CN105742149A - Base of plasma machine - Google Patents
Base of plasma machine Download PDFInfo
- Publication number
- CN105742149A CN105742149A CN201610173361.5A CN201610173361A CN105742149A CN 105742149 A CN105742149 A CN 105742149A CN 201610173361 A CN201610173361 A CN 201610173361A CN 105742149 A CN105742149 A CN 105742149A
- Authority
- CN
- China
- Prior art keywords
- base
- stand body
- screwed hole
- seat stand
- stop sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Abstract
The invention provides a base of a plasma machine. The base is provided with a base stand body, wherein the surface of the base stand body is provided with a support sleeve for supporting a reaction substrate; the support sleeve is fixed on the base stand body in a threaded connection manner; when a reaction cavity is cleaned, even if the support sleeve and the base are inconsistent in expansion and shrinkage states due to a temperature rise or a temperature drop, the support sleeve is not easily separated from the base and is not easily loosened for general deformation due to the threaded connection fixing manner; even if the support sleeve is loosened, a gap is difficult to generate between the support sleeve and the base due to screw-thread fit between the support sleeve and the base; a plasma gas can be prevented from entering the gap between the support sleeve and the base; and impurities are avoided. Threaded connection is utilized between the support sleeve and the base stand body, so that a support metal ring for preventing the support sleeve from sliding downwards does not need to be arranged at the bottom part of the base stand body; and the damage to the base body when the support metal ring is arranged is avoided.
Description
Technical field
The present invention relates to semiconductor plasma apparatus field, particularly to the base of a kind of plasma board.
Background technology
In semiconductor processing, the principle of plasma-treating technology is that reacting gas is fabricated to the surface of plasma gas bombarding base material, therefore it is applicable to the base material of any shape, even if the base material with the geometrical configuration of complexity can be carried out plasma-activated, plasma clean, the techniques such as plasma coating, owing to Cement Composite Treated by Plasma can process for the quasiconductor of any operation stage, therefore plasma-treating technology is step the more commonly used in semiconductor technology.Plasma-treating technology carries out in plasma board.
nullRefer to Fig. 1，Plasma board has the reaction chamber 01 for Cement Composite Treated by Plasma base material，Reaction chamber 01 is formed by insulation cavity wall 014 parcel，Reaction chamber 01 has breather 015，It is internal that breather 015 externally enters reaction chamber 01 from reaction chamber 01，For carrying plasma gas，Having in insulation cavity wall 016 can the thermal source 014 of heat plasmatic gas，For heating up to reaction chamber 01，For having the base 010 of refrigerating function bottom reaction chamber 01，Base 010 surface is for the base material of placing response，Refer to Fig. 2，Base 010 includes seat stand body 011，Seat stand body 011 surface is symmetrically distributed with several stop sleevees 012，Several stop sleevees 012 support covering plate 013，In base 01 central authorities, there is liter act foot (not shown)，The liter that base material is sent to through covering plate 013 by mechanical arm lifts foot，Mechanical arm is extracted out，Rise and lift foot jack-up base material，Then rise act underfooting to drop until being down to below covering plate 0113 surface，Drop in process in a liter act underfooting，Base material is placed on plate 0113 gradually，Complete the process of board feeding.
Existing plasma board, as in the plasma board of chemical vapour deposition (CVD) or physical gas-phase deposition, the temperature of its reaction chamber 01 is maintained at 35 DEG C, after often processing 3,000 wafer, reaction chamber is carried out.Refer to Fig. 3 and Fig. 4, prior art has on seat stand body 011 circular port 0111, stop sleeve 012 top and revealed section 0122 are positioned at above the circular port 0111 of seat stand body 011, revealed section 0122 radius of stop sleeve 012 is equal to the radius of circular port 0111, and the lower end of stop sleeve 0111 is positioned at the circular port 0111 of seat stand body 0115.
nullOn seat stand body 011，It is positioned at below circular port 0111 and there is shoulder 0112，The lower end of stop sleeve 012 is expanded towards periphery around circular port 0111 at shoulder 0112 place and is defined flange collar 0121，The external diameter of flange collar 0121 is more than the diameter of circular port 0111，And have support metal ring 0113 at shoulder 0112，Support the internal diameter external diameter less than flange collar 0121 of metal ring 0113，If stop sleeve 012 slide downward is until flange collar 0121 contact supports metal ring 0113，Then given flange collar 0121 i.e. stop sleeve 012 power upwards by support metal ring 0112，Stop sleeve 012 is stoped to continue slide downward，If stop sleeve 012 has the trend moved up simultaneously，Shoulder 0112 gives the barrier force that flange collar 0121 is downward，Stop sleeve 012 can be stoped to move up，Thus making stop sleeve 0111 be fixed on seat stand body 0115 with this kind of structure.
