CN105733198A - 3D printing method for electronic circuit - Google Patents
3D printing method for electronic circuit Download PDFInfo
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- CN105733198A CN105733198A CN201610203638.4A CN201610203638A CN105733198A CN 105733198 A CN105733198 A CN 105733198A CN 201610203638 A CN201610203638 A CN 201610203638A CN 105733198 A CN105733198 A CN 105733198A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/42—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of organic or organo-metallic materials, e.g. graphene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/01—Magnetic additives
Abstract
The invention discloses a 3D printing method for an electronic circuit.The method comprises the steps that an overall three-dimensional model of the electronic circuit is designed with three-dimensional plotting software and is converted into a printable file, and a corresponding printing path and corresponding use parameters are generated; a plurality of jet printing heads of a 3D ink jet printer move along the printing path, a layer of electronic paste is sprayed to a working forming tray, an ultraviolet curing lamp emits ultraviolet in the working direction of the printing heads, and the electronic paste is cured; different kinds of electronic paste is jet out by different printing heads, and finally a complete electronic circuit is formed.The electronic circuit is manufactured with the 3D printing method, the dimension and precision of products can be controlled by controlling the precision of a spray head of the printer and the distance between the printed layers, and the requirements for dimension miniaturization and shape complication of electronic instruments and instrument industrial products can be met.
Description
(1) technical field
The present invention relates to the manufacture of electronic circuit, the 3D of a kind of electronic circuit prints manufacture method specifically.
(2) background technology
At present, along with going deep into of functional composite material research, adopt thick-film technique by silk screen printing, cylinder transfer, nozzle smear etc. mode by having the electric slurry manufacture various electronic devices and components of wire, resistance, electric capacity, inductance, quasiconductor etc. of the various functional characteristics such as conduction, magnetic, dielectric, insulation, the technology by lamination integrated technology manufacture slice component and electronic module has been realized in industrialization.But these manufacture processes are all based on high-temperature calcination, plating or etching, and not only energy consumption is high, waste is serious, and environment can bring very big burden, such as cupric, nickeliferous waste water, acid solution, alkali liquor etc..
Meanwhile, along with the fast development of electronic product, requiring more and more higher to the size of electronic devices and components, precision etc., traditional production technology is difficult to meet high-precision demand.In the research and development of new product of traditional manufacture, the design and manufacture cost of mould is very big, and 3D printing technique can save this flow process, produces product either directly through modeling, saves R&D costs.And owing to the shower nozzle precision of printer is optional, printable layer spacing can also control, and therefore can print the product of various sizes, precision.
Therefore, need the manufacture method that a kind of electronic circuit is new badly, to solve the problem run in prior art.
(3) summary of the invention
It is an object of the invention to as solving the problems referred to above, it is provided that the 3D Method of printing of a kind of electronic circuit, overcome that conventional circuit processing technology is loaded down with trivial details, cost is high, the problem of cycle length.
The technical solution used in the present invention is:
The present invention provides the 3D Method of printing of a kind of electronic circuit, and described method carries out as follows:
(1) according to design specific requirement, use the overall threedimensional model of mapping software design electronic circuit as three-dimensional in Solidworks, AutoCAD, UnigraphicsNX, Pro-E or CATIA etc., the component such as including substrate, wire, resistance, electric capacity, inductance；
(2) the electronic circuit threedimensional model document that the three-dimensional software of step (1) is done converts printable file to；
(3) the corresponding printing path of printable file generated that formed according to step (2) and use parameter；
(4) the jet printing head of 3D ink-jet printer moves by printing path, and ejects electric slurry one layer very thin on operable profile pallet, and ultraviolet light is launched in the direction that UV cure lamp works along printhead, makes electric slurry solidify；Different printheads ejects different electric slurries, and described jet printing head includes inductance core pole printhead, wire printhead, capacitor dielectric printhead, resistive element printhead；Make inductance core pole and adopt magnetic slurry, make wire and adopt electrocondution slurry, make capacitor dielectric and adopt dielectric slurry, make resistive element and adopt heat conduction slurry；
(5) completing after the jet printing of a layer solidifies, the moulded tray of equipment can extremely accurately decline a height, and different jet printing heads continues to spray different electric slurries and carries out printing and the solidification of next layer；
(6) step (4), (5) it are repeated in, until electronic circuit prints complete；
(7) again the electronic circuit after curing molding is removed from 3D ink-jet printer；
(8) require to be as the criterion with the technology of the electronic circuit of design, electronic circuit is carried out post processing, ultimately forms complete electronic circuit.
