CN105783998A - Composite sensor - Google Patents
Composite sensor Download PDFInfo
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- CN105783998A CN105783998A CN201610237674.2A CN201610237674A CN105783998A CN 105783998 A CN105783998 A CN 105783998A CN 201610237674 A CN201610237674 A CN 201610237674A CN 105783998 A CN105783998 A CN 105783998A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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Abstract
An embodiment of the invention discloses a composite sensor, which comprises at least one acceleration sensor, wherein the top part of the acceleration sensor is provided with a protective cover plate; partial structure in the acceleration sensor is multiplexed into partial structure of at least one pressure sensor, part or all of the protective cover plate is multiplexed into a pressure sensitive film of the at least one pressure sensor; and the rest structure of the at least one pressure sensor is arranged on the protective cover plate. The composite sensor provided by the embodiment of the invention can achieve the integration of pressure sensing and acceleration sensing at the same time, can reduce the size of a chip after integrating the pressure sensor and the acceleration sensor, and can reduce cost.
Description
Technical field
The present embodiments relate to sensor technical field, particularly relate to a kind of compound sensor.
Background technology
Sensor is a kind of detecting device, it is possible to experiences measured information, and the information that the information experienced is for conversion into the signal of telecommunication or other desired form according to certain rule is exported, gives and experience intuitively.
Pressure transducer and acceleration transducer are two more common class sensors, and both are often used simultaneously.In order to more convenient when pressure transducer and acceleration transducer use simultaneously, both are often integrated by prior art, form an entirety, it is achieved pressure sensing and acceleration sensing integrated.At present, the scheme that pressure transducer and acceleration transducer integrate mainly is had two kinds: one be in the same plane in make pressure transducer and acceleration transducer；Another kind is to be embedded in the mass of acceleration transducer by pressure transducer.
Although the first scheme above-mentioned is capable of the integrated of pressure sensing and acceleration sensing, but integrated chip is larger in size.Although above-mentioned first scheme can reduce both integrated after chip size, but, in practical application, in order to protect the movable structure of acceleration transducer, generally cover sheet all can be set thereon, in order to adjust the dynamic property of acceleration transducer, sealing cavity is made between cover sheet and acceleration transducer movable structure, cavity inside after sealing is made the noble gas (such as nitrogen) of vacuum or filling certain pressure intensity and is regulated air damping, if pressure transducer is embedded in the mass of acceleration transducer, after the sealing of cover sheet, pressure transducer is just and external environment, lose detection function, that is: after above-mentioned first scheme, pressure transducer and acceleration transducer integrated after be only capable of realizing acceleration sensing, pressure sensing can not be realized.
Summary of the invention
The embodiment of the present invention provides a kind of compound sensor, to solve scheme integrated to pressure transducer and acceleration transducer can not be realized by prior art pressure sensing and acceleration sensing simultaneously, and both integrated after the bigger problem of chip size.
For reaching this purpose, the embodiment of the present invention by the following technical solutions:
A kind of compound sensor, including: at least one acceleration transducer；
The top of described acceleration transducer includes cover sheet；
Part-structure in described acceleration transducer is multiplexed with the part-structure of at least one pressure transducer, and wherein, part or all of described cover sheet is multiplexed with the pressure sensitive film of at least one pressure transducer described；
The remaining structure of at least one pressure transducer described is arranged on described cover sheet.
Further, described acceleration transducer includes annular seal space；
Described annular seal space is positioned under described cover sheet；
Described annular seal space is multiplexed with the pressure chamber of described pressure transducer.
Further, described annular seal space is be filled with noble gas in vacuum chamber or described annular seal space.
Further, the lower surface of described cover sheet is provided with getter material layer.
Further, described cover sheet is provided with at least one pressure chamber；
The quantity of described pressure chamber is identical with the quantity of described pressure transducer.
Further, described pressure chamber is annular seal space.
Further, described acceleration transducer is pressure resistance type or condenser type.
Further, described pressure transducer is pressure resistance type or condenser type.
The compound sensor that the embodiment of the present invention provides; by the part-structure at least one acceleration transducer being multiplexed with the part-structure of at least one pressure transducer; and the remaining structure of at least one pressure transducer is arranged on the cover sheet in acceleration transducer; achieve the integrated of at least one pressure transducer and at least one acceleration transducer; the size of at least one pressure transducer and the integrated rear chip of at least one acceleration transducer can be reduced, and then cost can be reduced；Owing to part or all of cover sheet is multiplexed with the sensitive membrane (that is: the sensitive membrane of pressure transducer is exposed to outside) of pressure transducer; therefore; acceleration detection can not only be realized, additionally it is possible to realize pressure detecting, it may be assumed that acceleration detection and pressure detecting can be realized simultaneously.
