CN105716322B - Multi-temperature zone semiconductor refrigerating equipment and its temprature control method - Google Patents
Multi-temperature zone semiconductor refrigerating equipment and its temprature control method Download PDFInfo
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- CN105716322B CN105716322B CN201410711922.3A CN201410711922A CN105716322B CN 105716322 B CN105716322 B CN 105716322B CN 201410711922 A CN201410711922 A CN 201410711922A CN 105716322 B CN105716322 B CN 105716322B
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Abstract
The invention discloses a kind of multi-temperature zone semiconductor refrigerating equipment and its temprature control methods, supply voltage is determined according to the refrigeration capacity requirement of each compartment, and the power output module for selecting the rated power that can export required supply voltage small is semiconductor refrigerating module for power supply, if the supply voltage needed for multiple compartments, in same power output module output voltage range, the maximum value that power output module exports the supply voltage needed for multiple warm areas is the semiconductor refrigerating module for power supply.Thus, each compartment can set refrigeration capacity requirement according to user demand, and the temperature of each warm area can be adjusted arbitrarily, and the arbitrary temp difference of demand can be achieved between each compartment, disclosure satisfy that the different demands of user, really realize multiple warm areas.Semiconductor refrigerating module of the present invention is the power output module power supply of the minimum rated power can ensure its normal work always, can substantially reduce the energy consumption of refrigeration equipment, improve the energy efficiency indexes of complete machine.
Description
Technical field
The invention belongs to semiconductor refrigerating equipment technical field, especially a kind of multi-temperature zone semiconductor refrigerating equipment and its temperature
Spend control method.
Background technology
Semiconductor refrigerating equipment in the prior art is by the cold end released cold quantity of semiconductor refrigerating module in babinet
Storage space freezes.But in actual use, all it is by the natural cooling in case, due to the work of gravitational field
With temperature of lower is low in case, and upper temp is high, can place shelf in the case, forms the smaller warm area of temperature difference.But by
Low in temperature of lower, upper temp is high, thus lower part can only store the higher article of storage temperature demand, and top can only store storage
The lower article of temperature requirements temperature is hidden, warm area position is fixed, cannot be converted, moreover, warm area temperature difference is limited, cannot be satisfied
The different storage demands of different user.
In addition, semiconductor refrigerating equipment generally comprises the power supply powered for semiconductor refrigerating module, supplied by adjusting
The size of electric electric power output voltage realizes the change of the refrigerating capacity of semiconductor refrigerating module.The confession of existing semiconductor refrigerating equipment
Power supply is in order to meet the refrigeration capacity requirement of semiconductor refrigerating module, and typically only there are one large power supplies for setting.However, half
Conductor refrigeration module is after reaching refrigeration capacity requirement, it is only necessary to and a smaller operating voltage is used to maintain the consumption of institute's chilling requirement,
At this time, it is only necessary to the normal work of semiconductor refrigerating module is just able to maintain that using a small-power power, and the prior art is still
It is so powered using large power supply, then can lead to the reduction of large power supply efficiency, be unfavorable for saving electric energy.
Invention content
The purpose of the present invention is to provide a kind of temprature control method of multi-temperature zone semiconductor refrigerating equipment, refrigeration equipment is more
A warm area can set respectively into trip temperature and control, and arbitrary warm area can be set according to user demand as the temperature of demand, meets user
Different demands, while greatly reducing power consumption.
In order to solve the above technical problems, the present invention is achieved by the following scheme：
A kind of temprature control method of multi-temperature zone semiconductor refrigerating equipment, the semiconductor refrigerating equipment include at least two
Liner thermally isolated from each other, the liner inside form compartment, and the liner is freezed by semiconductor refrigerating module, the semiconductor system
Chill group includes semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device, and the cold end radiator, which is connected to, described partly leads
The cold end of body refrigeration module, the hot-side heat dissipation device are connected to the hot junction of the semiconductor refrigerating module, the cold end radiator
It is also connect with the liner, the refrigeration equipment further includes having at least two power output modules, the compartment temperature controlling party
Method is：
Refrigeration capacity requirement supply voltage obtaining step：The power supply electricity corresponding to the refrigeration capacity requirement of each compartment is obtained respectively
Pressure；
Freeze energizing step：The power output module for selecting the rated power that can export required supply voltage small is institute
Semiconductor refrigerating module for power supply is stated, if the supply voltage needed for multiple compartments is in same power output module output voltage range
Interior, then the power output module exports the maximum value of the supply voltage needed for multiple warm areas and is supplied for the semiconductor refrigerating module
Electricity.
Preferably, the power output module includes that the first small power output module of rated power and rated power are big
Second power output module, the voltage range that the first power output module exports are（Umin, Ubest）, the second power output mould
Block output voltage range be（Ubest, Umax）；
Wherein, Ubest is the highest peak efficiency voltage of refrigerating efficiency so that the semiconductor refrigerating module；
Umax >=according to the maximum cooling capacity voltage of compartment maximum cooling capacity demand determination；
Umin≤according to the minimum refrigerating capacity voltage of the minimum refrigeration demand determination of compartment.