Described electrocondution slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, 0.5～11 part of argentum powder；Described photo-thermal dual curable resin is the resin containing acrylic；Described diluent boiling point 80 DEG C～180 DEG C, viscosity 1mPa s～2mPa s, surface tension 20mN/m～30mN/m, volatile；Described argentum powder particle diameter is 0.1～1 μm.Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin.Described electrocondution slurry also includes 0.03-0.09 part thixotropic agent, and described thixotropic agent is thixotropic agent MT6900-20X.Described electrocondution slurry also includes 0.008-0.025 part light trigger, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.Preferred described electrocondution slurry is made up of the raw material of following quality proportioning: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, 0.5～11 part of argentum powder, thixotropic agent 0.03-0.09 part, light trigger 0.008-0.025 part.The preparation method of electrocondution slurry is: by formula ratio, joins in diluent by photo-thermal dual curable resin, is sufficiently stirred for and makes it dissolve completely, it is subsequently adding light trigger, is sufficiently stirred for and makes it dissolve completely, add thixotropic agent, it is stirred well in solution and can't see obvious particulate matter, stand till forming homogeneous colloidal sol, stir, add argentum powder, after being sufficiently stirred for, ultrasonic 5 minutes, make the abundant wetting and dispersing of argentum powder, stir, it is thus achieved that electrocondution slurry.
Described heat conduction slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, alumina powder 0.5～4 part；Described photo-thermal dual curable resin is the resin containing acrylic；Described diluent boiling point 80 DEG C～150 DEG C, viscosity 1mPa s～2mPa s, surface tension 20mN/m～30mN/m, volatile；Described alumina powder particle diameter is 1～2 μm.Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin.Described heat conduction slurry also includes 0.01-0.08 part thixotropic agent, and described thixotropic agent is thixotropic agent MT6900-20X.Described heat conduction slurry also includes 0.002-0.018 part light trigger, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.Preferably, described heat conduction slurry is made up of the raw material of following quality proportioning: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, alumina powder 0.5～4 part, and thixotropic agent is 0.01-0.08 part, and light trigger is 0.002-0.018 part.Described alumina powder is the modified oxidized aluminium powder of surface conditioning agent, and described surface conditioning agent is Silane coupling agent KH550, tetraethyl orthosilicate or methyl parahydroxybenzoate；Described surface conditioning agent modified aluminas powder, preparation method thereof is: be dissolved in by surface conditioning agent in the ethanol water of volumetric concentration 60%, it is sufficiently stirred for dissolving completely, add alumina powder, ensure that the liquid level of ethanol water is higher than alumina powder aspect, it is sufficiently stirred for moistening uniform, 60 DEG C of calorstats react 6 hours, it was stirred every 2 hours and adds the ethanol water of volumetric concentration 60%, ensure that the liquid level of ethanol water is higher than alumina powder aspect, afterwards mixture is transferred in the thermostatic drying chamber of 110 DEG C and be dried, obtain the modified oxidized aluminium powder of surface conditioning agent；The mass ratio of described alumina powder and surface conditioning agent is 100:2.The preparation method of described heat conduction slurry is: by formula ratio, join in diluent by photo-thermal dual curable resin, is sufficiently stirred for and makes it dissolve completely, it is subsequently adding light trigger, is sufficiently stirred for and makes it dissolve completely, add thixotropic agent, it is stirred well in solution and can't see obvious particulate matter, stand till forming homogeneous colloidal sol, stir, add alumina powder, after being sufficiently stirred for, ultrasonic 5 minutes, make the abundant wetting and dispersing of alumina powder, stir, it is thus achieved that electrocondution slurry.
