CN105759922A - Flow regulating device - Google Patents
Flow regulating device Download PDFInfo
- Publication number
- CN105759922A CN105759922A CN201410785511.9A CN201410785511A CN105759922A CN 105759922 A CN105759922 A CN 105759922A CN 201410785511 A CN201410785511 A CN 201410785511A CN 105759922 A CN105759922 A CN 105759922A
- Authority
- CN
- China
- Prior art keywords
- node
- fan
- partition
- air flow
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001105 regulatory effect Effects 0.000 title claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 84
- 238000005192 partition Methods 0.000 claims description 110
- 238000001514 detection method Methods 0.000 claims description 11
- 230000001276 controlling effect Effects 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 description 13
- 230000007423 decrease Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
The invention discloses a flow regulating device. The flow regulating device comprises a frame, at least one node, at least one fan and at least one baffle, wherein the at least one node is arranged on the first side in an accommodating space defined by the frame; the at least one fan is arranged on the second side, opposite to the first side, in the accommodating space; the at least one baffle is arranged between the at least one node and the at least one fan; the cooling area of the at least one fan comprises at least two cooling subareas, and the first baffle of the at least one baffle can rotate between the at least one node and the at least one fan, so that the air flow of two cooling subareas, adjacent to the first baffle, of the at least two cooling subareas is changed.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a flow regulating device.
Background
Currently, rack (rack) cooling systems are typically located behind the computer/memory nodes and separate fan cooling zones are divided for customer needs. As shown in FIG. 1A, the computer/memory nodes do not have fan partitions, and each computer/memory node is cooled by a fan of the entire rack, or, as shown in FIG. 1B, the fan cooling area is divided by a fan partition, with every 4 computer/memory nodes belonging to the same fan cooling area.
If computers/storage nodes (hard disks, optical disk drives, storages, display cards and the like are installed in nodes) with different specifications and architectures are installed in the whole rack, for the nodes with less specifications and architectures, more flow can be obtained due to smaller resistance of the nodes to air and the flow field of the air can flow to the architecture with smaller resistance, and for the nodes with high load and more specifications and architectures, less flow can be obtained due to larger resistance of the nodes to the flow field of the air, under the condition, in order to meet the heat dissipation requirement of the nodes with high load, the system fan can increase the rotating speed, and more power supplies and cost are needed.
Therefore, the rack cooling system in the prior art can only meet the technical problem of the heat dissipation requirement of the high-load node by increasing the rotating speed of the fan.
Disclosure of Invention
The embodiment of the invention provides a flow regulating device, which is used for solving the technical problem that a rack cooling system in the prior art can only meet the heat dissipation requirement of a high-load node by increasing the rotating speed of a fan.
An embodiment of the present application provides a flow regulation apparatus, including:
a frame;
at least one node arranged on a first side in the accommodating space formed by the frame;
at least one fan arranged on a second side opposite to the first side in the accommodating space;
at least one partition disposed between the at least one node and the at least one fan;
wherein the cooling zone of the at least one fan includes at least two sub-cooling zones, a first partition of the at least one partition being rotatable between the at least one node and the at least one fan to vary an air flow rate of two sub-cooling zones of the at least two sub-cooling zones adjacent to the first partition.
Optionally, when the at least one fan is a first fan, the at least one partition is configured to divide a cooling area of the first fan into the at least two sub-cooling areas.
Optionally, when the at least one partition is a first partition and the at least one fan is at least two fans, the first partition is configured to determine a cooling area of N fans of the at least two fans as a first sub-cooling area, and determine a cooling area of another fan of the at least two fans except the N fans as a second sub-cooling area, where N is a positive integer.
Optionally, each of the at least one partition has a first end that is rotatably connected to one of the at least one node.
Optionally, each of the at least one node is rotatably connected to one of the at least one partition.
