CN105783576A - Composite heat conducting chip - Google Patents
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- CN105783576A CN105783576A CN201410813889.5A CN201410813889A CN105783576A CN 105783576 A CN105783576 A CN 105783576A CN 201410813889 A CN201410813889 A CN 201410813889A CN 105783576 A CN105783576 A CN 105783576A
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Abstract
The invention provides a composite heat conducting chip. The composite heat conducting chip comprises a first heat conducting substrate and multiple second heat conducting chips, wherein multiple through holes perpendicular to the first heat conducting substrate are formed in the first heat conducting substrate; the second heat conducting chips are arranged on the upper and lower surfaces of the first heat conducting substrate and the inner surfaces of the through holes; the second heat conducting chips arranged on the upper and lower surfaces of the first heat conducting substrate are substantially parallel to the first heat conducting substrate; and the second heat conducting chips arranged on the inner surfaces of the through holes are substantially parallel to the inner surfaces of the through holes.
Description
Technical field
The invention belongs to a kind of radiating element, particularly relate to the composite heat-conducting fin of a kind of high heat conduction.
Background technology
Heat Conduction Material has in national defense industry and national economy every field and is widely applied very much.Along with commercial production and scientific and technical developing rapidly, Heat Conduction Material is proposed renewal, higher requirement by people, except heat conductivity, it is desirable to material has excellent combination property such as light weight, workability, excellent in mechanical performance, resistance to chemical attack etc..
Fin is often used to dispel the heat in field of electronics.Fin usually metal by high heat conduction, it is possible to by conducting, heat is sent in the middle of environment by the mode such as convection current or radiation from heat generating components.But metal material heat conductivility is limited, the thermal conductivity 377W/m K of such as copper, the thermal conductivity of aluminum is 230W/m K.
Macromolecular material has that light weight, resistance to chemical attack, easy machine-shaping, electrical insulation capability be excellent, mechanics and the excellent feature such as anti-fatigue performance is excellent；But macromolecular material is insulator, and thermal conductivity is extremely low, greatly limit its application in heat conduction field.
In recent years, Graphene attracted wide attention in the whole world as a kind of new material.It is with sp by carbon atom2The monoatomic layer that hydridization connects is constituted, and its theoretic throat is only 0.35nm, is the thinnest two-dimensional material found at present.Graphene is the elementary cell constituting other material with carbon element, it is possible to be warped into the fullerene of zero dimension, curls into one-dimensional CNTs or is stacked to the graphite of three-dimensional.This special construction has contained abundant and peculiar physical phenomenon, makes Graphene show the physicochemical properties of many excellences.Here involved by is its thermal property, and it, as a kind of low-dimensional nano-carbon material, has the thermal conductivity of up to 3000W/m K～6000W/m K, be the heat conductivility best material having now been found that.But grapheme material also has weak point, such as its folding resistance is poor, and the intensity of material is weak, it is possible to tearing easily or produce breakage because adhered to position is subjected to displacement and entry material comes off, therefore it cannot be applied separately as heat sink material.
CNT, since within 1991, being found, has caused the very big attention of scientific circles and industrial circle at once.CNT is be made up of the coaxial pipe of several layers to tens of layers the carbon atom of hexagonal arrangement.CNT has excellent thermal conductivity, electric property and mechanical performance.But, owing to CNT has very big draw ratio, thus its thermal conductivity alongst is significantly high, and vertically the thermal conductivity of its length direction is very low, and this is unfavorable for that CNT carries out commercial application as Heat Conduction Material.
To sum up, develop high bond strength, the composite heat-conducting fin of high heat conductance not only has great creativeness, also has huge impetus for electronics industry heat radiation.
Summary of the invention
The main purpose of the present invention is to provide the composite heat-conducting fin of a kind of high heat conduction, this composite heat-conducting fin not only has higher thermal conductivity, also there is higher bond strength, be applied in the heat abstractor of the electronic equipments such as integrated circuit, electronic device, heat exchanger, LED, play quick heat radiating ensure electronic devices and components efficiently, the effect run of stable, long-life.
