particle diameter of the diamond is 10~1000 μm, preferably 100-500 μm, more preferably
For 100~300 μm.
In another preference, c2 ' is 0~10000nm.
In another preference, c2 ' is preferably 0~1000nm, is more preferably 0~10nm.
In another preference, c ' is 10-10000nm, preferably 10~300nm, is more preferably 10~100nm.
In another preference, the mesh number of the product is 30-300 mesh, preferably 50-100 mesh.
In another preference, after the product and metallic aluminium are compound, the thermal conductivity of gained composite for 420~
460W/m·K。
In the third aspect of the present invention, there is provided a kind of product, comprising the product described in second aspect of the present invention or by this
Product described in invention second aspect is made.
In the fourth aspect of the present invention, there is provided a kind of purposes of the product described in second aspect of the present invention, the product
For processing machinery product, composite, and/or electronic component.
In another preference, the machinework includes：Cutter, grinding tool, file, emery wheel, saw blade, drill bit etc..
In another preference, the composite includes：Heat-radiating substrate, fin etc..
It should be understood that within the scope of the present invention, above-mentioned each technical characteristic of the invention and have in below (eg embodiment)
It can be combined with each other between each technical characteristic of body description, so as to form new or preferable technical scheme.As space is limited, exist
This no longer tires out one by one states.
Brief description of the drawings
Fig. 1 is the diamond processing procedure schematic diagram of overlay coating of the present invention, wherein, A is diamond-carbide-metal
Coating complex surfaces pattern schematic diagram；B is that complex overlay coating after methods described is handled ruptures pattern schematic diagram；C is
Complex overall structure chap schematic perspective view.
Fig. 2 is the SEM image of the products therefrom of the embodiment of the present invention 1 and 2, wherein A, B be respectively complex D 300 ×,
10000 × times stereoscan photograph；C, D be respectively complex D ' 250 after methods described is handled ×, 13000 × times scan electricity
Mirror photo.
Embodiment
The present inventor's in-depth study by long-term, it has unexpectedly been found that pass through oxidation processes overlay coating at high temperature
The thickness for handling and can efficiently controlling diamond surface coating that comes off is carried out after diamond to it again, so as to reach simplified technique
With the effect for reducing cost.Based on above-mentioned discovery, inventor completes the present invention.
Term
As used herein, term " diamond of overlay coating of the present invention ", " diamond of overlay coating ", " diamond-carbon
Compound-coat of metal complex " and " complex " are used interchangeably, and refer both to be made up of diamond and overlay coating, wherein, it is described
Overlay coating includes carbide lamella and carbide formers layer or its alloy-layer；The carbide lamella is incorporated into the diamond table
Face；The carbide formers layer or its alloy-layer are incorporated into the carbide lamella.
Method
The method of the diamond of the present invention for preparing overlay coating controlled thickness, comprises the following steps：
(1) the diamond D of an overlay coating is provided, wherein, the diamond D of the overlay coating includes diamond and combination
In the overlay coating C of the diamond surface；The overlay coating C includes the first coating C1 and the second coating C2；Described first
Coating C1 is located between the diamond and the second coating C2；
The first coating C1 is carbide lamella, is selected from the group：Tungsten carbide, chromium carbide, molybdenum carbide, titanium carbide or its group
Close；
The second coating C2 is carbide formers layer or its alloy-layer, is selected from the group：Tungsten, chromium, molybdenum, titanium or its combination；
The thickness of the first coating C1 is c1, and the thickness of the second coating C2 is c2；
(2) the diamond D of the overlay coating is subjected to high-temperature process so that split the second coating C2 parts
Line；
(3) diamond of the overlay coating through step (2) high-temperature process is subjected to the processing that comes off, comes off described second
Coating C2 to target thickness c2 ', the thinned diamond D ' of overlay coating thickness is made, wherein 0≤c2 ' ＜ c2.
Specifically, the high-temperature process includes following steps：The diamond D of the overlay coating is placed in into treatment temperature is
200~1500 DEG C and processing atmosphere for non-oxidizing atmosphere reacting furnace in.
In a preference, the treatment temperature is preferably 300~1000 DEG C, is more preferably 650~850 DEG C.
In a preference, after the diamond D of the overlay coating is put into reacting furnace at room temperature, heating reaction furnace arrives
Treatment temperature.
In a preference, the rate of heat addition be 5~100 DEG C/min, preferably 5~50 DEG C/min, more preferably
For 5~20 DEG C/min.
In a preference, the diamond D of the overlay coating is incubated at processing temperatures.
In a preference, the soaking time is 1~200 minute, preferably 1~120 minute, more preferably for 5~
120 minutes.
In a preference, the diamond D of the overlay coating is cooled after isothermal holding.
In a preference, the rate of temperature fall be 5~100 DEG C/min, preferably 5~50 DEG C/min, more preferably
For 5~20 DEG C/min.
In a preference, reacting furnace Temperature fall after soaking time is reached.
In a preference, the overlay coating C coats the diamond completely.
Typically, the non-oxidizing atmosphere includes (but being not limited to)：Vacuum, inert gas, reducing gas or its
Combination.
In a preference, the vacuum of the vacuum is 10-4Pa~106Pa。
Typically, the inert gas includes (but being not limited to)：Helium, argon gas or its combination.
Typically, the reducing gas includes (but being not limited to)：Hydrogen, ammonia or its combination.
In a preference, the nonoxidizing atmosphere is to be passed through reducing gas under vacuo, it is preferable that the reducing gas
For hydrogen.
In a preference, the reacting furnace is vacuum carbon tube furnace.
Specifically, the processing that comes off includes (but being not limited to)：Supersound process, ball-milling treatment, vibration or its combination.
Typically, the medium of the processing that comes off includes (but being not limited to)：Water, ethanol.
In a preference, time of the processing that comes off is 1~100 minute, preferably 1~50 minute, more preferably
For 1~20 minute.
In a preference, the before processing that comes off also comprises the following steps：By the table through high-temperature process obtained by step (2)
The diamond D of face coating crosses the processing of 30~300 mesh sieves respectively.
In a preference, the mesh screen mesh number is followed successively by：30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, 300 mesh.
Typically, the high-temperature process and the processing cycle progress that comes off, until the second coating C2 thickness reaches target
Thickness c2 '.
In a preference, the cycle-index of the circulation is 1~50 time
In a preference, come off processing before the high-temperature process described in progress.
In a preference, after methods described is handled, it is 1-95% that degree (c2 '/c2), which is thinned, in the thickness of overlay coating,
Preferably 10-70%, it is more preferably 10-50%.
Now by taking the chromium plating of diamond powder surface and its compound layer as an example, illustrate the diamond surface thickness of coating of the present invention
Control process.First by the diamond powder ultrasound or ball-milling treatment after coating is handled so that the coating of diamond surface
Acted on by extraneous various power, form certain micro-crack or micro-damage.Then under certain heating rate, bortz powder
Body is heated to certain temperature processing, insulation a period of time, diamond powder is handled with certain rate of temperature fall, due to gold
The coating thermal coefficient of expansion of hard rock and diamond surface is different, at different temperature, micro- on the coating of diamond surface
Crackle further expands, and then produces bigger crackle.Last powder is further ultrasonic after taking out or under the effect of various power, gold
The coating of hard rock powder surface second can come off from bortz powder body surface portion or all, so as to control diamond powder surface to plate
Thickness degree.
The method of the invention and technology controlling and process factor in diamond powder surface galvanization process are substantially unrelated, generally only with
The property of thermal expansion coefficient difference and each layer is relevant between different layers in coating.
The thickness of the diamond surface coating of the present invention is controlled.This Novel control thickness of coating technique greatly simplifies
Substantial amounts of time spent by the improvement of various technological parameters and cost in diamond surface galvanization process, machinery, material,
The many-side such as electronics has good application prospect.
Product
Product of the present invention includes diamond and is incorporated into the overlay coating C ' of the diamond surface, wherein, it is described
Overlay coating C ' includes the first coating C1 ' and the second coating C2 '；The first coating C1 ' is located at the diamond and described
Between two coating C2 '；
The first coating C1 ' is carbide lamella, is selected from the group：Tungsten carbide, chromium carbide, molybdenum carbide, titanium carbide or its group
Close；
The second coating C2 ' is carbide formers layer or its alloy-layer, is selected from the group：Tungsten, chromium, molybdenum, titanium or its group
Close；
The thickness of the first coating C1 ' is c1 ', and the thickness of the second coating C2 ' is c2 ', the overlay coating C '
Thickness be c '.
In a preference, the diamond and the first coating C1 ' are combined by being chemically bonded.
In a preference, the overlay coating C ' coats the diamond completely.
The external forces such as the overlay coating of product of the present invention is easily changed by ambient temperature, ultrasonic or ball milling are influenceed to lead
Cause surface checking, come off, so that thickness of coating changes.
In a preference, the diamond is shaped as powdery, bulk, sheet or membranaceous.
In a preference, the diamond is natural or is to be generated through high temperature, high pressure or chemical vapor deposition.
In a preference, the particle diameter of the diamond is 10~1000 μm, preferably 100~500 μm, more preferably for
100-400μm。
In product of the present invention, c2 ' is 0~10000nm.