Accompanying drawing explanation
By reading the detailed description that non-limiting example is made made with reference to the following drawings, the other features, objects and advantages of the present invention will become more apparent upon:
Fig. 1 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention one provides.
Fig. 2 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention two provides.
Fig. 3 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention three provides.
Fig. 4 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention four provides.
Fig. 5 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention five provides.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail.It is understood that specific embodiment described herein is used only for explaining the present invention, but not limitation of the invention.It also should be noted that, for the ease of describing, accompanying drawing illustrate only part related to the present invention but not full content.
Embodiment one
Fig. 1 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention one provides.As it is shown in figure 1, the compound sensor that the embodiment of the present invention one provides includes an acceleration transducer and a pressure transducer.
Wherein, the top of acceleration transducer includes cover sheet 101；Part-structure in acceleration transducer is multiplexed with the part-structure of pressure transducer, and the remaining structure of pressure transducer is arranged on cover sheet 101.
Wherein, the cover sheet 101 in acceleration transducer is multiplexed with the pressure sensitive film (that is: the structure that cover sheet 101 is in acceleration transducer is also the structure in pressure transducer) of pressure transducer.Acceleration transducer includes annular seal space 102.Wherein, annular seal space 102 is positioned under cover sheet 101；This annular seal space 102 is multiplexed with the pressure chamber (that is: the structure that annular seal space 102 is in acceleration transducer is also the structure in pressure transducer) of pressure transducer.
It should be understood that except above-mentioned pressure sensitive film (that is: cover sheet 101) and pressure chamber (that is: annular seal space 102), remaining structure is respectively positioned on cover sheet 101 in the structure of pressure transducer.
Wherein, acceleration transducer and pressure transducer are pressure resistance type.
Below the concrete structure of piezoresistance type acceleration sensor is described.
As shown in Figure 1; acceleration transducer is except including above-mentioned cover sheet 101 and annular seal space 102, it is also possible to including: substrate the 103, first insulating barrier 104, silicon layer the 105, second insulating barrier 106, acceleration transducer pressure drag component 107, acceleration transducer electrode 108, mass 109 and acceleration transducer metal Pad110.
Wherein, the upper surface of substrate 103 is provided with cavity 111；First insulating barrier 104, silicon layer the 105, second insulating barrier 106 stack gradually from bottom to top, constitute layer laminate 112, and layer laminate 112 is positioned on substrate 103；Layer laminate 112 is provided with release groove 113, to discharge the movable structure of acceleration transducer.Release groove 113 is positioned on cavity 111；Acceleration transducer pressure drag component 107 is positioned within silicon layer 105, and forms resistance bridge, to realize the detection of acceleration；Acceleration transducer electrode 108 is positioned on the second insulating barrier 106, and extend to (that is: acceleration transducer electrode 108 runs through the second insulating barrier 106, realizes electrical contact with acceleration transducer pressure drag component 107) on acceleration transducer pressure drag component 107；Cover sheet 101 covering part layered stack 112, and do not cover acceleration transducer metal Pad110；Sealing means between cover sheet 101 and layer laminate 112 can be metal bonding, it is also possible to be the techniques such as BCBbonding；Annular seal space 102 is formed between cavity 111, release groove 113 and cover sheet 101; wherein; this annular seal space 102 can be vacuum chamber; the noble gas with certain pressure intensity can also be filled, the dynamic property (such as: frequency response etc.) of acceleration transducer can be regulated by adjusting the pressure of the noble gas filled；Mass 109 is positioned on layer laminate 112, can increase the sensitivity of acceleration transducer by arranging mass 109 in acceleration transducer；Acceleration transducer metal Pad110 is positioned on layer laminate 112, and acceleration transducer metal Pad110 electrically connects (not shown) with acceleration transducer electrode 108, electrical connection when acceleration transducer metal Pad110 is for subsequent applications.
Below the concrete structure of piezoresistive pressure sensor is described.
As it is shown in figure 1, pressure transducer is except including above-mentioned annular seal space 102 and cover sheet 101, it is also possible to including: the 3rd insulating barrier 116, pressure transducer pressure drag component 117, pressure transducer electrode 118 and pressure transducer metal Pad119.
