CN105720047A - LED (Light-Emitting Diode) packaging module - Google Patents
LED (Light-Emitting Diode) packaging module Download PDFInfo
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- CN105720047A CN105720047A CN201410716522.1A CN201410716522A CN105720047A CN 105720047 A CN105720047 A CN 105720047A CN 201410716522 A CN201410716522 A CN 201410716522A CN 105720047 A CN105720047 A CN 105720047A
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to an LED (Light-Emitting Diode) packaging module. According to the LED packaging module, bare chips with multiple light qualities are uniformly arranged on a substrate, micro lenses are arranged outside one or more bare chips, and the bare chips are connected into one unit in a lead boning mode; the LED packaging module further comprises a base frame bearing a plurality of units, a dimming drive module is configured for each LED unit, the LED units are arranged in parallel, the dimming drive modules are arranged between two adjacent rows of LED units, and the LED units are connected in a splicing mode. By adopting a direct packaging arrangement mode of the bare chips and the micro lenses, the light-emitting module has high light intensity and high composite spectrum uniformity; a specific number of the modules can be matched with a specific radiator and a dimming drive plate to form a standard module device for assembling a high-power lamp according to the requirements of customers for light intensity and spectra.
Description
Technical field
The present invention relates to LED technology field, specifically refer to a kind of LED encapsulation module.
Background technology
Along with Gloal Climate Change Impact is deepened, plant (biology) growth effect being strengthened, industrialized agriculture is fast-developing, and high performance artificial lighting has become as problem in the urgent need to address.Current artificial lighting mainly adopts high-pressure mercury lamp, mercury lamp or fluorescent lamp, and this type of lamp luminescence biology efficiency is low, consumes energy huge.In recent years, energy-saving artificial lighting technical development based on LED technology is rapid, existing LED biology light source mainly adopts techniques below: (1) adopts single 1W or 3WLED combination, light intensity is directly proportional to size, particularly great power LED cooling problem is difficult to solve, therefore the solution that there is no for the high light intensity high-pressure mercury lamp or Metal halogen lamp that substitute more than 400W, more can not substitute nature sunlight；(2) light fixture of many light qualities combination, illumination spectrum is uneven, and illumination uniformity is also poor.It addition, existing LED light source lamp size is fixed, can not flexible combination and dismounting, inconvenient maintenance.
Control mode for described LED biology light source mainly has the following two kinds: light source is divided into some loops, each loop to arrange a switch by (1), adopts whether on-off control light source works, non-adjustable light intensity and photoperiod；(2) adopt integrally adjusting light switch to adjust input voltage or electric current to control the power of light-source brightness, do not have editting function and power work efficiency is low.
Summary of the invention
In order to overcome above-mentioned problems of the prior art, the present invention provides a kind of LED encapsulation module.
Described LED encapsulation module, including substrate, described substrate is evenly distributed with the bare chip of multiple light quality, and one or more bare chips are outside equipped with lenticule or reflector, and each bare chip realizes electrical connection by the mode of wire bonding and forms LED unit.
Described LED encapsulation module also includes basis framework, some LED unit and the some light modulation driving modules being connected respectively with each LED unit it are provided with in the framework of basis, described LED unit parallel arranged, light modulation drive module setting is arranged between LED unit adjacent two, adopts inserting mode to connect between each LED unit.
Preferably, each LED unit is provided with heat abstractor.
Preferably, described heat abstractor is heat-pipe radiator.
Preferably, described basis framework surface configuration dimming control system, described dimming control system drives module by signal to be connected with light modulation.
Relative to prior art, the present invention has the advantage that (1) adopts bare chip to add lenticule and directly encapsulates the mode of arrangement, luminescence chip density is big, be prone to chip-scale optical design, makes illuminating module have significantly high intensity of illumination and complex light spectrum high uniformity effect；
(2) present invention exists with modular form, it is possible to specific module number coupling particular heat spreader, light modulation drive plate composition standardized module device, according to client to intensity of illumination and Requirement of Spectrum, is assembled into large-power lamp easily and uses, and change and easy to maintenance.
