CN105786282A - Mechanism adopting sensor cover and facilitating placement of sensor cover on capacitive circuit sensor on calculating equipment - Google Patents
Mechanism adopting sensor cover and facilitating placement of sensor cover on capacitive circuit sensor on calculating equipment Download PDFInfo
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- CN105786282A CN105786282A CN201610104587.XA CN201610104587A CN105786282A CN 105786282 A CN105786282 A CN 105786282A CN 201610104587 A CN201610104587 A CN 201610104587A CN 105786282 A CN105786282 A CN 105786282A
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- sensor
- computing equipment
- user
- sensing surface
- array
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The invention discloses a mechanism adopting a sensor cover and facilitating placement of the sensor cover on a capacitive circuit sensor on calculating equipment.A method provided by the embodiment comprises the steps that user touch to the outer surface of the dipping sensor cover placed on the sensor is sensed on the sensor of the calculating equipment, wherein the sensor cover comprises a plurality of holes penetrating through the outer surface and a plurality of wires corresponding to the holes; sensing is executed through one or more holes and one or more corresponding wires; the action is promoted in response to to each sensed user touch.
Description
Technical field
This field relates generally to computing equipment, and more specifically, relates to adopting a kind of mechanism, and it adopts and is easy on the condenser network sensor at computing equipment place places sender unit cap.
Background technology
Along with the increase of mobile equipment use, making these equipment be prone to use (such as, use touch panel) without increasing cost, size or complexity and/or reducing value, efficiency or existing feature, this becomes more and more important.Current technology is all unsatisfactory for above-mentioned standard.Such as, improve touch panel sensitivity or a functional method is to add many additional components (such as to equipment, microcontroller, CPU (CPU) driver, cable or adapter, etc.), this causes that cost, size, complexity etc. increase.Additionally, when having additional functionality, computing equipment becomes increasingly complex and is difficult to operate.Additionally, the more and more thinner of computing equipment makes these computing equipments be very difficult to adopt the circuit that can support these additional functionality.
Accompanying drawing explanation
Embodiments of the invention by way of example rather than by restricting mode illustrate in the figure of accompanying drawing, the wherein similar reference similar element of instruction and wherein:
Figure 1A-1B diagram is according to an embodiment of the invention for being easy to place sender unit cap to cover the placement mechanism of condenser network；
Fig. 2 illustrates computing equipment according to an embodiment of the invention, and it adopts sensor and has passage and the sender unit cap in the hole leading to wire；
Fig. 3 illustrates method according to an embodiment of the invention, the placement mechanism of its diagram sender unit cap for adopting and be easy on the sensor of computing equipment；And
Fig. 4 illustrates computing system according to an embodiment of the invention.
Detailed description of the invention
Embodiments of the invention provide the mechanism for adopting and be easy to place on the external sensor of computing equipment sender unit cap.The method of embodiments of the invention includes sensing at the sensor place of computing equipment the user of the outer surface to the dipping sender unit cap being placed on this sensor and touches, wherein this sender unit cap includes the multiple holes by outer surface and the multiple wires corresponding to the plurality of hole, and wherein performs sensing by the one or more holes in multiple holes and their one or more corresponding lead；And each in touching in response to the user that senses facilitates action.
In one embodiment, the physics size of the sensor of computing equipment is (such as, touch sensor on the side of mobile computing device or above) it is maintained to the shell (such as, sender unit cap) itself placed on a sensor by interpolation capacitance characteristic.At present, touch panel and touch pad manufacturer must reduce their panel size and arrange other sizes on the flat board that size reduces, or alternatively, sensor is done too narrow and has the width resolution to the minimizing that the thumb on sensor or finger move to reduce the overall utility of sensor, and is very worthless.Embodiments of the invention provide and place sender unit cap (and not changing size or the size of sensor) on a sensor, and this eliminates the limitation of routine techniques.In one embodiment, sender unit cap can be made up of the plastics with various conduction property (it has Capacitance Coupled ability), to promote that vinyl cover sensor uses glue to encapsulate with the novel of sensor.Such as, this vinyl cover sensor can be shaped to cover sensor securely for transformation to linearity.