In order to realize object above, the present invention proposes techniques below scheme:
A kind of composite heat-conducting fin, comprising: the first conductive substrate, this first conductive substrate is provided with multiple through hole and is perpendicular to described first conductive substrate；Multiple second conducting strips, this second conducting strip is arranged on the upper and lower surface of described first conductive substrate and the inner surface of through hole, and the second conducting strip being arranged on the upper and lower surface of described first conductive substrate is basically parallel to the first conductive substrate, the second conducting strip being arranged on the inner surface of described through hole is basically parallel to the inner surface of described through hole.
Described first conductive substrate is the same tropism Materials of heat conduction, and the thermal conductivity of described first conductive substrate is 0.05W/m K～500W/m K, and described second conducting strip is heat conduction Metamaterials, and the thermal conductivity along its in-plane is 1000W/m K～6000W/m K.
Described first conductive substrate is metal forming, and the thickness of described first conductive substrate is 5 μm～500 μm, and the thickness of described second conducting strip is 0.01 μm～10 μm.
The aperture of described through hole is 1 μm～1000 μm.
The density of described through hole is 102Individual/cm2～104Individual/cm2。
Described second conducting strip includes Graphene or carbon nano-tube film.
Described first conductive substrate is polymeric membrane, and the thickness of described first conductive substrate is 1 μm～1000 μm, and the thickness of described second conducting strip is 0.01 μm～10 μm.
A kind of composite heat-conducting fin, it includes a conductive substrate, is perpendicular to multiple heat pipes of this conductive substrate setting and the Graphene on the upper and lower surface relative with being distributed in described conductive substrate, described heat pipe is formed by the Graphene running through this conductive substrate, and the Graphene forming this heat pipe is basically perpendicular to described conductive substrate, the Graphene on the upper and lower surface being arranged on described conductive substrate is basically parallel to conductive substrate.
A kind of composite heat-conducting fin, it includes a netted conductive substrate and is coated with the anisotropic heat-conducting layer of heat conduction of this conductive substrate, and the mesh aperture of described conductive substrate is 1 μm～1000 μm；Described heat-conducting layer is coated with the upper and lower surface of this conductive substrate and the hole wall of mesh, and described heat-conducting layer is 1000W/m K～6000W/m K along the thermal conductivity of its in-plane, and vertically the thermal conductivity of its in-plane is 1W/m K～100W/m K.
Described heat-conducting layer thickness on this conductive substrate is 0.01 μm～10 μm, and it is 0.01 μm～10 μm that described heat-conducting layer is attached to the thickness on hole wall.
Compared to prior art, composite heat-conducting fin provided by the invention has the advantage that (1) has the heat dispersion of excellence.Conducting strip prepared by prior art is usually the surface being laid in substrate, and direction of heat flow is perpendicular to the surface of substrate, causes that final radiating effect is unsatisfactory.And composite heat-conducting fin of the present invention, two surfaces of the first conductive substrate and the inner surface of through hole are provided with the second conducting strip.The heat that the second conducting strip being positioned at the lower surface of the first conductive substrate is possible not only to be transmitted by thermal source is quickly dispersed in the surface of the first conductive substrate, and the heat obtained can be quickly transferred to the second conducting strip of the first conductive substrate upper surface by investing the second conducting strip of the inner surface of through hole.Being transferred to the second conducting strip surface that the heat on top passes through quickly to spread, the mode eventually through convection current and radiation realizes quick heat radiating.It is to say, the through hole inner surface of described composite heat-conducting fin the second conducting strip can improve the thermal conductivity on the direction being perpendicular to the first conductive substrate surface, thus substantially increasing the overall thermal conductivity of composite heat-conducting fin.Further, by through hole carries out rational aperture design and hole density design, the heat conduction of composite heat-conducting fin can be made to be more uniformly distributed.(2) second conducting strips and the first conductive substrate bond strength are high.Second conducting strip prepared by prior art is laid in the first conductive substrate surface, Presence of an interface stress between the two due to it, thus is easily caused the second conducting strip and peels off.And composite heat-conducting fin of the present invention, second conducting strip therein is not placed only in two surfaces up and down of the first conductive substrate, and it is distributed in the inner surface of through hole, the layer structure that this second conducting strip of inner surface being distributed in upper and lower surface and through hole is connected, first conductive substrate is clipped in the middle and entangles firm, thus second conducting strip and the bond strength of first conductive substrate are greatly improved.
