CN105744015A - Electronic communication device with metal shell and processing method of metal shell - Google Patents
Electronic communication device with metal shell and processing method of metal shell Download PDFInfo
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- CN105744015A CN105744015A CN201510312195.8A CN201510312195A CN105744015A CN 105744015 A CN105744015 A CN 105744015A CN 201510312195 A CN201510312195 A CN 201510312195A CN 105744015 A CN105744015 A CN 105744015A
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Abstract
The invention discloses an electronic communication device with a metal shell and a processing method of the metal shell. The objective of the invention is to make the surface of an electronic communication device has an overall metal texture under the premise that antenna performance is not affected. The electronic communication device comprises the metal shell and a first non-conductive layer; the metal shell includes an insulation separation portion and a plurality of metal portions which are separated by the insulation separation portion; the first non-conductive layer is arranged at the outer surface of the insulation separation portion; and the first non-conductive layer includes an non-conductive layer which is formed by performing electrical conductivity-removing treatment on a first metal layer which is plated on the outer surface of the insulation separation portion. With the above technical schemes of the invention adopted, the surface of the electronic communication device has an overall metal texture under the premise that antenna performance is not affected.
Description
Technical field
It relates to technical field of electronic communication equipment, particularly relate to the processing method of electronics and the metal shell with metal shell.
Background technology
At present, there is the electronics such as mobile phone of metal shell, in order to ensure the performance of built-in aerial, a few part can be divided into disconnect the metal shell that overall, a few part metals insulant such as plastic cement that will be switched off again through in-mould injection couple together, form insulation and cut off part, it is to avoid the metal of disconnection is partially ON, affects the signal of antenna.So causing that metal shell forms multiple metal part and insulation partition part, metal shell does not have the metal-like of entirety.If covering insulation partition part by the mode sprayed paint, whole metal shell can be made again to lose metal-like.
Summary of the invention
Disclosure embodiment provides has the electronics of metal shell and the processing method of metal shell, makes electronics under the premise not affecting antenna performance in order to realizing, and its surface has the metal-like of entirety.
First aspect according to disclosure embodiment, it is provided that a kind of electronics with metal shell, including:
Metal shell, cuts off part including insulation and is cut off multiple metal parts of spaced-apart by described insulation；
It is arranged at the first non-conductive layer of the outer surface of described insulation partition part, including the non-conductive layer going electric conductivity to be formed after processing the first metal layer being plated on described insulation partition partial outer face.
In one embodiment, described metal shell includes metal shell on the back and/or metal edge frame；
Described metal shell on the back and/or metal edge frame include insulation and cut off part and cut off multiple metal parts of spaced-apart by this insulation；
Described first non-conductive layer, is arranged on the outer surface of described metal shell on the back and/or the respective insulation partition part of metal edge frame.
In one embodiment, above-mentioned electronics also includes:
It is arranged at the second non-conductive layer on the outer surface of the plurality of metal part, including the non-conductive layer that the second metal level being plated on the plurality of metal partial outer face goes electric conductivity formed after processing.
In one embodiment, described the first metal layer and the second metal level are formed in one formula metal level.
In one embodiment, the thickness of described the first metal layer and/or the second metal level is 0.035 millimeter to 0.045 millimeter.
Second aspect according to disclosure embodiment, it is provided that a kind of method of metal shell processing electronics, including:
Making metal shell, described metal shell includes insulation and cuts off part and cut off multiple metal parts of spaced-apart by described insulation；
Plating the first metal layer on the outer surface of part is cut off in described insulation；
Go electric conductivity to process described the first metal layer, described in go electric conductivity process after the first metal layer form the first non-conductive layer.
In one embodiment, described metal shell includes metal shell on the back and/or metal edge frame；
Described metal shell on the back and/or metal edge frame include insulation and cut off part and cut off multiple metal parts of spaced-apart by this insulation；
The described partition in described insulation electroplates the first metal layer on the outer surface of part, including:
Plating the first metal layer on the outer surface of part is cut off in the respective insulation of described metal shell on the back and/or metal edge frame.
