CN105778476A - Composite resin with high heat conducing performance and low cost and preparation method thereof - Google Patents
Composite resin with high heat conducing performance and low cost and preparation method thereof Download PDFInfo
- Publication number
- CN105778476A CN105778476A CN201410805012.1A CN201410805012A CN105778476A CN 105778476 A CN105778476 A CN 105778476A CN 201410805012 A CN201410805012 A CN 201410805012A CN 105778476 A CN105778476 A CN 105778476A
- Authority
- CN
- China
- Prior art keywords
- composite resin
- low cost
- high heat
- heat conduction
- activator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
The invention relates to a composite resin with a high heat conducing performance and a low cost and a preparation method thereof. The composite resin is prepared from the following raw material in parts by weight: 50 parts of matrix resin, 10 to 20 parts of filling material, 1 to 3 parts of compatilizer, and 1 to 2 parts of activator; and is prepared by the following steps: adding a filling material and an activator into a high-speed mixing machine, controlling the temperature in a range of 10 to 150 DEG C, mixing for 0 to 50 minutes, then adding matrix resin and compatilizer into the high-speed mixing machine, keeping on mixing until all components are evenly mixed, then transferring the mixture to a double screw extruding machine, and carrying out granulation to obtain the composite resin. Compared with the prior art, the composite resin has the advantages of more economy, more suitability, and more excellent processing performance, and is suitable for being made into LED lamps (lamp cup).
Description
Technical field
The present invention relates to composite resin and preparation method thereof, especially relate to a kind of high heat conduction low cost composite resin and preparation method thereof.
Background technology
At present, the LED lamp cup that the macromolecular material of exploitation excellent performance does, producing needs consuming some time and substantial contribution, particularly present stage along with the use of LED light source technology from developing to, the new material of heat-conducting plastic aluminum component as an alternative has become as inexorable trend.But in existing production heat-conducting plastic Lamp cup technology, process is complicated, processes loaded down with trivial details, relatively costly, and Protean market environment is far from suitable.
Chinese patent CN102070899A discloses a kind of insulating heat-conductive polyamide compoiste material and preparation method, it is prepared from by polyamide (PA) resin, polyphenylene sulfide (PPS) resin, heat filling, glass fibre, coupling agent, antioxidant, processing aid, utilize the difform heat filling being readily available on market, when amount of filler is relatively low, allow and form contact between filler and interact, heat conduction network chain is formed in system, heat conductivity is greatly improved, but the raw material type of its addition is more, cause that the production cost of product is greatly improved.
Summary of the invention
Defect that the purpose of the present invention is contemplated to overcome above-mentioned prior art to exist and a kind of more economical, more applicable, high heat conduction low cost composite resin that processing characteristics is excellent and preparation method thereof is provided.
The purpose of the present invention can be achieved through the following technical solutions:
High heat conduction low cost composite resin, adopts the raw material of following components and weight portion content to prepare:
Matrix resin 50, filler 10-20, compatilizer 1-3, activator 1-2,
Described matrix resin is polyamide.
One or more in polyamide 6 or polyamide 66 of described polyamide.
Described filler is the wollastonite of particle diameter 2500-3000 order or Pulvis Talci or calcium carbonate.
Described compatilizer is commercially available CMG-9805 or CMG9801.
Described activator is KH550, KH560, titanate esters or TAF.
The preparation method of high heat conduction low cost composite resin, adopts following steps:
(1) get the raw materials ready according to following components and weight portion content: matrix resin 50, filler 10-20, compatilizer 1-3, activator 1-2,
(2) filler and activator are placed in high mixer, control temperature and be 10-150 DEG C, mix 15-50min；
(3) in high mixer, add matrix resin and compatilizer, continue mixing to uniformly, then through double screw extruder pelletize, prepare high heat conduction low cost composite resin.
The preferred 35-45min of filler and the activator incorporation time in high mixer, mixing temperature is preferably 120-140 degree.
Compatilizer adds after previous materials mixes 10-15min.