Magnetic slurry of the present invention is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, magnetic powder 0.5～5 part；Described photo-thermal dual curable resin is containing acrylic based resin；Described diluent boiling point 80 DEG C～180 DEG C, viscosity 1mPa s～2mPa s, surface tension 20mN/m～30mN/m, volatile；Described magnetic powder particle diameter is 0.1～1 μm.Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin.Described magnetic slurry also includes 0.01-0.07 part thixotropic agent, and described thixotropic agent is thixotropic agent MT6900-20X.Described magnetic slurry also includes 0.005-0.02 part light trigger, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.Preferred described magnetic slurry is made up of the raw material of following quality proportioning: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, magnetic powder 0.5～5 part, and thixotropic agent is 0.01-0.07 part, and light trigger is 0.005-0.02 part.Described magnetic powder is the modified magnetic powder of surface conditioning agent, and described surface conditioning agent is dodecyl sodium sulfate, tetraethyl orthosilicate, methyl parahydroxybenzoate or DOPAC；The modified magnetic powder preparation method of described surface conditioning agent is: be dissolved in by surface conditioning agent in the ethanol water of volumetric concentration 60%, it is sufficiently stirred for dissolving completely, immerse magnetic powder, it is sufficiently stirred for moistening uniform, 60 DEG C of calorstats react 6 hours, it was stirred every 2 hours and adds the ethanol water of volumetric concentration 60%, afterwards mixture being transferred in the thermostatic drying chamber of 110 DEG C and be dried, it is thus achieved that surface conditioning agent modifiies hard magnetic powders；The mass ratio of described hard magnetic powders and surface conditioning agent is 100:2.The preparation method of described magnetic slurry is: by formula ratio, join in diluent by photo-thermal dual curable resin, is sufficiently stirred for and makes it dissolve completely, it is subsequently adding light trigger, is sufficiently stirred for and makes it dissolve completely, add thixotropic agent, it is stirred well in solution and can't see obvious particulate matter, stand till forming homogeneous colloidal sol, stir, add magnetic powder, after being sufficiently stirred for, ultrasonic 5 minutes, make the abundant wetting and dispersing of hard magnetic powders, stir, it is thus achieved that magnetic slurry.
Dielectric slurry of the present invention is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, barium titanate powder 1～6 part；Described photo-thermal dual curable resin is the resin containing acrylic；Described diluent boiling point 80 DEG C～150 DEG C, viscosity 1mPa s～2mPa s, surface tension 20mN/m～30mN/m, volatile；Described barium titanate powder particle diameter is less than 1 μm.Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin.Described dielectric slurry also includes 0.02-0.08 part thixotropic agent, and described thixotropic agent is thixotropic agent MT6900-20X.Described dielectric slurry also includes 0.002-0.018 part light trigger, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.Described dielectric slurry is made up of the raw material of following quality proportioning: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, barium titanate powder 1～6 part, thixotropic agent 0.02-0.08 part, light trigger 0.002-0.018 part.Described barium titanate powder is surface conditioning agent modified barium carbonate powder, and described surface conditioning agent is silane coupling agent KH550, titanate coupling agent TMC-201 or titanate coupling agent TMC-102；Described surface conditioning agent modified barium carbonate powder, preparation method thereof is: be dissolved in by surface conditioning agent in the ethanol water that volumetric concentration is 80%, it is sufficiently stirred for dissolving completely, add barium titanate powder, ensure that the liquid level of ethanol water is higher than barium titanate powder aspect, it is sufficiently stirred for moistening uniform, react 6 hours in 60 DEG C of calorstats after sealing with preservative film, it was stirred every 2 hours and adds the ethanol water that volumetric concentration is 80% ensureing that the liquid level of ethanol water is higher than barium titanate powder aspect, afterwards mixture is transferred in the thermostatic drying chamber of 110 DEG C and be dried, obtain surface conditioning agent modified barium carbonate powder；The mass ratio of described barium titanate powder and surface conditioning agent is 100:2.The preparation method of described dielectric slurry is: by formula ratio, join in diluent by photo-thermal dual curable resin, is sufficiently stirred for and makes it dissolve completely, it is subsequently adding light trigger, is sufficiently stirred for and makes it dissolve completely, add thixotropic agent, it is stirred well in solution and can't see obvious particulate matter, stand till forming homogeneous colloidal sol, stir, add barium titanate powder, after being sufficiently stirred for, ultrasonic 5 minutes, make the abundant wetting and dispersing of hard barium titanate powder, stir, it is thus achieved that dielectric slurry.