Control method when power output module includes the first power output module and the second power output module is：
The supply voltage needed for the semiconductor refrigerating module of each compartment is determined respectively；
If supply voltage≤Ubest needed for compartment selects the first power output module for the semiconductor refrigerating module
Power supply；
If the supply voltage ＞ Ubest needed for compartment, select the second power output module for the semiconductor refrigerating module
Power supply.
If supply voltage≤Ubest needed for multiple compartments, determine that the maximum value in supply voltage, the first power of control are defeated
The maximum value for going out module output supply voltage is the semiconductor refrigerating module for power supply.
If the supply voltage ＞ Ubest needed for multiple compartments, determine that the maximum value in supply voltage, the second power of control are defeated
The maximum value for going out module output supply voltage is the semiconductor refrigerating module for power supply.
Preferably, refrigeration capacity requirement supply voltage obtaining step is：Obtain the mean temperature Tri of each compartment with it is preset
The temperature difference △ Ti of target temperature Tsi；The supply voltage needed for the semiconductor refrigerating module of each compartment is determined according to temperature difference △ Ti
Ui。
Further, the power supply to the semiconductor refrigerating module for power supply is obtained by formula Ui=UPID (△ Ti)+Ubest
Voltage Ui, Ubest are the highest peak efficiency voltage of refrigerating efficiency so that the semiconductor refrigerating module, UPID (△ Ti)
The numerical value that operation obtains is carried out to the temperature difference to adjust rule according to the PID;
The PID adjusts rule and is configured to：
When the temperature difference is more than or equal to preset temperature difference threshold so that the supply voltage, which is equal to, makes the semiconductor system
Chill block generates the maximum cooling capacity voltage of maximum cooling capacity；
When the temperature difference is reduced to the temperature difference threshold so that the supply voltage starts from maximum cooling capacity electricity
Drops.
Optionally, cold energizing step further includes：If Ti=0 △, the semiconductor that the power supply is i-th of compartment is controlled
The circuit of refrigeration module power supply disconnects.
Further, after the power supply disconnects for the circuit of the semiconductor refrigerating module for power supply of i-th of compartment, if △
Ti ＞ 0, into refrigeration capacity requirement supply voltage obtaining step.
After the temperature difference △ Ti of the mean temperature Tri and preset target temperature Tsi of i-th of compartment reach 0, dimension is determined
Voltage is held, the maintenance voltage is the voltage maintained needed for cold consumption.
Based on the design of above-mentioned temprature control method, the invention also provides a kind of semiconductor refrigerating equipments, including temperature
Control system, it is characterised in that：The temperature control system includes：
Master control borad is configured to execute above-mentioned temprature control method.
Further include：
Compartment temperature sensor, mean temperature Tr for detecting each compartment are simultaneously transmitted to master control borad；
Temperature setting module, for setting each indoor institute target temperature Ts to be achieved and being transmitted to master control borad.
Semiconductor refrigerating equipment liner is internally provided at least one non-insulated shelf, and the liner is divided into vertical point
Multiple spaces with temperature difference of cloth.
Compared with prior art, the advantages and positive effects of the present invention are：Multi-temperature zone semiconductor refrigerating equipment of the present invention
Temprature control method can determine supply voltage according to the refrigeration capacity requirement of each compartment, and select that required power supply can be exported
The power output module that the rated power of voltage is small is semiconductor refrigerating module for power supply, if the supply voltage needed for multiple compartments exists
In same power output module output voltage range, then power output module exports the maximum of the supply voltage needed for multiple warm areas
Value is the semiconductor refrigerating module for power supply.Thus, each compartment can set refrigeration capacity requirement, each warm area according to user demand
Temperature can arbitrarily adjust, the arbitrary temp difference of demand can be achieved between each compartment, disclosure satisfy that the different of user need
It asks, really realizes multiple warm areas.The power supply of the present invention includes the different power output module of at least two rated power, and
The power output module for selecting the rated power of supply voltage needed for semiconductor refrigerating module small is powered for semiconductor refrigerating module,
Thus, semiconductor refrigerating module is that the power output module of the minimum rated power can ensure its normal work supplies always
Electricity, other power output modules are then closed, thus, the present invention can substantially reduce the energy consumption of refrigeration equipment, improve
The energy efficiency indexes of complete machine.
After the detailed description of embodiment of the present invention is read in conjunction with the figure, the other features and advantages of the invention will become more
Add clear.
Description of the drawings
Fig. 1 be according to an embodiment of the present invention semiconductor refrigerating equipment liner and semiconductor refrigerating module group assembling structure and
Warm area distribution schematic diagram.
Fig. 2 is the side view of Fig. 1.
Fig. 3 is the functional block diagram of power supply according to an embodiment of the present invention.
The supply voltage of Fig. 4 semiconductor refrigerating modules according to an embodiment of the invention and refrigerating efficiency and refrigeration
The example graph of magnitude relation.
Fig. 5 is power-efficient comparison schematic diagram according to an embodiment of the invention.
Fig. 6 is the flow chart of temprature control method according to an embodiment of the present invention.
