CN105708491B - For the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof - Google Patents
For the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof Download PDFInfo
- Publication number
- CN105708491B CN105708491B CN201410728004.1A CN201410728004A CN105708491B CN 105708491 B CN105708491 B CN 105708491B CN 201410728004 A CN201410728004 A CN 201410728004A CN 105708491 B CN105708491 B CN 105708491B
- Authority
- CN
- China
- Prior art keywords
- piezo
- composite material
- electricity composite
- electrode layer
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Transducers For Ultrasonic Waves (AREA)
Abstract
M*N type piezo-electricity composite material is prepared first for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof, carries out electrode cutting division after sputtering electrode layer, this cutting technique draws the electrode signal lead of opposite face in the same face.Then the first matching layer, the second matching layer and acoustic lens are added.It is finally welded in the FPC plate of hollow out in the row or column electrode of face battle array.Back sheet is added again, is encapsulated probe made above with shell.Using the piezo-electricity composite material array single side row, column mode of connection, the working condition of each array element selects control in the on-off of certain a line (or column), a certain column (or row) by voltage, reduces number of leads.Meanwhile concentrating gage system simpler, quick, reliable using single side.Therefore, whether conductive to matching layer, back sheet there is no limit and do not have to cutting matching layer, back lining materials, reduce technology difficulty and complexity.
Description
Technical field
The present invention relates to ultrasonic radiation force probes, more particularly to a kind of adjusting for deep brain stimulation and nerve for simple process
Ultrasonic face battle array probe of control and preparation method thereof.
Background technique
Ultrasonic probe is component crucial in ultrasonic device.Such as it is imaged by diasonograph, diasonograph hair
It penetrates ultrasonic signal and handles the echo-signal of Tissue reflectance, the image of the property and structure that obtain tissue is post-processed by system.
It is well known that this device is harmless to human body and can obtain three-dimensional tomography, opposite X-ray diagnostic equipment, magnetic are total
For vibration imaging, nuclear medicine diagnostic instrument.And there are also the advantages such as real time imagery, small in size, cheap, two dimensions for ultrasonic imaging
Ultrasonic plane array probe uses phased array method, can control supersonic beam and is directed toward in three-dimensional space.
Due to the above, two-dimensional array ultrasonic probe is widely used in heart, abdomen, mammary gland and urinary organ
Inspection.Also it can use three-dimensional space directive property and do three dimensional sound manipulation, transport drug and reach designated position in tissue.
Two-dimentional energy focusing ultrasonic-high probe is also widely used in ultrasonic therapy, and two-dimensional array ultrasonic probe prepared by this patent is exactly to be used for
Ultrasonic depth brain regulation.And especially suitable for carrying out multiple spot regulation for different brain neuroblastoma function divisions.In recent years, due to complete
The brain science plan of the prophylactic treatment of ball primary study neurodevelopment disease, mental disorder etc. formally starts to start, vast
Scientific worker is look for various means, method carries out deep brain stem to patient and regulates and controls in advance with stimulation, using two-dimensional array ultrasound
Pop one's head in very convenient size, intensity and the direction for adjusting focus thus can become that deep brain stem is pre- and a kind of noninvasive work of stimulation regulation
Tool and means.
During preparing two-dimensional array ultrasonic probe, some critically important problems include the performance of material, technique
Complexity, the welding quality of lead need to solve.Each array element of conventional two-dimensional ultrasonic plane array probe has conducting wire individually to control, that
The two-dimensional array ultrasonic probe array of M*N (M, N can any value), it is necessary to which M*N lead is very complicated in technique
, operation it is also inconvenient.
Summary of the invention
Based on this, it is necessary to provide a kind of ultrasonic face battle array probe for being used for deep brain stimulation and neuromodulation of simple process
Preparation method.
