CN105704909B - Wiring board and terminal - Google Patents
Wiring board and terminal Download PDFInfo
- Publication number
- CN105704909B CN105704909B CN201610105360.7A CN201610105360A CN105704909B CN 105704909 B CN105704909 B CN 105704909B CN 201610105360 A CN201610105360 A CN 201610105360A CN 105704909 B CN105704909 B CN 105704909B
- Authority
- CN
- China
- Prior art keywords
- layer
- capacitor
- mould group
- wiring board
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
Abstract
The invention discloses a kind of wiring board and terminals, the wiring board includes circuit base plate, electronic building brick and barriers, the electronic building brick includes listening cylinder mould group and capacitor, it is described that cylinder mould group and the capacitor is listened to be both secured on the circuit base plate, and it is spaced apart from each other setting, the barriers include blocking portion, and the blocking portion is fixed on the circuit base plate, and be located at it is described listen between cylinder mould group and the capacitor, stop the sound of uttering long and high-pitched sounds of the capacitor to propagate to and described listen cylinder mould group.Using the blocking portion be located at it is described listen between cylinder mould group and the capacitor, stop the sound of uttering long and high-pitched sounds of the capacitor propagate to it is described listen cylinder mould group, to prevent the acoustic impacts of uttering long and high-pitched sounds of capacitor from listening the pronunciation of cylinder mould group, to improve user experience.
Description
Technical field
The present invention relates to field of electronic device more particularly to a kind of wiring board and terminals.
Background technique
Mobile phone listens the setting of cylinder mould group majority in the circuit board at present, however usually can also be provided with capacitor on wiring board,
And in order to sufficiently use the arrangement space on wiring board, capacitor distance listens cylinder mould group closer.In mobile phone use process, capacitor
It is easy to produce and utters long and high-pitched sounds after energization, utter long and high-pitched sounds sound and earpiece sound doping influence user use together, therefore lead to user experience
It is not high.
Summary of the invention
In view of this, the present invention provides a kind of wiring board and terminal for improving user experience.
The present invention provides a kind of wiring board, wherein the wiring board includes circuit base plate, electronic building brick and barriers, institute
Stating electronic building brick includes listening cylinder mould group and capacitor, described that cylinder mould group and the capacitor is listened to be both secured on the circuit base plate, and
Be spaced apart from each other setting, the barriers are fixed on the circuit base plate, and obstruct in it is described listen cylinder mould group and the capacitor it
Between, described cylinder mould group is listened to stop the sound of uttering long and high-pitched sounds of the capacitor to propagate to.
Wherein, the barriers are shielding case, and the barriers are fixed on the circuit base plate, and close the electricity
Hold.
Wherein, the barriers are silencing cotton, and the barriers are fixed on the circuit base plate, and coat the earpiece
Mould group.
Wherein, the circuit base plate includes the rigid insulation layer, line layer and anti-solder ink layer being cascading, described
It listens cylinder mould group and the capacitor to be welded in line layer side opposite with the rigid insulation layer, and passes through the anti-solder paste
Layer of ink, the barriers are fixed on the anti-solder ink layer.
Wherein, the circuit base plate further includes flexible media layer and copper foil layer, and the flexible media layer is fixed on described hard
Matter insulating layer deviates from the line layer side, and the copper foil layer is superimposed on the flexible media layer, and it is exhausted to be located at the hard
Between edge layer and the flexible media layer.
Wherein, the flexible media floor includes the firstth area and the secondth area for being connected to firstth area, the rigid insulation
Orthographic projection region of the floor on the flexible media floor coincides with firstth area, and the circuit base plate further includes cover film,
The cover film and the rigid insulation layer mutually side by side, and the orthographic projection region on the flexible media floor and secondth area
It coincides.
Wherein, described that cylinder mould group and the capacitor is listened to be located in firstth area in the orthographic projection of the flexible media floor.
Wherein, the rigid insulation layer is equipped with first through hole, in the first through hole setting be electrically connected the line layer with
The signal conductor of the copper foil layer.
