CN105799431A - Tire pressure monitoring sensor - Google Patents
Tire pressure monitoring sensor Download PDFInfo
- Publication number
- CN105799431A CN105799431A CN201410853309.5A CN201410853309A CN105799431A CN 105799431 A CN105799431 A CN 105799431A CN 201410853309 A CN201410853309 A CN 201410853309A CN 105799431 A CN105799431 A CN 105799431A
- Authority
- CN
- China
- Prior art keywords
- sensor
- battery
- circuit board
- printed circuit
- tire pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012544 monitoring process Methods 0.000 title claims abstract description 30
- 230000005484 gravity Effects 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 8
- 238000000354 decomposition reaction Methods 0.000 description 4
- 108010010803 Gelatin Proteins 0.000 description 3
- 229920000159 gelatin Polymers 0.000 description 3
- 239000008273 gelatin Substances 0.000 description 3
- 235000019322 gelatine Nutrition 0.000 description 3
- 235000011852 gelatine desserts Nutrition 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0491—Constructional details of means for attaching the control device
- B60C23/0494—Valve stem attachments positioned inside the tyre chamber
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to a tire pressure monitoring sensor including a casing, a battery, a sensor chip and a printed circuit board; the battery, the sensor chip and the printed circuit board are assembled in the casing, and the printed circuit board has a first side face and a second side face which are opposite; the sensor chip is arranged on the first side face of the printed circuit board; the battery is arranged on the second side face of the printed circuit board; when the sensor is mounted on a rim of a tire through an inflating valve, the first side face is toward the center of a circle of the rim, the second side face keeps away from the center of the circle of the rim, and the center of gravity of the sensor is located above the axis of an inflating valve mounting rim hole. The tire pressure monitoring sensor disclosed by the invention is not prone to generation of skewing overturning in a car driving process.
Description
Technical field
The present invention relates to a kind of tire pressure monitoring sensor (TirePressureMonitoringSensor is called for short TPMS) being connected with valve cock.
Background technology
System for monitoring pressure in tyre is mounted on automobile to monitor tire pressure and the temperature of automobile.System for monitoring pressure in tyre includes sensor and receiver.Tire pressure monitoring sensor is installed on each tire, detects tire pressure and temperature and is transferred to the receiver on body of a motor car.
Tire pressure monitoring sensor has external and built-in two kinds of mounting means.External mounting means is that sensor is arranged on outside tires, for instance be arranged on valve cock mouth.Built-in mounting means is mounted in inside tires.
In order to improve installation strength, it is proposed that the scheme that sensor is connected with valve cock.Fig. 1 illustrates known tire pressure monitoring sensor decomposition texture and the valve cock being connected with sensor, and Fig. 2 illustrates the installment state of sensor shown in Fig. 1.With reference to shown in Fig. 1 and Fig. 2, electronic devices and components 21, printed circuit board (PCB) (PCB) 22, chip 23, battery 24 and antenna 25 are set in sensor housing 20, finally utilize embedding gelatin substance to carry out wrapping and encapsulating.In housing 20, battery 24 is positioned on the left of the axis I-I of valve cock 10, and chip 23, electronic devices and components 21 and antenna 25 are positioned on the right side of the axis I-I of valve cock 10, the position that its two parts are respectively in housing the left and right sides, is naturally in left-right situs state.Whole sensor is connected with the bulb 11 of valve cock 10 by screw 26.At this, axis I-I refers to that the centre bore of wheel rim 12 and valve cock 10 installing hole connect into a plane, and wheel rim 12 and sensor are divided into two semi-sections in left and right, the axis formed centered by valve cock 10.
