CN105726146A - Implant for periodontal diseases and preparation method thereof - Google Patents
Implant for periodontal diseases and preparation method thereof Download PDFInfo
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- CN105726146A CN105726146A CN201610203567.8A CN201610203567A CN105726146A CN 105726146 A CN105726146 A CN 105726146A CN 201610203567 A CN201610203567 A CN 201610203567A CN 105726146 A CN105726146 A CN 105726146A
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- tiag
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
- A61C8/00—Means to be fixed to the jaw-bone for consolidating natural teeth or for fixing dental prostheses thereon; Dental implants; Implanting tools
- A61C8/0012—Means to be fixed to the jaw-bone for consolidating natural teeth or for fixing dental prostheses thereon; Dental implants; Implanting tools characterised by the material or composition, e.g. ceramics, surface layer, metal alloy
- A61C8/0013—Means to be fixed to the jaw-bone for consolidating natural teeth or for fixing dental prostheses thereon; Dental implants; Implanting tools characterised by the material or composition, e.g. ceramics, surface layer, metal alloy with a surface layer, coating
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
- A61C13/00—Dental prostheses; Making same
- A61C13/0003—Making bridge-work, inlays, implants or the like
- A61C13/0006—Production methods
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/26—Anodisation of refractory metals or alloys based thereon
Abstract
The invention belongs to the technical field of dental implants, and particularly relates to an implant for periodontal diseases and a preparation method thereof.The implant comprises a body made of pure titanium or titanium alloy and a coated film layer attached to the outer surface of the body, the coated film layer is made of Ta-Ag alloy or Ti-Ag alloy, the implant is connected with a base through a tapered lock column, a hole used for conveniently containing the tapered lock column is formed in the body, and the diameter of the hole is gradually decreased from outside to inside.According to the implant for the periodontal diseases and the preparation method thereof, the prepared implant not only can enhance the biocompatibility but also has the antibacterial effect, and the periodontal disease problem is solved.
Description
Technical field
The invention belongs to Dental Implant technical field, be specifically related to a kind of periodontal disease implantation body and preparation method thereof.
Background technology
Nineteen sixty-five professor Branmark carries out in the world after first Dental Implant, and Dental Implant has obtained unprecedented development, becomes the best approach that agomphosis is repaired.
Implantation body's business development is still concentrated mainly on bone so far and merges field, for instance the TiUnite implantation body product of NobelBiocare company of Sweden, has the perforate highly crystalline in nanometer range and is surface texture rich in phosphatic titanium oxide；The implantium implantation body product of Dentium company of Korea S, adopts surface bulky grain sandblasting and acid etch technique (being called for short: SLA).Also there is the more advanced biological surface factor, such as bone morphogenetic protein(BMP) (BMP), transforming growth factor-β (TGF-β), insulin-like growth factor-i (IGF-1), miRNA, siRNA are as plantation coating, such as the design that the patents such as CN1903140A, CN201119919Y, CN102579145A disclose.These methods significantly improve bone fusion rate, for healthy patients, hence it is evident that improve the success rate of implantation body.
But, for periodontal disease, diabetics, there is presently no and develop effective Commercial Growers body.Periodontal disease, diabetics, be still listed in the contraindication of Dental Implant so far.Even if in the normal population of non-periodontal disease, clinical research shows, general planting body is in the life cycle of 10-15, and the incidence rate of peri-implantitis is up to 14%, and plantation mortality reaches 10%.Its main cause is the design of Current commercial implantation body, and particularly implantation body's structural design provides bacteria breed space, and implantation body itself lacks or can not take into account infection function.
Implantation body's structural design provides bacteria breed space.General planting body is all made up of implant and plantation base station, and is tightened by center screw.Overwhelming majority connected mode, connection, outer connection in whether；Or hexagonal, anistree connection, all can cause implant and plantation base station leaving gap, and the small cavity so produced provides bacteria breed space.Such as the design that the patents such as US7108510B2, US7309231B2, DE20022420U1, US20040209226A1, US6663388B1 disclose.The Replace product of such as Sweden NobelBiocare company, XiVE, Frialit-2 product of Dentsply company of the U.S., Switzerland's ITI product etc..
Silver ion has general antibacterial action.In order to make implant surface prevent antibacterial attachment from suppressing bacteria breed, the preparation method that patent CN102345135A discloses a kind of silver-carrying dental implant.Adopt titania nanotube load silver method, it is thus achieved that silver ion layer.Compare with photocatalytic method, reducing process, hydrothermal deposition method, this patent using plasma plasma immersion ion implantation and depositing operation, it is said shortcomings such as can overcoming not high, the complex operation of silver-ion topical skewness, bond strength, but, have not yet to see formation commercial growth body report.