Wherein, the rigid insulation layer is additionally provided with the second through-hole, and setting is electrically connected the line layer in second through-hole
With the earth conductor of the copper foil layer.
The present invention also provides a kind of terminals, wherein the terminal include ontology, set on the body interior mainboard and
Wiring board described in above-mentioned any one, the wiring board is set to the body interior, and is electrically connected with the mainboard.
Wiring board and terminal of the invention, by installing barriers in the circuit base plate, the barriers include stopping
Portion is listened between cylinder mould group and the capacitor positioned at described using the blocking portion, the sound of uttering long and high-pitched sounds of the capacitor is stopped to propagate to
It is described to listen cylinder mould group, to prevent the acoustic impacts of uttering long and high-pitched sounds of capacitor from listening the pronunciation of cylinder mould group, to improve user experience.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic cross-section of wiring board provided by the invention；
Fig. 2 is the schematic cross-section of the wiring board of another embodiment provided by the invention.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
Referring to Fig. 1, a kind of wiring board 100 provided by the invention, the wiring board 100 includes circuit base plate 10, electronics
Component 20 and barriers 30, the electronic building brick 20 includes listening cylinder mould group 21 and capacitor 22, described to listen cylinder mould group 21 and the electricity
Hold 22 to be both secured on the circuit base plate 10, and be spaced apart from each other setting, the barriers 30 are fixed on the circuit base plate 10
On, the barriers 30 include blocking portion 31, and the blocking portion 31 is listened between cylinder mould group 21 and the capacitor 22 positioned at described, hindered
The sound of uttering long and high-pitched sounds for keeping off the capacitor 22, which propagates to, described listens cylinder mould group 21.It is understood that the wiring board 100 is applied to eventually
In end, which can be mobile phone, tablet computer or laptop etc..
By installing barriers 30 on the circuit base plate 10, the barriers 30 include blocking portion 31, using described
Blocking portion 31 is listened between cylinder mould group 21 and the capacitor 22 described in being located at, and stops the sound of uttering long and high-pitched sounds of the capacitor 22 to propagate to described
Cylinder mould group 21 is listened, to prevent the acoustic impacts of uttering long and high-pitched sounds of capacitor 22 from listening the pronunciation of cylinder mould group 21, to improve user experience.
The circuit base plate 10 is equipped with the circuit for being electrically connected the electronic building brick 20, to provide to the electronic building brick 20
Electric signal, the circuit base plate 10 carries the electronic building brick 20, so that the electronic building brick 20 is stable in the circuit base plate
On 10.The circuit base plate 10 can be printed circuit board, be also possible to flexible circuit board, in present embodiment, the route
Substrate 10 is Rigid Flex.
In present embodiment, the electronic building brick 20 is welded in the hard component of the circuit base plate 10.It is described to listen cylinder mould
Group 21 includes bottom end 211 and top 212, and the bottom end 211 is welded on the circuit base plate 10,212 sounding of top.Institute
State the route that capacitor 22 is welded on the circuit base plate 10, and is electrically connected on the circuit base plate 10.The capacitor 22 can be with
It is individually, to be also possible to multiple.The capacitor 22 and described listen between cylinder mould group 21 that there are spacing 20a.Preferably, the spacing
20a is 1mm~3mm.In other embodiments, can also be described listens cylinder mould group 21 to be welded in the hard of the circuit base plate 10
Property part, the capacitor 22 are welded in the flexible portion of the circuit base plate 10.
In present embodiment, the barriers 30 have sound absorption function.The blocking portion 31 is located in the spacing 20a.
When the capacitor 22 generation is uttered long and high-pitched sounds, the blocking portion 31 absorbs the howling, so that described listen cylinder mould group 21 that can not connect
By the howling, so that howling can not be mixed with the sounding of cylinder mould group 21 is listened, to improve user experience.The barrier
Part 30, which can be, to be adhered on the circuit base plate 10, and the barriers 30 have flexibility, to improve the barriers
30 sound-absorbing effect, and the barriers 30 is avoided to puncture the circuit base plate 10, that improves the wiring board 100 uses the longevity
Life.The barriers 30 are made of isolation material, prevent the barriers 30 from generating electrostatic with the electronic building brick 20.At it
In his embodiment, if the number of the capacitor 22 be it is multiple, the number of the barriers 30 can also be multiple, Mei Yisuo
The blocking portion 31 for stating barriers 30 stops the howling of each capacitor 22.