A kind of preparation method for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe；Include the following steps：
Piezo-electricity composite material after taking fine grinding, goes out M row baltimore groove along its transverse cuts, and the addition decoupling material in baltimore groove
Material；Again along its longitudinally cut N column baltimore groove, and decoupling material is added in baltimore groove；Wherein, M row baltimore groove and N column spill
The direction of slot is consistent；
The groove body of the M row baltimore groove of piezo-electricity composite material after cutting and N column baltimore groove is ground off, it is made to expose addition
Decoupling material, formed M*N piezo-electricity composite material array；
By the M*N piezo-electricity composite material array sputtering electrode layer, the M*N piezo-electricity composite material array is removed along thickness
Electrode layer on first long side surface in direction, the second long side surface；First long side surface, second long side surface are along the M*N
Piezo-electricity composite material array is laterally extended；
First front of the M*N piezo-electricity composite material array is removed into electrode layer along N column baltimore groove, retains described first
The electrode layer of front longitudinal edge and the electrode layer lateral along the excision of M row baltimore groove；
By the first short side surface of the M*N piezo-electricity composite material array, second short side surface, the second front along M row baltimore groove
Remove electrode layer；
Second front of the M*N piezo-electricity composite material array is successively bonded the first matching layer, the second matching layer and sound
Lens；
Flexible circuit board is connect to the M row electrode layer and N column electrode layer of the M*N piezo-electricity composite material array respectively；
Back sheet is Nian Jie with the electrode layer of the M*N piezo-electricity composite material array after connection flexible circuit board, thus
Form ultrasonic face battle array probe.
It in one of the embodiments, further include that will connect flexible circuit board and bonding back sheet, the first matching layer, second
The M*N piezo-electricity composite material array after matching layer and acoustic lens is encapsulated using shell.
In one of the embodiments, it is described take fine grinding after piezo-electricity composite material the step of before include：
Piezo-electricity composite material is refined to its thickness and reaches pre-set dimension.
It is described by the M row baltimore groove of the piezo-electricity composite material after cutting and N column baltimore groove in one of the embodiments,
Groove body is ground off, make its expose addition decoupling material the step of include：
The M*N piezo-electricity composite material array surface is refined, the groove body of M row baltimore groove and N column baltimore groove is removed,
M*N piezo-electricity composite material array thickness is set to reach preset thickness.
The M row that flexible circuit board is connect to the M*N piezo-electricity composite material array respectively in one of the embodiments,
The step of electrode layer and N column electrode layer includes：
The M*N piezo-electricity composite material array M row electrode layer is connect with the first flexible circuit board, by the M*N piezoelectricity
The N column electrode layer of composite material array is connect with the second flexible circuit board.
The M row electrode layer of the positive short side of the M*N piezo-electricity composite material array first connects in one of the embodiments,
First flexible circuit board；The N column electrode layer of the positive long side of the M*N piezo-electricity composite material array first connects described second
Flexible circuit board.
The M row electrode of positive two relative short edges of the M*N piezo-electricity composite material array first in one of the embodiments,
Layer connects first flexible circuit board respectively；The N of positive two relatively short sides of the M*N piezo-electricity composite material array first arranges electricity
Pole layer connects second flexible circuit board respectively.
The flexible circuit board is hollow out flexible circuit board in one of the embodiments,.
In addition, also providing a kind of popping one's head in for the ultrasonic face of deep brain stimulation and neuromodulation battle array for simple process.
It is a kind of to pop one's head in for the ultrasonic face of deep brain stimulation and neuromodulation battle array, acoustic lens, the first matching layer, the second matching layer
And back sheet, which is characterized in that further include as described above for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe
Second front of the M*N piezo-electricity composite material array of preparation method preparation, the M*N piezo-electricity composite material array is successively bonded the
One matching layer, the second matching layer and acoustic lens；The flexible circuit board connects the M row of the M*N piezo-electricity composite material array respectively
Electrode layer and N column electrode layer；The back sheet with connect the M*N piezo-electricity composite material array after the flexible circuit board
Electrode layer bonding, to form ultrasonic face battle array probe.
The flexible circuit board is hollow out flexible circuit board in one of the embodiments,.
It is above-mentioned to prepare M*N type pressure first for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof
Composite, electrode cutting division is carried out after sputtering electrode layer, this cutting technique draws the electrode signal lead of opposite face
The same face.Then the first matching layer, the second matching layer and acoustic lens are added.The row electricity of face battle array is finally welded in the FPC plate of hollow out
On pole or column electrode.Back sheet is added again, is encapsulated probe made above with shell.Using piezo-electricity composite material array single side
The row, column mode of connection, the working condition of each array element are selected by voltage in the on-off of certain a line (or column), a certain column (or row)
Control is selected, number of leads is reduced.Meanwhile concentrating gage system simpler, quick, reliable using single side.Therefore, to matching
Whether layer, back sheet are conductive, and there is no limit, and does not have to cutting matching layer, back lining materials, reduces technology difficulty and complexity.