Tantalum (Ta) has more excellent biocompatibility than titanium (Ti).Li Mao etc. have carried out plasma spraying prosthesis with tantalum coating Study on biocompatibility, see " the Orthopedic Journal of China ", and 2011,19 (4): 320-324.Adopt morphology to take off to examine and tetramethyl azo azoles salt (MTT) colorimetry, by cytotoxicity detection, cell adhesion and proliferative research, tantalum (Ta) coating material biocompatibility is evaluated.Cell adhesion experiment and proliferative experimental result show: Ta coating surface cell adhesion quantity is apparently higher than Ti coating (P<0.05), with HA coating no difference of science of statistics (P>0.05), illustrate that Ta coating is more suitable for adhesion and the growth of cell compared with Ti coating surface.Born of the same parents' morphological observation, cytotoxicity experiment result, display no difference of science of statistics (P > 0.05).
Pure titanium is to be found bone fusion phenomenon in nineteen fifty-two by professor Branmark, and its biocompatibility gains public acceptance the earliest.Commonly reach 99.0% and just can be called pure titanium, and as sputtering target material, it is necessary to choose ultra-pure titanium of 99.999%.
Summary of the invention
Invention broadly provides a kind of periodontal disease implantation body and preparation method thereof, the implantation body of preparation can strengthen biocompatibility and have again antibacterial action, solves periodontal disease problem.Its technical scheme is as follows:
A kind of periodontal disease implantation body, including the body of pure titanium or titanium alloy material and be attached to the film plating layer of body outer surface, the material of film plating layer is TaAg alloy or TiAg alloy, described implantation body is connected with adopting taper lock between base station, the inside of body is provided with is easy to the hole that described taper lock is accommodating, and the diameter in hole is by being gradually reduced inside outward.
Preferably, film plating layer is at least one layer.
Preferably, in TaAg alloy, the content that content is 70-90wt%, Ag of Ta is 10-30wt%；In TiAg alloy, the content of Ti is the content of 70-90wt%, Ag is 10-30wt%.
Preferably, the thickness of film plating layer is 0.01-10 μm.
A kind of periodontal disease preparation method of implantation body, concrete is, is placed in radome by body and TaAg target or TiAg target, adopts magnetron sputtering method, TaAg target or TiAg target carry out particle sputtering and forms the film plating layer being attached on body.
Preferably, when selecting TaAg target, it is one group of TaAg target that one piece of Ta target and one piece of Ag target are inlayed, and is provided with least one set TaAg target in radome, respectively to often organizing TaAg target sputtering 25-35min, forms the film plating layer that the number of plies is identical with TaAg target group number；When selecting TiAg target, it is one group of TiAg target that one piece of Ti target and one piece of Ag target are inlayed, and is provided with least one set TiAg target in radome, respectively to often organizing TiAg target sputtering 25-35min, forms the film plating layer that the number of plies is identical with TiAg target group number.
Preferably, when film plating layer has multilamellar, the amount containing Ag of film plating layer is gradually increased to outer layer by internal layer.
Preferably, when film plating layer has multilamellar, the amount containing Ag of film plating layer is gradually increased from 10-30wt% to outer layer by internal layer.
Preferably, different Ta targets or the heating-up temperature of Ti target are gradually lowered to outer layer by internal layer, and the heating-up temperature of different Ag targets is gradually risen to outer layer by internal layer.
Preferably, the heating-up temperature of different Ag targets is gradually risen from 200-600 DEG C to outer layer by internal layer.
Adopt above-mentioned periodontal disease implantation body and preparation method thereof, the invention have the advantages that
Periodontal disease implantation body of the present invention, adopts the structure of TaAg or TiAg film plating layer.Owing to Ta or Ti is respectively provided with good biocompatibility, and reach 70-90% at surface concentrations, implantation body can be kept to obtain excellent biocompatibility and bone fusion characteristics.Ag is good inorganic antiseptic, makes its antibacterial effect of silver nanoparticleization strengthen hundreds of times after sputtering, therefore, periodontal disease implantation body of the present invention, not only there is good biocompatibility, and there is again anti-microbial property.It is connected in conjunction with the taper lock adopting uniqueness between implantation body with base station so that interface achieves antibacterial and closes.
The present invention is a kind of good periodontal disease implantation body of overall performance, has biocompatibility and bone fusion characteristics is good, antibacterial surface, interface antibacterial are closed, make simple, high efficient and reliable.