Further, the barriers 30 are shielding case, and the barriers 30 are fixed on 10 on the circuit base plate, and cage
Cover the capacitor 22.Specifically, the barriers 30 are welded on the circuit base plate 10, the blocking portion 31 is shielding case
Side wall.The barriers 30 prevent the sound transmission of uttering long and high-pitched sounds of the capacitor 22, while carrying out electrostatic screen to the capacitor 22, from
And the capacitor 22 is protected, improve the service life of the wiring board 100.
In another embodiment, referring to Fig. 2, the barriers 30 are silencing cotton, the barriers 30 are fixed on institute
It states on circuit base plate 10, and listens cylinder mould group 21 described in cladding.Specifically, the barriers 30 are annular in shape, the barriers 30 are wrapped
21 side of cylinder mould group is listened described in being overlying on.To which blocking portion 31 absorbs the capacitor for listening 21 side of cylinder mould group sound of uttering long and high-pitched sounds.
Further, the circuit base plate 10 includes rigid insulation layer 11, line layer 12 and anti-solder ink layer 13, described to listen
Cylinder mould group 21 and the capacitor 22 both pass through the anti-solder ink layer 13 and are welded in the line layer 12, and the barriers 30 are solid
Due on the anti-solder ink layer 13.
In present embodiment, the rigid insulation layer 11 uses polyethylene material, and the rigid insulation layer 11 has insulation
Characteristic, so that the line layer 12 is set to insulation environment, to facilitate the trace arrangements diversification of the circuit base plate 10.Benefit
It is not easy bending, thus to the electronics group so that 10 intensity of the circuit base plate increases with the rigidity of the rigid insulation layer 11
The firm support of part 20.
In present embodiment, the line layer 12 can be the etched technological forming of copper foil.The line layer 12 fits in
On the rigid insulation layer 11.The circuit trace mode of the line layer 12 can arrange by the line map being pre-designed,
The 12 setting signal cabling of line layer and ground connection cabling, signal lead weld the electronic building brick 20, are the electronic building brick
20 provide electric signal, are grounded cabling connection signal cabling, provide grounding electrode for the electronic building brick 20.
In present embodiment, the route on 13 pairs of the anti-solder ink layer line layer 12 is protected, and is prevented described
Line short on line layer 12.Specifically, the anti-solder ink layer 13 is equipped with welding in welding hole 131 described in welding hole 131
The electronic building brick 20, specifically, the electronic building brick 20 passes through the welding sky 131, filling weldering in the welding hole 131
The electronic building brick 20 is welded on the route of the line layer 15 by tin, to realize that the splicing wiring board 100 has
The function of printed circuit board.
Further, the circuit base plate 10 further includes flexible media layer 14 and copper foil layer 15, the flexible media layer 14
The rigid insulation layer 11 is fixed on away from 12 side of line layer, and the copper foil layer 15 is arranged in the flexible media layer 14
On, and be laminated between the rigid insulation layer 11 and the flexible media layer 14.
In present embodiment, polyimides or the double stupid diformates of polyethylene are can be used in the flexible substrate layer 14
Materials such as (Polyethylene terephthalate PET), in order to which the copper foil is arranged in the flexible substrate layer 14
Layer 15, and the flexible substrate layer 14 can provide insulation environment for the copper foil layer 15, in order in the copper foil layer 15
Upper etching signal cabling and ground connection cabling.Preferably, the thickness of the flexible substrate layer 14 can be 20 μm.The flexible substrate layer
14 can be set the first area 14a and the second area 14b, and the firstth area 14a is rigid for rendering, fixed on the firstth area 14a
The rigid insulation layer 11, so that the wiring board 100 is improved in the rigidity of the first area 14a, to facilitate the wiring board 100
Realize printed circuit board function.The secondth area 14b is flexible for rendering, and the secondth area 14b facilitates the wiring board 100 to produce
Raw deformation, and then the wiring board 100 is facilitated to connect external device, realize flexible circuit board function.