Compared with prior art, the beneficial effects are mainly as follows:
A. the 3D method printed is adopted to carry out the manufacture of electronic circuit, the spacing of precision and the printable layer controlling printer head can be passed through, control size and the precision of product, and can meet that electronic instrument and meter industrial products size is microminiaturized, the requirement of complex-shapedization.
B.3D inkjet technology is to increase the one during material manufactures, and is without discharge, free of contamination a kind of production technology, except the production of base stock, will not bring extra burden to ecology.
C. according to electronic circuit production technology provided by the invention, the electronic circuit of its production is three-dimensional, and in three-dimensional circuit, electronic component is not distributed across on a two dimensional surface, and is distributed across in a three-dimensional solid space.Three-dimensional circuit has following significant advantage: 1) compared with traditional two-dimensional circuit, and the area of three-dimensional circuit is less, is conducive to the miniaturization of electrical equipment；2) it is easily achieved modularity, in a three-dimensional module, namely realizes some specific function, complete various task by the splicing of disparate modules；3) environment friendly and pollution-free, and save material.
(4) accompanying drawing explanation
Fig. 1 is the flow chart of electronic circuit manufacture method of the present invention.
(5) detailed description of the invention
By describing the technology contents of the present invention in detail, being realized purpose and effect, below in conjunction with embodiment and coordinate accompanying drawing to be explained in detail.The accompanying drawing used required in embodiment or description of the prior art is briefly described by Fig. 1, apparently, it is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
As it is shown in figure 1, electronic circuit manufacture method provided by the invention, including step:
(9) according to design specific requirement, use the overall threedimensional model of mapping software design electronic circuit as three-dimensional in Solidworks, AutoCAD, UnigraphicsNX, Pro-E or CATIA etc., the component such as including substrate, wire, resistance, electric capacity, inductance；
(10) the software ObjetStudio electronic circuit threedimensional model document done by above-mentioned three-dimensional software is used to convert printable file to；
(11) according to the corresponding printing path of printable file generated of above-mentioned formation and use parameter；
(12) the jet printing head of 3D ink-jet printer moves by printing path, and ejects electric slurry one layer very thin on operable profile pallet, and ultraviolet light is launched in the direction that UV cure lamp works along printhead, makes electric slurry solidify.Different printheads ejects different electric slurries；Make inductance core pole and adopt magnetic slurry, make wire and adopt electrocondution slurry, make capacitor dielectric and adopt dielectric slurry, make resistive element and adopt heat conduction slurry；
(13) completing after the jet printing of a layer solidifies, the moulded tray of equipment can extremely accurately decline a height, and different jet printing heads continues to spray different electric slurries and carries out printing and the solidification of next layer；
(14) step (4), (5) it are repeated in, until electronic circuit prints complete；
(15) again the electronic circuit after curing molding is removed from 3D ink-jet printer；
(16) require to be as the criterion with the technology of the electronic circuit of design, electronic circuit is carried out post processing, ultimately forms complete electronic circuit.
Described 3D ink-jet printer adopts the Eden260v photosensitive resin three-dimensional printer that Objet company of Israel produces, and software kit is ObjetStudio.
Described electrocondution slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, 0.5～11 part of argentum powder, thixotropic agent 0.03-0.09 part, light trigger 0.008-0.025 part.Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin.Described thixotropic agent is thixotropic agent MT6900-20X, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
Described heat conduction slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, alumina powder 0.5～4 part, thixotropic agent 0.01-0.08 part, light trigger 0.002-0.018 part；Described alumina powder particle diameter is 1～2 μm.Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin.Described thixotropic agent is thixotropic agent MT6900-20X, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
Described magnetic slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, magnetic powder 0.5～5 part, thixotropic agent 0.01-0.07 part, light trigger 0.005-0.02 part；Described magnetic powder particle diameter is 0.1～1 μm.Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin.Described thixotropic agent is thixotropic agent MT6900-20X, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
Described dielectric slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, barium titanate powder 1～6 part, thixotropic agent 0.02-0.08 part, light trigger 0.002-0.018 part；Described barium titanate powder particle diameter is less than 1 μm.Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin.Described thixotropic agent is thixotropic agent MT6900-20X, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
Above disclosed it is only the preferred embodiments of the present invention, certainly can not limit the interest field of the present invention, the equivalent variations therefore made according to the present patent application the scope of the claims with this, still belong to the scope that the present invention contains.
Claims (6)
1. the 3D Method of printing of an electronic circuit, it is characterised in that described method carries out as follows:
(1) the overall threedimensional model of three-dimensional mapping software design electronic circuit is utilized, including substrate, wire, resistance, electric capacity, inductance；
(2) the electronic circuit threedimensional model document that the three-dimensional software of step (1) does is converted to printable file；
(3) the corresponding printing path of printable file generated that formed according to step (2) and use parameter；
(4) multiple jet printing heads of 3D ink-jet printer move by printing path, and eject one layer of electric slurry on operable profile pallet, and ultraviolet light is launched in the direction that UV cure lamp works along printhead, makes electric slurry solidify；Different printheads ejects different electric slurries, and described jet printing head includes inductance core pole printhead, wire printhead, capacitor dielectric printhead, resistive element printhead；
(5), after completing the jet printing solidification of a layer, different jet printing heads continues to spray different electric slurries and carries out printing and the solidification of next layer；
(6) step (4), (5) it are repeated in, until electronic circuit prints complete；
(7) again the electronic circuit after curing molding is removed from 3D ink-jet printer；Require to be as the criterion with the technology of the electronic circuit of design, electronic circuit is carried out post processing, ultimately forms complete electronic circuit.
2. as claimed in claim 1 method, it is characterised in that described electric slurry is respectively as follows: the magnetic slurry for making inductance core pole, for making the electrocondution slurry of wire, for making the dielectric slurry of capacitor dielectric and for making the heat conduction slurry of resistive element.
3. method as claimed in claim 2, it is characterised in that described electrocondution slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, 0.5～11 part of argentum powder, thixotropic agent 0.03-0.09 part, light trigger 0.008-0.025 part；Described argentum powder particle diameter is 0.1～1 μm；Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol；Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin；Described thixotropic agent is thixotropic agent MT6900-20X, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
4. method as claimed in claim 2, it is characterized in that described heat conduction slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, alumina powder 0.5～4 part, thixotropic agent is 0.01-0.08 part, and light trigger is 0.002-0.018 part；Described alumina powder particle diameter is 0.1～1 μm；Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol；Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin；Described thixotropic agent is thixotropic agent MT6900-20X, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
5. method as claimed in claim 2, it is characterised in that described magnetic slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, magnetic powder 0.5～5 part, thixotropic agent 0.01-0.07 part, light trigger 0.005-0.02 part；Described magnetic powder particle diameter is 0.1～1 μm；Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol.Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin；Described thixotropic agent is thixotropic agent MT6900-20X, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
6. method as claimed in claim 2, it is characterised in that described dielectric slurry is made up of the raw material of following mass ratio: photo-thermal dual curable resin 1 part, diluent 1.5～4 parts, barium titanate powder 1～6 part, thixotropic agent 0.02-0.08 part, light trigger 0.002-0.018 part；Described barium titanate powder particle diameter is less than 1 μm；Described diluent is dehydrated alcohol, propylene glycol methyl ether acetate or isopropanol；Described photo-thermal dual curable resin is epoxy acrylic resin, polyester acrylate, polyether acrylate or aliphatic epoxy resin；Described thixotropic agent is thixotropic agent MT6900-20X, and described light trigger is 2,4,6-trimethylbenzoy-dipheny phosphine oxides.
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