In a preference, c2 ' is preferably 0~1000nm, is more preferably 0~10nm.
In a preference, c ' is 10-10000nm, preferably 10~300nm, is more preferably 10~100nm.
In a preference, the mesh number of the product is 30-300 mesh, preferably 50-100 mesh.
After product of the present invention and metallic aluminium are compound, the thermal conductivity of gained composite is 420~460W/mK.
Product and purposes
The invention provides a kind of product, the product includes product of the present invention or by product system of the present invention
Into.
Product of the present invention is used for processing machinery product, composite, electronic component.
Typically, the machinework includes (but being not limited to)：Cutter, grinding tool, file, emery wheel, saw blade, drill bit
Deng.
Typically, the composite includes (but being not limited to)：Heat-radiating substrate, fin etc..
Compared with prior art, the present invention has following major advantage：
(1) using the inventive method can quick, effective control surface coating thickness；
(2) it can greatly simplify preparation technology using the inventive method, reduce preparation cost；
(3) it is simple using the inventive method processing equipment；
(4) the overlay coating thickness using the diamond obtained by the inventive method is uniform；
The features described above that the present invention mentions, or the feature that embodiment is mentioned can be in any combination.Disclosed in this case specification
All features can be used in combination with any combinations thing form, each feature disclosed in specification, can with it is any be provided it is identical,
The alternative characteristics substitution of impartial or similar purpose.Therefore except there is special instruction, disclosed feature is only impartial or similar spy
The general example of sign.
With reference to specific embodiment, the present invention is expanded on further.It should be understood that these embodiments are merely to illustrate the present invention
Rather than limitation the scope of the present invention.The experimental method of unreceipted actual conditions in the following example, generally according to conventional strip
Part or according to the condition proposed by manufacturer.Unless otherwise indicated, otherwise percentage and number are calculated by weight.
Unless otherwise defined, anticipated known to all specialties used in text and scientific words and one skilled in the art
Justice is identical.In addition, any method similar or impartial to described content and material all can be applied in the inventive method.Wen Zhong
Described preferable implementation only presents a demonstration with material to be used.
Embodiment 1
Prepare the diamond complex D of chrome-faced layer
By diamond particles and high-purity chromium powder that 10g average grain diameters are 100 μm or so and a small amount of polyethylene glycol, (molecular weight is
2000) it is well mixed and mixture is made, is calculated by total weight of the mixture, chromium powder accounts for 10wt%, and polyethylene glycol accounts for 5wt%.Will be mixed
Compound, which is placed on to be uniformly mixed in mixer, is prepared into slurry.It is put into vacuum carbon tube furnace, it is about 10 to be evacuated to vacuum- 2Pa, hydrogen being then passed to, atmospheric pressure is 1Pa -120kPa, and the rate of heat addition is that 10 DEG C/min is warming up to 700 DEG C, is incubated 60min,
Then room temperature is cooled to the furnace.
The mixture that high-temperature process is crossed takes out, and crosses 30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, 300 mesh sieves respectively, so
Afterwards by gained diamond particles ultrasound ion, the chromium powder of surplus is removed, obtains diamond-chromium carbide-chrome plating complex
D, weighing powder quality are 10.546g.
Embodiment 2
Prepare the diamond complex D ' of chrome-faced layer
The diamond of the mesh chrome-faced layers of 10.546g 100 obtained by embodiment 1 is all placed again into vacuum carbon pipe
In stove, it is about 10 to be evacuated to vacuum-2Pa, then passes to hydrogen, and atmospheric pressure is 1Pa -120kPa, and the rate of heat addition is 10 DEG C/
Min is warming up to 750 DEG C, is incubated 60min, then cools to room temperature with the furnace.
High-temperature process is crossed into sample to take out, crosses 30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, 300 mesh sieves, Ran Houchao respectively
Sound ion, remove diamond powder surface and drop material, you can it is compound to obtain the thinned diamond of diamond surface coating
Body D ', weighing powder quality are 10.361g.
As a result
The detection such as surface topography is carried out to products therefrom.
The quality of the diamond of chrome-faced layer is reduced to from 10.546g after 1 high-temperature process and the processing that comes off
10.361g, this shows after the method for the invention is handled, and the particle diameter of diamond is reduced, i.e. diamond surface plating thickness
Degree is thinned.
From figure 2 it can be seen that after the method for the invention is handled, part fine fisssure in the overlay coating not fallen off be present
Line, the combination for existing for itself and other metal of these micro-cracks, which provides, puts forth effort position, beneficial to improving itself and other metals
Bond strength.