nullBut owing to the material of seat stand body 011 itself is aluminum，The material of stop sleeve 012 is pottery，The coefficient of expansion is inconsistent，Reaction chamber 01 can be made to heat up lower the temperature when being carried out，After colding and heat succeed each other，The dilation degree of stop sleeve 012 is seriously inconsistent with the dilation degree of seat stand body 011，Stop sleeve 012 itself is made to produce loosening rocking，It is particularly susceptible the movement producing horizontal direction and makes produce between stop sleeve 012 and seat stand body 011 gap，Once the plasma gas of reaction enters the gap between stop sleeve 012 and seat stand body 011，Can react thus producing impurity with the seat stand body 011 of aluminum，If these impurity are impacted above wafer by plasma gas，And stick on wafer，Follow-up processing procedure can be caused serious impact，Result even in major part chip failure in wafer.
In addition, when making base 010, first stop sleeve 012 is advanced in circular port 0111 below circular port 0111, and make stop sleeve 012 move up, until flange collar 0121 contacts shoulder 0112, now support metal ring 0113 is arranged on below shoulder 0112, as the method for welding can be used to be fixed on below shoulder 0112 by support metal ring 0113, and formation one is welded with seat stand body 011, but mounted stop sleeve 012 and circular port 0111 are often damaged by this method, reduce the quality of base finished product.
It is therefore desirable to existing understructure is improved, it is to avoid the generation of above-mentioned situation.
Summary of the invention
For solving the problems referred to above, the present invention proposes the base of a kind of plasma board, make to be threaded connection between stop sleeve and seat stand body, owing to being threaded, even if therefore stop sleeve is inconsistent with the deformed state of seat stand body, it is maintained to being stably connected with of stop sleeve and seat stand body, thus without occurring that plasma gas enters the situation of seat stand body, effectively reduces the generation of impurity.
For reaching above-mentioned purpose, the present invention provides the base of a kind of plasma board, and base has seat stand body, and the surface of seat stand body has the stop sleeve for supporting reaction base material, and the mode that stop sleeve is threaded connection is fixed on seat stand body.
As preferably, the material of described seat stand body is metal, and the material of described stop sleeve is pottery.
As preferably, the material of described seat stand body is aluminum.
As preferably, described seat stand body offers screwed hole, described screwed hole has female thread, described stop sleeve is divided into revealed section, thread segment and engaging section from top to bottom, described revealed section is positioned at the surface of described seat stand body, described thread segment has the external screw thread that the female thread with described screwed hole matches, and described thread segment is threadably secured in described screwed hole.
As preferably, described seat stand body has the shoulder being positioned at below described screwed hole, and described screwed hole extends downward described shoulder, and described engaging section one end is connected with described thread segment, the other end forms the diameter flange collar more than described screwed hole external diameter, described flange collar and described shoulder contacts.
As preferably, described shoulder has circular protrusion, and the projection direction of described circular protrusion is downward, and described flange collar and described shoulder contacts part have the annular recess matched with circular protrusion.
As preferably, the axis of described circular protrusion is through described screwed hole and parallel with the axis of described screwed hole.
As preferably, the dead in line of the axis of described circular protrusion and described screwed hole.
Compared with prior art, the invention has the beneficial effects as follows: the present invention provides the base of a kind of plasma board, having seat stand body on base, the surface of seat stand body has the stop sleeve for supporting reaction base material, and the mode that stop sleeve is threaded connection is fixed on seat stand body.When reaction chamber is carried out, even if owing to heating and cooling cause stop sleeve inconsistent with the dilation state of seat stand body, but threaded fixed form makes for general deformation, the more difficult disengaging seat stand body of stop sleeve, it also is difficult to produce to loosen, even if stop sleeve creates loosening, threaded engagement between stop sleeve and seat stand body also makes relatively to have difficult labour between the two raw gap, therefore, it is possible to prevent plasma gas from entering the gap between stop sleeve and seat stand body, it is to avoid the generation of impurity.Threaded additionally, due to employ between stop sleeve with seat stand body, then present platform body bottom portion is without being arranged to stop the support metal ring of stop sleeve slide downward again, it is to avoid destruction base body caused when installing and supporting metal ring.
Accompanying drawing explanation
Fig. 1 is the structural representation of prior art plasma board reaction chamber；
Fig. 2 is understructure schematic diagram in prior art；
Fig. 3 is the circular port sectional structure chart of seat stand body in prior art；
Fig. 4 is base sectional structure chart in prior art；
The sectional structure chart of the seat stand body that Fig. 5 provides for the embodiment of the present invention one；
The sectional structure chart of the base that Fig. 6 provides for the embodiment of the present invention one；
The sectional structure chart of the seat stand body that Fig. 7 provides for the embodiment of the present invention two；
Fig. 8 is the upward view of Fig. 7；
The sectional structure chart of the stop sleeve that Fig. 9 provides for the embodiment of the present invention two；
The sectional structure chart of the base that Figure 10 provides for the embodiment of the present invention two.
Fig. 1-Fig. 4: 01-reaction chamber, 010-base, 011-seat stand body, 0111-circular port, 0112-shoulder, 0113-support metal ring, 012-stop sleeve, 0121-flange collar, 0122-revealed section, 013-covering plate, 014-thermal source, 015-breather, 016-are incubated cavity wall；
Fig. 5-Figure 10: 1-seat stand body, 11-screwed hole, 12-shoulder, 121-circular protrusion, 2-stop sleeve, 21-revealed section, 22-thread segment, 23-engage section, 231-flange collar, 232-annular recess.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Embodiment one
Refer to Fig. 5, the present invention provides the base of a kind of plasma board, and base includes seat stand body 1, and the surface of seat stand body 1 has symmetrical some screwed holes 11, and screwed hole 11 extends downward the shoulder 12 being positioned at bottom seat stand body 1.
Refer to Fig. 6, stop sleeve 2 is divided into revealed section 21, thread segment 22 and engaging section 23 from top to bottom, thread segment 22 has external screw thread, this external screw thread mates with the female thread of screwed hole 11, formed threaded, when stop sleeve 2 thread segment 22 screws in screwed hole 11 until when cannot continue turn, the revealed section 21 of the surface of seat stand body 1 only remaining stop sleeve 2, for Support cover plate (not shown).
The engaging section 23 of stop sleeve 2 is positioned at the bottom of screwed hole 11, and engaging section 23 is expanded towards periphery around screwed hole 11, which form the external diameter flange collar 231 more than screwed hole 11 external diameter.Flange collar 231 contacts with shoulder 12, or is positioned at the lower section of shoulder 12.When using this structure, when thread segment 22 and screwed hole 11 create loosening, when there is the trend moved up, owing to the external diameter of flange collar 231 is more than the external diameter of screwed hole 11, the shoulder 12 contacted with flange collar 231 gives the power that flange collar 231 is downward, thus stoping flange collar 231 to continue to move up, thus preventing stop sleeve 2 to continue to move up.
Revealed section 21 diameter of stop sleeve 2 is equal to or slightly less than the internal diameter of screwed hole 11, when installing stop sleeve 2, revealed section 21 is first made to advance the screwed hole 11 being positioned at shoulder 12 side, owing to the diameter of revealed section 21 is equal to or slightly less than the internal diameter of screwed hole 11, therefore revealed section 21 can pass through screwed hole 11 and arrive the top of seat stand body 1, the external screw thread being arranged in the thread segment 22 below revealed section 21 screws in the female thread of screwed hole 11 gradually, when both rotate and cannot continue to move up to stop sleeve 2, then stop sleeve position is fixing.
Usually, the material of seat stand body 1 is metal, especially aluminum, and the material of stop sleeve 2 is pottery.When reaction chamber is carried out, even if owing to heating and cooling cause stop sleeve 2 inconsistent with the dilation state of seat stand body 1, but threaded fixed form makes for general deformation, the more difficult disengaging seat stand body 1 of stop sleeve 2, it also is difficult to produce to loosen, even if stop sleeve 2 creates loosening, threaded engagement between stop sleeve 2 and seat stand body 1 also makes relatively to have difficult labour between the two raw gap, therefore, it is possible to prevent plasma gas from entering the gap between stop sleeve 2 and seat stand body 1, it is to avoid the generation of impurity.
Embodiment two
Refer to Fig. 7, the present embodiment and embodiment one are distinctive in that shoulder 12 has circular protrusion 121, and the projection direction of circular protrusion 121 is downward, refer to Fig. 9, then flange collar 231 has the annular recess 232 matched with circular protrusion 121.Refer to Fig. 8, the axis of circular protrusion 121 passes through screwed hole 11 and parallel with the axis of screwed hole 11, that is, the upward view of circular protrusion 121 or top view are toroidal, the center of circle of this annulus is positioned at the overlay area of screwed hole 11 and the circle of screwed hole 11, it is preferred that the dead in line of the axis of circular protrusion 121 and screwed hole 11, the center of circle of circular protrusion 121 is on the axis of screwed hole 11 in other words.