Fig. 7 is according to an embodiment of the invention with higher refrigerating efficiency to be quickly obtained maximum cooling capacity and by semiconductor
The mean temperature of refrigeration equipment compartment accurately controls the example graph of the target temperature of setting.
Fig. 8 is the schematic block diagram of semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 9 is the schematic block diagram of semiconductor refrigerating equipment in accordance with another embodiment of the present invention.
Figure 10 is warm area distribution schematic diagram in accordance with another embodiment of the present invention.
Figure 11 is the flow chart of temprature control method in freezing energizing step according to an embodiment of the present invention.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with the accompanying drawings.
Multi-temperature zone semiconductor refrigerating equipment can be refrigerator, wine cabinet, refrigerator and ice etc..For example, can basis in wine cabinet
Different wine categories does not carry out classified storage, for example the suitable warm area of red wine is 10-18 DEG C；The suitable warm area of white wine
It is 5-10 DEG C；Champagne is then 3-5 DEG C.And the warm area range that ice product needs can be broader, divides into fruit area, vegetables
Area, the areas Jiu Pin, tealeaves area etc..Semiconductor refrigerating equipment of the present invention includes at least two liners thermally isolated from each other, each liner
Inside forms a compartment, and each compartment forms a warm area.Liner is freezed by semiconductor refrigerating module, semiconductor refrigerating module
Including semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device, cold end radiator is connected to the cold of semiconductor refrigerating module
End, hot-side heat dissipation device are connected to the hot junction of semiconductor refrigerating module, and cold end radiator is also connect with liner, and refrigeration is provided for liner
Amount.The present invention semiconductor refrigerating module can work independently as needed, and by cold end radiator liner distribution,
Obtain the warm area of various preference temperatures.
The present embodiment is illustrated so that two liners form two warm areas as an example：
As shown in Figure 1, 2, the present embodiment semiconductor refrigerating equipment includes two liners, 205, two groups of semiconductor refrigerating modules.
Semiconductor refrigerating module includes semiconductor refrigerating module 201,202, cold end radiator 203,204 and hot-side heat dissipation device（In figure not
It shows）, cold end radiator 203 is connected to the cold end of semiconductor refrigerating module 201, and cold end radiator 204 is connected to semiconductor system
The cold end of chill block 202, hot-side heat dissipation device are both connected to the hot junction of semiconductor refrigerating module 201 and 202.Two liners 205 it
Between realized by thermal insulation layer 208 heat-insulated, cold end radiator 203 is connected on upper inner-liner 205, and refrigerating capacity is provided for upper inner-liner 205,
Form warm area 1；Cold end radiator 204 is connected on bottom inner container 205, is provided refrigerating capacity for bottom inner container 205, is formed warm area 2.
The power supply of the present embodiment semiconductor refrigerating equipment includes：
The different power output module of at least two rated power；
Electronic switch, for selecting power output module for semiconductor refrigerating module for power supply, wherein electronic switch selection
Power output module is the small power output module of rated power for capableing of supply voltage U needed for output semiconductor refrigeration module,
The realization of the devices such as thyristor, optoelectronic switch, relay can be used in electronic switch.
Thus, semiconductor refrigerating module is the power output of the minimum rated power can ensure its normal work always
Module for power supply, other power output modules are then in idle state of closing, thus, the present invention can substantially reduce refrigeration equipment
Energy consumption, improve the energy efficiency indexes of complete machine.
Specifically, the present embodiment is said so that power supply includes two different power output modules of rated power as an example
Bright, certainly, power supply includes the realization principle and this two rated power of the different power output module of multiple rated power
Different power output modules is similar and can achieve the object of the present invention, within protection scope of the present invention.
As shown in figure 3, the power supply of the present embodiment includes the first small power output module 101 of rated power and specified
High-power second power output module 102, wherein the first power output module 101 output voltage range be（Umin,
Ubest）, the second power output module 102 output voltage range be（Ubest, Umax）.
Wherein, Ubest is the highest peak efficiency voltage of refrigerating efficiency so that the semiconductor refrigerating module.
Umax >=according to the maximum cooling capacity voltage of semiconductor refrigerating equipment maximum cooling capacity demand determination；
Umin≤according to the minimum refrigerating capacity voltage of the minimum refrigeration demand determination of semiconductor refrigerating equipment.
The present embodiment forms warm area 1 with the refrigeration of semiconductor refrigerating module 201, the refrigeration of semiconductor refrigerating module 202 forms temperature
It is illustrated for area 2：
If supply voltage U1≤Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2 ＞ Ubest are pressed, control the state of electronic switch 103, K1 is closed, K2 is disconnected, K3 is closed, K4 is disconnected, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 201, the first power output module 101 exports supply voltage U1
It powers for semiconductor refrigerating module 201, semiconductor refrigerating module 201 freezes to warm area 1, and certainly, semiconductor refrigerating module 201 can
Multiple to be provided with, multiple semiconductor refrigerating modules 201 are freezed for warm area 1 jointly.Second power output module 102 gives semiconductor
The closing of circuit that refrigeration module 202 is powered, it is semiconductor refrigerating module that the second power output module 102, which exports supply voltage U2,
202 power supply, semiconductor refrigerating module 202 be warm area 2 refrigeration, certainly, semiconductor refrigerating module 202 can be provided with it is multiple, it is more
A semiconductor refrigerating module 202 is freezed for warm area 2 jointly.