In one embodiment, described method also includes:
The outer surface of the plurality of metal part electroplates the second metal level；
Go electric conductivity to process described second metal level, described in go electric conductivity process after the second metal level form the second non-conductive layer.
In one embodiment, described on the outer surface of described insulation partition part, electroplate the first metal layer and described on the outer surface of the plurality of metal part, electroplate the second metal level, including:
Use same metal material to cut off in described insulation once and the outer surface of part and multiple metal parts electroplates one-body molded formula metal level；
Described described the first metal layer is gone electric conductivity process and go electric conductivity to process described second metal level, including:
Go electric conductivity to process described one-body molded formula metal level once, make described one-body molded formula metal level have non-conductive.
In one embodiment, go electric conductivity to process described in include:
Anodic oxidation mode, it processes the degree of depth thickness more than handled metal level.
In one embodiment, the thickness of described the first metal layer and/or the second metal level is 0.035 millimeter to 0.045 millimeter.
Embodiment of the disclosure that the technical scheme of offer can include following beneficial effect:
Electronics in technique scheme, the insulation partition partial outer face of metal shell arranges the first non-conductive layer, this first non-conductive layer dielectric also has metal-like having simultaneously, owing to multiple metal partial outer face of metal shell also show that metal-like, therefore, make electronics from the appearance, not only can't see insulation partition part, but also present the metal-like of globality；It addition, the first non-conductive layer that insulation cuts off on partial outer face is dielectric, therefore, it can't affect the antenna performance of electronics.Visible, above-mentioned electronics achieves under the premise not affecting antenna performance, and its surface has the metal-like of entirety, elegant in appearance.
It should be appreciated that it is only exemplary and explanatory that above general description and details hereinafter describe, the disclosure can not be limited.
Accompanying drawing explanation
Accompanying drawing herein is merged in description and constitutes the part of this specification, it is shown that meets and embodiment of the disclosure, and for explaining the principle of the disclosure together with description.
Figure 1A is the metal shell of the electronics according to exemplary embodiment structural representation when being not provided with the first non-conductive layer.
Figure 1B is section after the amplification of the part-structure of metal shell in Figure 1A.
Fig. 2 is the profile of the metal shell of the electronics according to an exemplary embodiment.
Fig. 3 is a kind of method flow diagram that the making according to an exemplary embodiment has the electronics of metal shell.
Fig. 4 is the another kind of method flow diagram that the making according to an exemplary embodiment has the electronics of metal shell.
Fig. 5 is the block diagram of the electronics with metal shell according to an exemplary embodiment.
Detailed description of the invention
Here in detail exemplary embodiment being illustrated, its example representation is in the accompanying drawings.When as explained below relates to accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represents same or analogous key element.Embodiment described in following exemplary embodiment does not represent all embodiments consistent with the disclosure.On the contrary, they only with in appended claims describe in detail, the disclosure some in the example of consistent apparatus and method.
Disclosure embodiment provides a kind of electronics with metal shell, this electronics can be any electronic equipment with communication function, such as mobile phone, panel computer, portable computer, router, picture pick-up device etc., antenna such as GPS (GlobalPositioningSystem can be provided with inside this electronics, global positioning system) antenna, WIFI antenna etc., to realize communication function.Figure 1A illustrates the metal shell being not provided with the first non-conductive layer, in order that understand insulation to cut off the position of part and multiple metal parts, Figure 1B be the part-structure of metal shell amplification after profile, illustrated therein is the position of the first non-conductive layer 4 and structure, as shown in Figure 1A and 1B:
Metal shell 1, cuts off part 2 including insulation and is cut off, by insulation, multiple metal parts 3 that part 2 separates；
First non-conductive layer 4, is arranged at insulation and cuts off the outer surface of part 2；First non-conductive layer 4 includes the non-conductive layer going electric conductivity to be formed after processing the first metal layer being plated on insulation partition part 2 surface.
