CN105694511A - Preparation method of high-temperature-resistant cover film for printed wiring boards - Google Patents
Preparation method of high-temperature-resistant cover film for printed wiring boards Download PDFInfo
- Publication number
- CN105694511A CN105694511A CN201610208961.0A CN201610208961A CN105694511A CN 105694511 A CN105694511 A CN 105694511A CN 201610208961 A CN201610208961 A CN 201610208961A CN 105694511 A CN105694511 A CN 105694511A
- Authority
- CN
- China
- Prior art keywords
- container
- mixing
- cover film
- granule
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L97/00—Compositions of lignin-containing materials
- C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2397/00—Characterised by the use of lignin-containing materials
- C08J2397/02—Lignocellulosic material, e.g. wood, straw or bagasse
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
Abstract
The invention relates to a preparation method of a high-temperature-resistant cover film for printed wiring boards, belonging to the technical field of high-polymer material preparation. The preparation method comprises the following steps: pretreating the main raw material flax stalk, mixing the flax stalk with a preservative and a flame retardant, mixing the mixture with polyamide fibers and sodium borohydride, heating, mixing with magnesium acetate, oxalic acid and diethanolamine, filtering, carrying out calcination and the like to prepare a mixture, uniformly mixing, banburying, carrying out extrusion granulation, and stretching to prepare the cover film. The cover film can not be softened or even liquefied under the temperature of high-temperature high heat, is fully provided with pore walls, and has high temperature resistance. The cover film has the deflection characteristic, and is suitable for preparing the printed wiring board cover film.
Description
Technical field
The present invention relates to a kind of printed substrate preparation method with high temperature resistant coverlay, belong to field of polymer material preparing technology。
Background technology
Along with developing rapidly of current electronic technology, in electronic product, almost the manufacturing process of requisite printed substrate have also been obtained huge development。Along with electronic product constantly toward development light, thin, short, little, printed circuit board (PCB) is i.e. towards the multilayer circuit board technical development of high-density wiring interconnection process so that can provide more function in less space at PCB。
It is said that in general, printed substrate is made up of copper clad laminate (FCCL) and coverlay (CL)。In this structure, generally use plastic film as coverlay, or utilize screen printing technology to form one layer of thin insulating ink layer as coverlay。But, in printed substrate processing procedure, so that the inside and outside layer circuit of this printed substrate communicates, it is necessary to carry out Drilling operation on this printed substrate, follow-up copper facing in hole is thus turning on inside and outside layer circuit, when Drilling operation, owing to drill bit and sheet material are in the process of quickly friction, high temperature high heat can be produced, cause that in coverlay, resinous principle softening is even liquefied, and it has been covered with hole wall, namely become glue slag after cooling。The glue slag that hole wall remains can affect the roughness of hole wall, is unfavorable for the combination of internal layer copper and hole wall copper, and therefore, successive process is often produced suitable puzzlement by the glue slag that Drilling operation is formed。
Summary of the invention
The technical problem to be solved: for making in process at printed substrate, Drilling operation must be carried out in the circuit board, when boring, high temperature high heat can be produced, cause that in coverlay, resinous principle softening is even liquefied, and the problem being covered with hole wall, provide a kind of with Caulis et Folium Lini stem for main raw material(s), after it is carried out pretreatment, after mixing with preservative and fire retardant, again by itself and Fypro, sodium borohydride Hybrid Heating, with utilize magnesium acetate, oxalic acid and diethanolamine are blended, filter, after mixture mix homogeneously prepared by the steps such as calcining, through banburying, extruding pelletization, stretching can prepare the method for coverlay。Coverlay prepared by the present invention, under high temperature high heat, will not soften and even liquefy, and be covered with hole wall, have resistance to elevated temperatures。