If supply voltage U1 ＞ Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2≤Ubest is pressed, controls the state of electronic switch 103, K1 is disconnected, K2 is closed, K3 is disconnected, K4 is closed, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 202, the first power output module 101 exports supply voltage U2
It powers for semiconductor refrigerating module 202, semiconductor refrigerating module 202 is freezed for warm area 2, and certainly, semiconductor refrigerating module 202 can
Multiple to be provided with, multiple semiconductor refrigerating modules 202 are freezed for warm area 2 jointly.Second power output module 102 gives semiconductor
The closing of circuit that refrigeration module 201 is powered, it is semiconductor refrigerating module that the second power output module 102, which exports supply voltage U1,
201 power supply, semiconductor refrigerating module 201 be warm area 1 refrigeration, certainly, semiconductor refrigerating module 201 can be provided with it is multiple, it is more
A semiconductor refrigerating module 201 is freezed for warm area 1 jointly.
If supply voltage U1 ＞ Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2 ＞ Ubest are pressed, by the state of electronic switch 103, K1 is disconnected, K2 is disconnected, K3 is closed, K4 is closed, and the second power of control is defeated
Go out the closing of circuit that module 102 is powered to semiconductor refrigerating module 201,202, the second power output module 102 output power supply electricity
The maximum value in U1, U2 is pressed to power for semiconductor refrigerating module 201,202, semiconductor refrigerating module 201 is that warm area 1,202 is temperature
Freeze in area 2.
If supply voltage U1≤Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2≤Ubest is pressed, by the state of electronic switch 103, K1 is closed, K2 is closed, K3 is disconnected, K4 is disconnected, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 201,202, the first power output module 101 output power supply electricity
The maximum value in U1, U2 is pressed to power for semiconductor refrigerating module 201,202, semiconductor refrigerating module 201 is the refrigeration of warm area 1,202
Freeze for warm area 2.
Certainly, the warm area number that the present invention can realize is not limited in two, can be arranged in n according to practical situation
Courage, to form n warm area, each warm area is corresponding with semiconductor refrigerating module, corresponding semiconductor refrigerating module and the first work(
The electronic switch that control power supply circuit break-make is added between rate output module 101 and the second power output module 102 can be realized,
As shown in figure 9, its realization principle is similar with two warm areas, within protection scope of the present invention.
Fig. 4 is the supply voltage and refrigerating efficiency and refrigerating capacity of semiconductor refrigerating module according to an embodiment of the invention
The example graph of relationship.As shown in figure 4, according to the relationship of supply voltage U and refrigerating efficiency, supply voltage U can be divided
For 4 regions：First non-economy area 401, high efficient district 402, high refrigerating capacity area 403, the second non-economy area 404.First non-economy
The refrigerating capacity in area 401 is very small, cannot substantially meet the minimum refrigeration demand of semiconductor refrigerating equipment；Second non-economy area
Although refrigerating capacity of semiconductor itself may meet the minimum refrigeration demand of semiconductor refrigerating equipment in 404, due to this area
Supply voltage U high needed for domain, power consumption are more much higher than high efficient district 402 and high refrigerating capacity area 403；Therefore in the implementation of the present invention
It is semiconductor refrigerating module for power supply without using the supply voltage U in the first non-economy area 401 and the second non-economy area 404 in example, and
It is that the supply voltage U of semiconductor refrigerating module is made to be located at high efficient district 402 and high refrigerating capacity area 403.That is, the present invention's
In embodiment, by according to the requirement to semiconductor refrigerating device refrigeration efficiency, semiconductor refrigerating module used is determined according to experiment
The maximum value of supply voltage（That is maximum supply voltage Umax）And minimum value（I.e. minimum supply voltage Umin）, make semiconductor refrigerating
The operating voltage of module is located in high efficient district 402 defined by the two values and high refrigerating capacity area 403.
As shown in figure 4, maximum supply voltage Umax can be chosen for maximum cooling capacity voltage Umax-cold by experiment.Most
Small supply voltage Umin can be chosen for the supply voltage that the first economic zone 401 is demarcated with high efficient district 402, i.e., minimum system by experiment
Cold voltage Umin-cold.In some alternative embodiments of the invention, minimum supply voltage Umin also can slightly below meet
Semiconductor refrigerating equipment minimum refrigerating capacity voltage Umin-cold.
In addition, as those skilled in the art can be appreciated that according to Fig. 4, peak efficiency voltage Ubest can be obtained through experiment,
Its value is obviously between maximum cooling capacity voltage Umax-cold and minimum refrigerating capacity voltage Umin-cold.
Fig. 5 is the first power output module（Small-power power）Voltage, the second power for exporting Umin-Ubest ranges are defeated
Go out the voltage and the second power output module of module output Ubest-Umax ranges（Large power supply）Export Umin-Umax ranges
Voltage when efficiency comparison schematic diagram.As shown in figure 5, the output voltage of the first power output module is in Umin-Ubest
Efficiency highest, the efficiency highest of the output voltage of the second power output module in Ubest-Umax.When the second work(is used alone
It when rate output module, i.e., powers only with large power supply, then its efficiency when output voltage is less than Ubest declines apparent, damage
It consumes larger.