Owing to the particle diameter of filler is at 2500-3000 order, the time of mixing, too short being difficult to made the surface of every particulate filler all be activated, if the time of mixing is long, filler can be made again to be formed and reunite.The mixing temperature of activator is too high, can vaporize and can decompose, and higher being not suitable for of its viscosity too low mixes temperature with filler, the covered effect that activator and filler are mixed to form only within specified temperatures.Compared with prior art, the present invention, mainly by clean resin matrix and preferred to conductive filler material, forms best of breed.Super mixer is prepared into the preparation processing method of the heat conduction engineering plastics product better heat-conducting plastic of processing characteristics more economical, more applicable of a kind of present domestic market sales of ratio by effective controls such as compatilizer/temperature/times.Using the hybrid technique of the present invention, filler can be made to obtain good dispersion effect in matrix material, the dispersion effect of filler directly affects the mobile performance of product.Scattered mobility is all right, and poor dispersion mobility is just relative low.
The present invention can save the material cost of about 40% than now commercially available heat-conducting plastic.
The present invention is applicable to process in LED lamp (Lamp cup), is suitable for the use of Multiple Type Lamp cup, its thermal conductivity and heat-resisting quantity and lower temperature resistance is higher.
The processing fluidity of the present invention, the hot strength of material, bending strength, impact strength, stress cracking resistance and dimensional stability all reach and exceed regulation requirement.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment 1
The preparation method of high heat conduction low cost composite resin, adopts following steps:
Raw material: matrix resin polyamide 66, filler are the wollastonite of 2500 orders, compatilizer, activator.Taking wollastonite 20 kilograms, 1 kilogram of activator mixed at high speed in high mixer activates 5 minutes, temperature 150 degree, rear adds 50 kilograms of polyamide 66s, compatilizer 2 kilograms, and mix homogeneously, by double screw extruder pelletize, it is thus achieved that plastic grain i.e. this product.
Embodiment 2
The preparation method of high heat conduction low cost composite resin, adopts following steps:
Raw material: matrix resin polyamide 6, filler are the Pulvis Talci of 3000 orders, compatilizer, activator.Taking Pulvis Talci 15 kilograms, 1.2 kilograms of activator mixed at high speed in high mixer activates 20 minutes, temperature 100 degree, rear adds 50 kilograms of polyamide 6s, compatilizer 1.5 kilograms, and mix homogeneously, by double screw extruder pelletize, it is thus achieved that plastic grain i.e. this product.
Embodiment 3
The preparation method of high heat conduction low cost composite resin, adopts following steps:
Raw material: matrix resin polyamide 66, filler are the wollastonite of 2500 orders, compatilizer, activator.Taking wollastonite 20 kilograms, 1 kilogram of activator mixed at high speed in high mixer activates 30 minutes, temperature 80 degree, rear adds 50 kilograms of polyamide 66s, compatilizer 2 kilograms, and mix homogeneously, by double screw extruder pelletize, it is thus achieved that plastic grain i.e. this product.
Embodiment 4
The preparation method of high heat conduction low cost composite resin, adopts following steps:
Raw material: matrix resin polyamide 6, High molecular weight polyethylene, filler are the calcium carbonate of 3000 orders, compatilizer, activator.Taking Pulvis Talci 10 kilograms, 1 kilogram of activator mixed at high speed in high mixer activates 50 minutes, temperature 10 degree, 50 kilograms of polyamide 66s of rear addition, High molecular weight polyethylene 6 kilograms, compatilizer 2.5 kilograms, mix homogeneously, by double screw extruder pelletize, it is thus achieved that plastic grain i.e. this product.
The following is above-described embodiment and prepare the testing result of product, as shown in the table.
Summary performance parameter, illustrates that the present invention has good processing fluidity, the hot strength of material, bending strength, impact strength, stress cracking resistance and dimensional stability really such that it is able to suitable in the fabrication and processing of LED lamp.
Embodiment 5
High heat conduction low cost composite resin, adopts the raw material of following components and weight portion to prepare:
Polyamide 50kg, filler 10kg, compatilizer 1kg, activator 1kg, wherein, the polyamide of employing is polyamide 6, and filler is the wollastonite of particle diameter 2500 order, and compatilizer is commercially available CMG-9805, and activator is KH550.