The above-mentioned electronics that disclosure embodiment provides, the insulation partition partial outer face of metal shell arranges the first non-conductive layer, this first non-conductive layer dielectric also has metal-like having simultaneously, owing to multiple metal partial outer face of metal shell also show that metal-like, therefore, make electronics from the appearance, not only can't see insulation partition part, but also present the metal-like of globality；It addition, the first non-conductive layer that insulation cuts off on partial outer face is dielectric, therefore, it can't affect the antenna performance of electronics.Visible, above-mentioned electronics achieves under the premise not affecting antenna performance, and its surface has the metal-like of entirety, elegant in appearance.
In one embodiment, it is also possible to as required, the first non-conductive layer is arranged on the inner surface of insulation partition part.Selection process can be carried out as required.
In one embodiment, metal shell can include arbitrary in metal shell on the back, metal edge frame or both；Metal shell on the back, metal edge frame can each include insulation and cut off part and cut off multiple metal parts of spaced-apart by this insulation；First non-conductive layer, is arranged on the outer surface of metal shell on the back, the respective insulation partition part of metal edge frame.I.e., it is possible to only cut off in the insulation of metal shell parts, partial outer face arranges the first non-conductive layer, it is achieved that the variation of outward appearance, reach various appearance.
In one embodiment, as in figure 2 it is shown, above-mentioned electronics may also include that
Second non-conductive layer 5, is arranged on the outer surface of multiple metal part 3, and the second non-conductive layer 5 includes the non-conductive layer that the second metal level being plated on multiple metal part 3 outer surface goes electric conductivity formed after processing.I.e., it is possible to arrange the second non-conductive layer on multiple metal partial outer face of metal shell simultaneously so that multiple metal parts also present metal-like having dielectric while.
In one embodiment, the first metal layer and the second metal level are formed in one formula metal level.That is, the first metal layer and the second metal level are same layer metal levels, easy to make fast and make the complete machine from the appearance one integrated mass of electronics, present the metal-like of one integrated mass.
In one embodiment, the first metal layer, the second metal level thickness can be 0.035 millimeter to 0.045 millimeter.Such thickness not will be a greater impact to the complete machine thickness of electronics, makes electronics comparatively attractive in appearance and exquisite.
Disclosure embodiment additionally provides a kind of method of metal shell processing electronics, as it is shown on figure 3, include step S31-S33:
In step S31, making metal shell, metal shell includes insulation and cuts off part and cut off multiple metal parts of spaced-apart by insulation.
In step s 32, plating the first metal layer on the outer surface of part is cut off in insulation.
The first metal layer is electroplated it is of course also possible to be embodied as on the inner surface of insulation partition part.Selection process can be carried out as required.
In one embodiment, metal shell can include arbitrary in metal shell on the back, metal edge frame or both；Metal shell on the back, metal edge frame each include insulation and cut off part and cut off multiple metal parts of spaced-apart by this insulation；Now, step S32 can be embodied as: cuts off plating the first metal layer on the outer surface of part in metal shell on the back, the respective insulation of metal edge frame.
Going electric conductivity to process in step S33, to the first metal layer, the first metal layer after going electric conductivity to process forms the first non-conductive layer.
The said method that disclosure embodiment provides, make the electronics produced, the insulation partition partial outer face of metal shell forms the first non-conductive layer, this first non-conductive layer dielectric also has metal-like having simultaneously, owing to multiple metal partial outer face of metal shell also show that metal-like, therefore so that electronics is from the appearance, not only can't see insulation partition part, but also present the metal-like of globality；It addition, the first non-conductive layer that insulation cuts off on partial outer face is dielectric, therefore, it can't affect the antenna performance of electronics.Visible, said method makes the electronics produced achieve under the premise not affecting antenna performance, and its surface has the metal-like of entirety, elegant in appearance.