Accompanying drawing explanation
Fig. 1 is LED encapsulation module structural representation of the present invention；
Fig. 2 is the first embodiment schematic diagram of described bare chip encapsulation；
Fig. 3 is the second embodiment schematic diagram of described bare chip encapsulation.
Detailed description of the invention
Below in conjunction with embodiment, the present invention will be described in detail.
As shown in Figure 2,3, described LED unit 1 adopts COB technology, the bare chip 10 of multiple light quality conduction or non-conductive adhesive are adhered on the base plate 20 by design proportion, then carrying out wire bonding and realize electrical connection, the additional lens of bare chip 10 or reflector 30 carry out integral type optical treatment and form a luminous source A.Module external form can be arranged as required to as circle, rectangle etc., and bare chip 10 is evenly distributed on substrate as far as possible.For arranging the embodiment of lens, recomposition module outside single bare chip in Fig. 2.Fig. 3 is the embodiment schematic diagram jointly arranging lens outside multiple bare chip.
Such as Fig. 1, the present embodiment adopts rectangular LED unit, LED encapsulation module is formed by multiple such unit, the all corresponding radiator 14 of each LED unit 1 and a light modulation drive module 12, these LED unit can parallel arranged, be arranged in a framework 13, light modulation drive module 12 be arranged on adjacent two row LED encapsulation module between, radiator 14 is arranged on the substrate back of encapsulation module, adopts inserting mode to connect between each LED unit 1.
Owing to the luminescence chip in a module is more, caloric value is big, therefore adopts the heat-pipe radiator that efficiency is higher and volume is little, or adopts high heat conduction aluminum matter fin in conjunction with fan cooling, and the volume of so whole module increases to some extent.
It addition, described device also needs configuration dimming control system, this dimming control system is arranged on framework surface, and as human-computer interaction interface, dimming control system drives module by signal to be connected with light modulation.Dimming control system may be configured as touch or button, is conveniently performed manually by operation, can configure remote control as required；As for many motors control, this controls system can be external, is installed on switch board.
In the present invention, the not concrete 26S Proteasome Structure and Function module introduced all can adopt mature structure of the prior art and functional module, is not repeated herein.
Embodiment described above only have expressed embodiments of the present invention; it describes comparatively concrete and detailed; but therefore can not be interpreted as the restriction to the scope of the claims of the present invention; in every case the technical scheme adopting the form of equivalent replacement or equivalent transformation to obtain, all should drop within protection scope of the present invention.
Claims (5)
1. a LED encapsulation module, including substrate, it is characterized in that: being evenly distributed with the bare chip of multiple light quality on described substrate, one or more bare chips are outside equipped with lenticule or reflector, each bare chip realizes electrical connection by the mode of wire bonding and forms LED unit.
2. LED encapsulation module as claimed in claim 1, it is characterized in that: also include basis framework, some LED unit and the some light modulation driving modules being connected respectively with each LED unit it are provided with in the framework of basis, described LED unit parallel arranged, light modulation drive module setting is arranged between LED unit adjacent two, adopts inserting mode to connect between each LED unit.
3. LED high-power dimming device according to claim 2, it is characterised in that: each LED unit is provided with heat abstractor.
4. LED high-power dimming device according to claim 3, it is characterised in that: described heat abstractor is heat-pipe radiator.
5. LED high-power dimming device according to claim 3, it is characterised in that: described basis framework surface configuration dimming control system, described dimming control system drives module by signal to be connected with light modulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410716522.1A CN105720047A (en) | 2014-12-02 | 2014-12-02 | LED (Light-Emitting Diode) packaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410716522.1A CN105720047A (en) | 2014-12-02 | 2014-12-02 | LED (Light-Emitting Diode) packaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105720047A true CN105720047A (en) | 2016-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410716522.1A Pending CN105720047A (en) | 2014-12-02 | 2014-12-02 | LED (Light-Emitting Diode) packaging module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105720047A (en) |
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2014
- 2014-12-02 CN CN201410716522.1A patent/CN105720047A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160629 |
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| WD01 | Invention patent application deemed withdrawn after publication |