For solving above-mentioned technical problem, the present invention adopts the technical scheme as described below to be:
(1) the fresh Caulis et Folium Lini stem of 1～2kg is plucked, after it is rinsed well with clear water and naturally dries, it is placed in pulverizer and pulverizes and cross 120 mesh sieves, obtain Caulis et Folium Lini granule, again Caulis et Folium Lini granule is placed in dehydrated alcohol and soaks 40～45min, take out, and be placed on mass fraction be in 30% sodium hydroxide solution soak, carry out basification 45～50min；
(2) after alkalization completes, take out, and it is placed in centrifugal dehydrator dehydration 2～3min, to slough alkali liquor, and the granule sloughing alkali liquor is placed in container, and in container, add granular mass 5～7% dehydroactic acid and granular mass 8～9% polyamide, after being uniformly mixed, container is heated being warming up to 50～65 DEG C, reacting by heating 45～50min；
(3) after question response completes, then in container, mixture quality 30% Fypro and mixture quality 15% sodium borohydride in container is added, stirring mixing, continue to be heated to 70～80 DEG C, after heating 30～40min, stand and be cooled to room temperature, filter, collect filtrate, standby；
(4) 2:1 in mass ratio, after being mixed homogeneously with oxalic acid granule by magnesium acetate, is placed in mill and mills and cross 200 mesh sieves; mix powder, then by solid-liquid mass ratio 2:1, after being stirred mix powder with diethanolamine mixing homogeneously; it is placed in container; being slowly introducing container volume 2/3 ammonia in container, controlling to pass into speed is 15～20mL/s, after having passed into simultaneously; by seal of vessel; stand, until container occurs precipitation, turbid liquid must be mixed；
(5) the turbid liquid of the mixing of above-mentioned gained is filtered, and collects filtrate, the filtrate of collection is placed in calcining furnace and calcines, controlling calcining heat is 300～350 DEG C, after calcining 1～2h so that it is naturally cool to room temperature, and the mixture in calcining furnace is taken out；
(6) filtrate that step (3) is prepared by 3:1 in mass ratio stirs with the mixture of above-mentioned taking-up and mixes, it is placed in banbury, controlling banbury rotating speed is 50r/min, banburying temperature is 150～170 DEG C, after banburying 5～10min, it is drawn off being placed in double screw extruder, extruding pelletization, entering horizontal pull system after stretching then through longitudinal stretching machine and carry out cross directional stretch, traction rolling can be prepared into the high temperature resistant coverlay of printed substrate。
The application process of the present invention: is first windowed in wiring board flexable-broken area, the high temperature resistant coverlay of corresponding fixing above-mentioned preparation in windowing again, and in coverlay is closely pressed on windowing, after testing, near windowing, the glue slag of residual is few, compared with traditional coverlay, glue slag rate reduces by 20～25%, and resistance to elevated temperatures improves 13～17%。
The present invention is compared with additive method, and Advantageous Effects is:
(1) coverlay prepared by the present invention is under high temperature high warm, will not soften and even liquefy, and be covered with hole wall, have resistance to elevated temperatures；
(2) coverlay prepared by the present invention has flexural property, it is adaptable to prepare printed substrate coverlay；
(3) preparing this coverlay preparation process simple, required cost is low。
Detailed description of the invention
First Caulis et Folium Lini stem fresh for 1～2kg is plucked, after it is rinsed well with clear water and naturally dries, it is placed in pulverizer and pulverizes and cross 120 mesh sieves, obtain Caulis et Folium Lini granule, again Caulis et Folium Lini granule is placed in dehydrated alcohol and soaks 40～45min, take out, and be placed on mass fraction be in 30% sodium hydroxide solution soak, carry out basification 45～50min；After alkalization completes, take out, and it is placed in centrifugal dehydrator dehydration 2～3min, to slough alkali liquor, and the granule sloughing alkali liquor is placed in container, and in container, add granular mass 5～7% dehydroactic acid and granular mass 8～9% polyamide, after being uniformly mixed, container is heated being warming up to 50～65 DEG C, reacting by heating 45～50min；After question response completes, then in container, add mixture quality 30% Fypro and mixture quality 15% sodium borohydride in