In addition, above-mentioned micro-crack also can pass through the entitled " one kind submitted on the same day with the present invention according to being actually needed
The cleaning treatment step referred in the application for a patent for invention of the method for preparing the thinned diamond of overlay coating thickness " removes.
Embodiment 3
The gained complex D of embodiment 1 and the composite 1 prepared by metallic aluminium
The gained complex D of embodiment 1 is mixed with metallic aluminium powder, in 650 DEG C of vacuum hotpressing 60min, obtains composite
1。
As a result
Thermal conductivity test is carried out to gained composite 1, test the thermal conductivity of composite 1 is 396W/mK.
Embodiment 4
The gained complex D ' of embodiment 2 and the composite 2 prepared by metallic aluminium
The gained complex D ' of embodiment 2 is mixed with metallic aluminium powder, in 650 DEG C of vacuum hotpressing 60min, obtains composite
2。
As a result
Test the thermal conductivity of composite 2 is 435W/mK.
Comparative example 3 and 4 understands that after the method for the invention is handled, the thermal conductivity of composite is significantly carried
Height, enhancing rate are up to 9.8%.
All it is incorporated as referring in this application in all documents that the present invention refers to, it is independent just as each document
It is incorporated as with reference to such.In addition, it is to be understood that after the above-mentioned instruction content of the present invention has been read, those skilled in the art can
To be made various changes or modifications to the present invention, these equivalent form of values equally fall within the model that the application appended claims are limited
Enclose.
Claims (6)
- A kind of 1. method for the diamond for preparing overlay coating controlled thickness, it is characterised in that comprise the following steps：(1) the diamond D of an overlay coating is provided, wherein, the diamond D of the overlay coating includes diamond and is incorporated into institute State the overlay coating C of diamond surface；The overlay coating C includes the first coating C1 and the second coating C2；First coating C1 is located between the diamond and the second coating C2；The first coating C1 is the carbide lamella that the carbide being selected from the group is formed：Tungsten carbide, chromium carbide, molybdenum carbide, carbonization Titanium or its combination；The second coating C2 is the carbide formers layer or its alloy-layer for the element composition being selected from the group：Tungsten, chromium, molybdenum, titanium or It is combined；The thickness of the first coating C1 is c1, and the thickness of the second coating C2 is c2；(2) the diamond D of the overlay coating is subjected to high-temperature process so that the second coating C2 parts are cracked；(3) diamond of the overlay coating through step (2) high-temperature process is subjected to the processing that comes off, come off second coating C2 to target thickness c2 ', the thinned diamond D ' of overlay coating thickness is made, wherein 0≤c2 ' ＜ c2.
- 2. the method as described in claim 1, it is characterised in that the high-temperature process includes following steps：The surface is plated Layer diamond D be placed in treatment temperature be 200~1500 DEG C and processing atmosphere be in the reacting furnace of non-oxidizing atmosphere.
- 3. method as claimed in claim 2, it is characterised in that the non-oxidizing atmosphere is selected from the group：Vacuum, indifferent gas Body, reducing gas or its combination.
- 4. the method as described in claim 1, it is characterised in that the processing that comes off is selected from the group：It is ultrasonically treated, at ball milling Reason, vibration or its combination.
- 5. the method as described in claim 1, it is characterised in that the high-temperature process and the processing cycle progress that comes off, until institute State the second coating C2 thickness and reach target thickness c2 '.
- 6. the method as described in claim 1, it is characterised in that after methods described is handled, journey is thinned in the thickness of overlay coating It is 1-95% to spend (c2 '/c2).
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104045081A (en) * | 2013-03-11 | 2014-09-17 | 中国科学院宁波材料技术与工程研究所 | Diamond composite and preparation method thereof |
| CN104162664A (en) * | 2013-05-16 | 2014-11-26 | 中国科学院宁波材料技术与工程研究所 | Diamond complex and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2008142657A1 (en) * | 2007-05-22 | 2008-11-27 | Element Six Limited | Coated diamond |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104045081A (en) * | 2013-03-11 | 2014-09-17 | 中国科学院宁波材料技术与工程研究所 | Diamond composite and preparation method thereof |
| CN104162664A (en) * | 2013-05-16 | 2014-11-26 | 中国科学院宁波材料技术与工程研究所 | Diamond complex and preparation method thereof |
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Denomination of invention: Preparation method for diamond with controllable surface coating thickness, and product prepared by using the same Effective date of registration: 20190813 Granted publication date: 20180102 Pledgee: Bank of Hangzhou Limited by Share Ltd. Ningbo Zhenhai Branch Pledgor: Ningbo Jingduan Industrial Technology Co.,Ltd. Registration number: Y2019330000004 |
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