CN105772504B - The method for improving simple metal intensity and plasticity - Google Patents

The method for improving simple metal intensity and plasticity Download PDF

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CN105772504B
CN105772504B CN201510988166.3A CN201510988166A CN105772504B CN 105772504 B CN105772504 B CN 105772504B CN 201510988166 A CN201510988166 A CN 201510988166A CN 105772504 B CN105772504 B CN 105772504B
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grain
rolling
simple metal
plasticity
coarse
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CN105772504A (en
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张新
邢本召
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Shandong Thailand Metal Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/22Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length

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  • Mechanical Engineering (AREA)
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Abstract

The present invention provides a kind of method for improving simple metal intensity and plasticity, it is characterised in that:Using the method for magnetron sputtering and asymmetrical rolling, the method repeatedly rolled using Light deformation, room temperature is rolled into less than the 0.5~2% of original depth.The crystal grain in microscopic structure after rolling is made of the crystal grain of two kinds of different grain size ranges, and one kind is coarse grain, and one kind is fine grain;The particle size range of fine grain is 10 200 nanometers, and coarse grained particle size range is 0.3 micron -5 microns.This method is while metal strength is improved, moreover it is possible to improve the plasticity of metal.

Description

The method for improving simple metal intensity and plasticity
Technical field
The present invention relates to a kind of preparation method of high-performance simple metal material, especially a kind of high-strength high-plasticity simple metal And preparation method thereof.
Background technology
Simple metal has excellent performance, but in general intensity is not high, therefore usually uses the means system of alloying It is standby to promote its intensity into alloy, but this loss plasticity.For the processing method of simple metal, it is typically limited to high temperature pressure Processing.The intensity and plasticity of simple metal can be improved simultaneously, be the target that research worker pursues.
105080966 A of Chinese patent CN provide a kind of preparation method of nanocrystalline metal strip in razor-thin, according to the following steps It carries out:(1) raw material used for steel, copper, aluminium, nickel, titanium or molybdenum ribbon material, or above-mentioned metal alloy strip steel rolled stock as rolled piece, thickness It is 200~5000 μm;(2) mill speed, friction speed ratio, different speed-ratio regulation step-length, the pre-pressing force of asynchronous very thin hoop mill are set With front and rear tensile stress;(3) start milling train and one passes is carried out to rolled piece, on-line control friction speed ratio during rolling (;4) it measures and rolls The thickness of part, and mill speed, friction speed ratio, different speed-ratio regulation step-length, front and rear tension and pre-pressing force are set again; (5) start milling train and carry out next passes to rolled piece, on-line control friction speed ratio during rolling;(6) step 2 to 5 is repeated, until rolling It is 1~5 μm that part, which is rolling to thickness,.The method of the present invention can realize the serialization of nanocrystalline metal strip in razor-thin production, and need not Intermediate annealing.
104846363 A of Chinese patent CN propose a kind of preparation method of nanostructured Titanium board, a kind of nanostructured The preparation method of Titanium board, including such as next stage:(1) selection of titanium valve particle:High purity titanium powder of hypoxemia, low hydrogen is selected, The particle size distribution range of titanium valve particle is 5-200 μm;(2) high speed spray deposition prepares Titanium board base:Titanium valve particle is accelerated, High speed titanium valve particle is collided with substrate, makes titanium valve particle that strong plastic deformation occur and deposit to form Titanium board base;(3) slab Heat treatment:Obtained Titanium board base is heat-treated;(4) hot rolling.Metallic titanium plate crystallite dimension prepared by this method is tiny, To be nanocrystalline, even tissue is had excellent performance, and overcomes the shortcomings that Titanium board intensity is low, hardness for 2 times of common Titanium board with On, while the advantages that inherit the excellent corrosion resisting property of common Titanium board, heat resistance and biocompatibility.Present invention process letter List, controllability is good, production efficiency is high, contributes to industrial applications.