Thus, the present embodiment is by the way of the first power output module and the switching power supply of the second power output module, i.e.,
It when output voltage is in Ubest or less, is powered using small-power power, is adopted when needing output voltage in Ubest or more
It is powered with large power supply, can ensure can to make in the entire power bracket of demand small-power power and high-power in this way
Power supply is operated under the operating mode of higher conversion efficiency, greatly reduces energy consumption.
Fig. 6 is the flow of the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to an embodiment of the invention
Figure.In the embodiment shown in fig. 6, which may include：
Data acquisition step S101 obtains the temperature difference of the mean temperature Tr1 and preset target temperature Ts1 of warm area 1 respectively
The temperature difference △ T2 of △ T1, the mean temperature Tr2 of warm area 2 and preset target temperature Ts2；
Refrigeration capacity requirement supply voltage obtaining step S102, determines according to temperature difference △ T1, △ T2 to the semiconductor refrigerating
Supply voltage U1, U2 of module for power supply.
The present embodiment adjusts rule according to preset PID, the supply voltage determined by formula Ui=UPID (△ Ti)+Ubest
U1, U2 power to semiconductor refrigerating module 201,202.Wherein, Ubest is the refrigerating efficiency highest so that semiconductor refrigerating module
Peak efficiency voltage, UPID (△ Ti) is to adjust rule according to PID to carry out the numerical value that operation obtains to temperature difference △ Ti, wherein i
Represent i-th of compartment.
Fig. 7 is that temprature control method according to an embodiment of the invention is quickly obtained maximum refrigeration with higher refrigerating efficiency
Measure and accurately control the mean temperature of semiconductor refrigerating equipment compartment the example graph of the target temperature of setting.Such as figure
Shown in 7, the PID of the present embodiment, which adjusts rule, to be configured to：When temperature difference △ T are more than or equal to preset temperature difference threshold △ Tthd
When so that supply voltage U is equal to maximum cooling capacity voltage Umax-cold, can rapidly be cooled down to compartment in this way；As temperature difference △
When T is reduced to temperature difference threshold △ Tthd so that supply voltage U starts to decline from maximum cooling capacity voltage Umax-cold, so not
Semiconductor refrigeration module is powered with larger supply voltage again, the temperature in semiconductor refrigerating equipment can be avoided to reduce
Bad refrigeration effect is caused to the temperature far below pre-set value.
Freeze energizing step S103：The power output mould that electronic switch selects the rated power that can export supply voltage small
Block is semiconductor refrigerating module for power supply, if the supply voltage needed for multiple warm areas is in the first power output module output voltage range
Interior, then the first power output module exports the maximum value of the supply voltage needed for multiple warm areas and is supplied for the semiconductor refrigerating module
Electricity；If the supply voltage needed for multiple warm areas is in the second power output module output voltage range, the second power output mould
The maximum value that block exports the supply voltage needed for multiple warm areas is the semiconductor refrigerating module for power supply.
Electronic switch selection can export the first power output module, the second power output of supply voltage in the present embodiment
Module is the semiconductor refrigerating module for power supply.
The rated power of first power output module is 50W, and output voltage range is（Umin, Ubest）；
The rated power of second power output module is 200W, and output voltage range is（Ubest, Umax）；
Ubest is the highest peak efficiency voltage of refrigerating efficiency so that the semiconductor refrigerating module.
Umax >=according to the maximum cooling capacity voltage of semiconductor refrigerating equipment maximum cooling capacity demand determination；
Umin≤according to the minimum refrigerating capacity voltage of the minimum refrigeration demand determination of semiconductor refrigerating equipment.
Thus, it is determined to the semiconductor refrigerating module 201 when according to temperature difference △ T1 of warm area 1, the temperature difference △ T2 of warm area 2
After the supply voltage U1 of power supply, the volume supply voltage U2 to power to the semiconductor refrigerating module 202：
If supply voltage U1≤Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2 ＞ Ubest are pressed, by the state of electronic switch 103, K1 is closed, K2 is disconnected, K3 is closed, K4 is disconnected, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 201, the first power output module 101 exports supply voltage U1
It powers for semiconductor refrigerating module 201, semiconductor refrigerating module 201 is freezed for warm area 1, and certainly, semiconductor refrigerating module 201 can
Multiple to be provided with, multiple semiconductor refrigerating modules 201 are freezed for warm area 1 jointly.Second power output module 102 gives semiconductor
The closing of circuit that refrigeration module 202 is powered, it is semiconductor refrigerating module that the second power output module 102, which exports supply voltage U2,
202 power supply, semiconductor refrigerating module 202 be warm area 2 refrigeration, certainly, semiconductor refrigerating module 202 can be provided with it is multiple, it is more
A semiconductor refrigerating module 202 is freezed for warm area 2 jointly.