container, stirring mixing, continue to be heated to 70～80 DEG C, after heating 30～40min, stand and be cooled to room temperature, filter, collect filtrate, standby；2:1 in mass ratio, after being mixed homogeneously with oxalic acid granule by magnesium acetate, is placed in mill and mills and cross 200 mesh sieves; mix powder, then by solid-liquid mass ratio 2:1, after being stirred mix powder with diethanolamine mixing homogeneously; it is placed in container; being slowly introducing container volume 2/3 ammonia in container, controlling to pass into speed is 15～20mL/s, after having passed into simultaneously; by seal of vessel; stand, until container occurs precipitation, turbid liquid must be mixed；The turbid liquid of mixing of above-mentioned gained being filtered, and collects filtrate, the filtrate of collection be placed in calcining furnace and calcine, controlling calcining heat is 300～350 DEG C, after calcining 1～2h so that it is naturally cools to room temperature, and is taken out by the mixture in calcining furnace；Filtrate is stirred with the mixture of above-mentioned taking-up and mixes by 3:1 in mass ratio, it is placed in banbury, controlling banbury rotating speed is 50r/min, banburying temperature is 150～170 DEG C, after banburying 5～10min, it is drawn off being placed in double screw extruder, extruding pelletization, entering horizontal pull system after stretching then through longitudinal stretching machine and carry out cross directional stretch, traction rolling can be prepared into the high temperature resistant coverlay of printed substrate。
Example 1
First the fresh Caulis et Folium Lini stem of 2kg is plucked, after it is rinsed well with clear water and naturally dries, it is placed in pulverizer and pulverizes and cross 120 mesh sieves, obtain Caulis et Folium Lini granule, again Caulis et Folium Lini granule is placed in dehydrated alcohol and soaks 45min, take out, and be placed on mass fraction be in 30% sodium hydroxide solution soak, carry out basification 50min；After alkalization completes, take out, and it is placed in centrifugal dehydrator dehydration 3min, to slough alkali liquor, and the granule sloughing alkali liquor is placed in container, and in container, add granular mass 7% dehydroactic acid and granular mass 9% polyamide, after being uniformly mixed, it is heated container being warming up to 65 DEG C, reacting by heating 50min；After question response completes, then in container, add mixture quality 30% Fypro and mixture quality 15% sodium borohydride in container, stirring mixing, continue to be heated to 80 DEG C, after heating 40min, stand and be cooled to room temperature, filter, collect filtrate, standby；2:1 in mass ratio, after being mixed homogeneously with oxalic acid granule by magnesium acetate, is placed in mill and mills and cross 200 mesh sieves; mix powder, then by solid-liquid mass ratio 2:1, after being stirred mix powder with diethanolamine mixing homogeneously; it is placed in container; being slowly introducing container volume 2/3 ammonia in container, controlling to pass into speed is 20mL/s, after having passed into simultaneously; by seal of vessel; stand, until container occurs precipitation, turbid liquid must be mixed；The turbid liquid of mixing of above-mentioned gained being filtered, and collects filtrate, the filtrate of collection be placed in calcining furnace and calcine, controlling calcining heat is 350 DEG C, after calcining 2h so that it is naturally cools to room temperature, and is taken out by the mixture in calcining furnace；Filtrate is stirred with the mixture of above-mentioned taking-up and mixes by 3:1 in mass ratio, it is placed in banbury, controlling banbury rotating speed is 50r/min, banburying temperature is 170 DEG C, after banburying 10min, it is drawn off being placed in double screw extruder, extruding pelletization, entering horizontal pull system after stretching then through longitudinal stretching machine and carry out cross directional stretch, traction rolling can be prepared into the high temperature resistant coverlay of printed substrate。
First is windowed in wiring board flexable-broken area, then in windowing the high temperature resistant coverlay of corresponding fixing above-mentioned preparation, and coverlay be closely pressed on window, after testing, near windowing, the glue slag of residual is few, compared with traditional coverlay, glue slag rate reduces by 25%, and resistance to elevated temperatures improves 17%。
Example 2