In one embodiment, as shown in Figure 4, said method also includes step S34-S35:
The second metal level is electroplated in step S34, on the outer surface of multiple metal parts.
In step s 35, going electric conductivity to process the second metal level, the second metal level after going electric conductivity to process forms the second non-conductive layer.
The execution sequence of above-mentioned steps S32-35 is unrestricted.Such as, perform step S34-S35 after can performing step S32-S33, it is also possible to after performing step S34-S35, perform step S32-S33.
I.e., it is possible to arrange the second non-conductive layer on multiple metal partial outer face of metal shell simultaneously so that multiple metal parts also present metal-like having dielectric while.
In one embodiment, above-mentioned steps S32 and S34 can be embodied as: uses same metal material to electroplate one-body molded formula metal level on the outer surface that insulation cuts off part and multiple metal parts once；Now, above-mentioned steps S33 and S35 can be embodied as: goes electric conductivity to process one-body molded formula metal level once, makes one-body molded formula metal level have non-conductive.That is, the first metal layer and the second metal level are same layer metal levels, easy to make fast and make the complete machine from the appearance one integrated mass of electronics, present the metal-like of one integrated mass.
In one embodiment, the above-mentioned mode going electric conductivity to process may is that anodic oxidation mode, and it processes the degree of depth thickness more than handled metal level, to ensure that handled metal level becomes non-conductive property completely.Generally, the anodised degree of depth all can control.It is, of course, also possible to be other processing mode, all should within disclosure embodiment protection domain.
In one embodiment, the first metal layer, the second metal level thickness can be 0.035 millimeter to 0.045 millimeter.Such thickness not will be a greater impact to the complete machine thickness of electronics, makes electronics comparatively attractive in appearance and exquisite.
Fig. 5 is the block diagram of a kind of electronics 1200 for having metal shell according to an exemplary embodiment, this electronics 1200 can be mobile phone, computer, digital broadcast terminal, messaging devices, game console, tablet device, armarium, body-building equipment, personal digital assistant etc..
With reference to Fig. 5, electronics 1200 can include following one or more assembly: processes assembly 1202, memorizer 1204, power supply module 1206, multimedia groupware 1208, audio-frequency assembly 1210, the interface 1212 of input/output (I/O), sensor cluster 1214, and communications component 1216.
Process assembly 1202 and generally control the integrated operation of electronics 1200, such as with display, call, data communication, the operation that camera operation and record operation are associated.Treatment element 1202 can include one or more processor 1220 to perform instruction, to complete all or part of step of above-mentioned method.Additionally, process assembly 1202 can include one or more module, it is simple to what process between assembly 1202 and other assemblies is mutual.Such as, processing component 1202 can include multi-media module, with facilitate multimedia groupware 1208 and process between assembly 1202 mutual.
Memorizer 1204 is configured to store various types of data to support the operation at electronics 1200.The example of these data includes any application program for operation on electronics 1200 or the instruction of method, contact data, telephone book data, message, picture, video etc..Memorizer 1204 can be realized by any kind of volatibility or non-volatile memory device or their combination, such as static RAM (SRAM), Electrically Erasable Read Only Memory (EEPROM), Erasable Programmable Read Only Memory EPROM (EPROM), programmable read only memory (PROM), read only memory (ROM), magnetic memory, flash memory, disk or CD.
The various assemblies that electric power assembly 1206 is electronics 1200 provide electric power.Electric power assembly 1206 can include power-supply management system, one or more power supplys, and other generate, manage and distribute, with for electronics 1200, the assembly that electric power is associated.