Accompanying drawing explanation
Fig. 1 is structural representation (wherein, 1 expression first conductive substrate of composite heat-conducting fin of the present invention；2 represent through hole；3 represent the second conducting strip).
Fig. 2 is the microphotograph of the composite heat-conducting fin that the embodiment of the present invention 1 obtains.
Fig. 3 a is the Raman collection of illustrative plates measured by the location A of composite heat-conducting fin described in Fig. 2.
Fig. 3 b is the Raman collection of illustrative plates measured by the B location of composite heat-conducting fin described in Fig. 2.
Detailed description of the invention
Below with reference to accompanying drawing, composite heat-conducting fin provided by the invention and preparation method thereof is described further.
Material provided by the present invention can pass through marketable material or the synthesis of traditional chemical transform mode.
Other aspects of the present invention, due to this disclosure, are apparent to those skilled in the art.
Below in conjunction with specific embodiment, it is further elucidated with the present invention.Should be understood that these embodiments are merely to illustrate the present invention rather than restriction the scope of the present invention.
Unless otherwise defined or described herein, the same meaning that all specialties used herein are familiar with scientific words and those skilled in the art.In addition any method similar or impartial to described content and material all can be applicable in the inventive method.
Referring to Fig. 1, the present invention provides a kind of composite heat-conducting fin.Described composite heat-conducting fin includes: the first conductive substrate 1 and multiple second conducting strip 3.This first conductive substrate 1 is provided with multiple through hole 2 and is perpendicular to described first conductive substrate 1.This second conducting strip 3 is arranged on the upper and lower surface of described first conductive substrate 1 and the inner surface of through hole.Concrete, second conducting strip 3 on the upper and lower surface being arranged on described first conductive substrate 1 is basically parallel to the first conductive substrate 1, and the second conducting strip 3 being arranged on the inner surface of described through hole 2 is basically parallel to the inner surface of described through hole 2.
Described composite heat-conducting fin is prepared by method and can obtain.Described preparation method comprises the following steps:
(1) the first conductive substrate 1 being carried out surface cleaning processing, processing procedure includes: oil removing, pickling, washing, alcohol wash, drying；
Wherein, described first conductive substrate 1 is the same tropism Materials of heat conduction, and the thermal conductivity of described first conductive substrate 1 is 0.05W/m K～500W/m K.Described first conductive substrate 1 can be metal forming or polymeric membrane.When the first conductive substrate 1 is metal forming, the thickness of described first conductive substrate 1 is 5 μm～500 μm, it is preferred to 10 μm～100 μm.When the first conductive substrate 1 is polymeric membrane, the thickness of described first conductive substrate 1 is 1 μm～1000 μm, it is preferred to 10 μm～100 μm.
(2) the first conductive substrate 1 after cleaning being carried out perforate process, perforate mode includes laser boring, plasma punching, machine drilling, chemical etching hole etc., obtains multiple through hole 2；
Wherein, the hole density of described through hole 2 is 101Individual/cm2～106Individual/cm2, it is preferred to 102Individual/cm2～104Individual/cm2.When the first conductive substrate 1 is metal forming, the aperture of described through hole 2 is 1 μm～1000 μm；So that the first conductive substrate 1 dispels the heat evenly, the aperture of described through hole 2 is preferably 10 μm～500 μm.When the first conductive substrate 1 is polymeric membrane, the aperture of described through hole 2 is 100nm～100 μm；So that the first conductive substrate 1 dispels the heat evenly, the aperture of through hole 2 is preferably 1 μm～50 μm；
(3) carry out perforate process the first conductive substrate 1 upper and lower surface and the inner surface of through hole 2 second conducting strip 3 is set, making the second conducting strip 3 being arranged on the upper and lower surface of described first conductive substrate 1 be basically parallel to the first conductive substrate 1, the second conducting strip 3 being arranged on the inner surface of described through hole 2 is basically parallel to the inner surface of described through hole 2.
Concrete, described second conducting strip 3 is heat conduction Metamaterials, and the thermal conductivity along its in-plane is 1000W/m K～6000W/m K.Owing to the second conducting strip 3 has heat conduction anisotropy, when heat reaches the second conducting strip 2, heat can transmit and disperse in the rapid direction that thermal conductivity is high in the second conducting strip 3 plane, without being detained.The thickness of described second conducting strip is 0.01 μm～10 μm.