Filling gelatin substance is passed through on the surface of PCB22, is undertaken above-mentioned all devices being wrapped within the cavity of shell 20, carries out sealing protection.This assembled inside mode volume takies greatly, and space availability ratio is low, and the combined volume thus resulting in integral sensors is bigger.In interblock space, the gelatin substance of filling is relatively big, and the volume of housing and other parts is also relatively big, thus causing that corresponding weight ratio is heavier.Such sensor is assembled on automobile rim 12, and owing to wheel rim 12 is in the rotary course of front and back, sensor is subject to wheel rim 12 centrifugal force that the outwardly directed center of circle is peripheral from center all the time.According under the same terms, volume is more big, and weight is more heavy, and its centrifugal force born also significantly raises accordingly.When wheel rim 12 high speed rotating (and because of change of speed Yu surface evenness), produce centripetal (being centrifuged) power size also corresponding Rapid Variable Design, radial load suffered by valve cock is caused to be continually changing, thus causing the Gravity Centre of Product instability of sensor, reciprocating upset occurs inside wheel rim 12, as easy as rolling off a log causes tire assembling valve cock 10 place leakage gas.
On the other hand, as shown in Figure 2, after sensor is installed, length bearing of trend X-Y is vertical with valve cock 10 axis I-I, it is assembled in the battery 24 in transmitter housing, electronic devices and components 21, antenna 25 and chip 23, center of gravity deflection axis I-I is towards direction, the wheel rim center of circle, namely the center of gravity NATURAL DISTRIBUTION of integral sensors is in valve cock axis below I-I, and left and right weight does not have symmetrical relations.This structure causes when sensor is installed on wheel rim 12, vehicle traveling process or brake process are easily subject to the wheel rim 12 different centrifugal force in advance or direction of retreat, sensor (includes valve cock), and there is upset around valve cock 10 axis in whole electronic module, the seal gasket of valve cock can be chronically at stress state, uses seal gasket easily to produce to reveal the risk of gas for a long time.
Summary of the invention
The technical problem to be solved is to provide a kind of tire pressure monitoring sensor, and it is not easy skew upset occur in vehicle traveling process.
The present invention solves that above-mentioned technical problem employed technical scheme comprise that a kind of tire pressure monitoring sensor of proposition, including housing, battery, sensor chip and printed circuit board (PCB), this battery, this sensor chip and this printed circuit board (PCB) are assembled in this housing, this printed circuit board (PCB) has the first relative side and the second side, this sensor chip is located at this first side of this printed circuit board (PCB), this second side of this printed circuit board (PCB) is located at by this battery, when this sensor is installed on the wheel rim of tire by valve cock, this first side is towards the center of circle of wheel rim, this second side is away from the center of circle of wheel rim, and the center of gravity of this sensor is positioned at valve cock and installs above the axis in wheel rim hole.
In one embodiment of this invention, when this sensor is installed on the wheel rim of tire, the angle of plane residing for this housing end face and wheel rim groove is distributed in the region of 0-60 degree.
In one embodiment of this invention, tire pressure monitoring sensor also includes metal rack, and this metal rack and this printed circuit board (PCB) are connected as entirety, and between this printed circuit board (PCB) and this battery.
In one embodiment of this invention, the size of this second side of this printed circuit board (PCB) and the size of this battery are suitable.
In one embodiment of this invention, the size of this battery is mated with the size of the interior holding part for housing this battery of this housing.
In one embodiment of this invention, the circular in cross-section of this housing.
In one embodiment of this invention, this sensor chip is assembled to this housing by seal gasket.
In one embodiment of this invention, when this sensor connects valve cock, this housing, this battery, this sensor chip and this printed circuit board (PCB) install the axisymmetrical in wheel rim hole relative to valve cock.
Due to the fact that the above technical scheme of employing, so as to compared with prior art, the top of the axis B-B of valve cock can be distributed in due to sensor entirety center of gravity, it is not easy that upset occurs, the fatigue strength of the seal gasket on minimizing valve cock, thus improving its reliability and extending its service life, reduce the risk of tire seepage air pressure.And product sensor inner space is stacked extremely compact, weight is extremely light, and the centrifugal force born is less, it is possible to make the more difficult upset of sensor.
Accompanying drawing explanation
For the above-mentioned purpose of the present invention, feature and advantage can be become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated, wherein:
Fig. 1 illustrates known tire pressure monitoring sensor decomposition texture and the valve cock being connected with sensor.
Fig. 2 illustrates the installment state of sensor shown in Fig. 1.