If supply voltage U1 ＞ Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2≤Ubest is pressed, by the state of electronic switch 103, K1 is disconnected, K2 is closed, K3 is disconnected, K4 is closed, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 202, the first power output module 101 exports supply voltage U2
It powers for semiconductor refrigerating module 202, semiconductor refrigerating module 202 is freezed for warm area 2, and certainly, semiconductor refrigerating module 202 can
Multiple to be provided with, multiple semiconductor refrigerating modules 202 are freezed for warm area 2 jointly.Second power output module 102 gives semiconductor
The closing of circuit that refrigeration module 201 is powered, it is semiconductor refrigerating module that the second power output module 102, which exports supply voltage U1,
201 power supply, semiconductor refrigerating module 201 to warm area 1 freeze, certainly, semiconductor refrigerating module 201 can be provided with it is multiple, it is more
A semiconductor refrigerating module 201 is freezed for warm area 1 jointly.
If supply voltage U1 ＞ Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2 ＞ Ubest are pressed, by the state of electronic switch 103, K1 is disconnected, K2 is disconnected, K3 is closed, K4 is closed, and the second power of control is defeated
Go out the closing of circuit that module 102 is powered to semiconductor refrigerating module 201,202, the second power output module 102 output power supply electricity
The maximum value in U1, U2 is pressed to power for semiconductor refrigerating module 201,202, semiconductor refrigerating module 201 is to the refrigeration of warm area 1,202
Freeze to warm area 2.
If supply voltage U1≤Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2≤Ubest is pressed, by the state of electronic switch 103, K1 is closed, K2 is closed, K3 is disconnected, K4 is disconnected, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 201,202, the first power output module 101 output power supply electricity
The maximum value in U1, U2 is pressed to power for semiconductor refrigerating module 201,202, semiconductor refrigerating module 201 is to the refrigeration of warm area 1,202
Freeze to warm area 2.
After step S103, step S101 is repeated.
As shown in figure 11, further comprising the steps of in the energizing step S103 that freezes：
S1031 judges whether △ T1 are 0If △ T1 are 0, S1032 is entered step.
S1032, control power supply are that the circuit of the semiconductor refrigerating module for power supply of the 1st compartment disconnects.
S1033 judges whether △ T2 are 0If △ T2 are 0, S1034 is entered step.
S1034, control power supply are that the circuit of the semiconductor refrigerating module for power supply of the 2nd compartment disconnects.
S1035 judges whether △ T1, △ T2 are 0, if so, entering step S1036.
S1036 determines that maintenance voltage Ukeep is that the 1st compartment and the 2nd compartment are powered, and the maintenance voltage Ukeep is to maintain
Voltage needed for cold consumption.
S1037 judges △ T1 or △ T2 ＞ setting valuesSetting value be 0 or close to 0 smaller value, if so, entering step
S101。
Fig. 8 is the schematic block diagram of multi-temperature zone semiconductor refrigerating equipment according to an embodiment of the invention.It is shown in Fig. 8
Embodiment in, provide a kind of multi-temperature zone semiconductor refrigerating equipment, which includes：
Controller 105 is used for the temperature of the mean temperature Tr and preset target temperature Ts according to each warm area of refrigeration equipment
Poor △ T determine the supply voltage U needed for the semiconductor refrigerating module of each warm area, output control signals to electronic switch 103, defeated
Go out voltage control signal to power output module, if what the supply voltage needed for multiple warm areas was exported in same power output module
In voltage range, then the voltage control signal of the corresponding required supply voltage maximum value of output power output module is defeated to power
Go out module.The mean temperature Tr of each warm area is acquired by the temperature sensor 106 of each warm area, each preset target temperature of warm area
Degree Ts is set by the temperature setting module 107 of each warm area.
Electronic switch 103, the control signalizing activity for being exported according to controller 105, selection can export supply voltage U
The small power output module of rated power be that semiconductor refrigerating module 104 is powered, the selection of electronic switch 103 the in the present embodiment
One power output module 101 or the second power output module 102 are powered for semiconductor refrigerating module 201,202.
The second power output module 102 of the first small power output module 101 of rated power and rated power greatly, first
Power output module 101 export voltage range be（Umin, Ubest）, the voltage range of the second power output module 102 output
For（Ubest, Umax）；
Wherein, Ubest is the highest peak efficiency voltage of refrigerating efficiency so that the semiconductor refrigerating module 104.
Umax >=according to the maximum cooling capacity voltage of semiconductor refrigerating equipment maximum cooling capacity demand determination；
Umin≤according to the minimum refrigerating capacity voltage of the minimum refrigeration demand determination of semiconductor refrigerating equipment.
If supply voltage U1≤Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2 ＞ Ubest are pressed, by the state of electronic switch 103, K1 is closed, K2 is disconnected, K3 is closed, K4 is disconnected, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 201, the first power output module 101 exports supply voltage U1
It powers for semiconductor refrigerating module 201, semiconductor refrigerating module 201 is freezed for warm area 1, and certainly, semiconductor refrigerating module 201 can
Multiple to be provided with, multiple semiconductor refrigerating modules 201 are freezed for warm area 1 jointly.Second power output module 102 gives semiconductor
The closing of circuit that refrigeration module 202 is powered, it is semiconductor refrigerating module that the second power output module 102, which exports supply voltage U2,
202 power supply, semiconductor refrigerating module 202 be warm area 2 refrigeration, certainly, semiconductor refrigerating module 202 can be provided with it is multiple, it is more
A semiconductor refrigerating module 202 is freezed for warm area 2 jointly.