Figure 1A illustrates according to an embodiment of the invention for being easy to place sender unit cap to cover the placement mechanism of condenser network.In one embodiment, this placement mechanism 100 provides sender unit cap 102, it to be placed on condenser network (" sensor ") 112 (such as, thumb sensor on the side of mobile computing device) so that facilitate can with cover little of sender unit cap 102 and the sensor 112 being closely integrated, this sender unit cap 102 provides the user bigger area to use sensor 112.Such as, in one embodiment, sender unit cap 102 can be made of plastics, and these plastics have the hole 104 with wire and seamlessly hold the passage 106 of sensor 112.Sender unit cap 102 can be placed on and be sealed in the part 114 of computing system by such as using such as epoxy resin or adhesive glue class etc. to couple material by sender unit cap 102 and sensor 112.This seamless seal can protect sensor 112 with air-prevention, moisture, displacement and other can potential injury or damage sensor 112 material.
In one embodiment, sender unit cap 102 can be made up of Plastic, or in certain embodiments, can use the material of other forms, for instance electronic textile (such as, fabric, plastic braid) suitably transmits heat, electric power, data, etc..Sender unit cap 102 can use on the upper sensor 112 exposed of computing equipment (such as Fig. 4 computing equipment 400), and can include mobile computing device, for instance smart mobile phone is (such as,Deng), handheld computing device, personal digital assistant (PDA), panel computer (such as,GalaxyDeng), notebook computer (such as, notebook, net book, the etc.) mobile computing device similar with other, etc..Computing equipment can farther include desktop computer, Set Top Box (such as, based on the CATV set-top-box of the Internet, etc.).Computing equipment can farther include to serve as the operating system at the interface between any hardware or physical resource and the user of this computer equipment.Computing equipment can farther include one or more processor, memory devices, the network equipment, driver or the like.It is noted that the term as " machine ", " equipment ", " computing equipment ", " computer ", " computing system " etc. can exchange and synonymously use in the publication.
Along with mobile computing device becomes less and narrower, the sensor (such as, the sensor of finger size) keeping less becomes more desirable.Embodiments of the invention provide sender unit cap 102 to encapsulate sensor 112 and are maintained with the size of sensor 112 and make the big I change of sender unit cap 102, rather than the size of sensor 112 is changed.Naturally, owing to such as manufacturing the complexity of sensor 112 (such as, capacitance wiring, etc.) (different based on the sender unit cap 102 of plastics from simply manufacturing), the size changing plastic opaque sensor cap 102 can be more much easier than changing electronic sensor 112 size.It addition, the sensor 112 that sensor 102 can manufacture with the part as computing equipment is separately manufactured.
In one embodiment, as illustrated about Figure 1B, wire 122 array is provided by shell or the passage 106 of sender unit cap 102.As above-mentioned and referring back to Figure 1A, these wires are exposed by some holes of exposing on the top surface of sender unit cap 102, so that regardless of its size how sensor 112 exports, for instance to the sensor surface area of little embedding at the edge of the sender unit cap 102 based on plastics.The sender unit cap 102 hole 104 array corresponding to wire 122 array is made so that each hole 104 is filled with conductive epoxy resin to form wire 122 and then directly contact to place with the bottom surface of the plastic top of sender unit cap 102.Such as, this can pass through to be put in passage 106 by sensor 112 or by sensing printed circuit board (PCB) (PCB) long spring song being perpendicular to plastics and allowing longer wire 122 coupling realize.
Plastics for manufacturing sender unit cap 102 can have high dielectric material to avoid from wire 122 to the electric leakage of wire 122.Then sensor 112 can be used to produce X, Y location value.In order to make up the surface differences between the outside of arch plastics and flexible printed circuits sensing element, before being exposed to the computing unit of computing system, perform X, Y conversion.