Wherein, the 3rd insulating barrier 116 is positioned on cover sheet 101；Pressure transducer pressure drag component 117 is positioned within cover sheet 101, and forms resistance bridge, to realize the detection of pressure；Pressure transducer electrode 118 is positioned on the 3rd insulating barrier 116, and extend to (that is: pressure transducer electrode 118 is positioned on the 3rd insulating barrier 116, and runs through the 3rd insulating barrier 116 and pressure transducer pressure drag component 117 realization electrical contact) on pressure transducer pressure drag component 117；Pressure transducer metal Pad119 is positioned on the 3rd insulating barrier 116, and pressure transducer metal Pad119 electrically connects (not shown) with pressure transducer electrode 118, electrical connection when pressure transducer metal Pad119 is for subsequent applications.
Cover sheet 101 serves not only as the cover sheet of acceleration transducer; also it is multiplexed with the pressure sensitive film of pressure transducer; after having pressure to be applied on cover sheet 101; cover sheet 101 deforms upon; the deformation data of cover sheet 101 is transferred out by pressure transducer pressure drag component 117 through pressure transducer electrode 118, it is achieved pressure detecting；When having acceleration signal, owing to inertia force effect causes acceleration transducer pressure drag component 107 to deform, deformation information is transferred out by acceleration transducer pressure drag component 107 through acceleration transducer electrode 108, it is achieved acceleration detection simultaneously.
The compound sensor that the embodiment of the present invention one provides; by the cover sheet 101 in acceleration transducer being multiplexed with the pressure sensitive film of pressure transducer; annular seal space 102 under cover sheet 101 in acceleration transducer is multiplexed with the pressure chamber of pressure transducer; achieve the integrated of a pressure transducer and an acceleration sensor; a pressure transducer and the size of an integrated rear chip of acceleration transducer can be reduced, and then cost can be reduced；Owing to cover sheet 101 is multiplexed with the pressure sensitive film (that is: the pressure sensitive film of pressure transducer is exposed to outside) of pressure transducer; therefore; acceleration detection can not only be realized, additionally it is possible to realize pressure detecting, it may be assumed that acceleration detection and pressure detecting can be realized simultaneously.
Embodiment two
Fig. 2 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention two provides.As shown in Fig. 2 and Fig. 1, the cover sheet 101 of the compound sensor that the compound sensor provided with the embodiment of the present invention one provides the difference is that, the embodiment of the present invention two is provided with sealing cavity 120；The lower surface of cover sheet 101 is provided with getter material layer 121；The number of acceleration transducer is represented schematically as two, and the number of actual integrated acceleration transducer can be determined according to practical application request.
Wherein seal cavity 120 to be positioned under pressure transducer pressure drag component 117.Pressure transducer is made by arranging sealing cavity 120 in cover sheet 101.Sealing cavity 120 can adopt CavitySOI material to realize by bonding technology or cover sheet 101.
Annular seal space 102 is vacuum chamber, if needing to improve vacuum, it is possible to by arranging getter material layer 121 at the lower surface of cover sheet 101, it is possible to absorb the gas in annular seal space 102, it is possible to ensure that annular seal space 102 is high vacuum state.Wherein, getter material layer 121 can be Ti-based getters material etc..
As shown in Fig. 2 and Fig. 1, the embodiment of the present invention two and embodiment one the difference is that: the sealing cavity 120 of pressure transducer is made within cover sheet 101；It is integrated with two acceleration transducers；Annular seal space 102 makes vacuum cavity, if required to ensure that vacuum, it is possible to the lower surface at cover sheet 101 arranges getter material layer 121.
The content not being described in detail in the embodiment of the present invention two can referring to above-described embodiment one; pressure cavities in embodiment two can also be identical with in embodiment one; namely pressure cavities can multiplexing annular seal space 102; annular seal space 102 in embodiment one can also be as identical in embodiment two; can also getter material layer 121 be set under cover sheet 101, repeat them here.
The compound sensor that the embodiment of the present invention two provides; by the part cover sheet 101 of two acceleration transducers being multiplexed with the pressure sensitive film of pressure transducer; and sealing cavity 120 is set among cover sheet 101; sealing cavity 120 is utilized to be multiplexed with the pressure chamber of pressure transducer; what achieve a pressure transducer and two acceleration transducers is integrated; a pressure transducer and the size of two integrated rear chips of acceleration transducer can be reduced, and then cost can be reduced；Owing to part cover sheet 101 is multiplexed with the pressure sensitive film (that is: the pressure sensitive film of pressure transducer is exposed to outside) of pressure transducer; therefore; acceleration detection can not only be realized, additionally it is possible to realize pressure detecting, it may be assumed that acceleration detection and pressure detecting can be realized simultaneously.