Accompanying drawing explanation
Fig. 1 is the periodontal disease structure chart with implantation body of the present invention；
Fig. 2 is the phantom of periodontal disease implantation body shown in Fig. 1.
Wherein: 1, body, 11, hole, 2, film plating layer.
Detailed description of the invention
1. periodontal disease implantation body
Described implantation body includes body 1 and multicoating layer 2, and described implantation body is connected with adopting taper lock between base station, and the inside of body 1 is provided with is easy to the hole 11 that described taper lock is accommodating, and the diameter in hole 11 is by being gradually reduced inside outward.
The material of body 1 is pure titanium or titanium alloy, and the material of film plating layer 2 is TaAg alloy or TiAg alloy.In TaAg alloy, the content of Ta is the content of 70-90wt%, Ag is 10-30wt%；In TiAg alloy, the content of Ti is the content of 70-90wt%, Ag is 10-30wt%.
The thickness of every layer of film plating layer 2 is 0.01-10 μm.
2. preparation method
Body 1 and TaAg target or TiAg target are placed in radome, when selecting TaAg target, it is one group of TaAg target that one piece of Ta target and one piece of Ag target are inlayed, least one set TaAg target it is provided with in radome, carry out particle sputtering 25-35min to often organizing TaAg target respectively, form the number of plies film plating layer 2 that be attached to body 1 on identical with TaAg target group number.When selecting TiAg target, it is one group of TiAg target that one piece of Ti target and one piece of Ag target are inlayed, it is provided with least one set TiAg target in radome, carries out particle sputtering 25-35min to often organizing TiAg target respectively, form the number of plies film plating layer 2 that be attached to body 1 on identical with TiAg target group number.
The amount containing Ag of film plating layer 2 is gradually increased from 10-30wt% to outer layer by internal layer.In order to make, film plating layer 2 is relatively more resistant to abrasive wear, antibacterial surface performance is better, target is adopted Temp change method, namely the temperature of Ag target, Ti target or Ta target changes in step in sputter procedure, different Ta targets or the heating-up temperature of Ti target are gradually lowered from 600-200 DEG C to outer layer by internal layer, and the heating-up temperature of different Ag targets is gradually risen from 200-600 DEG C to outer layer by internal layer.
Owing to the sputtering yield of different elements is different, the sputtering threshold values of Ti is higher, and the sputtering threshold values of Ag is relatively low.Therefore multiple Ti target is set in sputtering furnace chamber, increase the sputtering yield of Ti.Additionally, sputtering yield is also relevant with the temperature of target, when temperature reaches certain threshold values, sputtering yield will sharply increase, and therefore, Ti target be implemented high temperature, and low temperature implemented by Ag target, increases the sputtering yield of Ti.
Specific embodiment
Embodiment 1
1. periodontal disease implantation body
As shown in Figure 1-2, described implantation body includes body 1 and four layers of film plating layer 2, and described implantation body is connected with adopting taper lock between base station, and the inside of body 1 is provided with is easy to the hole 11 that described taper lock is accommodating, and the diameter in hole 11 is by being gradually reduced inside outward.
The material of body 1 is titanium alloy, and the material of film plating layer 2 is TaAg alloy.In TaAg alloy, the content of Ta is the content of 70wt%, Ag is 30wt%.
The thickness of every layer of film plating layer 2 is 1 μm.
2. preparation method
Body 1 and TaAg target are placed in radome, it is one group of TaAg target that one piece of Ta target and one piece of Ag target are inlayed, it is provided with four groups of TaAg targets in radome, carries out particle sputtering 25min to often organizing TaAg target respectively, form the number of plies film plating layer 2 that be attached to body 1 on identical with TaAg target group number.
The amount containing Ag of film plating layer 2 is gradually increased according to 10wt%, 17wt%, 24wt%, 30wt% to outer layer by internal layer.The heating-up temperature of different Ta targets is gradually lowered according to 600 DEG C, 467 DEG C, 334 DEG C, 200 DEG C by internal layer to outer layer, and the heating-up temperature of different Ag targets is gradually risen according to 200 DEG C, 334 DEG C, 467 DEG C, 600 DEG C by internal layer to outer layer.
Embodiment 2
1. periodontal disease implantation body
Described implantation body includes body 1 and one layer of film plating layer 2, and described implantation body is connected with adopting taper lock between base station, and the inside of body 1 is provided with is easy to the hole 11 that described taper lock is accommodating, and the diameter in hole 11 is by being gradually reduced inside outward.