Optionally, the apparatus further comprises:
the first end of each partition board is connected with one of the at least one rotary driving piece respectively, and the rotary driving piece is used for driving each partition board to rotate between the at least one node and the at least one fan by taking the first end as an axis.
Optionally, the apparatus further comprises:
at least one temperature detection unit arranged at an exhaust port and an air inlet port of each node, wherein the exhaust port is positioned on one side of each node close to the at least one fan, and the air inlet port is positioned on one side of each node far away from the at least one fan;
and the control unit calculates the node air flow of each node according to the exhaust port temperature and the air inlet temperature of each node.
Optionally, the control unit is further configured to:
controlling a first partition plate between a first node and a second node of the at least one node to rotate according to the corresponding relation between the node air flow rate of the first node and the partition plate angle so as to increase the air flow rate of a cooling area where the first node is located, reduce the air flow rate of the cooling area where the second node is located, or reduce the air flow rate of the cooling area where the first node is located, and increase the air flow rate of the cooling area where the second node is located;
the partition angle is an included angle between the first partition and the first node, and the second node is a node adjacent to the first node.
Optionally, the apparatus further comprises:
at least one load detection unit disposed on each of the at least one node, the at least one load detection unit being configured to detect a load of the each node;
and the control unit is used for controlling the rotation of a first partition plate connected with a first node to increase or reduce the air flow of a cooling area where the first node is located when the load of the first node in the at least one node is changed.
Optionally, when the at least one node is at least two nodes, the apparatus further includes:
a baffle disposed on a side adjacent to the at least one fan, wherein:
the baffle is positioned between two adjacent nodes of the at least two nodes; or,
the baffle plate is provided with a second end and a third end opposite to the second end, the second end is rotatably connected with one node of the at least one node, and the third end is abutted with one fan of the at least one fan;
the baffle is configured to block air from flowing into a gap between the two adjacent nodes when the at least one fan is operating.
One or more technical solutions in the embodiments of the present application have at least one or more of the following technical effects:
1. in the scheme of this application embodiment, through set up rotatable baffle between node and fan, rotation through the baffle, change two cooling area's adjacent air flow with this baffle, increase the air flow of high load node, reduce the air flow of low load node, the system fan is under the condition that does not improve rotational speed, also can satisfy the heat dissipation demand of different nodes, thereby among the prior art has been eliminated, the frame cooling system who exists can only satisfy the technical problem of the heat dissipation demand of high load node through the rotational speed that improves the fan, increase air flow through the baffle rotation, and then satisfy the technical effect of the heat dissipation demand of high load node, cooling system's power consumption has been reduced.
2. In the scheme of the embodiment of the application, the resistance of the node to the air flow field refers to the resistance of the node to the air flow field when the air flow field passes through the node, so that the resistance of the rack comprises the resistance of the node and the partition plate to the air flow field, the structure of the node is less, and the resistance is small; the structure of the node is many, and the resistance is just big, and in this application embodiment, after the node installation on the frame was accomplished, the structure of node can not change, if the air is when having the restriction of space on the route that flows, the air-out bore of node is the littleer, and the resistance that the exit received is also big more, therefore, rotates through the baffle, increases the air-out bore in order to reduce the resistance of node, reduces the air-out bore in order to increase the resistance of node, and then rotates through the baffle, adjusts the resistance of node to the air flow field.
3. In the scheme of this application embodiment, through the gas vent at the node and go into gas port installation temperature detecting element, detect gas vent temperature and go into gas port temperature, and then calculate the node air flow of every node, the relation between rethread node air flow and the baffle angle, the control baffle rotates, has realized accurate control baffle pivoted technological effect.
4. In the scheme of the embodiment of the application, the load detection unit is arranged on the node, the load size of each node is detected, the larger the load is, the higher the temperature is, the larger the required air flow is, the smaller the load is, and the smaller the required air flow is, and then the partition plate is controlled to rotate through the size of the load, so that the air flow of the node with the large load is increased, and the air flow of the node with the small load is reduced.