Described second conducting strip includes Graphene or carbon nano-tube film.Described second conducting strip 3 can be formed at described first conductive substrate 1 by liquid phase deposition or chemical vapour deposition technique.
When adopting liquid phase deposition, the dispersion liquid of graphene-containing or CNT can be pre-formed, then the first conductive substrate 1 carrying out perforate process is immersed in the dispersion liquid of graphene-containing or CNT, take out through after a period of time, composite heat-conducting fin described in drying.Concrete, Graphene or CNT, dispersant and solvent are disperseed by means such as high-speed stirred, ultrasonic, ball milling and/or sand millings, obtains the dispersion liquid of homogeneous and stable graphene-containing or CNT.Described dispersant is oligomer of phenylamine.Described oligomer of phenylamine has good dissolubility, dissolves in described solvent.Described oligomer of phenylamine includes the one in aniline trimer, Tetraaniline, aniline pentamer or aniline six aggressiveness or combination.This oligomer of phenylamine can and Graphene or CNT between formed π-π interaction force and realize combine.Concrete, owing to the phenyl ring in described oligomer of phenylamine is close with Graphene and carbon nano tube structure, thus described oligomer of phenylamine can and Graphene or CNT between form pi-pi bond and realize and Graphene or CNT Homogeneous phase mixing.
Described solvent can be the one in deionized water, ethanol, acetone, isopropanol, butanol, ethyl acetate, toluene, chloroform, dimethylformamide, dimethyl sulfoxide dichloroethanes or combination.In the dispersion liquid of described graphene-containing or CNT, the mass percent (i.e. solid content) of Graphene or CNT is 0.1%～10%.It is appreciated that to help described second conducting strip to be adsorbed in described first conductive substrate more closely, described first conductive substrate can be carried out negative charge process.Due to oligomer of phenylamine positively charged, make the also positively charged of the dispersion liquid containing Graphene or CNT, first conductive substrate passes through strong electrostatic attraction with Graphene or CNT, it is achieved Graphene or the CNT adventitious deposit on the first conductive substrate surface, thus obtaining composite heat-conducting fin.
When adopting chemical vapour deposition technique, the first conductive substrate 1 that can described perforate be processed puts into chemical deposition reaction zone, pass into carbon-source gas and carrier gas, under uniform temperature and pressure conditions, by chemical vapour deposition technique to realize Graphene or CNT on the hole wall of the surface of metal forming 1 and through hole 2 all deposits.
The Graphene of the inner surface of this surface being deposited on the first conductive substrate 1 and through hole 2 or CNT are connected formation layer structure, and the first conductive substrate 1 is clipped in the middle and is entangled firm.Namely described second conducting strip 3 covers the surface of described first conductive substrate 1 and the inner surface of through hole 2.
When the material of described second conducting strip 3 is Graphene, described second conducting strip 3 is made up of the Graphene that multilamellar is pure.In described second conducting strip 3, the number of plies of Graphene is 1 layer～100 layers.The thickness of described second conducting strip 3 is 0.01 μm～10 μm.Now, when the first conductive substrate is metal forming, the thermal conductivity of the composite heat-conducting fin obtained is 500W/m K～2000W/m K, and the bond strength of the second conducting strip and the first conductive substrate is 1Mpa～100Mpa；When the first conductive substrate is polymeric membrane, the thermal conductivity of the composite heat-conducting fin obtained is 20W/m K～500W/m K, and the bond strength of the second conducting strip and the first conductive substrate is 1Mpa～20Mpa.
When the material of described second conducting strip 3 is CNT, described second conducting strip 3 is made up of the CNT of multiple lack of alignment.Two adjacent CNT mutual overlap to form one network structures.The thickness of described second conducting strip 3 is 0.01 μm～10 μm.
The present invention also provides for another kind of composite heat-conducting fin, and it includes a conductive substrate, is perpendicular to multiple heat pipes of this conductive substrate setting and the Graphene on the upper and lower surface relative with being distributed in described conductive substrate.Described heat pipe is formed by the Graphene running through this conductive substrate.The Graphene forming this heat pipe is basically perpendicular to described conductive substrate, and the Graphene on the upper and lower surface being arranged on described conductive substrate is basically parallel to conductive substrate.