The preparation method of high heat conduction low cost composite resin, adopts following steps:
(1) get the raw materials ready according to above component and content；
(2) being placed in high mixer by filler and activator, controlling temperature is 10 DEG C, mixes 50min；
(3) adding matrix resin and compatilizer in high mixer, compatilizer adds after previous materials mixes 10min, continues mixing to uniformly, then through double screw extruder pelletize, prepares high heat conduction low cost composite resin.
Embodiment 6
High heat conduction low cost composite resin, adopts the raw material of following components and content to prepare:
Polyamide 50kg, filler 15kg, compatilizer 2kg, activator 1kg, wherein, the polyamide of employing is the mixture of polyamide 6 and polyamide 66, and filler is the Pulvis Talci of particle diameter 2700 order, and compatilizer is commercially available CMG9801, and activator is KH560.The preparation method of high heat conduction low cost composite resin, adopts following steps:
(1) get the raw materials ready according to above component and content；
(2) being placed in high mixer by filler and activator, controlling temperature is 120 DEG C, mixes 45min；
(3) adding matrix resin and compatilizer in high mixer, compatilizer adds after previous materials mixes 10min, continues mixing to uniformly, then through double screw extruder pelletize, prepares high heat conduction low cost composite resin.
Embodiment 7
High heat conduction low cost composite resin, adopts the raw material of following components and content to prepare:
Polyamide 50kg, filler 18kg, compatilizer 2kg, activator 2kg, wherein, the polyamide of employing is the mixture of polyamide 6 and polyamide 66, and filler is the calcium carbonate of particle diameter 2800 order, and compatilizer is commercially available CMG9801, and activator is titanate esters.The preparation method of high heat conduction low cost composite resin, adopts following steps:
(1) get the raw materials ready according to above component and content；
(2) being placed in high mixer by filler and activator, controlling temperature is 140 DEG C, mixes 35min；
(3) adding matrix resin and compatilizer in high mixer, compatilizer adds after previous materials mixes 15min, continues mixing to uniformly, then through double screw extruder pelletize, prepares high heat conduction low cost composite resin.
Embodiment 8
High heat conduction low cost composite resin, adopts the raw material of following components and content to prepare:
Polyamide 50kg, filler 20kg, compatilizer 3kg, activator 2kg, wherein, the polyamide of employing is polyamide 66, and filler is the calcium carbonate of particle diameter 3000 order, and compatilizer is commercially available CMG9801, and activator is TAF.The preparation method of high heat conduction low cost composite resin, adopts following steps:
(1) get the raw materials ready according to above component and content；
(2) being placed in high mixer by filler and activator, controlling temperature is 150 DEG C, mixes 15min；
(3) adding matrix resin and compatilizer in high mixer, compatilizer adds after previous materials mixes 15min, continues mixing to uniformly, then through double screw extruder pelletize, prepares high heat conduction low cost composite resin.
Claims (9)
1. high heat conduction low cost composite resin, it is characterised in that adopt the raw material of following components and weight portion content to prepare:
Matrix resin 50, filler 10-20, compatilizer 1-3, activator 1-2,
Described matrix resin is polyamide.
2. high heat conduction low cost composite resin according to claim 1, it is characterised in that one or more in polyamide 6 or polyamide 66 of described polyamide.
3. high heat conduction low cost composite resin according to claim 1, it is characterised in that described filler is the wollastonite of particle diameter 2500-3000 order or Pulvis Talci or calcium carbonate or magnesium salt etc..
4. high heat conduction low cost composite resin according to claim 1, it is characterised in that described compatilizer is commercially available CMG-9805A or CMG9801.
5. high heat conduction low cost composite resin according to claim 1, it is characterised in that described activator is KH550, KH560, titanate esters or TAF.
6. the preparation method of the high heat conduction low cost composite resin as according to any one of claim 1-5, it is characterised in that the method adopts following steps:
(1) get the raw materials ready according to following components and weight portion content: matrix resin 50, filler 10-20, compatilizer 1-3, activator 1-2,
(2) filler and activator are placed in high mixer, control temperature and be 10-150 DEG C, mix 15-50min；
(3) in high mixer, add matrix resin and compatilizer, continue mixing to uniformly, then through double screw extruder pelletize, prepare high heat conduction low cost composite resin.