It should be strongly noted that embodiment two is represented schematically as the integrated of two acceleration transducers and a pressure transducer, it is possible to according to the actual requirements, it is achieved multiple acceleration transducers and a pressure transducer integrated.
Embodiment three
Fig. 3 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention three provides.As shown in Fig. 3 and Fig. 1, the number of the pressure transducer in the compound sensor that the compound sensor provided with the embodiment of the present invention one provides the difference is that, the embodiment of the present invention three is represented schematically as two.The number of actual integrated pressure transducer can be determined according to practical application request.
The particular content of the acceleration transducer part in the compound sensor that the embodiment of the present invention three provides referring to above-described embodiment one, can not repeat them here.
Owing to the quantity of the pressure transducer in the compound sensor that the embodiment of the present invention two provides is 1, therefore, particular content for two pressure sensor part in the compound sensor that the embodiment of the present invention three provides, can referring to Fig. 3 and Fig. 2, compared with the pressure transducer in the compound sensor that the embodiment of the present invention two provides, the quantity sealing cavity 120 is 2.
Each pressure transducer electrode 118 is positioned on the 3rd insulating barrier 116, and each pressure transducer electrode 118 extends on the pressure transducer pressure drag component 117 of correspondence；Each pressure transducer metal Pad119 electrically connects with corresponding pressure transducer electrode 118；Each sealing cavity 120 is positioned under the pressure transducer pressure drag component 117 of correspondence, and the pressure drag component 117 of each pressure transducer forms a resistance bridge, it is achieved the detection of pressure.
The content that pressure sensor part in the embodiment of the present invention three is not described in detail referring to above-described embodiment two, can not repeat them here.
The compound sensor that the embodiment of the present invention three provides; by using the part cover sheet 101 of the acceleration transducer pressure sensitive film as pressure transducer; and two sealing cavitys 120 are set among cover sheet 101; and sealing cavity 120 is positioned under the pressure transducer pressure drag component 117 of correspondence; what achieve two pressure transducers and an acceleration transducer is integrated; two pressure transducers and the size of an integrated rear chip of acceleration transducer can be reduced, and then cost can be reduced；Owing to the subregion (that is: part cover sheet 101) of cover sheet 101 is multiplexed with the pressure sensitive film (that is: the pressure sensitive film of pressure transducer is exposed to outside) of pressure transducer; therefore; acceleration detection can not only be realized; pressure detecting can also be realized, it may be assumed that acceleration detection and pressure detecting can be realized simultaneously.Same annular seal space 102 can be identical with embodiment two, makes vacuum chamber, it is possible to is arranged below getter layer 121 at cover sheet 101, repeats no more here.
It should be strongly noted that embodiment three is represented schematically as the integrated of two pressure transducers and an acceleration transducer, it is possible to according to the actual requirements, it is achieved multiple pressure transducers and an acceleration transducer integrated.
Embodiment four
Fig. 4 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention four provides.As shown in Fig. 4 and Fig. 3, with the embodiment of the present invention three provide compound sensor the difference is that, the compound sensor that the embodiment of the present invention four provides include in the number of acceleration transducer be schematically represented as two, the number of pressure transducer is represented schematically as two.The number of concrete pressure transducer and the number of acceleration transducer can be determined according to practical application request.
The particular content of two acceleration transducer parts in the compound sensor that the embodiment of the present invention four provides can referring to above-described embodiment two, and the particular content of two pressure sensor part referring to above-described embodiment three, can not repeat them here.
The compound sensor that the embodiment of the present invention provides, by using the part cover sheet 101 of two acceleration transducers pressure sensitive film as two pressure transducers, and two sealing cavitys 120 are set among cover sheet 101, and the pressure drag component 117 of two pressure transducers and the electrode 118 of two pressure transducers are set on cover sheet 101, and sealing cavity 120 is positioned under the pressure transducer pressure drag component 117 of correspondence, what achieve two pressure transducers and two acceleration transducers is integrated, two pressure transducers and the size of two integrated rear chips of acceleration transducer can be reduced, and then cost can be reduced；Owing to part cover sheet 101 is multiplexed with the pressure sensitive film (that is: the pressure sensitive film of pressure transducer is exposed to outside) of pressure transducer; therefore; acceleration detection can not only be realized, additionally it is possible to realize pressure detecting, it may be assumed that acceleration detection and pressure detecting can be realized simultaneously.
