CN105775248A - Sealing mechanism used for chip packaging bag - Google Patents
Sealing mechanism used for chip packaging bag Download PDFInfo
- Publication number
- CN105775248A CN105775248A CN201610365283.9A CN201610365283A CN105775248A CN 105775248 A CN105775248 A CN 105775248A CN 201610365283 A CN201610365283 A CN 201610365283A CN 105775248 A CN105775248 A CN 105775248A
- Authority
- CN
- China
- Prior art keywords
- chip packaging
- packaging bag
- base
- hot plate
- enclosed mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
- B65B51/146—Closing bags
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Package Closures (AREA)
Abstract
The invention relates to a sealing mechanism used for a chip packaging bag.The sealing mechanism comprises a base and a door-shaped board installed on the base.Two stand columns are fixed to the door-shaped board and sequentially sleeved with a heat-insulating board and a heating board from top to bottom, an air bag is arranged between the heat-insulating board and the door-shaped board and connected with an air pump, an air discharging plug is arranged on the air bag, at least one heating rod is arranged inside the heating board, and two elastic parts are arranged between the heating board and the base.The sealing mechanism is simple in structure and convenient to use, the heating board is stressed evenly, heat sealing efficiency is high, heat sealing quality is good, and the sealing mechanism is safe and reliable to use and wide in application range, saves the production cost and has good social and economic benefits.
Description
Technical field
The present invention relates to a kind of enclosed mechanism, particularly relate to a kind of chip packaging bag enclosed mechanism.
Background technology
The bag mouth of chip packaging bag is closed generally by heating at sealing part and pressing, and makes bag mouth heat sealing.Traditional pressure that applies is generally adopted manual mode, and labor intensity is big, production efficiency is low.The existing automatic sealing device that occurs in that, but this closing device structure is complicated, manufacturing cost is high, and hot plate discontinuity, cause that seal quality is poor.
Summary of the invention
Instant invention overcomes the deficiencies in the prior art, it is provided that the chip packaging bag enclosed mechanism of a kind of simple in construction.
For reaching above-mentioned purpose, the technical solution used in the present invention is: a kind of chip packaging bag enclosed mechanism, including base, the door shape plate that is arranged on described base, described door shape plate is fixed with two columns, two described columns are arranged with thermal insulation board, hot plate from top to bottom successively, it is provided with air bag between described thermal insulation board and door shape plate, described air bag is connected to air pump, described air bag is provided with venting plug, it is provided with at least one heating rod in described hot plate, between described hot plate and base, is provided with two elastic components.
In a preferred embodiment of the present invention, chip packaging bag enclosed mechanism farther includes to be provided with two grooves on described base, and one end of described elastic component and described hot plate are fixed, and the other end is inserted in described groove.
In a preferred embodiment of the present invention, chip packaging bag enclosed mechanism farther includes to offer in described hot plate at least one horizontal through hole, and described heating rod inserts in described horizontal through hole.
In a preferred embodiment of the present invention, chip packaging bag enclosed mechanism farther includes described air bag and is rectangle.
In a preferred embodiment of the present invention, chip packaging bag enclosed mechanism farther includes to be provided with baffle plate on described base.
In a preferred embodiment of the present invention, it is spring that chip packaging bag enclosed mechanism farther includes described elastic component.
The invention solves the defect existed in background technology, present configuration is simple, easy to use, the dual function of column and air bag, hot plate is more uniformly stressed, heat-sealing efficiency is high and heat seal quality is good, safe and reliable, applied widely, save production cost, there is good Social benefit and economic benefit.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the structural representation of the preferred embodiments of the present invention；
Fig. 2 is the top view of the preferred embodiments of the present invention.
Detailed description of the invention
Presently in connection with drawings and Examples, the present invention is further detailed explanation, and these accompanying drawings are the schematic diagram of simplification, and the basic structure of the present invention is only described in a schematic way, and therefore it only shows the composition relevant with the present invention.