Detailed description of the invention
Fig. 1 is the flow chart for the preparation method of the ultrasonic face of deep brain stimulation and neuromodulation battle array probe；
Fig. 2 is the structural schematic diagram of monomer piezo-electricity composite material；
Fig. 3 is the structural schematic diagram of the M*N piezo-electricity composite material after cutting；
Fig. 4 is the M*N piezo-electricity composite material array structure schematic diagram removed after two long side surface sputtering electrode layers；
Fig. 5 is the structural schematic diagram for removing the M*N piezo-electricity composite material array of N column electrode layer；
Fig. 6 be remove M row, N column electrode layer M*N piezo-electricity composite material array front view；
Fig. 7 be remove M row, N column electrode layer M*N piezo-electricity composite material array bottom view；
Fig. 8 is the structural schematic diagram for being bonded the M*N piezo-electricity composite material array after transducer assemblies；
Fig. 9 is the structural schematic diagram that the M*N piezo-electricity composite material array of flexible circuit board is connected in one embodiment；
Figure 10 is the structural schematic diagram that the M*N piezo-electricity composite material array of flexible circuit board is connected in another embodiment；
Figure 11 is the structural schematic diagram of M*N piezo-electricity composite material array after pasting back sheet；
Figure 12 is the structural schematic diagram for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe after encapsulation.
Specific embodiment
As shown in Figure 1, for the flow chart of the preparation method for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe.
A kind of preparation method for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe；Include the following steps：
It is described take fine grinding after piezo-electricity composite material the step of before include：
The fine grinding of piezo-electricity composite material 101 to its thickness is reached into pre-set dimension.
Step S110, the piezo-electricity composite material after taking fine grinding, goes out M row baltimore groove along its transverse cuts, and in baltimore groove
Add decoupling material；Again along its longitudinally cut N column baltimore groove, and decoupling material is added in baltimore groove；Wherein, M row spill
Slot is consistent with the direction of N column baltimore groove.
Specifically, taking monomer piezo-electricity composite material 101, as shown in Figure 2.Its thickness is ground to certain thickness.
Then it is divided into the baltimore groove of M row, add decoupling material 102 and is solidified.It is divided into the baltimore groove of N column, addition again
Decoupling material 102 simultaneously solidifies, then is refined specified thickness (size determined by parameters,acoustic).
The groove body of the M row baltimore groove of piezo-electricity composite material after cutting and N column baltimore groove is ground off, is made by step S120
Its decoupling material for exposing addition forms M*N piezo-electricity composite material array.
Step S120 includes：
The M*N piezo-electricity composite material array surface is refined, the groove body of M row baltimore groove and N column baltimore groove is removed,
M*N piezo-electricity composite material array thickness is set to reach preset thickness.
Specifically, grinding off the piezo-electricity composite material 101 not cut through, exposes joint-cutting all, M*N type (M, N can be prepared
Arbitrary integer can be taken) piezo-electricity composite material, as shown in Figure 3.
The 100 sputtering electrode layer 103 of M*N piezo-electricity composite material array it is multiple to be removed the M*N piezoelectricity by step S130
Electrode layer 103 on first long side surface of 100 through-thickness of condensation material array, the second long side surface；First long side surface, institute
State the second long side surface being laterally extended along the M*N piezo-electricity composite material array 100.
Specifically, by M*N piezo-electricity composite material array sputtering electrode layer 103 made above.Electrode layer 103 is sputtered
Afterwards, the electrode layer (i.e. electrode layer on the first long side surface, the second long side surface) for two sides of being expert at is removed, makes electrode layer 103 at it
Remaining the conducting of four faces, the first long side surface, the second long side surface and other four faces are not turned on, as shown in Figure 4.
First front of the M*N piezo-electricity composite material array 100 is removed electrode layer along N column baltimore groove by step S140
103, retain the electrode layer 103 of first front longitudinal edge and the electrode layer lateral along the excision of M row baltimore groove.
Specifically, electrode layer 103 is dispersed to cut according to 102 arrangement mode of decoupling material, by the first positive electrode layer
103 dispersions are cut into N column, retain its left and right side and do not cut, and only cut through electrode layer when cutting, as shown in Figure 5.
Step S150, by the first short side surface of the M*N piezo-electricity composite material array 100, second short side surface, the second front
Electrode layer 103 is removed along M row baltimore groove.