It should be strongly noted that embodiment four is represented schematically as the integrated of two pressure transducers and two acceleration transducers, it is possible to according to the actual requirements, it is achieved multiple pressure transducers and multiple acceleration transducer integrated.
Embodiment one to embodiment four achieves the integrated of at least one pressure transducer and at least one acceleration transducer, and in the content of description, acceleration transducer and pressure transducer are pressure resistance type.It should be understood that acceleration transducer in the compound sensor that provides of the embodiment of the present invention and pressure transducer are except can be except pressure resistance type, it is also possible to be condenser type.The structure that acceleration transducer and pressure transducer are capacitive compound sensor below is described.
Embodiment five
Fig. 5 is the cross-sectional schematic of the structure of the compound sensor that the embodiment of the present invention five provides.As shown in Fig. 5 and Fig. 1, acceleration transducer and pressure transducer in the compound sensor that the compound sensor provided with the embodiment of the present invention one provides the difference is that, the embodiment of the present invention five are capacitive.Fig. 5 schematically show the integrated of a capacitance pressure transducer of a capacitance pressure transducer, and the actual integrated number of acceleration transducer and the number of pressure transducer can be determined according to practical application request.
For acceleration transducer, owing to being no longer pressure resistance type, but condenser type, therefore, acceleration transducer no longer includes the acceleration transducer pressure drag component 107 in Fig. 1 and acceleration transducer electrode 108, but includes electrode 122 on the acceleration electric capacity in Fig. 5, acceleration capacitor lower electrode 123, conductive hole 124 and acceleration transducer electrode electric isolution insulating barrier 125.
Wherein, on the second insulating barrier 106 that on acceleration electric capacity, electrode 122 is arranged in, and (that is: on acceleration electric capacity, the lower surface of electrode 122 and the upper surface of silicon layer 105 are generally aligned in the same plane to extend to the upper surface of silicon layer 105；Acceleration capacitor lower electrode 123 is positioned on the second insulating barrier 106, and (that is: the upper surface of the lower surface of acceleration capacitor lower electrode 123 and silicon layer 105 is generally aligned in the same plane to extend to the upper surface of silicon layer 105, conductive hole 124 is positioned under acceleration capacitor lower electrode 123, can fill with quasiconductor or conductor material, such as polycrystalline silicon material, and extend to the upper surface (utilizing conductive hole 124 that acceleration capacitor lower electrode 123 functionally extends to the upper surface of substrate 103 in electrical connection) of substrate 103；Acceleration transducer electrode electric isolution insulating barrier 125 (utilizes acceleration transducer electrode electric isolution insulating barrier 125 to realize on acceleration electric capacity the electric insulation between electrode 122 and acceleration capacitor lower electrode 123) on acceleration electric capacity within silicon layer 105 between electrode 122 and acceleration capacitor lower electrode 123.When there being acceleration signal, due to inertia force effect, cause that on acceleration sensor electric capacity, electrode 122 deforms, cause the change of the capacitance size of electrode 122 and acceleration transducer capacitor lower electrode 123 on acceleration transducer electric capacity, detect this capacitance variations, thus realizing the detection of acceleration signal.
For pressure transducer, owing to being no longer pressure resistance type, but condenser type, therefore, pressure transducer no longer includes the pressure transducer pressure drag component 117 in Fig. 1 and pressure transducer electrode 118, but includes electrode 126 on the pressure capacitance in Fig. 5, pressure capacitance bottom electrode 127, seals cavity 128 and pressure transducer electrode electric isolution insulating barrier 129.
Wherein, on pressure capacitance, electrode 126 and pressure capacitance bottom electrode 127 are positioned on the 3rd insulating barrier 116, and extend to the upper surface (that is: on pressure capacitance, the lower surface of electrode 126, the lower surface of pressure capacitance bottom electrode 127 and the upper surface of the 3rd insulating barrier 116 are generally aligned in the same plane) of cover sheet 101；Seal cavity 128 to be positioned within cover sheet 101, and be positioned on pressure transducer electric capacity under electrode 126, and seal cavity 128 and pressure transducer electric capacity are provided with cover sheet sub-block 130 between electrode 126；Pressure transducer electrode electric isolution insulating barrier 129 surrounds cover sheet sub-block 130 and seals cavity 128 (utilizing pressure transducer electrode to electrically insulate the electric insulation that insulating barrier 129 realizes on pressure capacitance between electrode 126 and pressure capacitance bottom electrode 127).When there being pressure signal, pressure causes electrode 126 on pressure transducer electric capacity to deform, thus causing the change of electric capacity between electrode 126 and pressure transducer capacitor lower electrode 127 on pressure transducer electric capacity, detects this capacitance variations, it is achieved the detection of pressure signal.