Multimedia groupware 1208 includes the screen providing an output interface between described electronics 1200 and user.In certain embodiments, screen can include liquid crystal display (LCD) and touch panel (TP).If screen includes touch panel, screen may be implemented as touch screen, to receive the input signal from user.Touch panel includes one or more touch sensor to sense the gesture on touch, slip and touch panel.Described touch sensor can not only sense the border of touch or sliding action, but also detects the persistent period relevant to described touch or slide and pressure.In certain embodiments, multimedia groupware 1208 includes a front-facing camera and/or post-positioned pick-up head.When electronics 1200 is in operator scheme, during such as screening-mode or video mode, front-facing camera and/or post-positioned pick-up head can receive the multi-medium data of outside.Each front-facing camera and post-positioned pick-up head can be a fixing optical lens system or have focal length and optical zoom ability.
Audio-frequency assembly 1210 is configured to output and/or input audio signal.Such as, audio-frequency assembly 1210 includes a mike (MIC), and when electronics 1200 is in operator scheme, during such as call model, logging mode and speech recognition mode, mike is configured to receive external audio signal.The audio signal received can be further stored at memorizer 1204 or send via communications component 1216.In certain embodiments, audio-frequency assembly 1210 also includes a speaker, is used for exporting audio signal.
I/O interface 1212 provides interface for processing between assembly 1202 and peripheral interface module, above-mentioned peripheral interface module can be keyboard, puts striking wheel, button etc..These buttons may include but be not limited to: home button, volume button, startup button and locking press button.
Sensor cluster 1214 includes one or more sensor, for providing the state estimation of various aspects for electronics 1200.Such as, what sensor cluster 1214 can detect electronics 1200 opens/closed mode, the relative localization of assembly, such as described assembly is display and the keypad of electronics 1200, sensor cluster 1214 can also detect electronics 1200 or the position change of 1,200 1 assemblies of electronics, the presence or absence that user contacts with electronics 1200, the variations in temperature of electronics 1200 orientation or acceleration/deceleration and electronics 1200.Sensor cluster 1214 can include proximity transducer, is configured to when not having any physical contact object near detection.Sensor cluster 1214 can also include optical sensor, such as CMOS or ccd image sensor, for using in imaging applications.In certain embodiments, this sensor cluster 1214 can also include acceleration transducer, gyro sensor, Magnetic Sensor, pressure transducer or temperature sensor.
Communications component 1216 is configured to facilitate between electronics 1200 and other equipment the communication of wired or wireless mode.Electronics 1200 can access the wireless network based on communication standard, such as WiFi, 2G or 3G, or their combination.In one exemplary embodiment, communication component 1216 receives the broadcast singal or the broadcast related information that manage system from external broadcasting via broadcast channel.In one exemplary embodiment, described communication component 1216 also includes near-field communication (NFC) module, to promote junction service.Such as, can based on RF identification (RFID) technology in NFC module, Infrared Data Association (IrDA) technology, ultra broadband (UWB) technology, bluetooth (BT) technology and other technologies realize.
In the exemplary embodiment, electronics 1200 can be realized by one or more application specific integrated circuits (ASIC), digital signal processor (DSP), digital signal processing appts (DSPD), PLD (PLD), field programmable gate array (FPGA), controller, microcontroller, microprocessor or other electronic components, is used for performing said method.
In the exemplary embodiment, additionally providing a kind of non-transitory computer-readable recording medium including instruction, for instance include the memorizer 1204 of instruction, above-mentioned instruction can have been performed said method by the processor 820 of electronics 1200.Such as, described non-transitory computer-readable recording medium can be ROM, random access memory (RAM), CD-ROM, tape, floppy disk and optical data storage devices etc..
Those skilled in the art, after considering description and putting into practice disclosed herein disclosing, will readily occur to other embodiment of the disclosure.The application is intended to any modification of the disclosure, purposes or adaptations, and these modification, purposes or adaptations are followed the general principle of the disclosure and include the undocumented known general knowledge in the art of the disclosure or conventional techniques means.Description and embodiments is considered only as exemplary, and the true scope of the disclosure and spirit are pointed out by claim below.
It should be appreciated that the disclosure is not limited to precision architecture described above and illustrated in the accompanying drawings, and various amendment and change can carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.