In present embodiment, the copper foil layer 15 is the plate that copper foil is arranged on film, the ground connection on the copper foil layer 15
Cabling and signal lead are that copper foil is formed according to the etched technique of prescribed route structure.Ground connection cabling on the copper foil layer 15
It can be and be wholely set with signal lead, the signal lead on the copper foil layer 15 realizes the conduction between electric elements, described
Ground connection cabling on copper foil layer 15 is grounded.
Further, orthographic projection region of the rigid insulation floor 11 on the flexible media floor 14 and firstth area
14a coincides, and the circuit base plate 10 further includes cover film 16, the cover film 16 with 11 phase of rigid insulation layer side by side,
And the orthographic projection region on the flexible media floor 14 coincides with the secondth area 14b.
In the present embodiment, the cover film 16 can be carried out hot-forming using polyester material.The cover film 16 passes through
Paste adhesive protects the copper foil layer 15 positioned at the secondth area 14b on the copper foil layer 15.Specifically, described cover
Epiphragma 16 is fitted in completely on the copper foil layer 15, and part covers signal lead and ground connection cabling on the copper foil layer 15,
To protect signal lead and ground connection cabling on the copper foil layer 15 being located in the secondth area 14b not lost or damaged, together
When, by the way of paste adhesive, it is also possible that the cover film 16 and the connection of the copper foil layer 15 are closer, prevent institute
It states the displacement of cover layer 16 and the part cabling for exposing the cover film 16 can not be protected.11 pairs of the rigid insulation layer
Copper foil layer 15 in the firstth area 14a is protected, and realizes the copper foil layer 15 with the line layer 12 mutually
Isolation.
Further, the orthographic projection for listening cylinder mould group 21 and the capacitor 22 in the flexible media layer 14 is positioned at described
In first area 14a, thus the support for listening cylinder mould group 21 and the capacitor 22 by the rigid insulation layer 14, and reduce
It is described that cylinder mould group 21 and the capacitor 22 is listened to shake, so that cylinder mould group 21 and the capacitor 22 be listened to generate noise described in preventing, mention
The user experience of elevated track plate 100.
Further, the rigid insulation layer 11 is equipped with first through hole 111, setting electrical connection in the first through hole 111
The signal conductor 112 of the copper foil layer 15 and the line layer 12.The copper foil layer 15 is electrically connected using the signal conductor 112
The line layer 12, thus 12 line conduction of the copper foil layer 15 and the line layer, to improve the line of the wiring board 100
Line structure.
Further, the rigid insulation layer 11 is additionally provided with the second through-hole 113, and setting is electrically connected in second through-hole 113
Connect the earth conductor 114 of the line layer 12 and the copper foil layer 15.The line layer is electrically connected using the earth conductor 142
12 and the copper foil layer 15, so that the ground connection cabling mutual conduction of the line layer 12 and the copper foil layer 15, thus the line
Road floor 12 is grounded, to provide grounding electrode for the electronic building brick 20, improves the line construction of the splicing wiring board 100.
The present invention also provides a kind of terminal (not shown), the terminal includes ontology (not shown), is set in the ontology
The mainboard (not shown) and the wiring board 100 in portion, the wiring board 100 be set to the body interior, and with the mainboard
Electrical connection.The terminal can be mobile phone, computer, plate, handheld device or media player etc..
Wiring board and terminal of the invention installs barriers by the circuit base plate, and the barriers include blocking portion,
It is listened between cylinder mould group and the capacitor using the blocking portion positioned at described, stops the sound of uttering long and high-pitched sounds of the capacitor to propagate to described
Cylinder mould group is listened, to prevent the acoustic impacts of uttering long and high-pitched sounds of capacitor from listening the pronunciation of cylinder mould group, to improve user experience.
It is the preferred embodiment of the present invention above, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection scope.