5. In the solution of the embodiment of the present application, when the rack is not full of architecture, a baffle is added at an empty node, the baffle is disposed at a side between two adjacent nodes close to the fan, and the baffle can resist air from flowing into the empty node, that is, a gap between the two nodes.
Drawings
FIGS. 1A-1B are schematic views of a prior art gantry;
FIG. 2 is a schematic diagram of a fake node in the prior art;
FIG. 3 is a schematic view of a flow regulating device in an embodiment of the present application;
FIG. 4 is a schematic view of a partition dividing a cooling area of a fan according to an embodiment of the present invention;
FIG. 5 is a schematic view of a partition dividing cooling areas of a plurality of fans according to an embodiment of the present application;
FIG. 6 is a schematic diagram illustrating the adjustment of the angle of the partition in the embodiment of the present application;
fig. 7A-7B are schematic views of baffles in embodiments of the present application.
Detailed Description
In the technical scheme that this application embodiment provided, through set up rotatable baffle between node and fan, rotation through the baffle, change two cooling area's adjacent air flow with this baffle, increase the air flow of high load node, reduce the air flow of low load node, thereby solved prior art, the frame cooling system that exists can only satisfy the technical problem of the heat dissipation demand of high load node through the rotational speed that improves the fan, increase air flow through the baffle rotation, and then satisfy the technical effect of the heat dissipation demand of high load node.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The main implementation principle, the specific implementation mode and the corresponding beneficial effects of the technical scheme of the embodiment of the present application are explained in detail with reference to the accompanying drawings.
An embodiment of the present application provides a flow rate adjustment device, as shown in a in fig. 3, including:
a frame 1;
at least one node 10 arranged on a first side of the accommodating space formed by the frame 1;
at least one fan 11 disposed at a second side opposite to the first side in the accommodating space;
at least one partition 12 disposed between at least one node 10 and at least one fan 11;
wherein the cooling zone of the at least one fan 11 comprises at least two sub-cooling zones, a first partition of the at least one partition 12 being rotatable between the at least one node 10 and the at least one fan 11 to vary the air flow of two sub-cooling zones of the at least two sub-cooling zones adjacent to the first partition.
In particular, the cooling system of the rack may comprise only one fan, i.e. when the at least one fan 11 is a first fan, the at least one partition 12 is adapted to divide the cooling area of the first fan into at least two sub-cooling areas.
For example: when the flow rate adjusting device includes one partition plate, the cooling area of the first fan may be divided into two sub-cooling areas, such as area one and area two in fig. 4, where the air flow rates of the area one and area two may change with the rotation of the partition plate, where the solid line in fig. 4 is the position before the rotation of the partition plate, and the dotted line is the position after the rotation of the partition plate, the air flow rate of the area one increases and the air flow rate of the area two decreases after the rotation of the partition plate from the solid line position to the dotted line position.
Also, when the flow rate adjusting means includes two partitions, it is possible to divide the cooling area of the first fan into three sub-cooling areas and to change the flow rates of air in the three sub-cooling areas by the rotation of the partitions.
In this embodiment, the cooling system of the rack may also include a plurality of fans, that is, at least one fan 11 is a plurality of fans, and assuming that at least one partition 12 is a first partition, the first partition may divide the cooling area of N fans in the plurality of fans into a first sub-cooling area, and then divide the cooling area of other fans except the N fans in the plurality of fans into a second sub-cooling area.
For example: as shown in fig. 5, the flow rate adjusting device includes a partition, and the cooling system includes three fans, namely, a fan 1, a fan 2, and a fan 3, so that when the partition is in the position of the solid line in the figure, the cooling areas of the fan 1 and the fan 2 are divided into a first sub-cooling area, and the cooling area of the fan 3 is divided into a second sub-cooling area; and when the partition is in the position of the dotted line in the figure, the cooling area of the fan 1 is divided into a first sub-cooling area, and the cooling areas of the fan 2 and the fan 3 are divided into a second sub-cooling area.