7. the preparation method of high heat conduction low cost composite resin according to claim 6, it is characterised in that filler and the activator incorporation time in high mixer is 35-45min.
8. the preparation method of high heat conduction low cost composite resin according to claim 6, it is characterised in that filler and the activator mixing temperature in high mixer is 120-140 DEG C.
9. the preparation method of high heat conduction low cost composite resin according to claim 6, it is characterised in that compatilizer adds after previous materials mixes 10-15min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410805012.1A CN105778476A (en) | 2014-12-19 | 2014-12-19 | Composite resin with high heat conducing performance and low cost and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410805012.1A CN105778476A (en) | 2014-12-19 | 2014-12-19 | Composite resin with high heat conducing performance and low cost and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105778476A true CN105778476A (en) | 2016-07-20 |
Family
ID=56385581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410805012.1A Pending CN105778476A (en) | 2014-12-19 | 2014-12-19 | Composite resin with high heat conducing performance and low cost and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105778476A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104004347A (en) * | 2014-05-28 | 2014-08-27 | 广东银禧科技股份有限公司 | PA6 (polyamide 6) composite material and preparation method thereof |
-
2014
- 2014-12-19 CN CN201410805012.1A patent/CN105778476A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104004347A (en) * | 2014-05-28 | 2014-08-27 | 广东银禧科技股份有限公司 | PA6 (polyamide 6) composite material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104610714A (en) | Insulated and heat-conductive polybutylene terephthalate/polycarbonate composite material and preparation method thereof | |
| CN104559148A (en) | High-thermal-diffusion-coefficient high molecular material and preparation method thereof | |
| KR101557813B1 (en) | Heat dissipating polymer composite having an excellent thermal conductivity, preparation method thereof, and heat sink comprising the same | |
| CN104130508A (en) | Low-oriented extrusion grade polypropylene material and preparation method thereof | |
| CN104479349B (en) | A kind of flame-proof composite material for 3D printing and preparation method thereof | |
| CN103642219A (en) | High-heat-conduction and high-temperature-resistant PPO (polyphenylene oxide)/PA (polyamide) alloy and preparation method thereof | |
| CN108690315A (en) | A kind of Heat resistance ABS material of matt and preparation method thereof | |
| CN105924952A (en) | Heat conductive and insulating composite material for LED and preparation method thereof | |
| CN104788951A (en) | LED (light-emitting diode) high-thermal-conductivity composite material and preparation method thereof | |
| CN103571185A (en) | Insulation engineering plastic with high heat-conducting property and preparation method thereof | |
| CN104072966A (en) | Multi-element composite heat-conducting functional master batch and preparation method thereof | |
| CN103740084B (en) | A kind of PC/AES alloy material and preparation method thereof | |
| CN104559146A (en) | Whisker reinforced thermally conductive plastic material and preparation method thereof | |
| CN104262954A (en) | High-performance polyamide plastic PA8T and preparation method thereof | |
| CN105778476A (en) | Composite resin with high heat conducing performance and low cost and preparation method thereof | |
| CN104262965A (en) | PPS (polyphenylene sulfide) composite material and preparation method thereof | |
| CN104419195A (en) | Inorganic mineral filled semi-aromatic nylon composite material and preparation method thereof | |
| CN105885173A (en) | Special master batch for silane crosslinking insulation material and preparation method of special master batch | |
| CN102399427A (en) | Polycarbonate composite material and method for making extrusion grade light diffusion light emitting diode (LED) lamp tube | |
| CN106349689B (en) | Toughening enhances PA6 materials and preparation method thereof | |
| CN104403311B (en) | Nylon Heat Conduction Material and preparation method thereof | |
| CN108017835A (en) | A kind of heat conduction wear-resistant plastic and preparation method thereof | |
| CN105238042A (en) | High-heat-conductivity high-toughness nylon 66 composite material and preparation method therefor | |
| CN103665522B (en) | A kind of PE heat-melting butt-joint pipe fitting | |
| CN105462252A (en) | Short-fiber-reinforced heat-conducting electric-insulating nylon 46 composite material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160720 |
|
| RJ01 | Rejection of invention patent application after publication |