Claims (7)
1. a kind of wiring board, which is characterized in that the wiring board includes circuit base plate, electronic building brick and barriers, the electronics
Component includes listening cylinder mould group and capacitor, described that cylinder mould group and the capacitor is listened to be both secured on the circuit base plate, and each other
Every setting, the barriers are fixed on the circuit base plate, and are obstructed and listened between cylinder mould group and the capacitor in described, with resistance
The sound of uttering long and high-pitched sounds for keeping off the capacitor, which propagates to, described listens cylinder mould group；
Wherein, the barriers are shielding case, and the barriers are fixed on the circuit base plate, and close the capacitor；Or
Person, the barriers are silencing cotton, and the barriers are fixed on the circuit base plate, and listen cylinder mould group described in cladding；
Wherein, the circuit base plate includes the rigid insulation layer, line layer and anti-solder ink layer being cascading, the earpiece
Mould group and the capacitor are welded in line layer side opposite with the rigid insulation layer, and pass through the anti-solder ink
Layer, the barriers are fixed on the anti-solder ink layer.
2. wiring board according to claim 1, which is characterized in that the circuit base plate further includes flexible media layer and copper foil
Layer, the flexible media layer are fixed on the rigid insulation layer away from the line layer side, and the copper foil layer is superimposed on described
On flexible media layer, and between the rigid insulation layer and the flexible media layer.
3. wiring board according to claim 2, which is characterized in that the flexible media floor includes the firstth area and is connected to institute
Secondth area in the firstth area is stated, orthographic projection region of the rigid insulation floor on the flexible media floor is mutually be overlapped with firstth area
Close, the circuit base plate further includes cover film, the cover film and rigid insulation layer phase side by side, and in the flexible media
Orthographic projection region on floor coincides with secondth area.
4. wiring board according to claim 3, which is characterized in that described to listen cylinder mould group and the capacitor in flexible Jie
The orthographic projection of matter floor is located in firstth area.
5. wiring board according to claim 4, which is characterized in that the rigid insulation layer is equipped with first through hole, and described the
Setting is electrically connected the signal conductor of the line layer and the copper foil layer in one through-hole.
6. wiring board according to claim 5, which is characterized in that the rigid insulation layer is additionally provided with the second through-hole, described
Setting is electrically connected the earth conductor of the line layer and the copper foil layer in second through-hole.
7. a kind of terminal, which is characterized in that the terminal includes ontology, set on the mainboard of the body interior and as right is wanted
Wiring board described in 1~6 any one is sought, the wiring board is set to the body interior, and is electrically connected with the mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105360.7A CN105704909B (en) | 2016-02-25 | 2016-02-25 | Wiring board and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105360.7A CN105704909B (en) | 2016-02-25 | 2016-02-25 | Wiring board and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105704909A CN105704909A (en) | 2016-06-22 |
| CN105704909B true CN105704909B (en) | 2019-02-12 |
Family
ID=56222515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105360.7A Active CN105704909B (en) | 2016-02-25 | 2016-02-25 | Wiring board and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105704909B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2744105Y (en) * | 2004-08-17 | 2005-11-30 | 黄大伟 | Noise-resistant earphone and matching device with low cost and high efficience |
| CN102395259A (en) * | 2011-10-19 | 2012-03-28 | 华为终端有限公司 | Structure for preventing electronic element from interference and mobile terminal |
| CN204305458U (en) * | 2014-12-31 | 2015-04-29 | 青岛歌尔声学科技有限公司 | A kind of for eliminating the board structure of circuit that electric capacity is uttered long and high-pitched sounds |
-
2016
- 2016-02-25 CN CN201610105360.7A patent/CN105704909B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2744105Y (en) * | 2004-08-17 | 2005-11-30 | 黄大伟 | Noise-resistant earphone and matching device with low cost and high efficience |
| CN102395259A (en) * | 2011-10-19 | 2012-03-28 | 华为终端有限公司 | Structure for preventing electronic element from interference and mobile terminal |
| CN204305458U (en) * | 2014-12-31 | 2015-04-29 | 青岛歌尔声学科技有限公司 | A kind of for eliminating the board structure of circuit that electric capacity is uttered long and high-pitched sounds |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105704909A (en) | 2016-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |