CN105778582A - High-heat-conductivity heat-radiating nano composite coating - Google Patents
High-heat-conductivity heat-radiating nano composite coating Download PDFInfo
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- CN105778582A CN105778582A CN201610160059.6A CN201610160059A CN105778582A CN 105778582 A CN105778582 A CN 105778582A CN 201610160059 A CN201610160059 A CN 201610160059A CN 105778582 A CN105778582 A CN 105778582A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
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- Wood Science & Technology (AREA)
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- Inorganic Chemistry (AREA)
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Abstract
The invention discloses a high-heat-conductivity heat-radiating nano composite coating which comprises, by weight, 50-60 parts of nano alumina sol, 30-40 parts of high-density polyethylene, 1-3 parts of carbon nano tube, 5-10 parts of titanium phosphate, 10-15 parts of composite filler, 2-3 parts of polyvinylpyrrolidone, 5-9 parts of methyl methacrylate, 2-5 parts of ethyl acetate, 10-15 parts of isopropanol, 5-8 parts of acrylate emulsion, 3-5 parts of nano copper powder and 1-3 parts of triethanolamine. Through reasonable formulation designing, the composite coating has excellent adhesiveness and coating hardness, is efficient in heat radiating after being coated on the surface of an electronic device and is conducive to guiding out heat generated by the electronic device timely and efficiently, so that heat radiating rate is increased, cooling effect is improved, and the composite coating has excellent comprehensive performance and wide market prospect.
Description
Technical field
The present invention relates to paint field, particularly relate to a kind of high heat conduction and heat radiation nano composite dope.
Background technology
Development along with electron trade, electronic original part constantly develops towards miniaturization and the direction that runs up, components and parts raw heat in use also gradually steps up, therefore, one of heat dissipation problem technical bottleneck becoming restriction electron trade development improving or increasing electronic devices and components, excellent radiating effect is to ensure that the powerful guarantee that electronic product efficiently and accurately runs.
Traditional heat-dissipating mode includes at heat-generating electronic elements back side closed assembly fin and installs electronic fan additional, but two ways all can largely increase the volume of electronic product, thus the requirement of the microminiaturization of current electronic device, miniaturization and precise treatment cannot be met.
Heat radiation coating is the wide variety of radiating mode of current industry.But there are the following problems for existing heat radiation coating: 1, heat conductivility is relatively poor；2, tackness is not enough.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of high heat conduction and heat radiation nano composite dope, it is possible to solve the problems referred to above that existing heat radiation coating exists.
For solving above-mentioned technical problem, the technical scheme that the present invention adopts is: provide a kind of high heat conduction and heat radiation composite coating, including following parts by weight of component: nano alumina sol 50～60 parts, high density polyethylene (HDPE) 30～40 parts, CNT 1～3 part, titanium phosphate 5～10 parts, compounded mix 10～15 parts, polyvinylpyrrolidone 2～3 parts, methyl methacrylate 5～9 parts, ethyl acetate 2～5 parts, isopropanol 10～15 parts, acrylic acid ester emulsion 5～8 parts, copper nanoparticle 3～5 parts, triethanolamine 1～3 part.
In a preferred embodiment of the present invention, described heat radiation filler includes following parts by weight of component: aluminium nitride 5～7 parts, carborundum 4～6 parts, nano-calcium carbonate 10～13 parts, pyrophillite 13～25 parts, butyl polyacrylate 0.5～1.5 part and silane coupler 5～10 parts.
In a preferred embodiment of the present invention, the preparation method of described heat radiation filler is: above-mentioned pyrophillite is calcined 1.5～2h at 550～580 DEG C, the aluminium nitride of formula ratio, carborundum, nano-calcium carbonate and silane coupler mixed grinding 1～3h after discharging cooling, it is subsequently adding the butyl polyacrylate of formula ratio, mixed at high speed grinds 10～30min under certain condition, obtains described heat radiation filler after drying.
In a preferred embodiment of the present invention, the condition of described mixed grinding is: temperature 50～55 DEG C, rotating speed 1800～2200r/min；Described drying condition is: vacuum 0.01～0.03MPa, 70～80 DEG C, 1～3h.
In a preferred embodiment of the present invention, the caliber 10～13nm of described CNT, length 5～10um, monolayer.
In a preferred embodiment of the present invention, the particle diameter of described copper nanoparticle is 10～50nm.
The invention has the beneficial effects as follows: a kind of high heat conduction and heat radiation composite coating of the present invention, designed by rational formula, composite coating is made to have adhesive performance and the film hardness of excellence, after it is coated in electronic devices and components surface, while high efficiency and heat radiation, additionally aiding the heat by electronic devices and components produce derives in time efficiently, thus adding rate of heat dispation, improve radiating and cooling effect, excellent combination property, wide market.