The present invention also provides for another kind of composite heat-conducting fin, and it includes a netted conductive substrate and is coated with the anisotropic heat-conducting layer of heat conduction of this conductive substrate, and the mesh aperture of described conductive substrate is 1 μm～1000 μm.Described heat-conducting layer is coated with the upper and lower surface of this conductive substrate and the hole wall of mesh.Described heat-conducting layer is 1000W/m K～6000W/m K along the thermal conductivity of its in-plane, and vertically the thermal conductivity of its in-plane is 1W/m K～100W/m K.
Described composite heat-conducting fin is applied in the heat abstractor of integrated circuit, electronic device, heat exchanger or LED as heat dissipation element.
Compared to prior art, composite heat-conducting fin provided by the invention has the advantage that (1) has the heat dispersion of excellence.Conducting strip prepared by prior art is usually the surface being laid in substrate, and direction of heat flow is perpendicular to the surface of substrate, causes that final radiating effect is unsatisfactory.And composite heat-conducting fin of the present invention, two surfaces of the first conductive substrate and the inner surface of through hole are provided with the second conducting strip.The heat that the second conducting strip being positioned at the lower surface of the first conductive substrate is possible not only to be transmitted by thermal source is quickly dispersed in the surface of the first conductive substrate, and the heat obtained can be quickly transferred to the second conducting strip of the first conductive substrate upper surface by investing the second conducting strip of the inner surface of through hole.Being transferred to the second conducting strip surface that the heat on top passes through quickly to spread, the mode eventually through convection current and radiation realizes quick heat radiating.It is to say, the through hole inner surface of described composite heat-conducting fin the second conducting strip can improve the thermal conductivity on the direction being perpendicular to the first conductive substrate surface, thus substantially increasing the overall thermal conductivity of composite heat-conducting fin.Further, by through hole carries out rational aperture design and hole density design, the heat conduction of composite heat-conducting fin can be made to be more uniformly distributed.(2) second conducting strips and the first conductive substrate bond strength are high.Second conducting strip prepared by prior art is laid in the first conductive substrate surface, Presence of an interface stress between the two due to it, thus is easily caused the second conducting strip and peels off.And composite heat-conducting fin of the present invention, second conducting strip therein is not placed only in two surfaces up and down of the first conductive substrate, and it is distributed in the inner surface of through hole, the layer structure that this second conducting strip of inner surface being distributed in upper and lower surface and through hole is connected, first conductive substrate is clipped in the middle and entangles firm, thus second conducting strip and the bond strength of first conductive substrate are greatly improved.
For further describing the present invention, it is the preparation method of described Graphene composite film-stuck below, the specific embodiment under different parameters:
Embodiment 1:
Choose the Copper Foil of 35 μ m-thick, and it is carried out the cleaning treatment such as oil removing, pickling, washing, alcohol wash, drying.Copper Foil after cleaning is carried out laser boring process, obtains multiple through hole.The aperture of described through hole is 100 μm, hole density is 2000/cm2.Then put into chemical vapor deposition reaction zone by carrying out the Copper Foil that perforate processed, pass into methane and reductive hydrogen, under 1000 DEG C and 50Pa pressure conditions, at the hole wall deposited graphite alkene layer of copper foil surface and through hole.Finally obtain Graphene composite copper foil.The thickness of described graphene layer is 0.05 μm.
Described Graphene composite copper foil is carried out performance test.Concrete, record its thermal conductivity by heat reflection method film coefficient of heat transfer measuring instrument (model NanoTR, NETZSCH company of Germany)；The bond strength of Graphene and metal forming is recorded by pulling open method adhesion-force tester (model PosiTestAT, DeFelsko company of the U.S.).Test result is: the thermal conductivity of described Graphene composite copper foil is 1000W/m K, and the bond strength of Graphene and Copper Foil is 10Mpa.
Also carry out taking pictures under microscope and Raman spectrum test to described Graphene composite copper foil.Refer to Fig. 2, it is seen that be evenly distributed with multiple through hole on the surface of Copper Foil.Refer to Fig. 3 a and Fig. 3 b, it is seen then that the Raman obtained on the surface of Copper Foil and the position of through hole schemes all at 1600cm-1And 2700cm-1Occurring in that the absworption peak at G peak and the 2D peak corresponding respectively to Graphene near position, this explanation is all covered with described Graphene on the surface of Copper Foil and the inwall of through hole.