First the fresh Caulis et Folium Lini stem of 1kg is plucked, after it is rinsed well with clear water and naturally dries, it is placed in pulverizer and pulverizes and cross 120 mesh sieves, obtain Caulis et Folium Lini granule, again Caulis et Folium Lini granule is placed in dehydrated alcohol and soaks 40min, take out, and be placed on mass fraction be in 30% sodium hydroxide solution soak, carry out basification 45min；After alkalization completes, take out, and it is placed in centrifugal dehydrator dehydration 2min, to slough alkali liquor, and the granule sloughing alkali liquor is placed in container, and in container, add granular mass 5% dehydroactic acid and granular mass 8% polyamide, after being uniformly mixed, it is heated container being warming up to 50 DEG C, reacting by heating 45min；After question response completes, then in container, add mixture quality 30% Fypro and mixture quality 15% sodium borohydride in container, stirring mixing, continue to be heated to 70 DEG C, after heating 30min, stand and be cooled to room temperature, filter, collect filtrate, standby；2:1 in mass ratio, after being mixed homogeneously with oxalic acid granule by magnesium acetate, is placed in mill and mills and cross 200 mesh sieves; mix powder, then by solid-liquid mass ratio 2:1, after being stirred mix powder with diethanolamine mixing homogeneously; it is placed in container; being slowly introducing container volume 2/3 ammonia in container, controlling to pass into speed is 15mL/s, after having passed into simultaneously; by seal of vessel; stand, until container occurs precipitation, turbid liquid must be mixed；The turbid liquid of mixing of above-mentioned gained being filtered, and collects filtrate, the filtrate of collection be placed in calcining furnace and calcine, controlling calcining heat is 300 DEG C, after calcining 1h so that it is naturally cools to room temperature, and is taken out by the mixture in calcining furnace；Filtrate is stirred with the mixture of above-mentioned taking-up and mixes by 3:1 in mass ratio, it is placed in banbury, controlling banbury rotating speed is 50r/min, banburying temperature is 150 DEG C, after banburying 5min, it is drawn off being placed in double screw extruder, extruding pelletization, entering horizontal pull system after stretching then through longitudinal stretching machine and carry out cross directional stretch, traction rolling can be prepared into the high temperature resistant coverlay of printed substrate。
First is windowed in wiring board flexable-broken area, then in windowing the high temperature resistant coverlay of corresponding fixing above-mentioned preparation, and coverlay be closely pressed on window, after testing, near windowing, the glue slag of residual is few, compared with traditional coverlay, glue slag rate reduces by 20%, and resistance to elevated temperatures improves 13%。
Example 3
First the fresh Caulis et Folium Lini stem of 1kg is plucked, after it is rinsed well with clear water and naturally dries, it is placed in pulverizer and pulverizes and cross 120 mesh sieves, obtain Caulis et Folium Lini granule, again Caulis et Folium Lini granule is placed in dehydrated alcohol and soaks 42min, take out, and be placed on mass fraction be in 30% sodium hydroxide solution soak, carry out basification 47min；After alkalization completes, take out, and it is placed in centrifugal dehydrator dehydration 3min, to slough alkali liquor, and the granule sloughing alkali liquor is placed in container, and in container, add granular mass 6% dehydroactic acid and granular mass 9% polyamide, after being uniformly mixed, it is heated container being warming up to 60 DEG C, reacting by heating 47min；After question response completes, then in container, add mixture quality 30% Fypro and mixture quality 15% sodium borohydride in container, stirring mixing, continue to be heated to 75 DEG C, after heating 35min, stand and be cooled to room temperature, filter, collect filtrate, standby；2:1 in mass ratio, after being mixed homogeneously with oxalic acid granule by magnesium acetate, is placed in mill and mills and cross 200 mesh sieves; mix powder, then by solid-liquid mass ratio 2:1, after being stirred mix powder with diethanolamine mixing homogeneously; it is placed in container; being slowly introducing container volume 2/3 ammonia in container, controlling to pass into speed is 17mL/s, after having passed into simultaneously; by seal of vessel; stand, until container occurs precipitation, turbid liquid must be mixed；The turbid liquid of mixing of above-mentioned gained being filtered, and collects filtrate, the filtrate of collection be placed in calcining furnace and calcine, controlling calcining heat is 320 DEG C, after calcining 2h so that it is naturally cools to room temperature, and is taken out by the mixture in calcining furnace；Filtrate is stirred with the mixture of above-mentioned taking-up and mixes by 3:1 in mass ratio, it is placed in banbury, controlling banbury rotating speed is 50r/min, banburying temperature is 160 DEG C, after banburying 7min, it is drawn off being placed in double screw extruder, extruding pelletization, entering horizontal pull system after stretching then through longitudinal stretching machine and carry out cross directional stretch, traction rolling can be prepared into the high temperature resistant coverlay of printed substrate。