In the present embodiment, to enable the partition to rotate about the node, each of the at least one partition 12 has a first end that is rotatably connected to one of the at least one node 10.
Specifically, when the partition plate rotates, the sizes of the air outlet apertures of the two sub-cooling areas adjacent to the partition plate can be changed, as shown in b in fig. 3, when the partition plate rotates upwards, the air outlet aperture of the area 1 decreases, the node resistance to the air flow field increases, the air flow decreases, the air outlet aperture of the area 2 increases, the node resistance to the air flow field decreases, and the air flow increases. When the partition plate rotates downwards, the air outlet aperture of the area 1 is increased, the node resistance to the air flow field is reduced, the air flow is increased, the air outlet aperture of the area 2 is reduced, the node resistance to the air flow field is increased, and the air flow is reduced.
In particular embodiments, each of the at least one nodes 10 may be rotatably coupled to one of the at least one partition 12 for regulating the flow of air available to each node within the rack.
Specifically, each node in the rack is in a separate sub-cooling zone when each node is connected to a partition, as shown in a in fig. 3.
In this embodiment, the flow rate adjusting device further includes at least one rotation driving member, the first end of each partition board is connected with one rotation driving member of the at least one rotation driving member, and the rotation driving member is configured to drive each partition board to rotate between at least one node 10 and at least one fan 11 by using the first end as an axis.
Specifically, the rotary drive member is provided on the node side, and the rotary drive member may be a motor rotary structure, and each partition is connected to one motor rotary structure so that each partition can be independently rotated to change the cooling area of the fan.
In the embodiment of the present application, in order to reasonably distribute the air flow between the high load node and the low load node, the rotation of the partition plate needs to be controlled.
In the first mode, the air flow required by the node is calculated through the temperature of the node, and then the partition plate is controlled to rotate according to the relation between the air flow of the node and the angle of the partition plate.
Specifically, a temperature detection unit is provided for each of an exhaust port and an intake port of each of the at least one node 10, wherein the exhaust port is located on a side of the each node close to 1 of the at least one fan 11, and the intake port is located on a side of the each node far from the at least one fan 11, as shown by a in fig. 3.
In the rack, the fan is a system blowing out, and for the system, the air flow field is a suction flow field, as shown in a in fig. 3, so that the air flow field is driven to flow from the left to the right, and therefore, the exhaust port is right of the node point, and the left is the intake port.
In a specific implementation, the temperature detection unit may be a temperature sensor, the temperature sensor transmits detected data to the control unit, and the control unit calculates the node air flow rate of each node according to the exhaust port temperature and the intake port temperature of each node.
In particular implementations, the node air flow required for each node may be calculated by the following equation.
Q=1.76P/(△T)
Where Q is the node air flow in the present embodiment, P is the node, and Δ T is the difference between the outlet temperature and the inlet temperature of the node.
Then, according to the corresponding relation between the standard air flow of a first node in at least one node 10 and the angle of the partition plate, controlling the first partition plate between the first node and a second node in at least one node 10 to rotate so as to increase the air flow of a cooling area where the first node is located, reduce the air flow of the cooling area where the second node is located, or reduce the air flow of the cooling area where the first node is located, and increase the air flow of the cooling area where the second node is located;
the partition angle is an included angle between the first partition and the first node, and the second node is a node adjacent to the first node.
For example: when the nodes are installed on the rack, the partition plates of the flow regulating device are horizontal, when the load of one node is increased, the temperature of the node parts is increased, and further the temperature of the exhaust port is increased, therefore, the air flow required by the node is also increased, the angle of the partition plates is adjusted in a mode shown as a in fig. 6, the air outlet aperture of the node is increased by adjusting the angle of the partition plates, the resistance of the node to an air flow field is reduced, and further the air flow obtained by the node is increased, so that the heat of the node is dissipated.