The material of body 1 is pure titanium, and the material of film plating layer 2 is TaAg alloy.In TaAg alloy, the content of Ta is the content of 90wt%, Ag is 10wt%.
The thickness of every layer of film plating layer 2 is 10 μm.
2. preparation method
Being placed in radome by body 1 and TaAg target, it is one group of TaAg target that one piece of Ta target and one piece of Ag target are inlayed, and is provided with one group of TaAg target in radome, TaAg target carries out particle sputtering 30min, forms one layer of film plating layer being attached on body 12.
Heating-up temperature to Ta target is 600 DEG C, and the heating-up temperature to Ag target is 200 DEG C.
Embodiment 3
1. periodontal disease implantation body
Described implantation body includes body 1 and six layers of film plating layer 2, and described implantation body is connected with adopting taper lock between base station, and the inside of body 1 is provided with is easy to the hole 11 that described taper lock is accommodating, and the diameter in hole 11 is by being gradually reduced inside outward.
The material of body 1 is titanium alloy, and the material of film plating layer 2 is TiAg alloy.In TiAg alloy, the content of Ti is the content of 70wt%, Ag is 30wt%.
The thickness of every layer of film plating layer 2 is 0.01 μm.
2. preparation method
Body 1 and TiAg target are placed in radome, it is one group of TiAg target that one piece of Ti target and one piece of Ag target are inlayed, it is provided with six groups of TiAg targets in radome, carries out particle sputtering 30min to often organizing TiAg target respectively, form the number of plies film plating layer 2 that be attached to body 1 on identical with TiAg target group number.
The amount containing Ag of film plating layer 2 is gradually increased according to 10wt%, 14wt%, 18wt%, 22wt%, 26wt%, 30wt% to outer layer by internal layer.The heating-up temperature of different Ti targets is gradually lowered according to 600 DEG C, 520 DEG C, 440 DEG C, 360 DEG C, 280 DEG C, 200 DEG C by internal layer to outer layer, and the heating-up temperature of different Ag targets is gradually risen according to 200 DEG C, 280 DEG C, 360 DEG C, 440 DEG C, 520 DEG C, 600 DEG C by internal layer to outer layer.
Embodiment 4
1. periodontal disease implantation body
Described implantation body includes body 1 and eight layers of film plating layer 2, and described implantation body is connected with adopting taper lock between base station, and the inside of body 1 is provided with is easy to the hole 11 that described taper lock is accommodating, and the diameter in hole 11 is by being gradually reduced inside outward.
The material of body 1 is pure titanium, and the material of film plating layer 2 is TiAg alloy.In TiAg alloy, the content of Ti is the content of 80wt%, Ag is 20wt%.
The thickness of every layer of film plating layer 2 is 0.05 μm.
2. preparation method
Body 1 and TiAg target are placed in radome, it is one group of TiAg target that one piece of Ti target and one piece of Ag target are inlayed, it is provided with eight groups of TiAg targets in radome, carries out particle sputtering 35min to often organizing TiAg target respectively, form the number of plies film plating layer 2 that be attached to body 1 on identical with TiAg target group number.
The amount containing Ag of film plating layer 2 is gradually increased according to 10wt%, 11.25wt%, 13.75wt%, 15wt%, 16.25wt%, 17.5wt%, 18.75wt%, 20wt% to outer layer by internal layer.The heating-up temperature of different Ti targets is gradually lowered according to 600 DEG C, 543 DEG C, 486 DEG C, 429 DEG C, 372 DEG C, 315 DEG C, 258 DEG C, 200 DEG C by internal layer to outer layer, and the heating-up temperature of different Ag targets is gradually risen according to 200 DEG C, 258 DEG C, 315 DEG C, 372 DEG C, 429 DEG C, 486 DEG C, 543 DEG C, 600 DEG C by internal layer to outer layer.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various corresponding changes and deformation, and all these change and deformation all should belong within the protection domain of the claims in the present invention.
Claims (10)
1. a periodontal disease implantation body, it is characterized in that: include the body (1) of pure titanium or titanium alloy material and be attached to the film plating layer (2) of body (1) outer surface, the material of film plating layer (2) is TaAg alloy or TiAg alloy, described implantation body is connected with adopting taper lock between base station, the inside of body (1) is provided with is easy to the hole (11) that described taper lock is accommodating, and the diameter of hole (11) is by being gradually reduced inside outward.
2. periodontal disease implantation body according to claim 1, it is characterised in that: film plating layer (2) is at least one layer.