Chinese patent 10162923 proposes a kind of preparation method of superfine crystalline pure iron, including:Prepared material to be rolled is selected, 5 hours are kept the temperature at 900 DEG C;Symmetric rolling and the rolling of asynchronous friction speed;Second synchronization rolling is carried out after heat preservation at normal temperatures, is made super Fine grain pure iron.Crystal particle scale is made as 0.9 Μ M using the above scheme, by easy steps in the present invention, high-angle boundary (Θ >= 15 °) content reach more than 65% ultrafine-grained (UFG) microstructure.Show through uniaxial tensile test, material is surrendered by force after asymmetrical rolling Degree is obviously improved.
Invention content:
Goal of the invention:In order to excavate the potential of simple metal material, simple metal intensity is improved simultaneously the present invention provides a kind of With the method for plasticity.The ductility of simple metal can only be usually extended within 10000% by conventional calendering processing, for some The material processed is difficult to, such as magnesium alloy and titanium alloy, ductility is then very low.And the present invention uses micro-machined method, It is rolled under room temperature, the ductility of the simple metal of the cubic systems such as copper can be extended to more than 50000%, the metals such as magnesium, titanium Ductility can also reach more than 5000%.Crystal grain in the microscopic structure of simple metal after processing is by two kinds of different grain size ranges Crystal grain forms, and one kind is coarse grain, and one kind is fine grain;The particle size range of fine grain is 10-200 nanometers, coarse grained granularity Range is 0.3 micron -5 microns.Wherein more than 70% volume fraction of Jingjing grain, coarse grained volume fraction 30% hereinafter, Coarse grain is distributed in fine grain.The intensity of the simple metal is high, and excellent plasticity.
Technical scheme is as follows:
Using simple metal as target, the simple metal plank of microscopic structure layering is prepared.Asymmetrical rolling is used at room temperature Method, each deformation amount controlling is within 5%, using multiple rolling, the thickness of final simple metal original thickness 0.5~ Thus 2% hereinafter, prepare a kind of simple metal material of high intensity.
Specific preparation method includes the following steps:
1. the simple metal plank of microscopic structure layering is prepared as target using simple metal;
2. starting Multi-functional rolling system, the fast ratio of top and bottom rolls is set, speed is than being 1.1-1.3;Setting rolls shape every time Variable is 1-5%;The speed of low speed roller is set as 0.5-2 meter per seconds;
3. starting main driving motor, start the operation of rolling;
4. treating after once rolling, repeat to roll, until thickness is thinned to less than the 0.5~2% of original thickness;
5. carrying out full annealed heat treatment, recrystallization temperature arrives a quarter for 1/3rd of the simple metal fusing point, Time 3-20 minute;
Beneficial effect:Processing method using the present invention can fully excavate the ductility of simple metal, and ductility is most Height can reach more than 100000%, more than any report data in available data.The present invention can obtain high ductility and prepare Simple metal, existing coarse grain in institutional framework, and have fine grain can have both the outstanding plasticity of coarse grain and fine grain is excellent Different intensity.In fact, the metal material being made of entirely fine grain, is not only difficult to prepare, and plasticity is very poor.And present invention system Standby material, not only intensity is high, but also plasticity is high, is even better than fine grain in intensity.It has its source in this material knot Structure can reach greatly back of the body processing hardening, generate apparent Bauschinger effect.In addition, the present invention is compared using room temperature rolling It is energy saving, it is at low cost, suitable for large-scale production.
Description of the drawings
Fig. 1 is the micro-organization chart of the present invention, larger for coarse grain, tiny for fine grain.
Specific embodiment
Below by with reference to attached drawing and embodiment detailed description of the present invention preparation method, but the limit to the present invention is not formed System.
Embodiment 1
1. fine copper is selected to be deposited in magnetic control sputtering system as target:It is evacuated to 10-3Pa is filled with argon gas, so It is evacuated to 10 again afterwards-3Pa, adjustment operating voltage are 600V, sputter duty ratio 70%, proceed by sputtering sedimentation copper coin;Work as copper When the thickness of plate reaches 150 microns, voltage is transferred to 300V, duty ratio is transferred to 40%;When the overall thickness of copper coin reaches 300 microns When, voltage is recalled into 600V, duty ratio adjusts back to 70%;It is so repeated, until copper plate thickness reaches 18 millimeters, takes out copper Plate;