Another example is: when the nodes are installed on the rack, the partition plates of the flow regulating device are horizontal, when one of the nodes is IDLE load (the node system does not use any software or execution program), and the load of the node adjacent to the node is increased, the angle of the partition plates is adjusted in a manner shown as b in fig. 6, the air outlet aperture of the node is reduced, the resistance of the node to an air flow field is increased, the air flow obtained by the node is further reduced, and the air flow obtained by the adjacent node is increased, so that the adjacent node is cooled.
In the specific implementation process, the partition plate angle can be finely adjusted, the air flow obtained by the node is continuously changed in the process of finely adjusting the partition plate angle, and due to the heat dissipation of the node, the temperature of an air outlet and the temperature of an air inlet of the node are also changed, so that the air flow of the node required currently by the node needs to be recalculated in the process of finely adjusting the partition plate angle.
Finally, when the current node air flow required to be obtained at the current node of the node corresponds to the angle of the current partition plate, namely when the angle of the partition plate is the current angle and the air flow which can be actually obtained by the partition plate is the current air flow, stopping rotating the partition plate; or stopping the rotation of the diaphragm when the temperature of the target node decreases to the target temperature.
In the embodiment of the present application, the more software or programs that are used or executed by the node system, the greater the load on the node, the higher the temperature of the node components, and the higher the exhaust port temperature.
In the present embodiment, baffle rotation may also be controlled by the node air flow rate of adjacent nodes.
Specifically, when the node air flow rate of the first node is larger than the node air flow rate required by the second node and the air flow rate available to the first node needs to be increased, the first partition plate is moved in the direction of the second node to increase the outlet air diameter of the first node, increase the air flow rate available to the first node, and decrease the air flow rate available to the second node.
When the node air flow at the first node is smaller than the node air flow required by the second node, the air flow which can be obtained by the first node needs to be reduced, and the first partition plate is moved towards the first node so as to reduce the air outlet aperture of the first node, reduce the air flow obtained by the first node and increase the air flow obtained by the first node.
In the second mode, the rotation of the partition plate is controlled by the size of the node load.
Specifically, a load detection unit is provided on each node for detecting a load of said each node.
In a specific implementation process, the load of a node may be represented by the CPU usage rate or the memory occupancy rate (memory) caused by the software or the executed program that each node is running.
Specifically, the higher the CPU utilization or memory occupancy, the greater the load on the node; the lower the CPU utilization or memory occupancy, the smaller the load of the node.
In the present embodiment, the control unit is connected to the rotary drive and, in the event of a change in the load at a first node of the at least one node 10, controls the rotation of a first partition connected to said first node to increase or decrease the air flow in the cooling zone in which the first node is located.
Specifically, when the load of the first node is increased, the first diaphragm connected to the first node is controlled to rotate, as shown by a in fig. 6, to increase the air outlet opening size and thus increase the air flow rate obtained by the first node, and when the load of the first node is decreased, the first diaphragm is controlled to rotate, as shown by b in fig. 6, to decrease the air outlet opening size and thus decrease the air flow rate obtained by the first node.
In the embodiment of the present application, assuming that the first node is rotatably connected to the first partition, when the rack is in a full structure, as shown in a in fig. 3, the first partition of the flow rate adjusting device is horizontal, and when the first partition is controlled to rotate, it is necessary to determine whether to rotate the partition, and the direction in which the partition rotates, in combination with the load change of the first node and the node adjacent to the first node.
For example: when the load at the first node becomes large and the load at the second node adjacent to the first node becomes small, or an IDLE load, the rotation of the first partition plate may be controlled to increase the air flow rate obtained at the first node and decrease the air flow rate obtained at the second node.
When the loads of the first node and the second node are increased, the rotating partition plate cannot effectively dissipate heat of the first node and the second node, and at the moment, the rotating speed of a system fan can be increased to dissipate heat of the first node and the second node.