If supply voltage U1 ＞ Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2≤Ubest is pressed, by the state of electronic switch 103, K1 is disconnected, K2 is closed, K3 is disconnected, K4 is closed, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 202, the first power output module 101 exports supply voltage U2
It powers for semiconductor refrigerating module 202, semiconductor refrigerating module 202 is freezed for warm area 2, and certainly, semiconductor refrigerating module 202 can
Multiple to be provided with, multiple semiconductor refrigerating modules 202 are freezed for warm area 2 jointly.Second power output module 102 gives semiconductor
The closing of circuit that refrigeration module 201 is powered, it is semiconductor refrigerating module that the second power output module 102, which exports supply voltage U1,
201 power supply, semiconductor refrigerating module 201 to warm area 1 freeze, certainly, semiconductor refrigerating module 201 can be provided with it is multiple, it is more
A semiconductor refrigerating module 201 is freezed for warm area 1 jointly.
If supply voltage U1 ＞ Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2 ＞ Ubest are pressed, by the state of electronic switch 103, K1 is disconnected, K2 is disconnected, K3 is closed, K4 is closed, and the second power of control is defeated
Go out the closing of circuit that module 102 is powered to semiconductor refrigerating module 201,202, the second power output module 102 output power supply electricity
The maximum value in U1, U2 is pressed to power for semiconductor refrigerating module 201,202, semiconductor refrigerating module 201 is to the refrigeration of warm area 1,202
Freeze to warm area 2.
If supply voltage U1≤Ubest needed for semiconductor refrigerating module 201, power supply electricity needed for semiconductor refrigerating module 202
U2≤Ubest is pressed, by the state of electronic switch 103, K1 is closed, K2 is closed, K3 is disconnected, K4 is disconnected, and the first power of control is defeated
Go out the closing of circuit that module 101 is powered to semiconductor refrigerating module 201,202, the first power output module 101 output power supply electricity
The maximum value in U1, U2 is pressed to power for semiconductor refrigerating module 201,202, semiconductor refrigerating module 201 is to the refrigeration of warm area 1,202
Freeze to warm area 2.
At least one set of semiconductor refrigerating module 201, the supply voltage for receiving power output module output generate corresponding
Refrigerating capacity refrigeration, formed warm area 1.
At least one set of semiconductor refrigerating module 202, the supply voltage for receiving power output module output generate corresponding
Refrigerating capacity refrigeration, formed warm area 2.
In one embodiment of the invention, each warm area of the semiconductor refrigerating equipment includes temperature sensor 502, temperature
Spend setting module 503.Wherein, the temperature sensor 502 of each warm area detects the average temperature of each semiconductor refrigerating equipment compartment
Degree；The temperature setting module 503 of each warm area sets the indoor institute of semiconductor refrigerating equipment target temperature to be achieved.
It should be noted that in order to obtain more warm areas, it on the basis of the above embodiments, can be in each liner
Portion adds the non-insulated shelf of at least one non-insulated material making as interior partition.Non-insulated shelf can be foamed board, glass
The adjacent warm area that the shelf of above-mentioned form is formed is respectively adopted in glass plate, plastic drawer or steel wire shelf form, identical liner
The temperature difference can gradually reduce.Interior partition is at least two warm areas for capableing of mutual heat output, due to using direct-cooled mode, under by cold
The influence of heavy factor, can obtain the warm area of other temperature.As shown in Figure 10, it is both provided in upper inner-liner 205 and bottom inner container 205
One non-insulated shelf 209 forms the warm area 11 that a temperature is T1 using the temprature control method of above-described embodiment, and temperature is
The warm area 21 of T2 can then obtain the warm area 12 that temperature is T1- △ T3, the warm area 22 of T2- △ T4, by freezing to semiconductor module
The setting of amount and the arrangement mode of cold end radiator heat pipe can obtain different temperature gaps, and general heat pipe arrangement is got on the lower then
The adjacent two warm areas temperature difference obtained is bigger.Usual △ T3, △ T4 can be between 3-10 DEG C.Such mode can meet ice
Multi-temperature zone Temperature Distribution needs.
Afterwards it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although ginseng
According to previous embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be with
Technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；And
These modifications or replacements, the spirit and model of various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution
It encloses.