First is windowed in wiring board flexable-broken area, then in windowing the high temperature resistant coverlay of corresponding fixing above-mentioned preparation, and coverlay be closely pressed on window, after testing, near windowing, the glue slag of residual is few, compared with traditional coverlay, glue slag rate reduces by 22%, and resistance to elevated temperatures improves 14%。
Claims (1)
1. the printed substrate preparation method of high temperature resistant coverlay, it is characterised in that concrete preparation process is:
(1) the fresh Caulis et Folium Lini stem of 1～2kg is plucked, after it is rinsed well with clear water and naturally dries, it is placed in pulverizer and pulverizes and cross 120 mesh sieves, obtain Caulis et Folium Lini granule, again Caulis et Folium Lini granule is placed in dehydrated alcohol and soaks 40～45min, take out, and be placed on mass fraction be in 30% sodium hydroxide solution soak, carry out basification 45～50min；
(2) after alkalization completes, take out, and it is placed in centrifugal dehydrator dehydration 2～3min, to slough alkali liquor, and the granule sloughing alkali liquor is placed in container, and in container, add granular mass 5～7% dehydroactic acid and granular mass 8～9% polyamide, after being uniformly mixed, container is heated being warming up to 50～65 DEG C, reacting by heating 45～50min；
(3) after question response completes, then in container, mixture quality 30% Fypro and mixture quality 15% sodium borohydride in container is added, stirring mixing, continue to be heated to 70～80 DEG C, after heating 30～40min, stand and be cooled to room temperature, filter, collect filtrate, standby；
(4) 2:1 in mass ratio, after being mixed homogeneously with oxalic acid granule by magnesium acetate, is placed in mill and mills and cross 200 mesh sieves; mix powder, then by solid-liquid mass ratio 2:1, after being stirred mix powder with diethanolamine mixing homogeneously; it is placed in container; being slowly introducing container volume 2/3 ammonia in container, controlling to pass into speed is 15～20mL/s, after having passed into simultaneously; by seal of vessel; stand, until container occurs precipitation, turbid liquid must be mixed；
(5) the turbid liquid of the mixing of above-mentioned gained is filtered, and collects filtrate, the filtrate of collection is placed in calcining furnace and calcines, controlling calcining heat is 300～350 DEG C, after calcining 1～2h so that it is naturally cool to room temperature, and the mixture in calcining furnace is taken out；
(6) filtrate that step (3) is prepared by 3:1 in mass ratio stirs with the mixture of above-mentioned taking-up and mixes, it is placed in banbury, controlling banbury rotating speed is 50r/min, banburying temperature is 150～170 DEG C, after banburying 5～10min, it is drawn off being placed in double screw extruder, extruding pelletization, entering horizontal pull system after stretching then through longitudinal stretching machine and carry out cross directional stretch, traction rolling can be prepared into the high temperature resistant coverlay of printed substrate。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610208961.0A CN105694511A (en) | 2016-04-06 | 2016-04-06 | Preparation method of high-temperature-resistant cover film for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610208961.0A CN105694511A (en) | 2016-04-06 | 2016-04-06 | Preparation method of high-temperature-resistant cover film for printed wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105694511A true CN105694511A (en) | 2016-06-22 |
Family
ID=56218345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610208961.0A Pending CN105694511A (en) | 2016-04-06 | 2016-04-06 | Preparation method of high-temperature-resistant cover film for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105694511A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101058644A (en) * | 2007-03-26 | 2007-10-24 | 尤尼吉可株式会社 | Method of preparing polyamide |
| CN101302337A (en) * | 2008-07-03 | 2008-11-12 | 杭州临安宏凯工程塑料有限公司 | High temperature resistant low water absorption polyamide 66 composite material and preparation thereof |
| CN103469588A (en) * | 2013-09-12 | 2013-12-25 | 天津大学 | Preparation method of sisal fiber surface sizing agent and sisal fiber composite material |
| CN103509329A (en) * | 2012-06-28 | 2014-01-15 | 中山台光电子材料有限公司 | Low dielectric resin composite and copper foil base plate applying composite as well as printed circuit board |
| CN104744891A (en) * | 2013-12-27 | 2015-07-01 | 台燿科技股份有限公司 | Prepreg and application thereof |
-
2016
- 2016-04-06 CN CN201610208961.0A patent/CN105694511A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101058644A (en) * | 2007-03-26 | 2007-10-24 | 尤尼吉可株式会社 | Method of preparing polyamide |
| CN101302337A (en) * | 2008-07-03 | 2008-11-12 | 杭州临安宏凯工程塑料有限公司 | High temperature resistant low water absorption polyamide 66 composite material and preparation thereof |
| CN103509329A (en) * | 2012-06-28 | 2014-01-15 | 中山台光电子材料有限公司 | Low dielectric resin composite and copper foil base plate applying composite as well as printed circuit board |
| CN103469588A (en) * | 2013-09-12 | 2013-12-25 | 天津大学 | Preparation method of sisal fiber surface sizing agent and sisal fiber composite material |
| CN104744891A (en) * | 2013-12-27 | 2015-07-01 | 台燿科技股份有限公司 | Prepreg and application thereof |
Non-Patent Citations (3)
| Title |
|---|
| 李大鹏主编: "《纺织材料与检测》", 30 September 2013, 天津大学出版社 * |
| 杨鸣波等主编: "《高分子材料手册[上]》", 31 July 2009, 化学工业出版社 * |
| 邬国铭等: "《高分子材料加工工艺学》", 31 July 2000, 中国纺织出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103057213B (en) | The copper-clad plate of environment-friendly type LED single color display screen, glue and preparation method | |
| CN102796478B (en) | Copper foil clad laminated board with UV shielding function, adhesive and preparation methods thereof | |
| CN105419064A (en) | Laminated composite metal hydroxide and multifunctional master batch preparation method thereof | |
| CN103992622A (en) | Halogen-free resin composition, prepreg prepared from halogen-free resin composition and laminated board prepared from halogen-free resin composition and used for printed circuit | |
| CN105061761A (en) | Nano zirconium phosphate-modified triazine macromolecular charring agent, and preparation method and application thereof | |
| CN103788580A (en) | Halogen-free benzoxazine resin composition and prepreg and laminated board prepared from same | |
| CN104829860A (en) | Melamine cyanurate and montmorillonite nano-composite and preparation method thereof | |
| CN109749396A (en) | A kind of polyphenyl ether resin composition and its application | |
| CN113831684A (en) | Epoxy resin glue solution, prepreg and glass fiber epoxy resin copper-clad plate containing epoxy resin glue solution and preparation method of prepreg and glass fiber epoxy resin copper-clad plate | |
| CN105694511A (en) | Preparation method of high-temperature-resistant cover film for printed wiring boards | |
| CN103627166A (en) | Flame-retardant thermoplastic resin composite material and preparation method thereof | |
| CN112408440B (en) | Process for preparing superfine coral velvet-shaped environment-friendly magnesium hydroxide by batch hydrothermal method | |
| CN104448555B (en) | Preparation method of halogen-free fire retardant for polypropylene | |
| CN109535554A (en) | A kind of LED light shell special-purpose anti-flaming reinforced polypropylene material and preparation method thereof | |
| CN105585475B (en) | Printing and dyeing white clay resource utilization method | |
| CN102977390B (en) | Method for preparing collagen-fiber containing polyurethane-based synthetic paper | |
| CN108165040A (en) | Composite material prepared using discarded dry film and preparation method thereof | |
| CN108103832A (en) | A kind of photochromic speciality paper and preparation method thereof | |
| CN107298769B (en) | A kind of phenyl modified expansible graphite fire retardant and preparation method thereof | |
| CN105112989B (en) | A kind of preparation method of calcium sulfate crystal whiskers | |
| CN110628179B (en) | Low-dielectric-constant flame-retardant electronic packaging material and preparation method thereof | |
| CN107652501A (en) | A kind of inflaming retarding stone paper and preparation method thereof | |
| CN103923301A (en) | Preparation method of electronic-grade brominated epoxy resin with low bromine content | |
| CN108148259A (en) | A kind of novel flame-retardant cable material and preparation method thereof | |
| CN112239222B (en) | Equipment and method for continuous hydrothermal production of magnesium hydroxide |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160622 |