In the embodiment of the present application, when the rack is in the less-than-full configuration, as shown in fig. 7A-7B, the first partition of the flow rate adjustment device is horizontal, and the node adjacent to the first node is an empty node, and when the load of the first node changes, the first partition is controlled to rotate to increase the air flow rate obtained by the first node.
Further, in this embodiment of the application, when the rack is of a less-than-full architecture, that is, when there are empty nodes on the rack, the flow rate adjustment device further includes: and a baffle 14 disposed at a side adjacent to the at least one fan 11, the baffle 14 being configured to block air from flowing into a gap between the adjacent two nodes, i.e., an empty node, when the at least one fan 11 is operated. In the prior art, in order to resist the flow of the air flow through the empty node, a dummy node 13 is installed at the empty node, as shown in fig. 2, although the dummy node 13 can block the air flow from flowing through the empty node, a flow field backflow condition is generated in the empty node, and for the system, there is no heat dissipation effect.
In the embodiment of the present application, the baffle 14 may be disposed between two adjacent nodes, as shown in fig. 7A.
The baffle 14 may also be disposed between the nodes and the fan, as shown in fig. 7B, the baffle 14 has a second end rotatably connected to one of the at least one node 10 and a third end opposite the second end, the third end abutting one of the at least one fan 11, i.e., the flow regulating device at the node where it is not installed is not horizontal, but rather is an angled baffle 14.
In this application embodiment, baffle 14 can rotate around the node, and when the baffle rotated downwards, baffle 14 rotated downwards to change the size of air-out bore, when the baffle upwards rotated, baffle 14 upwards rotated.
In the embodiment of the present application, the partition and the baffle 14 may be made of elastic materials, that is, the length of the partition and the baffle 14 may be changed within a certain range. Or the length of the partition board can be fixed, and when the partition board is not in the horizontal position, a gap exists between the partition board and the fan.
Through one or more technical solutions in the embodiments of the present application, one or more of the following technical effects can be achieved:
1. in the scheme of this application embodiment, through set up rotatable baffle between node and fan, rotation through the baffle, change two cooling area's adjacent air flow with this baffle, increase the air flow of high load node, reduce the air flow of low load node, the system fan is under the condition that does not improve rotational speed, also can satisfy the heat dissipation demand of different nodes, thereby among the prior art has been eliminated, the frame cooling system who exists can only satisfy the technical problem of the heat dissipation demand of high load node through the rotational speed that improves the fan, increase air flow through the baffle rotation, and then satisfy the technical effect of the heat dissipation demand of high load node, cooling system's power consumption has been reduced.
2. In the scheme of the embodiment of the application, the resistance of the node to the air flow field refers to the resistance of the node to the air flow field when the air flow field passes through the node, so that the resistance of the rack comprises the resistance of the node and the partition plate to the air flow field, the structure of the node is less, and the resistance is small; the structure of the node is many, and the resistance is just big, and in this application embodiment, after the node installation on the frame was accomplished, the structure of node can not change, if the air is when having the restriction of space on the route that flows, the air-out bore of node is the littleer, and the resistance that the exit received is also big more, therefore, rotates through the baffle, increases the air-out bore in order to reduce the resistance of node, reduces the air-out bore in order to increase the resistance of node, and then rotates through the baffle, adjusts the resistance of node to the air flow field.
3. In the scheme of this application embodiment, through the gas vent at the node and go into gas port installation temperature detecting element, detect gas vent temperature and go into gas port temperature, and then calculate the node air flow of every node, the relation between rethread node air flow and the baffle angle, the control baffle rotates, has realized accurate control baffle pivoted technological effect.
4. In the scheme of the embodiment of the application, the load detection unit is arranged on the node, the load size of each node is detected, the larger the load is, the higher the temperature is, the larger the required air flow is, the smaller the load is, and the smaller the required air flow is, and then the partition plate is controlled to rotate through the size of the load, so that the air flow of the node with the large load is increased, and the air flow of the node with the small load is reduced.
