CN105772960A - Laser head inserting and connecting frame - Google Patents
Laser head inserting and connecting frame Download PDFInfo
- Publication number
- CN105772960A CN105772960A CN201610180755.3A CN201610180755A CN105772960A CN 105772960 A CN105772960 A CN 105772960A CN 201610180755 A CN201610180755 A CN 201610180755A CN 105772960 A CN105772960 A CN 105772960A
- Authority
- CN
- China
- Prior art keywords
- laser head
- gripper shoe
- installation
- sleeve pipe
- supporting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lasers (AREA)
Abstract
The invention discloses a laser head inserting and connecting frame which comprises an installation plate. An installation groove is formed in the installation plate. A casing pipe is arranged in the installation groove. An installation hole is formed in the casing pipe in the axial direction. A first supporting plate and a second supporting plate are arranged at the bottom of the installation plate. The first supporting plate and the second supporting plate are each in a triangular shape. By means of the laser head inserting and connecting frame, a laser head can be installed at the position of the installation hole of the casing pipe, fixing and supporting effects can be achieved through the first supporting plate and the second supporting plate, and the laser head can be conveniently installed through the installation hole.
Description
Technical field
The present invention relates to a kind of cuttage grafting frame, particularly to a kind of laser head cuttage grafting frame.
Background technology
Launching the device of laser, divide by working media, laser instrument can be divided into gas laser, solid state laser, semiconductor laser and the big class of dye laser 4.Recently there have been developed free electron laser, high power laser is generally all pulsed output.Existing laser head installs inconvenience, installs insecure.
Summary of the invention
The present invention mainly solves the technical problem existing for prior art, thus providing a kind of position of mounting hole that laser head can be arranged on sleeve pipe, effect that is fixing and that support can be played by the first gripper shoe and the second gripper shoe, be facilitated the laser head cuttage grafting frame of the installation to laser head by installing hole.
The above-mentioned technical problem of the present invention is addressed mainly by following technical proposals:
A kind of laser head cuttage grafting frame, including installing plate, installing plate is provided with mounting groove, and mounting groove is provided with sleeve pipe, sleeve pipe be axially arranged with installing hole；The bottom of installing plate is provided with the first gripper shoe and the second gripper shoe, and being shaped as of the first gripper shoe and the second gripper shoe is triangular shaped.
Further, described first gripper shoe and the second gripper shoe are in being arranged in parallel.
Further, described sleeve pipe is cylinder form.
Adopt the laser head cuttage grafting frame of technique scheme, it is possible to laser head is arranged on the position of mounting hole of sleeve pipe, effect that is fixing and that support can be played by the first gripper shoe and the second gripper shoe, facilitate the installation to laser head by installing hole.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of laser head cuttage grafting frame of the present invention；
Fig. 2 is the exploded view of laser head cuttage grafting frame of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described in detail, so that advantages and features of the invention can be easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention being made apparent clear and definite defining.
As shown in Figures 1 and 2, a kind of laser head cuttage grafting frame, including installing plate 1, installing plate 1 is provided with mounting groove 2, and mounting groove 2 is provided with sleeve pipe 5, sleeve pipe 5 be axially arranged with installing hole 6；The bottom of installing plate 1 is provided with the first gripper shoe 3 and the second gripper shoe 4, and being shaped as of the first gripper shoe 3 and the second gripper shoe 4 is triangular shaped；First gripper shoe 3 and the second gripper shoe 4 are in being arranged in parallel, and sleeve pipe 5 is cylinder form.
Laser head cuttage grafting frame of the present invention, it is possible to laser head is arranged on installing hole 6 position of sleeve pipe 5, can play effect that is fixing and that support by the first gripper shoe 3 and the second gripper shoe 4, facilitate the installation to laser head by installing hole 6.
Wherein, the first gripper shoe 3 and the second gripper shoe 4, in being arranged in parallel, support so convenient.
Wherein, sleeve pipe 5 is cylinder form, so conveniently installing laser head.
The above, be only the specific embodiment of the present invention, but protection scope of the present invention be not limited thereto, any change expected without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with claims protection defined.
Claims (3)
1. a laser head cuttage grafting frame, including installing plate, it is characterised in that: installing plate is provided with mounting groove, and mounting groove is provided with sleeve pipe, sleeve pipe be axially arranged with installing hole；The bottom of installing plate is provided with the first gripper shoe and the second gripper shoe, and being shaped as of the first gripper shoe and the second gripper shoe is triangular shaped.
2. laser head cuttage grafting frame according to claim 1, it is characterised in that: the first gripper shoe and the second gripper shoe are in being arranged in parallel.
3. laser head cuttage grafting frame according to claim 1, it is characterised in that: sleeve pipe is cylinder form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610180755.3A CN105772960A (en) | 2016-03-28 | 2016-03-28 | Laser head inserting and connecting frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610180755.3A CN105772960A (en) | 2016-03-28 | 2016-03-28 | Laser head inserting and connecting frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105772960A true CN105772960A (en) | 2016-07-20 |
Family
ID=56391798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610180755.3A Pending CN105772960A (en) | 2016-03-28 | 2016-03-28 | Laser head inserting and connecting frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105772960A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011075067A (en) * | 2009-09-30 | 2011-04-14 | Seiko Instruments Inc | Rolling bearing device |
| CN202479695U (en) * | 2012-02-28 | 2012-10-10 | 句容市大华激光科技开发有限公司 | Cutting laser head |
| CN203355144U (en) * | 2013-06-28 | 2013-12-25 | 深圳市天基权科技股份有限公司 | Positioner used for acupoint radiation |
| CN103480969A (en) * | 2013-09-23 | 2014-01-01 | 温岭市鑫凯汽车零部件有限公司 | Notching machine for machining dust-proof cover of automobile shock absorber |
| US20140027416A1 (en) * | 2012-07-27 | 2014-01-30 | Foxconn Technology Co., Ltd. | Method for manufacturing rotor |
| CN204997232U (en) * | 2015-09-21 | 2016-01-27 | 丰顺中品实业有限公司 | Steering wheel lock utensil shell laser welding tool |
-
2016
- 2016-03-28 CN CN201610180755.3A patent/CN105772960A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011075067A (en) * | 2009-09-30 | 2011-04-14 | Seiko Instruments Inc | Rolling bearing device |
| CN202479695U (en) * | 2012-02-28 | 2012-10-10 | 句容市大华激光科技开发有限公司 | Cutting laser head |
| US20140027416A1 (en) * | 2012-07-27 | 2014-01-30 | Foxconn Technology Co., Ltd. | Method for manufacturing rotor |
| CN203355144U (en) * | 2013-06-28 | 2013-12-25 | 深圳市天基权科技股份有限公司 | Positioner used for acupoint radiation |
| CN103480969A (en) * | 2013-09-23 | 2014-01-01 | 温岭市鑫凯汽车零部件有限公司 | Notching machine for machining dust-proof cover of automobile shock absorber |
| CN204997232U (en) * | 2015-09-21 | 2016-01-27 | 丰顺中品实业有限公司 | Steering wheel lock utensil shell laser welding tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160720 |
|
| WD01 | Invention patent application deemed withdrawn after publication |