The compound sensor that the embodiment of the present invention five provides; by the subregion of the cover sheet 101 in acceleration transducer being multiplexed with the pressure sensitive film of pressure transducer; cover sheet 101 in acceleration transducer is provided with sealing cavity 128; sealing cavity 128 is multiplexed with the pressure chamber of pressure transducer; what achieve a pressure transducer and an acceleration transducer is integrated; reduce a pressure transducer and the size of an integrated rear chip of acceleration transducer, and then cost can be reduced；Owing to cover sheet 101 is multiplexed with the pressure sensitive film (that is: the pressure sensitive film of pressure transducer is exposed to outside) of pressure transducer; therefore; acceleration detection can not only be realized, additionally it is possible to realize pressure detecting, it may be assumed that acceleration detection and pressure detecting can be realized simultaneously.
It should be noted that, above-described embodiment five is represented schematically as the integrated of a capacitance pressure transducer and a capacitance acceleration transducer, the integrated of multiple (including one) capacitance pressure transducer and multiple (including one) capacitance acceleration transducer can also be realized according to structure as embodiment two, embodiment three, embodiment four, simply the bottom electrode 123 of multiple capacitance pressure transducers is public, and the bottom electrode 127 of multiple capacitance acceleration transducers is public；Simultaneously, integrated or multiple (including one) capacitance acceleration transducer of multiple (including one) piezoresistance type acceleration sensor and multiple (including one) capacitance pressure transducer and the integrated of multiple (including one) piezoresistive pressure sensor can also be realized, repeat no more here.
It should be understood that those skilled in the art can content described in one to embodiment five obtain by any number of pressure transducer (wherein according to embodiments of the present invention, pressure transducer can be pressure resistance type, can also be capacitive) and any number of acceleration transducer is (wherein, acceleration transducer can be pressure resistance type, it is also possible to be capacitive) integrate after the structure of compound sensor.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that and the invention is not restricted to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute without departing from protection scope of the present invention.Therefore, although the present invention being described in further detail by above example, but the present invention is not limited only to above example, when without departing from present inventive concept, other Equivalent embodiments more can also be included, and the scope of the present invention is determined by appended right.
Claims (8)
1. a compound sensor, it is characterised in that including: at least one acceleration transducer；
The top of described acceleration transducer includes cover sheet；
Part-structure in described acceleration transducer is multiplexed with the part-structure of at least one pressure transducer, and wherein, part or all of described cover sheet is multiplexed with the pressure sensitive film of at least one pressure transducer described；
The remaining structure of at least one pressure transducer described is arranged on described cover sheet.
2. compound sensor according to claim 1, it is characterised in that described acceleration transducer includes annular seal space；
Described annular seal space is positioned under described cover sheet；
Described annular seal space is multiplexed with the pressure chamber of described pressure transducer.
3. compound sensor according to claim 2, it is characterised in that described annular seal space is be filled with noble gas in vacuum chamber or described annular seal space.
4. compound sensor according to claim 3, it is characterised in that the lower surface of described cover sheet is provided with getter material layer.
5. compound sensor according to claim 1, it is characterised in that be provided with at least one pressure chamber in described cover sheet；
The quantity of described pressure chamber is identical with the quantity of described pressure transducer.
6. compound sensor according to claim 5, it is characterised in that described pressure chamber is annular seal space.
7. compound sensor according to claim 1, it is characterised in that described acceleration transducer is pressure resistance type or condenser type.
8. compound sensor according to claim 1, it is characterised in that described pressure transducer is pressure resistance type or condenser type.
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| CN201610237674.2A CN105783998A (en) | 2016-04-15 | 2016-04-15 | Composite sensor |
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| CN201610237674.2A CN105783998A (en) | 2016-04-15 | 2016-04-15 | Composite sensor |
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| CN111780899A (en) * | 2019-04-04 | 2020-10-16 | 合肥杰发科技有限公司 | Composite sensor and manufacturing method thereof |
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