5. In the solution of the embodiment of the present application, when the rack is not full of architecture, a baffle is added at an empty node, the baffle is disposed at a side between two adjacent nodes close to the fan, and the baffle can resist air from flowing into the empty node, that is, a gap between the two nodes.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A flow regulating device comprising:
a frame;
at least one node arranged on a first side in the accommodating space formed by the frame;
at least one fan arranged on a second side opposite to the first side in the accommodating space;
at least one partition disposed between the at least one node and the at least one fan;
wherein the cooling zone of the at least one fan includes at least two sub-cooling zones, a first partition of the at least one partition being rotatable between the at least one node and the at least one fan to vary an air flow rate of two sub-cooling zones of the at least two sub-cooling zones adjacent to the first partition.
2. The apparatus of claim 1, wherein when the at least one fan is a first fan, the at least one partition is configured to divide a cooling zone of the first fan into the at least two sub-cooling zones.
3. The apparatus according to claim 1, wherein when the at least one partition is a first partition and the at least one fan is at least two fans, the first partition is configured to determine a cooling area of N fans of the at least two fans as a first sub-cooling area and determine cooling areas of other fans of the at least two fans except the N fans as a second sub-cooling area, N being a positive integer.
4. The apparatus of claim 1, wherein each of the at least one partition has a first end that is rotatably coupled to one of the at least one node.
5. The apparatus of claim 4, wherein each of the at least one nodes is rotatably coupled to one of the at least one partition.
6. The apparatus of claim 4, wherein the apparatus further comprises:
the first end of each partition board is connected with one of the at least one rotary driving piece respectively, and the rotary driving piece is used for driving each partition board to rotate between the at least one node and the at least one fan by taking the first end as an axis.
7. The apparatus of claim 6, wherein the apparatus further comprises:
at least one temperature detection unit arranged at an exhaust port and an air inlet port of each node, wherein the exhaust port is positioned on one side of each node close to the at least one fan, and the air inlet port is positioned on one side of each node far away from the at least one fan;
and the control unit calculates the node air flow of each node according to the exhaust port temperature and the air inlet temperature of each node.
8. The apparatus of claim 7, wherein the control unit is further to:
controlling a first partition plate between a first node and a second node of the at least one node to rotate according to the corresponding relation between the node air flow rate of the first node and the partition plate angle so as to increase the air flow rate of a cooling area where the first node is located, reduce the air flow rate of the cooling area where the second node is located, or reduce the air flow rate of the cooling area where the first node is located and increase the air flow rate of the cooling area where the second node is located;
the partition angle is an included angle between the first partition and the first node, and the second node is a node adjacent to the first node.
9. The apparatus of claim 6, wherein the apparatus further comprises:
at least one load detection unit disposed on each of the at least one node, the at least one load detection unit being configured to detect a load of the each node;
and the control unit is used for controlling the rotation of a first partition plate connected with a first node to increase or reduce the air flow of a cooling area where the first node is located when the load of the first node in the at least one node is changed.