2. starting Multi-functional rolling system, the fast ratio of top and bottom rolls is set, speed is than being 1.2;Set each rolling deformation amount It is 3%;The speed of low speed roller is set as 0.5 meter per second;
3. starting main driving motor, start the operation of rolling;
4. treating after once rolling, repeat to roll, until thickness is thinned to 15 microns;
5. carrying out full annealed heat treatment, recrystallization temperature is 250 degrees Celsius, 20 minutes time.
Fabric analysis:Coarse grained average grain size is 1.5 microns, and the average grain diameter of fine grain is 90 nanometers.
Embodiment 2
1. the pure titanium target material of selection, is deposited in magnetic control sputtering system:It is evacuated to 10-3Pa is filled with argon gas, Ran Houzai It is evacuated to 10-3Pa, adjustment operating voltage are 400V, sputter duty ratio 70%, proceed by sputtering sedimentation titanium plate;When titanium plate When thickness reaches 20 microns, voltage is transferred to 300V, duty ratio is transferred to 40%;It, will when the overall thickness of titanium plate reaches 40 microns Voltage recalls to 400V, and duty ratio adjusts back to 70%;So 10 times repeatedly, obtain the titanium plate of one piece of 10 sputtering sedimentation, Ran Houguan System is closed, takes out titanium plate;
2. starting Multi-functional rolling system, the fast ratio of top and bottom rolls is set, speed is than being 1.1;Set each rolling deformation amount It is 2%;The speed of low speed roller is set as 0.5 meter per second;
3. starting main driving motor, start to roll;
4. treating after once rolling, (2) (3) process is repeated 20 times;
5. carry out full annealed heat treatment, 3 minutes time at 470 degrees Celsius.
The results show that the average grain size of micron crystalline substance is 2.4 microns, nanocrystalline average grain diameter is for metallographic microanalysis 89 nanometers.
Embodiment 3
1. fine copper is selected to be deposited in magnetic control sputtering system as target:It is evacuated to 10-3Pa is filled with argon gas, so It is evacuated to 10 again afterwards-3Pa, adjustment operating voltage are 600V, sputter duty ratio 70%, proceed by sputtering sedimentation copper coin;Work as copper When the thickness of plate reaches 100 microns, voltage is transferred to 300V, duty ratio is transferred to 40%;When the overall thickness of copper coin reaches 200 microns When, voltage is recalled into 600V, duty ratio adjusts back to 70%;It is so repeated, until copper plate thickness reaches 1 millimeter, takes out copper Plate;
2. starting Multi-functional rolling system, the fast ratio of top and bottom rolls is set, speed is than being 1.2;Set each rolling deformation amount It is 3%;The speed of low speed roller is set as 0.8 meter per second;
3. starting main driving motor, start the operation of rolling;
4. treating after once rolling, repeat to roll, until thickness is thinned to 0.8 micron;
5. carrying out full annealed heat treatment, recrystallization temperature is 280 degrees Celsius, 3 minutes time.
Fabric analysis:Coarse grained average grain size is 0.35 micron, and the average grain diameter of fine grain is 56 nanometers.
Embodiment 4
1. fine copper is selected to be deposited in magnetic control sputtering system as target:It is evacuated to 10-3Pa is filled with argon gas, so It is evacuated to 10 again afterwards-3Pa, adjustment operating voltage are 600V, sputter duty ratio 70%, proceed by sputtering sedimentation copper coin;Work as copper When the thickness of plate reaches 50 microns, voltage is transferred to 300V, duty ratio is transferred to 40%;When the overall thickness of copper coin reaches 100 microns When, voltage is recalled into 600V, duty ratio adjusts back to 70%;It is so repeated, until copper plate thickness reaches 0.5 millimeter, takes out Copper coin;
2. starting Multi-functional rolling system, the fast ratio of top and bottom rolls is set, speed is than being 1.3;Set each rolling deformation amount It is 1%;The speed of low speed roller is set as 2 meter per seconds;
3. starting main driving motor, start the operation of rolling;
4. treating after once rolling, repeat to roll, until thickness is thinned to 0.5 micron;
5. carrying out full annealed heat treatment, recrystallization temperature is 300 degrees Celsius, 3 minutes time.
Fabric analysis:Coarse grained average grain size is 0.24 micron, and the average grain diameter of fine grain is 24 nanometers.
Performance test:Simple metal tension test is carried out using universal testing machine, the results are shown in Table 1.As can be seen that this The simple metal of invention maintains excellent plasticity while intensity is increased substantially.
The above is only some examples of embodiment of the present invention, it should be pointed out that:For the technology people of the art For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should It is considered as protection scope of the present invention.

Claims (4)

  1. A kind of 1. method for improving simple metal intensity and plasticity, it is characterised in that:Microscopic structure is prepared using magnetically controlled sputter method For the material of layering, then using the method for Light deformation, the multiple asymmetrical rolling of room temperature, be rolled into original depth 0.5~ 2% hereinafter, the crystal grain in microscopic structure after rolling is made of the crystal grain of two kinds of different grain size ranges, and one kind is a kind of for coarse grain For fine grain;The particle size range of fine grain is 10-200 nanometers, and coarse grained particle size range is 0.3 micron -5 microns, and coarse-grain The stripped distribution of grain.
  2. A kind of 2. method as described in claim 1 for improving simple metal intensity and plasticity, it is characterised in that:Preparation method packet Include following steps:
    1)Simple metal is selected to prepare the simple metal plank of microscopic structure layering as target;
    2)Start Multi-functional rolling system, set the fast ratio of top and bottom rolls, speed is than being 1.1-1.3;Set each rolling deformation It measures as 1-5%;The speed of low speed roller is set as 0.5-2 meter per seconds;
    3)Start main driving motor, start the operation of rolling;
    4)It treats after once rolling, repeats to roll, until the thickness of final simple metal becomes less than the 2% of original depth; 5)Carry out full annealed heat treatment.
  3. A kind of 3. method as claimed in claim 2 for improving simple metal intensity and plasticity, it is characterised in that:Recrystallization temperature is / 3rd of the melting point metal arrive a quarter, time 3-20 minute.
  4. 4. a kind of simple metal prepared by method as described in claim 1, it is characterised in that:More than 70% volume fraction of fine grain, Coarse grained volume fraction is 30% hereinafter, coarse grain is distributed in fine grain.
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CN109201738B (en) * 2018-11-02 2020-01-07 中南大学 Composite rolling preparation method of gradient structure strip

Citations (1)

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CN104846363A (en) * 2014-02-14 2015-08-19 宝山钢铁股份有限公司 Nanostructured pure titanium plate preparation method

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JP4242801B2 (en) * 2004-03-26 2009-03-25 住友金属鉱山伸銅株式会社 Rolled copper foil and method for producing the same
CN101629231A (en) * 2009-08-20 2010-01-20 上海交通大学 Superfine crystalline pure iron preparation method
CN102161051A (en) * 2010-10-29 2011-08-24 东北大学 Asynchronous rolling method for forming nano structure on surface of metal sheet
CN102321896A (en) * 2011-09-09 2012-01-18 北京工业大学 Nanocrystalline nickel with high-density twin structure and preparation method thereof
CN102925832A (en) * 2012-10-31 2013-02-13 昆明理工大学 Large plastic deformation method for preparing superfine twin crystal copper
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