Embodiment 2:
Weighing 10g Graphene, 3g Tetraaniline and 990g ethanol, mix homogeneously forms solid content under high velocity agitation is the graphene dispersing solution of 1%.Choose the native gold of 5 μ m-thick, and it is carried out the cleaning treatment such as oil removing, pickling, washing, alcohol wash, drying.Native gold after cleaning is carried out plasma perforate process, obtains multiple through hole.The aperture of described through hole is 1 μm, and hole density is 105Individual/cm2.Then it is immersed in above-mentioned graphene dispersing solution by carrying out the native gold that perforate processed, takes out after 5min, drying Graphene compound native gold.Hole wall at the surface of native gold and through hole forms graphene layer, and the thickness of described graphene layer is 0.5 μm.
Described Graphene compound native gold is carried out performance test.Method of testing is with embodiment 1.Test result is: the thermal conductivity of described Graphene compound native gold is 1000W/m K, and the bond strength of Graphene and native gold is 20Mpa.
Embodiment 3:
Weighing 5g Graphene, 2g aniline pentamer and 995g acetone, mix homogeneously forms solid content under high velocity agitation is the graphene dispersing solution of 5 ‰.Choose the native silver of 100 μ m-thick, and it is carried out the cleaning treatment such as oil removing, pickling, washing, alcohol wash, drying.Native silver after cleaning is carried out chemical etching perforate process, obtains multiple through hole.The aperture of described through hole is 10 μm, hole density is 104Individual/cm2.Then it is immersed in above-mentioned graphene dispersing solution by carrying out the native silver that perforate processed, takes out after 2min, drying Graphene compound native silver.Hole wall at the surface of native silver and through hole forms graphene layer, and the thickness of described graphene layer is 0.1 μm.
Described Graphene compound native silver Progressive symmetric erythrokeratodermia can be tested.Method of testing is with embodiment 1.Test result is: the thermal conductivity of described Graphene compound native silver is 1500W/m K, and the bond strength of Graphene and native silver is 5Mpa.
Embodiment 4:
Weighing 2g Graphene, 2g aniline six aggressiveness and 998g oxolane, mix homogeneously forms solid content under high velocity agitation is the graphene dispersing solution of 2 ‰.Choose aperture be 50 μm, hole density be 102Individual/cm2, thickness is the porous PET film of 500 μm, and is carried out processing to it and negative charge processes.Then the porous PET film processed through negative charge is immersed in above-mentioned graphene dispersing solution, takes out after 10min, drying Graphene compound PET film.Hole wall at the surface of PET film and through hole forms graphene layer, and the thickness of described graphene layer is 0.3 μm.
Described Graphene compound PET film is carried out performance test.Method of testing is with embodiment 1.Test result is: the thermal conductivity of described Graphene compound PET film is 20W/m K, and the bond strength of Graphene and PET film is 2Mpa.
Embodiment 5:
Choose the nickel plating Copper Foil of 200 μ m-thick, and it is carried out the cleaning treatment such as oil removing, pickling, washing, alcohol wash, drying.Nickel plating Copper Foil after cleaning is carried out laser boring process, obtains multiple through hole.The aperture of described through hole is 50 μm, hole density is 103Individual/cm2.Then put into chemical vapor deposition reaction zone by carrying out the nickel plating Copper Foil that perforate processed, pass into methane and hydrogen, under 1100 DEG C and 0.1Pa pressure conditions, at the hole wall deposition of carbon nanotubes layer of nickel plating copper foil surface and through hole.Finally obtain CNT composite nickel-plating Copper Foil.The thickness of described carbon nanotube layer is 0.1 μm.
Described CNT composite nickel-plating Copper Foil is carried out performance test.Method of testing is with embodiment 1.Test result is: the thermal conductivity of described CNT composite nickel-plating Copper Foil is 1200W/m K, and the bond strength of CNT and nickel plating Copper Foil is 5Mpa.