Fig. 2 illustrates computing equipment 200 according to an embodiment of the invention, and it adopts sensor 112 and has passage 106 and the sender unit cap 102 in the hole 104 leading to wire.In the illustrated embodiment, it is provided that sensor 112 as such as on the right side of computing equipment 200 and with touch panel 202 one-tenth an angle of 90 degrees place thumb sensor.In one embodiment, whenever user touches (such as, press, roll, rub, pat, etc.) sender unit cap 102, user touches and is sensed by hole 104 and via the wire of sender unit cap 102 by sensor 112.It is envisioned that, touch the various parts then associated by the one or more sensing/signal transmission mechanisms adopted with sensor and/or computing equipment 200 or module receives, analyzes and explains.
Fig. 3 diagram method according to an embodiment, the placement mechanism of its diagram sender unit cap for adopting and be easy on the sensor of computing equipment.Method 300 can be performed with having the equipment processing logic by many manufacturing technologies, this process logic can include hardware (such as, circuit, special logic, FPGA, etc.), software (instruction such as run on a processing device), or its combination.In one embodiment, method 300 performs according to the explanation of Figure 1A, 1B and 2.
Method 300 sentences manufacture computing equipment (such as in processing block 305, mobile computing device, such as smart mobile phone, tablet computing device, Deng) start, this computing equipment has various touch pad or touch panel and more visible on the computing device local (such as, left side or right side at computing equipment) sensor, for instance thumb sensor or thumb pad.Similarly, process 310 frame places, sender unit cap manufactures at a lot of manufacturing facility places, its can to or can not with making computing equipment place manufacturing facility relevant.Sender unit cap can use much suitable material (such as Plastic, electronic textile, etc.) to make.
In one embodiment, at processing block 315 place, sender unit cap is put on a sensor.At processing block 320 place, then to place be calibrated the wire so that sender unit cap and sender unit cap itself is properly placed on sensor and with pick up calibration so that the output of sensor and proper use of.In one embodiment, sender unit cap can include some holes (corresponding to wire), it makes sensor be externally exposed the touch of environment and user, such sensor is touching (such as whenever user, roll, press, pat, etc.) place sender unit cap top on a sensor time can sense the touch of user.In one embodiment, at processing block 325 place, sender unit cap uses glue class etc. to be sealed to (computing equipment) peripheral surface around sensor.
Fig. 4 illustrates computing system 400 according to an embodiment of the invention, its sender unit cap adopting and being easy on the sensor of computing system.Exemplary computing systems 400 can be same or similar with the computing equipment 200 of Fig. 2 and include: 1) one or more processors 401, therein at least one can include above-described feature；2) memorizer control axis (MCH) 402；3) system storage 403 (there is it dissimilar, for instance double data rate RAM (DDRRAM), growth data output RAM (EDORAM) etc.)；4) high-speed cache 404；5) input/output (I/O) control axis (ICH) 405；6) graphic process unit 406；7) (there is it dissimilar in display/screen 407, such as cathode ray tube (CRT), thin film transistor (TFT) (TFT), light emitting diode (LED), molecule organic LED (MOLED), liquid crystal display (LCD), Digital light projector (DLP), etc.)；With 8) one or more I/O equipment 408.
One or more processors 401 perform instruction to perform any software routines that computing system realizes.These instructions frequently involve certain operation that data are performed.Data and instruction are both stored in system storage 403 and high-speed cache 404.High-speed cache 404 is typically designed to have shorter time delay than system storage 403.Such as, high-speed cache 404 can be integrated on the silicon identical with processor and/or construct with more rapid static RAM (SRAM) unit, and system storage 403 can use slower dynamic ram (DRAM) unit structure.More frequently used instruction and data is stored in high-speed cache 404 (as contrary with system storage 403) by tending to, improves the overall execution efficiency of computing system.