Tire pressure monitoring sensor decomposition texture that Fig. 3 illustrates one embodiment of the invention and the valve cock being connected with sensor.
Fig. 4 illustrates the installment state of sensor shown in Fig. 3.
Fig. 5 illustrates the sectional view of the installment state of sensor shown in Fig. 4.
Fig. 6 illustrates the top view of the installment state of sensor shown in Fig. 4.
Detailed description of the invention
The internal structure of the tire pressure monitoring sensor of the present invention adopts brand-new assembling mode and the weight method of salary distribution, thus being not easy skew upset occur in vehicle traveling process.
Tire pressure monitoring sensor decomposition texture that Fig. 3 illustrates one embodiment of the invention and the valve cock being connected with sensor.With reference to shown in Fig. 3, tire pressure monitoring sensor mainly includes housing 40, battery 41, sensor chip 42 and printed circuit board (PCB) (PCB) 43.Battery 41, sensor chip 42 and PCB43 are assembled in housing 40.PCB43 has the first relative side and the second side, and from figure, downside B is the first side, and upper side F is the second side.Sensor chip 42 is located at first side of PCB43, and second side of PCB43 is located at by battery 41, and sensor chip 42, PCB43 and battery 41 are positioned on same axis (axis A-A).Axis A-A is vertical direction in the drawings.
Being a difference in that with the one of known tire pressure monitoring sensor, the tire pressure monitoring sensor of the present embodiment employs vertical assembling mode.It is to say, battery 41 and sensor chip 42 are no longer on same plane or approximately horizontal plane, but battery 41, sensor chip 42 and PCB43 these three critical piece orthogonal sets are loaded in housing 40.The advantage of this compact Layout mode is the size that can significantly reduce sensor housing at the circumferencial direction (Fig. 3, in 4 for vertical paper direction) of wheel rim, without substantially increasing the sensor housing size in axis A-A direction, the volume of such sensor can significantly reduce.
Coordinating with forenamed vertical assembling mode, PCB43 size (such as on the B of downside) in the plane is so big not necessarily like known sensor, but narrows down to suitable with the size of battery 41.Correspondingly, housing 40 size in the plane can also narrow down to and just be large enough to hold PCB43 and battery 41.Specifically, forming holding part 40c and carry out set battery 41 in housing 40, the size of this holding part 40c can be mated with the size of battery 41.Such as holding part 40c is only bigger than the size of battery 41.
The cross section of housing 40 generally can be rounded.It will of course be understood that housing 40 also other Common Shape optional, for instance rectangle.Housing 40 is typically spliced by upper cover 40a and lower cover 40b.After parts are completed, upper cover 40a and lower cover 40b can adopt laser weld integral, seals.Housing 40 internal can without casting glue class and other sealing medium, to reduce volume further.
On mounting means, sensor chip 42 and other electronic devices and components can pass through to weld the downside B being affixed on PCB43.Sensor chip 42 can pass through seal gasket 44 and attach to lower cover 40b.Seal gasket 44 can be rubber blanket.Lower cover 40b is provided with passage 46, for the air pressure outside sensor chip 42 perception and temperature.
Battery 41 is set off by metal rack 45.Metal rack 45 is connected as a whole with PCB43, and metal rack is between PCB43 and battery 41.It addition, the downside of PCB43 is provided with antenna 47.
Fig. 4 illustrates the installment state of sensor shown in Fig. 3.Fig. 5 illustrates the sectional view of the installment state of sensor shown in Fig. 4.Fig. 6 illustrates the top view of the installment state of sensor shown in Fig. 4.With reference to shown in Fig. 4-6, during assembling, the housing 40 of sensor is connected with valve cock 30 by screw, and then valve cock 30 is assembled on the wheel rim hole 51 of wheel rim 50.Now in housing, the downside B of PCB43 is towards the center of circle of wheel rim 50, and namely towards F direction, and upper side F is away from the center of circle of wheel rim 50, namely towards T direction.With another difference is that of known tire pressure monitoring sensor, the tire pressure monitoring sensor of the present embodiment owing to being located at the upper side F of PCB43 by battery 41, suitable weight now only need to be coordinated to distribute, the center of gravity of whole sensor is located at the top of the axis B-B in wheel rim hole 51.