As shown in Figure 1, a kind of chip packaging bag enclosed mechanism, including base 2, the door shape plate 4 that is arranged on base 2, door shape plate 4 is fixed with two columns 6, two columns 6 is arranged with thermal insulation board 8, hot plate 10 from top to bottom successively, between thermal insulation board 8 and door shape plate 4, is provided with air bag 12, air bag 12 is connected to air pump 14, air bag 12 is provided with venting plug 16, in hot plate 10, is provided with at least one heating rod 18, between hot plate 10 and base 2, be provided with two elastic components 20.
The preferred base 2 of the present invention is provided with two grooves 22, one end of elastic component 20 is fixed with hot plate 10, the other end is inserted in groove 22, when hot plate 10 is compressed, elastic component 20 can be compressed in groove 22, avoiding the interference to hot plate 10, hot plate 10 can contact with base 2, and then realizes the heat-sealing to the chip packaging bag being placed on base 2.
Offering at least one horizontal through hole 24 in the preferred hot plate 10 of the present invention, heating rod 18 inserts in horizontal through hole 24.It is preferred that the quantity of horizontal through hole 24 is 5,5 horizontal through hole 24 uniform intervals are arranged, so, the quantity of heating rod 18 can be selected, insert in the horizontal through hole 24 of respective amount respectively, regulate the temperature of hot plate 10, it is achieved the heat-sealing to the chip packaging bag of unlike material, applied widely, provide cost savings.
In order to improve the uniform of hot plate 10 pressure, the preferred air bag 12 of the present invention is rectangle.
As in figure 2 it is shown, the seal location in order to ensure each chip packaging bag is consistent, improves packaging efficiency and package quality, the preferred base 2 of the present invention is provided with baffle plate 26.
The preferred elastic component 20 of the present invention is spring.
One end that chip packaging bag needs sealing in use, is abutted by the present invention with baffle plate 26, and air pump 14 starts, inflate to air bag 12, due to air bag 12 upper end by door shape plate 4 spacing live, air bag 12 down expands, and promotes thermal insulation board 8, hot plate 10 down to move, elastic component 20 is compressed in groove 22, the bag mouth of chip packaging bag is sealed by hot plate 10, extracts venting plug 16, and air bag 12 is exitted, under the effect of elastic component 20, hot plate 10 and thermal insulation board 8 return.
Above according to the desirable embodiment of the present invention for enlightening, by above-mentioned description, related personnel in the scope not necessarily departing from this invention technological thought, can carry out various change and amendment completely.The technical scope of this invention is not limited to the content in description, it is necessary to determine technical scope according to right.
Claims (6)
1. a chip packaging bag enclosed mechanism, it is characterized in that: the door shape plate include base, being arranged on described base, described door shape plate is fixed with two columns, two described columns are arranged with thermal insulation board, hot plate from top to bottom successively, being provided with air bag between described thermal insulation board and door shape plate, described air bag is connected to air pump, and described air bag is provided with venting plug, it is provided with at least one heating rod in described hot plate, between described hot plate and base, is provided with two elastic components.
2. chip packaging bag enclosed mechanism according to claim 1, it is characterised in that: being provided with two grooves on described base, one end of described elastic component and described hot plate are fixed, and the other end is inserted in described groove.
3. chip packaging bag enclosed mechanism according to claim 1, it is characterised in that: offering at least one horizontal through hole in described hot plate, described heating rod inserts in described horizontal through hole.
4. chip packaging bag enclosed mechanism according to claim 1, it is characterised in that: described air bag is rectangle.
5. chip packaging bag enclosed mechanism according to claim 1, it is characterised in that: described base is provided with baffle plate.