The explanation of above example is only intended to help to understand method and the core concept thereof of the present invention.It should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to the present invention carries out some improvement and modification, these improve and modify in the protection domain also falling into the claims in the present invention.The multiple amendment of these embodiments is apparent from for those skilled in the art, and generic principles defined herein can realize without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein, and is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (10)
1. a composite heat-conducting fin, it is characterised in that comprising:
First conductive substrate, this first conductive substrate is provided with multiple through hole and is perpendicular to described first conductive substrate；
Multiple second conducting strips, this second conducting strip is arranged on the upper and lower surface of described first conductive substrate and the inner surface of through hole, and the second conducting strip being arranged on the upper and lower surface of described first conductive substrate is basically parallel to the first conductive substrate, the second conducting strip being arranged on the inner surface of described through hole is basically parallel to the inner surface of described through hole.
2. a composite heat-conducting fin as claimed in claim 1, it is characterized in that, described first conductive substrate is the same tropism Materials of heat conduction, the thermal conductivity of described first conductive substrate is 0.05W/m K～500W/m K, described second conducting strip is heat conduction Metamaterials, and the thermal conductivity along its in-plane is 1000W/m K～6000W/m K.
3. a composite heat-conducting fin as claimed in claim 2, it is characterised in that described first conductive substrate is metal forming, the thickness of described first conductive substrate is 5 μm～500 μm, and the thickness of described second conducting strip is 0.01 μm～10 μm.
4. a composite heat-conducting fin as claimed in claim 3, it is characterised in that the aperture of described through hole is 1 μm～1000 μm.
5. a composite heat-conducting fin as claimed in claim 4, it is characterised in that the density of described through hole is 102Individual/cm2～104Individual/cm2。
6. a composite heat-conducting fin as claimed in claim 2, it is characterised in that described second conducting strip includes Graphene or carbon nano-tube film.
7. a composite heat-conducting fin as claimed in claim 6, it is characterised in that described first conductive substrate is polymeric membrane, the thickness of described first conductive substrate is 1 μm～1000 μm, and the thickness of described second conducting strip is 0.01 μm～10 μm.
8. a composite heat-conducting fin, it is characterized in that, it includes a conductive substrate, is perpendicular to multiple heat pipes of this conductive substrate setting and the Graphene on the upper and lower surface relative with being distributed in described conductive substrate, described heat pipe is formed by the Graphene running through this conductive substrate, and the Graphene forming this heat pipe is basically perpendicular to described conductive substrate, the Graphene on the upper and lower surface being arranged on described conductive substrate is basically parallel to conductive substrate.
9. a composite heat-conducting fin, it is characterised in that it includes a netted conductive substrate and is coated with the anisotropic heat-conducting layer of heat conduction of this conductive substrate, and the mesh aperture of described conductive substrate is 1 μm～1000 μm；Described heat-conducting layer is coated with the upper and lower surface of this conductive substrate and the hole wall of mesh, and described heat-conducting layer is 1000W/m K～6000W/m K along the thermal conductivity of its in-plane, and vertically the thermal conductivity of its in-plane is 1W/m K～100W/m K.
10. a composite heat-conducting fin as claimed in claim 9, it is characterised in that described heat-conducting layer thickness on this conductive substrate is 0.01 μm～10 μm, it is 0.01 μm～10 μm that described heat-conducting layer is attached to the thickness on hole wall.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410813889.5A CN105783576B (en) | 2014-12-24 | 2014-12-24 | A kind of composite heat-conducting fin |
| PCT/CN2015/095742 WO2016086796A1 (en) | 2014-12-02 | 2015-11-27 | Graphene dispersant and application thereof |
| EP15865917.7A EP3228592A4 (en) | 2014-12-02 | 2015-11-27 | Graphene dispersant and application thereof |
| TW104139658A TWI602611B (en) | 2014-12-02 | 2015-11-27 | Graphene dispersant and its application |
| US15/607,552 US10696790B2 (en) | 2014-12-02 | 2017-05-29 | Graphene dispersant and application thereof |
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| CN201410813889.5A CN105783576B (en) | 2014-12-24 | 2014-12-24 | A kind of composite heat-conducting fin |
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| CN111085765A (en) * | 2019-12-27 | 2020-05-01 | 哈尔滨工业大学 | Flat NiTi alloy electron beam welding anisotropic heat dissipation cooling device and welding method thereof |
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