Claims (14)
1. a kind of temprature control method of multi-temperature zone semiconductor refrigerating equipment, the semiconductor refrigerating equipment include at least two that
This heat-insulated liner, the liner inside form compartment, and the liner is freezed by semiconductor refrigerating module, the semiconductor refrigerating
Module includes semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device, and the cold end radiator is connected to the semiconductor
The cold end of refrigeration module, the hot-side heat dissipation device are connected to the hot junction of the semiconductor refrigerating module, and the cold end radiator is also
It is connect with the liner, which is characterized in that the refrigeration equipment further includes having at least two power output modules, the room temperature
Spending control method is：
Refrigeration capacity requirement supply voltage obtaining step：The supply voltage corresponding to the refrigeration capacity requirement of each compartment is obtained respectively；
Obtain the temperature difference △ Ti of the mean temperature Tri and preset target temperature Tsi of each compartment；Between being determined each according to temperature difference △ Ti
Supply voltage Ui needed for the semiconductor refrigerating module of room;It is obtained to the semiconductor by formula Ui=UPID (△ Ti)+Ubest
The supply voltage Ui, Ubest of refrigeration module power supply are so that the refrigerating efficiency of the semiconductor refrigerating module is highest most efficiently
Rate voltage, UPID (△ Ti) are to adjust rule according to PID to carry out the numerical value that operation obtains to the temperature difference;Freeze energizing step：
The power output module for selecting the rated power that can export required supply voltage small is the semiconductor refrigerating module for power supply,
If the supply voltage needed for multiple compartments is in same power output module output voltage range, the power output module is defeated
The maximum value for going out the supply voltage needed for multiple warm areas is the semiconductor refrigerating module for power supply.
2. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 1, it is characterised in that：The work(
Rate output module includes the second power output module of the first small power output module of rated power and rated power greatly.
3. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 2, it is characterised in that：Described
One power output module output voltage range be（Umin, Ubest）, the second power output module output voltage range be
（Ubest, Umax）；Wherein, Ubest is the highest peak efficiency voltage of refrigerating efficiency so that the semiconductor refrigerating module.
4. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 3, it is characterised in that：
The Umax >=according to the maximum cooling capacity voltage of compartment maximum cooling capacity demand determination；
The Umin≤according to the minimum refrigerating capacity voltage of the minimum refrigeration demand determination of compartment.
5. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 3, it is characterised in that：The control
Method processed is：
The supply voltage needed for the semiconductor refrigerating module of each compartment is determined respectively；
If supply voltage≤Ubest needed for compartment selects the first power output module for the semiconductor refrigerating module for power supply；
If the supply voltage ＞ Ubest needed for compartment, select the second power output module for the semiconductor refrigerating module for power supply.
6. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 5, which is characterized in that
If supply voltage≤Ubest needed for multiple compartments, the maximum value in supply voltage is determined, control the first power output mould
The maximum value that block exports supply voltage is the semiconductor refrigerating module for power supply.
7. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 5, which is characterized in that
If the supply voltage ＞ Ubest needed for multiple compartments, the maximum value in supply voltage is determined, control the second power output mould
The maximum value that block exports supply voltage is the semiconductor refrigerating module for power supply.
8. the temprature control method of the multi-temperature zone semiconductor refrigerating equipment according to claim 1-7 any one, feature
It is,
The PID adjusts rule and is configured to：
When the temperature difference is more than or equal to preset temperature difference threshold so that the supply voltage, which is equal to, makes the semiconductor refrigerating mould
Block generates the maximum cooling capacity voltage of maximum cooling capacity；
When the temperature difference is reduced to the temperature difference threshold so that the supply voltage starts under the maximum cooling capacity voltage
Drop.
9. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 8, which is characterized in that
The refrigeration energizing step further includes：If Ti=0 △, control power supply is that the semiconductor refrigerating module of i-th of compartment supplies
The circuit of electricity disconnects.
10. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 9, it is characterised in that：It is described
Power supply is after the circuit of the semiconductor refrigerating module for power supply of i-th of compartment disconnects, if △ Ti ＞ setting values, into refrigerating capacity
Demand supply voltage obtaining step.
11. the temprature control method of multi-temperature zone semiconductor refrigerating equipment according to claim 9, it is characterised in that：When i-th
After the temperature difference △ Ti of the mean temperature Tri of a compartment and preset target temperature Tsi reach 0, maintenance voltage, the dimension are determined
It is the voltage maintained needed for cold consumption to hold voltage.
12. a kind of semiconductor refrigerating equipment, including temperature control system, it is characterised in that：The temperature control system includes：
Master control borad is configured to the temprature control method described in perform claim requirement 1-11 any one.
13. semiconductor refrigerating equipment according to claim 12, it is characterised in that：Further include：
Compartment temperature sensor, mean temperature Tr for detecting each compartment are simultaneously transmitted to master control borad；
Temperature setting module, for setting each indoor institute target temperature Ts to be achieved and being transmitted to master control borad.
14. semiconductor refrigerating equipment according to claim 12 or 13, it is characterised in that：The liner be internally provided with to
The liner, is divided into multiple spaces with temperature difference of vertical distribution by a few non-insulated shelf.
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| CN106091508B (en) * | 2016-07-22 | 2019-01-04 | 沈阳理工大学 | A kind of control system of semiconductor temperature-control case |
| CN107131715B (en) * | 2017-06-16 | 2019-10-15 | 合肥华凌股份有限公司 | A kind of temprature control method, control system and the computer installation of dual temperature wine cabinet |
| CN108790696B (en) | 2018-06-29 | 2021-05-11 | 京东方科技集团股份有限公司 | Temperature control method, temperature control device, electronic equipment and storage medium |
| CN114484924A (en) * | 2020-11-11 | 2022-05-13 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration equipment and power supply control method |
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