It is to say, in sensor use procedure, its center of gravity is towards the outside of wheel rim 50, i.e. T direction in figure, assembles in TPMS use procedure at wheel rim, because wheel rim is towards above rotating, TPMS entirety center of gravity tilts towards front all the time, is therefore not easy skew upset occur.
Shown in reference Fig. 4, during assembling, upper cover 40a, lower cover 40b and inner structural members, for instance the position of battery 41, PCB43 and sensor chip 42 is similar to parallel to each other.Further, when sensor is installed on wheel rim 50, the angle α of plane residing for the end face of upper cover 40a and wheel rim groove is distributed in the region of 0-60 degree.The advantage of this angle design is to make the center of gravity of whole sensor naturally be located on the axis B-B in wheel rim hole 51, without carrying out special weight distribution.
Furthermore, the various piece of sensor, can be distributed relative to each axisymmetrical such as housing 40, battery 41, sensor chip 42, PCB43, electronic devices and components etc..Such as symmetrical relative to the axis B-B in valve cock installation wheel rim hole.
The tire pressure sensor of the present invention has the advantage that relative to existing sensor
1, owing to sensor entirety center of gravity can be distributed in the top of axis B-B, it is not easy to upset, the fatigue strength of the seal gasket 11 on minimizing valve cock occur, thus improving its reliability and extending its service life, reduces the risk of tire seepage air pressure.
2, product sensor inner space is stacked extremely compact, and weight is extremely light, and the centrifugal force born is less, it is possible to make the more difficult upset of sensor.
Although the present invention discloses as above with preferred embodiment; so it is not limited to the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when doing a little amendment and perfect, therefore protection scope of the present invention is when with being as the criterion that claims define.
Claims (8)
1. a tire pressure monitoring sensor, including housing, battery, sensor chip and printed circuit board (PCB), this battery, this sensor chip and this printed circuit board (PCB) are assembled in this housing, this printed circuit board (PCB) has the first relative side and the second side, this sensor chip is located at this first side of this printed circuit board (PCB), this second side of this printed circuit board (PCB) is located at by this battery, when this sensor is installed on the wheel rim of tire by valve cock, this first side is towards the center of circle of wheel rim, this second side is away from the center of circle of wheel rim, and the center of gravity of this sensor is positioned at valve cock and installs above the axis in wheel rim hole.
2. tire pressure monitoring sensor as claimed in claim 1, it is characterised in that when this sensor is installed on the wheel rim of tire, the angle of plane residing for this housing end face and wheel rim groove is distributed in the region of 0-60 degree.
3. tire pressure monitoring sensor as claimed in claim 1, it is characterised in that also including metal rack, this metal rack and this printed circuit board (PCB) are connected as entirety, and between this printed circuit board (PCB) and this battery.
4. tire pressure monitoring sensor as claimed in claim 1, it is characterised in that the size of this second side of this printed circuit board (PCB) is suitable with the size of this battery.
5. tire pressure monitoring sensor as claimed in claim 1, it is characterised in that the size of this battery is mated with the size of the interior holding part for housing this battery of this housing.
6. tire pressure monitoring sensor as claimed in claim 1, it is characterised in that the circular in cross-section of this housing.
7. tire pressure monitoring sensor as claimed in claim 1, it is characterised in that this sensor chip is assembled to this housing by seal gasket.
8. tire pressure monitoring sensor as claimed in claim 1, it is characterised in that when this sensor connects valve cock, this housing, this battery, this sensor chip and this printed circuit board (PCB) install the axisymmetrical in wheel rim hole relative to valve cock.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410853309.5A CN105799431A (en) | 2014-12-31 | 2014-12-31 | Tire pressure monitoring sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410853309.5A CN105799431A (en) | 2014-12-31 | 2014-12-31 | Tire pressure monitoring sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105799431A true CN105799431A (en) | 2016-07-27 |
Family
ID=56421614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410853309.5A Pending CN105799431A (en) | 2014-12-31 | 2014-12-31 | Tire pressure monitoring sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105799431A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110774837A (en) * | 2018-07-31 | 2020-02-11 | 森萨塔科技公司 | Tire pressure monitor with variable angle mounting |
| CN113272159A (en) * | 2018-12-05 | 2021-08-17 | 大陆汽车有限公司 | Adapter, tire parameter monitoring system and method for mounting a tire parameter monitoring system on a wheel rim |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1227802A (en) * | 1998-03-02 | 1999-09-08 | 黄添财 | Radio tyre-pressure detector |
| JP2002046433A (en) * | 2000-08-03 | 2002-02-12 | Yokohama Rubber Co Ltd:The | Internal information detector for pressure vessel |
| JP2004345485A (en) * | 2003-05-22 | 2004-12-09 | Toyota Motor Corp | Wheel state transmitter |
| CN2826556Y (en) * | 2005-08-09 | 2006-10-11 | 深圳市航盛电子股份有限公司 | External tire-pressure monitoring transmitter |
| CN102259566A (en) * | 2010-05-27 | 2011-11-30 | 上海保隆汽车科技股份有限公司 | Angle adjustable valve |
| US20130125640A1 (en) * | 2009-11-20 | 2013-05-23 | Continental Automotive Gmbh | Electronic unit adapted to be positioned on the inner face of the tread of a tire |
| CN203254901U (en) * | 2013-01-31 | 2013-10-30 | 上海保隆汽车科技股份有限公司 | Tire pressure monitoring sensor |
-
2014
- 2014-12-31 CN CN201410853309.5A patent/CN105799431A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1227802A (en) * | 1998-03-02 | 1999-09-08 | 黄添财 | Radio tyre-pressure detector |
| JP2002046433A (en) * | 2000-08-03 | 2002-02-12 | Yokohama Rubber Co Ltd:The | Internal information detector for pressure vessel |
| JP2004345485A (en) * | 2003-05-22 | 2004-12-09 | Toyota Motor Corp | Wheel state transmitter |
| CN2826556Y (en) * | 2005-08-09 | 2006-10-11 | 深圳市航盛电子股份有限公司 | External tire-pressure monitoring transmitter |
| US20130125640A1 (en) * | 2009-11-20 | 2013-05-23 | Continental Automotive Gmbh | Electronic unit adapted to be positioned on the inner face of the tread of a tire |
| CN102259566A (en) * | 2010-05-27 | 2011-11-30 | 上海保隆汽车科技股份有限公司 | Angle adjustable valve |
| CN203254901U (en) * | 2013-01-31 | 2013-10-30 | 上海保隆汽车科技股份有限公司 | Tire pressure monitoring sensor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110774837A (en) * | 2018-07-31 | 2020-02-11 | 森萨塔科技公司 | Tire pressure monitor with variable angle mounting |
| CN113272159A (en) * | 2018-12-05 | 2021-08-17 | 大陆汽车有限公司 | Adapter, tire parameter monitoring system and method for mounting a tire parameter monitoring system on a wheel rim |
| US11970029B2 (en) | 2018-12-05 | 2024-04-30 | Continental Automotive Gmbh | Adapter, tyre parameter monitoring system and method for mounting a tyre parameter monitoring system onto a wheel rim |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170524 Address after: 201619 No. 5500 Shen brick road, Shanghai, Songjiang District Applicant after: SHANGHAI BAOLONG AUTOMOTIVE Corp. Address before: 201619, No. 4, Shen brick road 5500, Jing Zhen Town, Shanghai, Songjiang District Applicant before: Shanghai Qunying Automotive Electronics Co.,Ltd. |
|
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190104 Address after: 201619 No. 5500 Shenzhuan Highway, Songjiang District, Shanghai Applicant after: Baolong Huofu (Shanghai) Electronics Co.,Ltd. Address before: 201619 No. 5500 Shenzhuan Highway, Songjiang District, Shanghai Applicant before: SHANGHAI BAOLONG AUTOMOTIVE Corp. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160727 |