6. chip packaging bag enclosed mechanism according to claim 1, it is characterised in that: described elastic component is spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610365283.9A CN105775248A (en) | 2016-05-30 | 2016-05-30 | Sealing mechanism used for chip packaging bag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610365283.9A CN105775248A (en) | 2016-05-30 | 2016-05-30 | Sealing mechanism used for chip packaging bag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105775248A true CN105775248A (en) | 2016-07-20 |
Family
ID=56375361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610365283.9A Pending CN105775248A (en) | 2016-05-30 | 2016-05-30 | Sealing mechanism used for chip packaging bag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105775248A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106586122A (en) * | 2017-02-20 | 2017-04-26 | 海宁先锋印刷有限公司 | Packaging heat sealing machine for sealing packaging bag |
| CN108033079A (en) * | 2018-02-07 | 2018-05-15 | 德清利维通讯科技股份有限公司 | Intelligent closing device and its operation principle for packing chip |
| CN110902045A (en) * | 2019-12-24 | 2020-03-24 | 福州大学 | Sealing device convenient to turn for heat sealing machine and using method of sealing device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2414006Y (en) * | 2000-02-14 | 2001-01-10 | 张崇益 | Heating pressing-bond device for package machine |
| US20040206049A1 (en) * | 2003-02-17 | 2004-10-21 | Toyo Jidoki Co., Ltd. | Bag sealing apparatus |
| CN202574708U (en) * | 2012-04-23 | 2012-12-05 | 青岛科瑞新型环保材料有限公司 | Gas-bag pressurizing vacuum thermal baffle sealing device |
| CN103274089A (en) * | 2013-06-26 | 2013-09-04 | 苏州市金翔钛设备有限公司 | Automatic sealing machine |
| CN103587752A (en) * | 2013-11-22 | 2014-02-19 | 昆山一恒仪器有限公司 | Electric thermostatical plate sealing machine |
| CN104354933A (en) * | 2014-10-20 | 2015-02-18 | 苏州速腾电子科技有限公司 | Sealing device for chip packaging bag |
| CN104354932A (en) * | 2014-10-20 | 2015-02-18 | 苏州速腾电子科技有限公司 | Sealing device used for chip packaging bag |
| CN205770466U (en) * | 2016-05-30 | 2016-12-07 | 苏州速腾电子科技有限公司 | Chip packaging bag enclosed mechanism |
-
2016
- 2016-05-30 CN CN201610365283.9A patent/CN105775248A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2414006Y (en) * | 2000-02-14 | 2001-01-10 | 张崇益 | Heating pressing-bond device for package machine |
| US20040206049A1 (en) * | 2003-02-17 | 2004-10-21 | Toyo Jidoki Co., Ltd. | Bag sealing apparatus |
| CN202574708U (en) * | 2012-04-23 | 2012-12-05 | 青岛科瑞新型环保材料有限公司 | Gas-bag pressurizing vacuum thermal baffle sealing device |
| CN103274089A (en) * | 2013-06-26 | 2013-09-04 | 苏州市金翔钛设备有限公司 | Automatic sealing machine |
| CN103587752A (en) * | 2013-11-22 | 2014-02-19 | 昆山一恒仪器有限公司 | Electric thermostatical plate sealing machine |
| CN104354933A (en) * | 2014-10-20 | 2015-02-18 | 苏州速腾电子科技有限公司 | Sealing device for chip packaging bag |
| CN104354932A (en) * | 2014-10-20 | 2015-02-18 | 苏州速腾电子科技有限公司 | Sealing device used for chip packaging bag |
| CN205770466U (en) * | 2016-05-30 | 2016-12-07 | 苏州速腾电子科技有限公司 | Chip packaging bag enclosed mechanism |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106586122A (en) * | 2017-02-20 | 2017-04-26 | 海宁先锋印刷有限公司 | Packaging heat sealing machine for sealing packaging bag |
| CN106586122B (en) * | 2017-02-20 | 2019-04-02 | 海宁先锋印刷有限公司 | A kind of packaging heat sealing machine for packaging bag enclosing |
| CN108033079A (en) * | 2018-02-07 | 2018-05-15 | 德清利维通讯科技股份有限公司 | Intelligent closing device and its operation principle for packing chip |
| CN110902045A (en) * | 2019-12-24 | 2020-03-24 | 福州大学 | Sealing device convenient to turn for heat sealing machine and using method of sealing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160720 |