Specifically, by the second front of electrode layer 103, the first long side surface, the second long side surface and first positive two
Side column dispersion is cut into M row, and when cutting only cuts through electrode layer 103 can be as shown in Figure 6.Thus the electrode of opposite face is believed
Number lead draws in same electrode level.
Step S160, by the second of the M*N piezo-electricity composite material array 100 the front be successively bonded the first matching layer 201,
Second matching layer 202 and acoustic lens 203.
First is successively pasted on the second positive electrode layer 103 (opposite face of lead articulamentum) for being cut into M row
With layer 201, the second matching layer 202, acoustic lens 203, as shown in Figure 8.Wherein, the first matching layer 201, the second matching layer 202, sound
Lens 203 can form transducer assemblies.
Flexible circuit board is connect the M row electrode layer and N column of the M*N piezo-electricity composite material array 100 by step S170 respectively
Electrode layer.
Step S170 includes：
The M row electrode layer of the M*N piezo-electricity composite material array 100 is connect with the first flexible circuit board, by the M*N
The N column electrode layer of piezo-electricity composite material array is connect with the second flexible circuit board.
Specifically, M row, N column electrode are respectively connected to circuit using hollow out flexible circuit board, can be used manual welding or
Machine thermocompression bonding etc., due to using hollow out flexible circuit board, so welding point mass is high, is readily inspected, and hollow-out flexible electricity
Road plate is more easier to bend to required structure.The unilateral connection signal lead of hollow out flexible circuit board row, column can be used, such as
Shown in Fig. 9.Or using hollow out flexible circuit board in the bilateral connection signal lead of row, column, as shown in Figure 10.
Incorporated by reference to Fig. 9.In one embodiment, the M row electricity of the positive short side of M*N piezo-electricity composite material array 100 first
Pole layer connects first flexible circuit board 204；The N column electrode of the positive long side of the M*N piezo-electricity composite material array 100 first
Layer connects second flexible circuit board 205.Wherein, the every lead correspondence of flexible circuit board connects M row electrode or N column electrode.
Incorporated by reference to Figure 10.In yet another embodiment, positive two relative short edges of M*N piezo-electricity composite material array 100 first
M row electrode layer connect first flexible circuit board 204 respectively；100 first front two of M*N piezo-electricity composite material array
The N column electrode layer of relatively short side connects second flexible circuit board 205 respectively.Wherein, the first opposite flexible circuit board 204
Even when M row electrode, it is attached every a row electrode.It is wrong to the pin connection mode of the first opposite flexible circuit board 204
It opens.Connection type of the connection type of second flexible circuit board 205 similar to the first flexible circuit board 204.
Step S180, by back sheet and the electrode layer for connecting the M*N piezo-electricity composite material array after flexible circuit board
Bonding, to form ultrasonic face battle array probe.
Back sheet 206 is pasted on the electrode layer 103 in wiring face, as shown in figure 11.It is bent flexible circuit board again, i.e.,
Two-dimentional M*N ultrasonic plane array probe can be prepared
Incorporated by reference to Figure 12.Preparation method for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe further includes that will connect
M*N pressure after flexible circuit board and bonding back sheet 206, the first matching layer 201, the second matching layer 202 and acoustic lens 203
Composite array 100 is encapsulated using shell 207.
Flexible circuit board is hollow out flexible circuit board.
It is multiple that the above-mentioned preparation method for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe prepares M*N type piezoelectricity first
Condensation material array 100, relatively easy maturation in technique.And it can be used for preparing high frequency or the spy of low frequency two-dimensional array ultrasound
Head.The process of the dispersion cutting of electrode layer 103, the electrode signal lead of opposite face is drawn in the same electrode layer, Ke Yishi
Existing single side concentrates wiring, simple and reliable process.Whether matching layer and 206 material of back sheet are conductive materials, and there is no limit can be with
Using conductive material, it can also not use, widen material selection range.Using hollow out flexible circuit board, solder joint can be improved
Quality is readily inspected, and the FPC plate of hollow out is relatively easily bent.And matching layer and back sheet 206 can be directly pasted, no
With cutting again, thus to the thickness of back sheet 206 there is no limit.It avoids because of matching layer, piezo-electricity composite material, back sheet 206
Overall thickness blocked up the phenomenon that causing machine cuts that can not cut through.Also it avoids a large amount of using thicker backing generation is cut by laser
Heat makes piezoelectricity array element depolarization and loses the acoustical behavior of probe.