3. periodontal disease implantation body according to claim 1, it is characterised in that: in TaAg alloy, the content of Ta is the content of 70-90wt%, Ag is 10-30wt%；In TiAg alloy, the content of Ti is the content of 70-90wt%, Ag is 10-30wt%.
4. periodontal disease implantation body according to claim 1, it is characterised in that: the thickness of film plating layer (2) is 0.01-10 μm.
5. the method preparing periodontal disease as claimed in claim 1 implantation body, it is characterized in that: body (1) and TaAg target or TiAg target are placed in radome, adopt magnetron sputtering method, TaAg target or TiAg target are carried out the film plating layer (2) that particle sputtering formation is attached on body (1).
6. the periodontal disease according to claim 5 preparation method of implantation body, it is characterized in that: when selecting TaAg target, it is one group of TaAg target that one piece of Ta target and one piece of Ag target are inlayed, least one set TaAg target it is provided with in radome, respectively to often organizing TaAg target sputtering 25-35min, form the film plating layer (2) that the number of plies is identical with TaAg target group number；When selecting TiAg target, it is one group of TiAg target that one piece of Ti target and one piece of Ag target are inlayed, and is provided with least one set TiAg target in radome, respectively to often organizing TiAg target sputtering 25-35min, forms the film plating layer (2) that the number of plies is identical with TiAg target group number.
7. the periodontal disease according to claim 6 preparation method of implantation body, it is characterised in that: when film plating layer (2) has multilamellar, the amount containing Ag of film plating layer (2) is gradually increased to outer layer by internal layer.
8. the periodontal disease according to claim 7 preparation method of implantation body, it is characterised in that: when film plating layer (2) has multilamellar, the amount containing Ag of film plating layer (2) is gradually increased from 10-30wt% to outer layer by internal layer.
9. the periodontal disease according to claim 7 preparation method of implantation body, it is characterised in that: different Ta targets or the heating-up temperature of Ti target are gradually lowered to outer layer by internal layer, and the heating-up temperature of different Ag targets is gradually risen to outer layer by internal layer.
10. the periodontal disease according to claim 9 preparation method of implantation body, it is characterized in that: different Ta targets or the heating-up temperature of Ti target are gradually lowered from 600-200 DEG C to outer layer by internal layer, and the heating-up temperature of different Ag targets is gradually risen from 200-600 DEG C to outer layer by internal layer.
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| CN201610203567.8A CN105726146A (en) | 2016-04-05 | 2016-04-05 | Implant for periodontal diseases and preparation method thereof |
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| CN201610203567.8A CN105726146A (en) | 2016-04-05 | 2016-04-05 | Implant for periodontal diseases and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106691609A (en) * | 2016-11-24 | 2017-05-24 | 北京华钽生物科技开发有限公司 | High-tissue-affinity corrosion-resisting implant tooth and manufacturing method thereof |
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|---|---|---|---|---|
| CN1140977A (en) * | 1993-11-18 | 1997-01-22 | 韦斯泰姆技术有限公司 | Anti-microbial material |
| US6227857B1 (en) * | 1997-02-11 | 2001-05-08 | Vincent Morgan | Dental and orthopedic implant system |
| CN1570196A (en) * | 2004-04-30 | 2005-01-26 | 麦桥 | Surface antibiotic, wearable stainless steel products and its production method |
| WO2006004297A1 (en) * | 2004-04-26 | 2006-01-12 | Korea Institute Of Machinery And Materials | Osseoinductive metal implants for a living body and producing method thereof |
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2016
- 2016-04-05 CN CN201610203567.8A patent/CN105726146A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1140977A (en) * | 1993-11-18 | 1997-01-22 | 韦斯泰姆技术有限公司 | Anti-microbial material |
| US6227857B1 (en) * | 1997-02-11 | 2001-05-08 | Vincent Morgan | Dental and orthopedic implant system |
| WO2006004297A1 (en) * | 2004-04-26 | 2006-01-12 | Korea Institute Of Machinery And Materials | Osseoinductive metal implants for a living body and producing method thereof |
| CN1570196A (en) * | 2004-04-30 | 2005-01-26 | 麦桥 | Surface antibiotic, wearable stainless steel products and its production method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106691609A (en) * | 2016-11-24 | 2017-05-24 | 北京华钽生物科技开发有限公司 | High-tissue-affinity corrosion-resisting implant tooth and manufacturing method thereof |
| CN106691609B (en) * | 2016-11-24 | 2022-04-15 | 北京华钽生物科技开发有限公司 | High-affinity tissue corrosion-resistant implant and manufacturing method thereof |
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Application publication date: 20160706 |