System storage 403 has a mind to the miscellaneous part in computing system is made available by.Such as, from leading to the various interfaces of computing system (such as, keyboard and mouse, printer port, LAN (LAN) port, modem port, etc.) data that receive or retrieve from the internal storage unit (such as, hard disk drive) of computer system generally temporarily lined up to enter system storage 403 before they are operated by one or more processors 401 in the realization of software program.Similarly, the data that software program is determined should be sent to external entity by computing system interface from computing system, or is stored in internal storage unit, generally temporarily lined up in system storage 403 before being transmitted or storing.
ICH405 is responsible for guaranteeing the correctly transmission between system storage 403 with its suitable corresponding computing system interface (and internal storage device (if computing system is designed so as to)) of such data.The various competitiveness that MCH402 is responsible between processor 401, interface and the internal memory element occurred accessibly in time each other and system storage 403 is accessed are asked.In one embodiment, MCH502 and ICH505 can not individually be used；But provide as a part for chipset, this chipset includes MCH502, ICH505 and other controller maincenters, etc..
One or more I/O equipment 408 also realize in typical computing system.I/O equipment is generally responsible for transmitting data to computing system (such as, networking adapter) and/or transmitting data from computing system；Or, it is responsible for the large-scale non-volatile memories (such as, hard disk drive) in computing system.ICH405 has bi-directional point to multipoint link between self and the I/O equipment 408 observed.
The part of various embodiments of the present invention can provide as computer program, this computer program can include the computer-readable medium with the computer program instructions being stored thereon, and these computer program instructions can be used for computer (or other electronic equipments) is programmed to carry out process according to an embodiment of the invention.Machine readable media can include, but it is not limited to, floppy disk, CD, compact disk read only memory (CD-ROM) and magneto-optic disk, ROM, RAM, Erasable Programmable Read Only Memory EPROM (EPROM), electricity EPROM (EEPROM), magnetic card or light-card, flash memory or the other type of medium/machine readable media suitable in storage e-command.
The technology illustrated in the drawings can be used in the upper storage of one or more electronic equipment (such as, terminal station, NE) and code and the data performed realize.Such electronic equipment uses such as non-transitory computer-readable storage media (such as, disk；CD；Random access memory；Read only memory；Flash memory is arranged；Phase transition storage) and the computer-readable medium such as temporary computer-readable transmission medium (such as, the transmitting signal of electricity, light, sound or other forms such as carrier wave, infrared signal, digital signal) store and transmit (internal and/or with other electronic equipments on network) code and data.Additionally, such electronic equipment typically comprises the collection of one or more processor, it is coupled to one or more miscellaneous part, such as one or more storage devices (non-transitory machinable medium), user's input-output apparatus are (such as, keyboard, touch screen, and/or display) and network connection.The coupling of this processor collection and miscellaneous part is typically via one or more buses and bridge (being also called bus control unit).Thus, the storage device of given electronic equipment typically stores code and/or data and performs on the collection at one or more processors of this electronic equipment.Certainly, the one or more part of embodiments of the invention can use the various combination of software, firmware and/or hardware to realize.
In description above, the present invention describes by reference to its concrete one exemplary embodiment.But, it can be made various amendment and change without departing from such as the broader spirit and scope of the present invention set forth in the claim enclosed, this will be apparent from.Therefore, specification and drawings is treated in illustrative and not restrictive meaning.
Claims (20)
1. a computing system, it can touch for use in computing equipment place execution task being easy to external user, and described computing system includes:
Sensing surface；With
Described computing equipment, it has:
Sensor, touches for detecting the user to the described sensing surface with multiple hole, and wherein said sensing surface covers at least some of of described sensor；
Processor；And
Storage device, it can store the instruction to be performed by described processor,
Wherein said instruction promotes described processor to perform action in response to described user touch when being performed by described processor.
2. computing system as claimed in claim 1, wherein said multiple holes are arranged in an array, and in described array, described hole exposes a part for described sensor on described sensor simultaneously.
3. computing system as claimed in claim 1, wherein said action includes the execution of described computing equipment place task.
4. computing system as claimed in claim 1, wherein said sensor localization is before described computing equipment.