It is a kind of to pop one's head in for the ultrasonic face of deep brain stimulation and neuromodulation battle array based on above-mentioned all embodiments, acoustic lens
203, the first matching layer 201, the second matching layer 202 and back sheet 206 further include as described above for deep brain stimulation and mind
The M*N piezo-electricity composite material array 100 of the preparation method preparation of regulated ultrasonic face battle array probe, the M*N Piezoelectric anisotropy material
Second front of material array 100 is successively bonded the first matching layer 201, the second matching layer 202 and acoustic lens 203；The flexible electrical
Road plate connects the M row electrode layer and N column electrode layer of the M*N piezo-electricity composite material array 100 respectively；The back sheet 206 and company
The electrode layer 103 of the M*N piezo-electricity composite material array 100 after connecing the flexible circuit board is bonded, to form ultrasonic face
Battle array probe.
Flexible circuit board is hollow out flexible circuit board.
Based on above-mentioned all embodiments, piezo-electricity composite material array-is arranged by multiple lines and multiple rows piezoelectricity array element, is used for
Receive transmitting ultrasonic signal.
Electrode layer 103, bound edge row electrode or bound edge column electrode-are used to draw electrode signal lead in same electrode surface, real
Now to the application of piezoelectricity array element or return pulse signal.
Decoupling material 102-is filled in the joint-cutting between each piezoelectricity array element, for reducing the string sound of each piezoelectricity array element
Interference.
Acoustic impedance match of the matching layer-between realization piezoelectricity array element and object, thickness and parameter work frequently according to piezoelectricity battle array
Rate and parameters,acoustic determine.
Back sheet 206-absorbs the sound energy at the piezoelectricity array element back side, and thickness and parameter are according to piezoelectricity battle array working frequency and acoustics
Parameter determines.
The contact conductor-of flexible circuit board is for electrode signal lead to be linked into circuit system.
It is above-mentioned to prepare M*N type pressure first for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof
Composite, electrode cutting division is carried out after sputtering electrode layer, this cutting technique draws the electrode signal lead of opposite face
The same face.Then the first matching layer 201, the second matching layer 202 and acoustic lens 203 are added.Finally use the flexible circuit board of hollow out
It is welded in the row or column electrode of M*N type piezo-electricity composite material array 100.Back sheet 206 is added again, it will be with shell 207
The construction packages of upper preparation.Using the 100 single side row, column mode of connection of piezo-electricity composite material array, the working condition of each array element
Control is selected in the on-off of certain a line (or column), a certain column (or row) by voltage, reduces number of leads.Meanwhile using list
Concentrate gage system simpler, quick, reliable in face.Therefore, whether conductive to matching layer, back sheet there is no limit and not
With cutting matching layer, back lining materials, technology difficulty and complexity are reduced.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (9)
1. a kind of preparation method for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe；Include the following steps：
Piezo-electricity composite material after taking fine grinding, goes out M row baltimore groove along its transverse cuts, and decoupling material is added in baltimore groove；
Again along its longitudinally cut N column baltimore groove, and decoupling material is added in baltimore groove；Wherein, M row baltimore groove and N column baltimore groove
Direction it is consistent；
The groove body of the M row baltimore groove of piezo-electricity composite material after cutting and N column baltimore groove is ground off, it is made to expose going for addition
Coupling material forms M*N piezo-electricity composite material array；
By the M*N piezo-electricity composite material array sputtering electrode layer, the M*N piezo-electricity composite material array through-thickness is removed
The first long side surface, the electrode layer on the second long side surface；First long side surface, second long side surface are along the M*N piezoelectricity
Composite material array is laterally extended；
First front of the M*N piezo-electricity composite material array is removed into electrode layer along N column baltimore groove, retains first front
The electrode layer of longitudinal edge and the electrode layer lateral along the excision of M row baltimore groove；
The first short side surface of the M*N piezo-electricity composite material array, second short side surface, the second front are removed along M row baltimore groove
Electrode layer；
Second front of the M*N piezo-electricity composite material array is successively bonded the first matching layer, the second matching layer and acoustic lens；
Flexible circuit board is connect to the M row electrode layer and N column electrode layer of the M*N piezo-electricity composite material array respectively；
Back sheet is Nian Jie with the electrode layer of the M*N piezo-electricity composite material array after connection flexible circuit board, to be formed
Ultrasonic face battle array probe；
It further include that will connect flexible circuit board and be bonded described after back sheet, the first matching layer, the second matching layer and acoustic lens
M*N piezo-electricity composite material array is encapsulated using shell.