Detailed description of the invention
Below presently preferred embodiments of the present invention is described in detail, so that advantages and features of the invention can be easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention being made apparent clear and definite defining.
The embodiment of the present invention includes:
Embodiment 1
A kind of high heat conduction and heat radiation composite coating, including following parts by weight of component: nano alumina sol 50 parts, high density polyethylene (HDPE) 30 parts, CNT 1 part, titanium phosphate 5 parts, compounded mix 10 parts, polyvinylpyrrolidone 2 parts, methyl methacrylate 5 parts, ethyl acetate 2 parts, isopropanol 10 parts, acrylic acid ester emulsion 5 parts, particle diameter are the copper nanoparticle 3 parts of 10～50nm, triethanolamine 1 part, wherein, described CNT is single layer structure, its caliber 10～13nm, length 5～10um.
Described heat radiation filler includes following parts by weight of component: aluminium nitride 5 parts, carborundum 4 parts, nano-calcium carbonate 10 parts, pyrophillite 13 parts, butyl polyacrylate 0.5 part and silane coupler 5 parts, its preparation method is: above-mentioned pyrophillite is calcined 1.5h at 550～580 DEG C, the aluminium nitride of formula ratio after discharging cooling, carborundum, nano-calcium carbonate and silane coupler mixed grinding 3h, it is subsequently adding the butyl polyacrylate of formula ratio, at 50～55 DEG C, 30min is ground with the speed mixed at high speed of 1800r/min, being subsequently placed in vacuum is 0.01～0.03MPa, temperature is the drying oven interior drying 1h of 80 DEG C, obtain described heat radiation filler.
Embodiment 2
A kind of high heat conduction and heat radiation composite coating, including following parts by weight of component: nano alumina sol 60 parts, high density polyethylene (HDPE) 40 parts, CNT 3 parts, titanium phosphate 10 parts, compounded mix 15 parts, polyvinylpyrrolidone 3 parts, methyl methacrylate 9 parts, ethyl acetate 5 parts, isopropanol 15 parts, acrylic acid ester emulsion 8 parts, particle diameter are the copper nanoparticle 5 parts of 10～50nm, triethanolamine 3 parts.Wherein, described CNT is single layer structure, its caliber 10～13nm, length 5～10um.
Described heat radiation filler includes following parts by weight of component: aluminium nitride 7 parts, carborundum 6 parts, nano-calcium carbonate 13 parts, pyrophillite 25 parts, butyl polyacrylate 1.5 parts and silane coupler 10 parts, its preparation method is: above-mentioned pyrophillite is calcined 2h at 550～580 DEG C, the aluminium nitride of formula ratio after discharging cooling, carborundum, nano-calcium carbonate and silane coupler mixed grinding 1h, it is subsequently adding the butyl polyacrylate of formula ratio, at 50～55 DEG C, 10min is ground with the speed mixed at high speed of 2200r/min, being subsequently placed in vacuum is 0.01～0.03MPa, temperature is the drying oven interior drying 3h of 70 DEG C, obtain described heat radiation filler.
Above-mentioned composite coating, the flat appearance of film is smooth, and without shrinkage cavity and pin-hole phenomena, the test of 2H hardness pencil is without scratching, and the initial viscosity under room temperature is 315Pa s.When coating thickness is 39 μm, the cooling temperature difference of thermal dispersant coatings is maximum, is 14.5 DEG C.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, all in like manner include in the scope of patent protection of the present invention.
Claims (6)
1. one kind high heat conduction and heat radiation composite coating, it is characterized in that, including following parts by weight of component: nano alumina sol 50～60 parts, high density polyethylene (HDPE) 30～40 parts, CNT 1～3 part, titanium phosphate 5～10 parts, compounded mix 10～15 parts, polyvinylpyrrolidone 2～3 parts, methyl methacrylate 5～9 parts, ethyl acetate 2～5 parts, isopropanol 10～15 parts, acrylic acid ester emulsion 5～8 parts, copper nanoparticle 3～5 parts, triethanolamine 1～3 part.
2. high heat conduction and heat radiation nano composite dope according to claim 1, it is characterized in that, described heat radiation filler includes following parts by weight of component: aluminium nitride 5～7 parts, carborundum 4～6 parts, nano-calcium carbonate 10～13 parts, pyrophillite 13～25 parts, butyl polyacrylate 0.5～1.5 part and silane coupler 5～10 parts.