The annular recess 232 of flange collar 231 matches with circular protrusion 121, when producing to loosen between the thread segment 22 and screwed hole 11 of stop sleeve 2, if flange collar 231 has the trend moved in the horizontal direction, owing to circular protrusion 121 prevents annular recess 232 movement in the horizontal direction, accordingly even when create loosening between thread segment 22 and screwed hole 11, stop sleeve 2 is also difficult to move in the horizontal direction, so that stop sleeve 2 is more stable with the connection of seat stand body 1.
Above-described embodiment is described by the present invention, but the present invention is not limited only to above-described embodiment.Invention can be carried out various change and modification without deviating from the spirit and scope of the present invention by obvious those skilled in the art.So, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to include these change and modification.
Claims (8)
1. a base for plasma board, base has seat stand body, and the surface of seat stand body has the stop sleeve for supporting reaction base material, it is characterised in that the mode that stop sleeve is threaded connection is fixed on seat stand body.
2. the base of plasma board as claimed in claim 1, it is characterised in that the material of described seat stand body is metal, the material of described stop sleeve is pottery.
3. the base of plasma board as claimed in claim 2, it is characterised in that the material of described seat stand body is aluminum.
4. the base of plasma board as claimed in claim 1, it is characterized in that, described seat stand body offers screwed hole, described screwed hole has female thread, described stop sleeve is divided into revealed section, thread segment and engaging section from top to bottom, described revealed section is positioned at the surface of described seat stand body, and described thread segment has the external screw thread that the female thread with described screwed hole matches, and described thread segment is threadably secured in described screwed hole.
5. the base of plasma board as claimed in claim 4, it is characterized in that, described seat stand body has the shoulder being positioned at below described screwed hole, described screwed hole extends downward described shoulder, described engaging section one end is connected with described thread segment, the other end forms the diameter flange collar more than described screwed hole external diameter, described flange collar and described shoulder contacts.
6. the base of plasma board as claimed in claim 5, it is characterised in that described shoulder has circular protrusion, and the projection direction of described circular protrusion is downward, and described flange collar and described shoulder contacts part have the annular recess matched with circular protrusion.
7. the base of plasma board as claimed in claim 6, it is characterised in that the axis of described circular protrusion is through described screwed hole and parallel with the axis of described screwed hole.
8. the base of plasma board as described in claim 7, it is characterised in that the dead in line of the axis of described circular protrusion and described screwed hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610173361.5A CN105742149B (en) | 2016-03-24 | 2016-03-24 | A kind of base of plasma board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610173361.5A CN105742149B (en) | 2016-03-24 | 2016-03-24 | A kind of base of plasma board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105742149A true CN105742149A (en) | 2016-07-06 |
| CN105742149B CN105742149B (en) | 2017-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610173361.5A Active CN105742149B (en) | 2016-03-24 | 2016-03-24 | A kind of base of plasma board |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09186225A (en) * | 1995-12-29 | 1997-07-15 | Dainippon Screen Mfg Co Ltd | Substrate holding device |
| JP2002203761A (en) * | 2000-12-14 | 2002-07-19 | Promos Technologies Inc | Baking unit and method for wafer |
| JP2010272730A (en) * | 2009-05-22 | 2010-12-02 | Shinko Electric Ind Co Ltd | Electrostatic chuck |
| CN103904014A (en) * | 2012-12-31 | 2014-07-02 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Static chuck and reaction chamber |
| CN204102876U (en) * | 2014-10-16 | 2015-01-14 | 中芯国际集成电路制造(北京)有限公司 | A kind of chip bearing apparatus |
-
2016
- 2016-03-24 CN CN201610173361.5A patent/CN105742149B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09186225A (en) * | 1995-12-29 | 1997-07-15 | Dainippon Screen Mfg Co Ltd | Substrate holding device |
| JP2002203761A (en) * | 2000-12-14 | 2002-07-19 | Promos Technologies Inc | Baking unit and method for wafer |
| JP2010272730A (en) * | 2009-05-22 | 2010-12-02 | Shinko Electric Ind Co Ltd | Electrostatic chuck |
| CN103904014A (en) * | 2012-12-31 | 2014-07-02 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Static chuck and reaction chamber |
| CN204102876U (en) * | 2014-10-16 | 2015-01-14 | 中芯国际集成电路制造(北京)有限公司 | A kind of chip bearing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105742149B (en) | 2017-09-29 |
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