2. the preparation method according to claim 1 for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe, special
Sign is, the piezo-electricity composite material taken after fine grinding the step of before include：
Piezo-electricity composite material is refined to its thickness and reaches pre-set dimension.
3. the preparation method according to claim 1 for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe, special
Sign is that the groove body by the M row baltimore groove of the piezo-electricity composite material after cutting and N column baltimore groove is ground off, and makes its exposing
The step of decoupling material of addition includes：
The M*N piezo-electricity composite material array surface is refined, the groove body of M row baltimore groove and N column baltimore groove is removed, makes M*
N piezo-electricity composite material array thickness reaches preset thickness.
4. the preparation method according to claim 1 for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe, special
Sign is, the M row electrode layer that flexible circuit board is connect to the M*N piezo-electricity composite material array respectively and N column electrode layer
Step includes：
The M*N piezo-electricity composite material array M row electrode layer is connect with the first flexible circuit board, by the M*N Piezoelectric anisotropy
The N column electrode layer of material array is connect with the second flexible circuit board.
5. the preparation method according to claim 4 for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe, special
Sign is that the M row electrode layer of the positive short side of the M*N piezo-electricity composite material array first connects first flexible circuit board；
The N column electrode layer of the positive long side of the M*N piezo-electricity composite material array first connects second flexible circuit board.
6. the preparation method according to claim 4 for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe, special
Sign is that it is soft that the M row electrode layer of positive two relative short edges of the M*N piezo-electricity composite material array first connects described first respectively
Property circuit board；The N column electrode layer of positive two relatively short sides of the M*N piezo-electricity composite material array first connects described second respectively
Flexible circuit board.
7. the preparation described in -6 any one for the ultrasonic face of deep brain stimulation and neuromodulation battle array probe according to claim 1
Method, which is characterized in that the flexible circuit board is hollow out flexible circuit board.
8. a kind of preparation method preparation using as described in claim 1-7 any one is used for deep brain stimulation and neuromodulation
Ultrasonic face battle array probe, which is characterized in that including acoustic lens, the first matching layer, the second matching layer and back sheet.
9. according to claim 8 pop one's head in for the ultrasonic face of deep brain stimulation and neuromodulation battle array, which is characterized in that described
Flexible circuit board is hollow out flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410728004.1A CN105708491B (en) | 2014-12-03 | 2014-12-03 | For the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410728004.1A CN105708491B (en) | 2014-12-03 | 2014-12-03 | For the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105708491A CN105708491A (en) | 2016-06-29 |
| CN105708491B true CN105708491B (en) | 2018-11-20 |
Family
ID=56143110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410728004.1A Active CN105708491B (en) | 2014-12-03 | 2014-12-03 | For the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105708491B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107280704B (en) * | 2017-04-10 | 2020-04-10 | 深圳深超换能器有限公司 | Two-dimensional ultrasonic area array probe and preparation method thereof |
| CN108178121B (en) * | 2018-02-07 | 2024-05-03 | 北京先通康桥医药科技有限公司 | Palpation probe and manufacturing method thereof |
| CN109662731B (en) * | 2019-02-25 | 2024-02-20 | 南京广慈医疗科技有限公司 | Phased array power ultrasonic device with two-dimensional imaging probe in center |
| CN109700479A (en) * | 2019-02-25 | 2019-05-03 | 南京广慈医疗科技有限公司 | A kind of two-dimensional array ultrasound imaging probe |
| CN109771855A (en) * | 2019-03-04 | 2019-05-21 | 武汉市中创悟空生命科技有限公司 | The device and method of ultrasound regulation nerve fiber based on multi-modality imaging |
| CN110109123B (en) * | 2019-03-25 | 2021-01-12 | 中国船舶重工集团公司第七一五研究所 | Preparation method of underwater sound high-frequency phased array |