5. computing equipment as claimed in claim 1, it is one or more that wherein said user touches corresponding in rolling, pat, rub or pressing.
6., for being easy to external user touch for the method performing task at computing equipment place, described method includes:
By sensor detection, the user sensing surface with multiple hole being touched, wherein said sensing surface covers at least some of of described sensor；And
Action is performed in response to described user touch by processor.
7. method as claimed in claim 6, wherein said multiple holes are arranged in an array, and in described array, described hole exposes a part for described sensor on described sensor simultaneously.
8. method as claimed in claim 6, wherein said action includes the execution of described computing equipment place task.
9. method as claimed in claim 6, wherein said sensor localization is before described computing equipment.
10. method as claimed in claim 6, it is one or more that wherein said user touches corresponding in rolling, pat, rub or pressing.
11. a device, comprising:
Sensing surface；And
Computing equipment, it has:
Sensor, touches for detecting the user to the sensing surface with multiple hole, and wherein said sensing surface covers at least some of of described sensor；
Processor, performs action for touching in response to described user.
12. device as claimed in claim 11, wherein said multiple holes are arranged in an array, and in described array, described hole exposes a part for described sensor on described sensor simultaneously.
13. device as claimed in claim 11, wherein said action includes the execution of described computing equipment place task.
14. device as claimed in claim 11, wherein said sensor localization is before described computing equipment.
15. device as claimed in claim 11, it is one or more that wherein said user touches corresponding in rolling, pat, rub or pressing.
16. at least one machine readable media, it includes instruction, and described instruction promotes described computing equipment to perform operation when being performed by computing equipment, and described operation includes:
By sensor detection, the user sensing surface with multiple hole being touched, wherein said sensing surface covers at least some of of described sensor；And
Touch in response to described user and perform action.
17. machine readable media as claimed in claim 16, wherein said multiple holes are arranged in an array, and in described array, described hole exposes a part for described sensor on described sensor simultaneously.
18. machine readable media as claimed in claim 16, wherein said action includes the execution of described computing equipment place task.
19. machine readable media as claimed in claim 16, wherein said sensor localization is before described computing equipment.
20. machine readable media as claimed in claim 16, it is one or more that wherein said user touches corresponding in rolling, pat, rub or pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610104587.XA CN105786282B (en) | 2011-09-30 | 2011-09-30 | Using and convenient for calculate equipment at condenser network sensor on place sender unit cap mechanism |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610104587.XA CN105786282B (en) | 2011-09-30 | 2011-09-30 | Using and convenient for calculate equipment at condenser network sensor on place sender unit cap mechanism |
| CN201180075254.4A CN103959210B (en) | 2011-09-30 | 2011-09-30 | Using and be easy on the condenser network sensor at computing device place sender unit cap mechanism |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180075254.4A Division CN103959210B (en) | 2011-09-30 | 2011-09-30 | Using and be easy on the condenser network sensor at computing device place sender unit cap mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105786282A true CN105786282A (en) | 2016-07-20 |
| CN105786282B CN105786282B (en) | 2019-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610104587.XA Active CN105786282B (en) | 2011-09-30 | 2011-09-30 | Using and convenient for calculate equipment at condenser network sensor on place sender unit cap mechanism |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1860432A (en) * | 2003-06-24 | 2006-11-08 | 3M创新有限公司 | Sensing device |
| KR20110068666A (en) * | 2009-12-16 | 2011-06-22 | 엘지전자 주식회사 | Mobile terminal having a side touch input device and method for executingfunctions of thereof |
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2011
- 2011-09-30 CN CN201610104587.XA patent/CN105786282B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1860432A (en) * | 2003-06-24 | 2006-11-08 | 3M创新有限公司 | Sensing device |
| KR20110068666A (en) * | 2009-12-16 | 2011-06-22 | 엘지전자 주식회사 | Mobile terminal having a side touch input device and method for executingfunctions of thereof |
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| Publication number | Publication date |
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| CN105786282B (en) | 2019-07-16 |
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