10. The apparatus of claim 1, wherein when the at least one node is at least two nodes, the apparatus further comprises:
a baffle disposed on a side adjacent to the at least one fan, wherein:
the baffle is positioned between two adjacent nodes of the at least two nodes; or,
the baffle plate is provided with a second end and a third end opposite to the second end, the second end is rotatably connected with one node of the at least one node, and the third end is abutted with one fan of the at least one fan;
the baffle is configured to block air from flowing into a gap between the two adjacent nodes when the at least one fan is operating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410785511.9A CN105759922A (en) | 2014-12-17 | 2014-12-17 | Flow regulating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410785511.9A CN105759922A (en) | 2014-12-17 | 2014-12-17 | Flow regulating device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105759922A true CN105759922A (en) | 2016-07-13 |
Family
ID=56340118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410785511.9A Pending CN105759922A (en) | 2014-12-17 | 2014-12-17 | Flow regulating device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105759922A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI686541B (en) * | 2018-06-19 | 2020-03-01 | 廣達電腦股份有限公司 | A chassis intelligent airflow control and cooling regulation mechanism |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060227505A1 (en) * | 2005-04-06 | 2006-10-12 | Kenichi Miyamoto | Air flow distribution adjusting mechanism for disk array apparatus |
CN101109982A (en) * | 2007-08-22 | 2008-01-23 | 中兴通讯股份有限公司 | Method for implementing variable air quantity zone control and system frame thereof |
CN101471785A (en) * | 2007-12-29 | 2009-07-01 | 华为技术有限公司 | Network element equipment |
CN203327454U (en) * | 2013-04-24 | 2013-12-04 | 杭州华三通信技术有限公司 | Air channel isolating device |
-
2014
- 2014-12-17 CN CN201410785511.9A patent/CN105759922A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060227505A1 (en) * | 2005-04-06 | 2006-10-12 | Kenichi Miyamoto | Air flow distribution adjusting mechanism for disk array apparatus |
CN101109982A (en) * | 2007-08-22 | 2008-01-23 | 中兴通讯股份有限公司 | Method for implementing variable air quantity zone control and system frame thereof |
CN101471785A (en) * | 2007-12-29 | 2009-07-01 | 华为技术有限公司 | Network element equipment |
CN203327454U (en) * | 2013-04-24 | 2013-12-04 | 杭州华三通信技术有限公司 | Air channel isolating device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI686541B (en) * | 2018-06-19 | 2020-03-01 | 廣達電腦股份有限公司 | A chassis intelligent airflow control and cooling regulation mechanism |
US10888028B2 (en) | 2018-06-19 | 2021-01-05 | Quanta Computer Inc. | Chassis intelligent airflow control and cooling regulation mechanism |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20130242504A1 (en) | Cooling an electronic assembly using position variable flow restrictors | |
JP6179196B2 (en) | Data center | |
US7310737B2 (en) | Cooling system for computer systems | |
US8248793B2 (en) | Electronic component having a movable louver | |
US7568360B1 (en) | Air re-circulation effect reduction system | |
JP6031891B2 (en) | Grill with air volume adjustment mechanism and air volume adjustment system | |
US20120041600A1 (en) | Load Balancing Tasks in a Data Center Based on Pressure Differential Needed for Cooling Servers | |
JP2008111588A (en) | Air-conditioning installation and computer system | |
EP2653797B1 (en) | Air-conditioning control system with airflow adjustment device | |
US20140060798A1 (en) | Configuring A Liquid Cooling System Associated With Electrical Computing Racks | |
EP3943323B1 (en) | Air outlet device and air outlet method for an air conditioning system of a vehicle | |
US20130208419A1 (en) | Temperature control system | |
JP6036428B2 (en) | Electronic device cooling system and electronic device cooling method | |
WO2010002388A1 (en) | Cooling medium distribution over a network of passages | |
EP2833238A1 (en) | Information processing device, control method and program | |
US20150116929A1 (en) | Backflow prevention for computing devices | |
TW201319476A (en) | Energy saving air condition system and air condition mode thereof | |
US10856437B2 (en) | System for automatically classifying electrical devices for fan control application | |
JP2015161451A (en) | Data center, data center controlling method and control program | |
CN111367373A (en) | Dynamic air impedance mechanism and server with same | |
JP6051886B2 (en) | Container type data center and control method of container type data center | |
TW201218933A (en) | Data center and heat dissipation apparatus thereof | |
JP2009174726A (en) | Floor blowout fan unit | |
JP5477208B2 (en) | Air conditioning management system and air conditioning management method | |
JP5549619B2 (en) | Air conditioning system and air conditioning method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160713 |