Claims (11)
1. an electronics with metal shell, it is characterised in that including:
Metal shell, cuts off part including insulation and is cut off multiple metal parts of spaced-apart by described insulation；
It is arranged at the first non-conductive layer of the outer surface of described insulation partition part, including the non-conductive layer going electric conductivity to be formed after processing the first metal layer being plated on described insulation partition partial outer face.
2. electronics as claimed in claim 1, it is characterised in that
Described metal shell includes metal shell on the back and/or metal edge frame；
Described metal shell on the back and/or metal edge frame include insulation and cut off part and cut off multiple metal parts of spaced-apart by this insulation；
Described first non-conductive layer, is arranged on the outer surface of described metal shell on the back and/or the respective insulation partition part of metal edge frame.
3. electronics as claimed in claim 1 or 2, it is characterised in that also include:
It is arranged at the second non-conductive layer on the outer surface of the plurality of metal part, including the non-conductive layer that the second metal level being plated on the plurality of metal partial outer face goes electric conductivity formed after processing.
4. electronics as claimed in claim 3, it is characterised in that
Described the first metal layer and the second metal level are formed in one formula metal level.
5. electronics as claimed in claim 1, it is characterised in that
The thickness of described the first metal layer and/or the second metal level is 0.035 millimeter to 0.045 millimeter.
6. the method for the metal shell processing electronics, it is characterised in that including:
Making metal shell, described metal shell includes insulation and cuts off part and cut off multiple metal parts of spaced-apart by described insulation；
Plating the first metal layer on the outer surface of part is cut off in described insulation；
Go electric conductivity to process described the first metal layer, described in go electric conductivity process after the first metal layer form the first non-conductive layer.
7. method as claimed in claim 6, it is characterised in that
Described metal shell includes metal shell on the back and/or metal edge frame；
Described metal shell on the back and/or metal edge frame include insulation and cut off part and cut off multiple metal parts of spaced-apart by this insulation；
The described partition in described insulation electroplates the first metal layer on the outer surface of part, including:
Plating the first metal layer on the outer surface of part is cut off in the respective insulation of described metal shell on the back and/or metal edge frame.
8. method as claimed in claim 6, it is characterised in that described method also includes:
The outer surface of the plurality of metal part electroplates the second metal level；
Go electric conductivity to process described second metal level, described in go electric conductivity process after the second metal level form the second non-conductive layer.
9. method as claimed in claim 8, it is characterised in that
Described on the outer surface of described insulation partition part, electroplate the first metal layer and described on the outer surface of the plurality of metal part, electroplate the second metal level, including:
Use same metal material to cut off in described insulation once and the outer surface of part and multiple metal parts electroplates one-body molded formula metal level；
Described described the first metal layer is gone electric conductivity process and go electric conductivity to process described second metal level, including:
Go electric conductivity to process described one-body molded formula metal level once, make described one-body molded formula metal level have non-conductive.
10. such as the method as described in arbitrary in claim 6 to 9, it is characterised in that
Described go electric conductivity process include:
Anodic oxidation mode, it processes the degree of depth thickness more than handled metal level.
11. such as the method as described in arbitrary in claim 6 to 9, it is characterised in that
The thickness of described the first metal layer and/or the second metal level is 0.035 millimeter to 0.045 millimeter.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2014108321301 | 2014-12-26 | ||
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| CN105744015A true CN105744015A (en) | 2016-07-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872936A (en) * | 2016-09-28 | 2018-04-03 | 华为机器有限公司 | A kind of metal-back of mobile device and preparation method thereof, mobile device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107872936A (en) * | 2016-09-28 | 2018-04-03 | 华为机器有限公司 | A kind of metal-back of mobile device and preparation method thereof, mobile device |
| US11178785B2 (en) | 2016-09-28 | 2021-11-16 | Huawei Technologies Co., Ltd. | Metal enclosure of mobile device, production method for metal enclosure, and mobile device |
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Application publication date: 20160706 |