| CN110074814B (en) * | 2019-05-17 | 2020-05-15 | 清华大学 | Flexible ultrasonic detection device and using method thereof |
| CN111317507B (en) * | 2019-10-30 | 2021-09-14 | 深圳迈瑞生物医疗电子股份有限公司 | Acoustic head of area array ultrasonic probe and area array ultrasonic probe |
| CN110828655B (en) * | 2019-11-15 | 2021-11-30 | 飞依诺科技(苏州)有限公司 | Ultrasonic probe, piezoelectric composite material wafer and preparation method thereof |
| CN111803125A (en) * | 2020-07-31 | 2020-10-23 | 中国科学院苏州生物医学工程技术研究所 | Micro array ultrasonic transducer, preparation method thereof and ultrasonic probe comprising micro array ultrasonic transducer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4385255A (en) * | 1979-11-02 | 1983-05-24 | Yokogawa Electric Works, Ltd. | Linear array ultrasonic transducer |
| US4691418A (en) * | 1986-08-11 | 1987-09-08 | Medasonics Inc. | Ultrasonic transducer method |
| CN102743192A (en) * | 2012-07-04 | 2012-10-24 | 华中科技大学 | Annular three-dimensional ultrasonic probe for endoscopy and preparation method thereof |
| CN102755176A (en) * | 2012-07-02 | 2012-10-31 | 华中科技大学 | Two-dimensional ultrasonic area array probe and manufacturing method thereof |
| CN103300889A (en) * | 2013-05-17 | 2013-09-18 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic array probe signal acquisition component and preparation method thereof, and probe |
-
2014
- 2014-12-03 CN CN201410728004.1A patent/CN105708491B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4385255A (en) * | 1979-11-02 | 1983-05-24 | Yokogawa Electric Works, Ltd. | Linear array ultrasonic transducer |
| US4691418A (en) * | 1986-08-11 | 1987-09-08 | Medasonics Inc. | Ultrasonic transducer method |
| CN102755176A (en) * | 2012-07-02 | 2012-10-31 | 华中科技大学 | Two-dimensional ultrasonic area array probe and manufacturing method thereof |
| CN102743192A (en) * | 2012-07-04 | 2012-10-24 | 华中科技大学 | Annular three-dimensional ultrasonic probe for endoscopy and preparation method thereof |
| CN103300889A (en) * | 2013-05-17 | 2013-09-18 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic array probe signal acquisition component and preparation method thereof, and probe |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105708491A (en) | 2016-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105708491B (en) | For the ultrasonic face of deep brain stimulation and neuromodulation battle array probe and preparation method thereof | |
| CN102755176B (en) | Two-dimensional ultrasonic area array probe and manufacturing method thereof | |
| CN103946996B (en) | The method of ultrasonic transducer and manufacture ultrasonic transducer | |
| JP4408974B2 (en) | Ultrasonic transducer and manufacturing method thereof | |
| EP2614897A2 (en) | Ultrasonic probe and manufacturing method thereof | |
| CN105395216B (en) | Probe of ultrasonic imaging apparatus and method for manufacturing the same | |
| DE112007001957T5 (en) | Sound transducer arrangement with low profile | |
| DE102007001304A1 (en) | Converter order with Z-axis connection | |
| CN105640588B (en) | The extensive ultrasonic plane array of deep brain stimulation and neuromodulation probe and preparation method thereof | |
| EP2623217A2 (en) | Ultrasonic Probe and Manufacturing Method Thereof | |
| EP2894631B1 (en) | Ultrasonic diagnostic apparatus and manufacturing method thereof | |
| KR102092589B1 (en) | Ultrasound Probe and Manufacturing Method thereof | |
| US20150115773A1 (en) | Ultrasound transducer and method for manufacturing an ultrasound transducer | |
| Latham et al. | A 30-MHz, 3-D imaging, forward-looking miniature endoscope based on a 128-element relaxor array | |
| Cabrera-Munoz et al. | Fabrication and characterization of a miniaturized 15-MHz side-looking phased-array transducer catheter | |
| Yang et al. | Characterization of an array-based dual-frequency transducer for superharmonic contrast imaging | |
| JP7065837B2 (en) | Interposer for intracardiac echography | |
| US20240252145A1 (en) | Radiopaque arrangement of electronic components in intra-cardiac echocardiography (ice) catheter | |
| EP4013307A1 (en) | System and method for medical ultrasound with monitoring pad | |
| JP2020508806A (en) | Ultrasonic imaging device having a thermally conductive plate | |
| CN105640590A (en) | Ultrasound probe and manufacturing method for same | |
| Kotopoulis et al. | Lithium niobate transducers for MRI-guided ultrasonic microsurgery | |
| JP6802917B2 (en) | Transducer array with air groove for intraluminal imaging | |
| Smiley et al. | Toward transcranial ultrasound tomography: design of a 456-element low profile conformal array | |
| JP2005324008A (en) | Ultrasonic probe and ultrasonic diagnostic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |