CN105679727A - Water-cooled heat sink - Google Patents

Water-cooled heat sink Download PDF

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Publication number
CN105679727A
CN105679727A CN201610032145.9A CN201610032145A CN105679727A CN 105679727 A CN105679727 A CN 105679727A CN 201610032145 A CN201610032145 A CN 201610032145A CN 105679727 A CN105679727 A CN 105679727A
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CN
China
Prior art keywords
water
sump
wall body
main wall
waterwall
Prior art date
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Granted
Application number
CN201610032145.9A
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Chinese (zh)
Other versions
CN105679727B (en
Inventor
舒双武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chizhou Runmai Electric Technology Co., Ltd.
Original Assignee
Chizhou Ronger Electric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chizhou Ronger Electric Technology Co Ltd filed Critical Chizhou Ronger Electric Technology Co Ltd
Priority to CN201610032145.9A priority Critical patent/CN105679727B/en
Publication of CN105679727A publication Critical patent/CN105679727A/en
Application granted granted Critical
Publication of CN105679727B publication Critical patent/CN105679727B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4336Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement

Abstract

A water-cooled heat sink comprises a water bin, a water inlet, a water outlet, a water diversion wall and a water baffle wall, wherein the water diversion wall comprises a main wall body and an auxiliary wall body, and the main wall body comprises two arc segments in opposite directions and is S-shaped or inverted S shaped. The characteristics that incoming water at a water inlet pipe is low in temperature and has very high impact force are fully utilized, a large-area impact region is provided, and heat is rapidly and effectively dissipated; and when the water temperature rises, the width of a water channel is limited by additionally arranging the water diversion walls, the water speed and the contact area for heat dissipation are increased, and the heat is enabled to be timely taken away and dissipated. The water-cooled heat sink has the characteristics of rapid heat dissipation, uniform cooling, reasonable design and the like, is simple to fabricate, and is worthy of promotion and application.

Description

A kind of water-filled radiator
Technical field
The present invention relates to a kind of heat abstractor, be specifically related to a kind of water-filled radiator for power semiconductor device heat radiation.
Background technology
Along with semiconductor element is automatically controlling, electro-mechanical arts, the extensive use of the aspect such as industrial electric and household electrical appliances. And the use of increasing large-power semiconductor element, it is necessary to being left by heat in time, otherwise will affect normal operation, this is also just also more and more higher to the requirement of quasiconductor radiator performance aspect.
A kind of water cooling radiator for semiconductor on the market at present, utilizes water to flow through from the internal sump of cylinder, takes away the heat on the quasiconductor contacted; Arranging cylinder heat-sink unit in sump, heat-sink unit not only increases area of dissipation, improves the circulation passage of fluid simultaneously, improves radiating efficiency; But current water cooling radiator for semiconductor radiating effect is not especially desirable, the paces of quasiconductor development are not caught up with, so for the technical staff of the industry, it is necessary existing radiator for semiconductor is improved, to reach to improve the purpose of its radiating effect, meet the requirement of growing semiconductor heat-dissipating.
Summary of the invention
It is an object of the invention to the deficiency existed for prior art, it is provided that a kind of water-filled radiator, this water-filled radiator has radiating efficiency height, the feature such as dispel the heat uniform.
Technical scheme:
A kind of water-filled radiator, including sump, water inlet, outlet, approach area and waterwall, described sump is the hollow metal cylinder of platypelloid type, water inlet and outlet are distributed on the sidewall of sump, approach area and waterwall are connected on sump, it is distributed in sump internal composition water channel, described approach area is made up of main wall body and secondary body of wall, main wall body is made up of two sections of rightabout circular arcs, in serpentine or reversely serpentine, one end of main wall body is connected formation waterwall with close sump sidewall, water inlet points to the nock of the circular arc of the main wall body connecting waterwall, water storage is formed with main wall body, outlet is arranged on the opposite side of waterwall on the sidewall of the sump of waterwall, form sump with main wall body, secondary body of wall is arranged on out in sump, in to meshing distribution.
Described outlet is higher than water inlet, and outlet is arranged on the position of top end.
Compared with prior art, the invention has the beneficial effects as follows: the present invention takes full advantage of the water inlet at water inlet pipe place, and to have temperature low and have the feature of very strong impulsive force, large-area shock zone is provided, dispel the heat fast and effectively, when water temperature promotes, carry out the width of restriced channel by increasing approach area, reach improve water speed and increase the contact area of heat radiation, it is ensured that heat is taken away in time to leave.The present invention has rapid heat dissipation, the feature such as dispel the heat uniform, reasonable in design, makes simple, is worth of widely use.
Accompanying drawing explanation
Fig. 1 is sump cut-away view of the present invention.
Fig. 2 is entery and delivery port layout drawing of the present invention.
Detailed description of the invention
The present invention is expanded on further below in conjunction with accompanying drawing. Should be understood that these embodiments are merely to illustrate the present invention rather than restriction the scope of the present invention. In addition, it is to be understood that after having read the content that the present invention lectures, the present invention can be made various changes or modifications by those skilled in the art, and these equivalent form of values fall within the application appended claims limited range equally.
A kind of water-filled radiator, such as Fig. 1, shown in 2, including sump 1, water inlet 2, outlet 3, approach area 4 and waterwall 5, described sump 1 is the hollow metal cylinder of platypelloid type, water inlet 2 and outlet 3 are distributed on the sidewall 11 of sump 1, approach area 4 and waterwall 5 are connected on sump 1, it is distributed in sump 1 internal composition water channel 12, it is characterized in that: described approach area 4 is made up of main wall body 41 and secondary body of wall 42, main wall body 41 is made up of two sections of rightabout circular arcs, in serpentine or reversely serpentine, one end of main wall body 41 is connected formation waterwall 5 with close sump 1 sidewall 11, water inlet 2 points to the nock of the circular arc of the main wall body 41 connecting waterwall 5, water storage 13 is formed with main wall body 41, outlet 3 is arranged on the opposite side of waterwall 5 on the sidewall 11 of the sump 1 of waterwall 5, form sump 14 with main wall body 41, secondary body of wall 42 is arranged on out in sump 14, in to meshing distribution. take one piece of full bronze cylinders cake block polished, Digit Control Machine Tool is used to be processed into wall thickness 3mm, design the main wall body 41 of the semicircular arc of " S " type and three secondary bodies of wall 42 for basic point with the center of circle of cake, thickness of wall body is 3mm, waterwall 5 is left between the upper end of main wall body 41 " S " and the 11 of sidewall, article three, secondary body of wall 42 is positioned at the lower left quarter of main wall body 41, is distributed in meshing shape. the fine copper part that will process, with drill bit at main wall body 41 " S " gets out water inlet 2 on the sidewall 11 that upper right quarter cambered surface is corresponding, the left side of waterwall 5 gets out outlet 3, insert the copper pipe of correspondingly-sized, welded seal, take the same with copper cake diameter, thickness is the copper sheet of 3mm, cover on sump 1, welded seal, obtain this water-filled radiator.
Outlet 3 is higher than water inlet 2, outlet 3 is located at the position near upper end, on the one hand due to the reason of air, if the air within sump 1 can not be got rid of in time during water inlet, air can flock together and be positioned at the top of sump 1, cause having the end face in sub-fraction region to be not readily accessible to water, impact heat radiation; Consider that the proportion of hot water is little on the other hand, the ratio of cold water is great, cold water is in bottom, and the slightly higher water of temperature can up gush, if enter cold water from down, hot water upwards flows out from outlet 3, always can preferentially be discharged by a part of water the hottest in sump 1 in time, so can increase the radiating efficiency of water-filled radiator.
The present invention takes full advantage of the water inlet at water inlet pipe place, and to have temperature low and have the feature of very strong impulsive force, large-area shock zone is provided, dispel the heat fast and effectively, when water temperature promotes, the width of restriced channel is carried out by increasing approach area, reach improve water speed and increase the contact area of heat radiation, it is ensured that heat is taken away in time to leave. The present invention has rapid heat dissipation, the feature such as dispel the heat uniform, reasonable in design, makes simple, is worth of widely use.

Claims (2)

1. a water-filled radiator, including sump (1), water inlet (2), outlet (3), approach area (4) and waterwall (5), the hollow metal cylinder that described sump (1) is platypelloid type, water inlet (2) and outlet (3) are distributed on the sidewall of sump (1) (11), approach area (4) and waterwall (5) are connected on sump (1), it is distributed in sump (1) internal composition water channel (12), it is characterized in that: described approach area (4) is made up of main wall body (41) and secondary body of wall (42), main wall body (41) is made up of two sections of rightabout circular arcs, in serpentine or reversely serpentine, one end of main wall body (41) is connected formation waterwall (5) with close sump (1) sidewall (11), water inlet (2) points to the nock of the circular arc of the main wall body (41) connecting waterwall (5), water storage (13) is formed with main wall body (41), outlet (3) is arranged on the opposite side of waterwall (5) on the sidewall (11) of the sump (1) of waterwall (5), form sump (14) with main wall body (41), secondary body of wall (42) is arranged on out in sump (14), in to meshing distribution.
2. a kind of water-filled radiator as claimed in claim 1, it is characterised in that: outlet (3) is higher than water inlet (2), and outlet (3) is arranged on the position of top end.
CN201610032145.9A 2016-01-18 2016-01-18 A kind of water-filled radiator Active CN105679727B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610032145.9A CN105679727B (en) 2016-01-18 2016-01-18 A kind of water-filled radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610032145.9A CN105679727B (en) 2016-01-18 2016-01-18 A kind of water-filled radiator

Publications (2)

Publication Number Publication Date
CN105679727A true CN105679727A (en) 2016-06-15
CN105679727B CN105679727B (en) 2018-06-01

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Family Applications (1)

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Country Status (1)

Country Link
CN (1) CN105679727B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
CN201219105Y (en) * 2007-12-29 2009-04-08 上海工商信息学校 CPU refrigerating device
CN202049944U (en) * 2011-04-25 2011-11-23 江阴市可控硅附件有限公司 Cooling water cavity of water-cooling radiator
CN205376501U (en) * 2016-01-18 2016-07-06 池州容尔电气科技有限责任公司 Water cooling radiator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6655449B1 (en) * 2002-11-08 2003-12-02 Cho-Chang Hsien Heat dissipation device by liquid cooling
CN201219105Y (en) * 2007-12-29 2009-04-08 上海工商信息学校 CPU refrigerating device
CN202049944U (en) * 2011-04-25 2011-11-23 江阴市可控硅附件有限公司 Cooling water cavity of water-cooling radiator
CN205376501U (en) * 2016-01-18 2016-07-06 池州容尔电气科技有限责任公司 Water cooling radiator

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Effective date of registration: 20190703

Address after: 247000 Jinan Industrial Park, Chizhou Economic and Technological Development Zone, Guichi District, Chizhou City, Anhui Province

Patentee after: Chizhou Runmai Electric Technology Co., Ltd.

Address before: 247000 Standardized Workshop of Jin'an Industrial Park, Chizhou Economic and Technological Development Zone, Anhui Province

Patentee before: CHIZHOU RONGER ELECTRIC TECHNOLOGY CO., LTD.