3. high heat conduction and heat radiation nano composite dope according to claim 2, it is characterized in that, the preparation method of described heat radiation filler is: above-mentioned pyrophillite is calcined 1.5～2h at 550～580 DEG C, the aluminium nitride of formula ratio, carborundum, nano-calcium carbonate and silane coupler mixed grinding 1～3h after discharging cooling, it is subsequently adding the butyl polyacrylate of formula ratio, mixed at high speed grinds 10～30min under certain condition, obtains described heat radiation filler after drying.
4. high heat conduction and heat radiation nano composite dope according to claim 3, it is characterised in that the condition of described mixed grinding is: temperature 50～55 DEG C, rotating speed 1800～2200r/min；Described drying condition is: vacuum 0.01～0.03MPa, 70～80 DEG C, 1～3h.
5. high heat conduction and heat radiation nano composite dope according to claim 1, it is characterised in that the caliber 10～13nm of described CNT, length 5～10um, monolayer.
6. high heat conduction and heat radiation nano composite dope according to claim 1, it is characterised in that the particle diameter of described copper nanoparticle is 10～50nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610160059.6A CN105778582A (en) | 2016-03-21 | 2016-03-21 | High-heat-conductivity heat-radiating nano composite coating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610160059.6A CN105778582A (en) | 2016-03-21 | 2016-03-21 | High-heat-conductivity heat-radiating nano composite coating |
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| CN105778582A true CN105778582A (en) | 2016-07-20 |
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| CN201610160059.6A Pending CN105778582A (en) | 2016-03-21 | 2016-03-21 | High-heat-conductivity heat-radiating nano composite coating |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106519757A (en) * | 2016-11-21 | 2017-03-22 | 郑州源冉生物技术有限公司 | Thermal conductive coating for heat dissipation of electronic device |
| CN109216548A (en) * | 2018-10-22 | 2019-01-15 | 东莞理工学院 | A kind of perovskite solar battery scrapes coating preparation method |
| CN111440493A (en) * | 2019-12-24 | 2020-07-24 | 宁波激智科技股份有限公司 | Heat-conducting antistatic coating liquid and heat-conducting antistatic silver reflective film |
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| US6166123A (en) * | 1997-10-07 | 2000-12-26 | H. B. Fuller Company | Reflective composition of particles with resinous binder and process for preparing same |
| CN103756432A (en) * | 2014-01-15 | 2014-04-30 | 芜湖市宝艺游乐科技设备有限公司 | Novel high-thermal conductivity heat-dissipating coating |
| CN103965671A (en) * | 2014-05-19 | 2014-08-06 | 宁波市爱使电器有限公司 | Coating for cooling surface of light-emitting diode (LED) radiator |
| CN103965672A (en) * | 2014-05-19 | 2014-08-06 | 宁波市爱使电器有限公司 | Paint with strong adhesion for cooling surface for LED (light emitting diode) radiator |
| CN105111846A (en) * | 2015-08-14 | 2015-12-02 | 安徽艳阳电气集团有限公司 | Polyethylene and epoxy resin compound led radiating coating and preparation method therefor |
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2016
- 2016-03-21 CN CN201610160059.6A patent/CN105778582A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166123A (en) * | 1997-10-07 | 2000-12-26 | H. B. Fuller Company | Reflective composition of particles with resinous binder and process for preparing same |
| CN103756432A (en) * | 2014-01-15 | 2014-04-30 | 芜湖市宝艺游乐科技设备有限公司 | Novel high-thermal conductivity heat-dissipating coating |
| CN103965671A (en) * | 2014-05-19 | 2014-08-06 | 宁波市爱使电器有限公司 | Coating for cooling surface of light-emitting diode (LED) radiator |
| CN103965672A (en) * | 2014-05-19 | 2014-08-06 | 宁波市爱使电器有限公司 | Paint with strong adhesion for cooling surface for LED (light emitting diode) radiator |
| CN105111846A (en) * | 2015-08-14 | 2015-12-02 | 安徽艳阳电气集团有限公司 | Polyethylene and epoxy resin compound led radiating coating and preparation method therefor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106519757A (en) * | 2016-11-21 | 2017-03-22 | 郑州源冉生物技术有限公司 | Thermal conductive coating for heat dissipation of electronic device |
| CN109216548A (en) * | 2018-10-22 | 2019-01-15 | 东莞理工学院 | A kind of perovskite solar battery scrapes coating preparation method |
| CN111440493A (en) * | 2019-12-24 | 2020-07-24 | 宁波激智科技股份有限公司 | Heat-conducting antistatic coating liquid and heat-conducting antistatic silver reflective film |
| CN111440493B (en) * | 2019-12-24 | 2021-10-26 | 宁波激智科技股份有限公司 | Heat-conducting antistatic coating liquid and heat-conducting antistatic silver reflective film |
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Application publication date: 20160720 |