CN105674898B - A kind of computer TrackPad and TopCase is measured and its offset prediction technique - Google Patents
A kind of computer TrackPad and TopCase is measured and its offset prediction technique Download PDFInfo
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- CN105674898B CN105674898B CN201610034223.9A CN201610034223A CN105674898B CN 105674898 B CN105674898 B CN 105674898B CN 201610034223 A CN201610034223 A CN 201610034223A CN 105674898 B CN105674898 B CN 105674898B
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- plane
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- General Physics & Mathematics (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a kind of computer TrackPad and TopCase measurements and its offset prediction techniques.Its height by measuring TrackPad and TopCase respectively obtains best-fitting plane and calculates the spacer thickness for leveling up needs, the theoretical offset value after being assembled, quadratic fit fine tuning is carried out again, theoretical spacer thickness is obtained, immediate gasket is chosen, predicts practical offset value.The present invention calculates best match part data by the detection to parts, is calculated by theoretical data and predicts final assembling result, reach precision assembly purpose, this method algorithmic stability, strong interference immunity, assembly precision is high, is suitble to large-scale industrial production.
Description
Technical field：
The invention belongs to computer package technique field, be specifically related to a kind of computer TrackPad and TopCase measure and
Its offset prediction technique.
Background technology：
Under the background of industry 4.0, automation industry competition is more and more fierce, requirement of the client to automation equipment performance
Also higher and higher, it is that enterprise meets customer need to improve the assembly precision of equipment and yields, the weight won victory in keen competition
Want one of means.
With the development of mobile terminal, electronic product it is universal increasingly wider, group reload request is also higher and higher.Current society
Can divide the work fining, and often different parts are produced by different supplier, the same part having it could also be possible that by
Ji Jia suppliers produce, and the allowance control of each parts may be different.To reach high-precision assembling, it is necessary to before assembling
Parts are detected, by the data analysis to detection, calculate best match part, to reach the mesh of precision assembly
's.
Invention content：
For this purpose, the present invention is directed to the deficiencies in the prior art, a kind of measurement precision assembly computer touch plate, meter are proposed
Calculate spacer thickness and prediction offset method.By the detection to parts, best match part data is calculated, theory is passed through
Data calculate and predict final assembling as a result, reaching precision assembly purpose.
In order to achieve the above objectives, technical scheme is as follows：
A kind of computer TrackPad and TopCase is measured and its offset prediction technique, includes the following steps：
S1：The first height for measuring and obtaining TrackPad carries out best fit plane fitting according to first height, and counts
Calculate the first spacer thickness for obtaining and leveling up needs.
S2：The second height for measuring and obtaining TopCase carries out best fit plane fitting according to second height, and counts
Calculate the second spacer thickness for obtaining and leveling up needs.
S3：The theoretical offset value after assembling is obtained according to first spacer thickness and second spacer thickness.
S4：Theoretical offset value in step S3 is subjected to quadratic fit, obtains theoretical spacer height.
S5：Immediate gasket is chosen according to the theoretical spacer height.
S6：Practical offset value is predicted according to the immediate gasket.
As a preferred embodiment of the above technical solution, the step S1 specifically comprises the following steps：
S11：The first altitude information and the first reference plane of M point on the glass surface of TrackPad are obtained using 2D laser heads
The second altitude information.
S12：The first altitude information of the M point is fitted using least square method and obtains the glass surface
First plane equation.
S13：The coordinate of N number of point on TrackPad is substituted into first plane equation, the third of N number of corresponding points is obtained
Altitude information.
S14：Choose the maximum value in the third height data of N number of corresponding points.
S15：The first spacer thickness is calculated on the basis of the maximum value, by the glass surface and first reference plane
It levels up.
As a preferred embodiment of the above technical solution, the M values are 20, and the N values are 6.
As a preferred embodiment of the above technical solution, the step S2 specifically comprises the following steps：
S21：The 4th altitude information of U point in the second reference plane of TopCase is obtained using 3D laser heads.
S22：The 4th altitude information of the U point is fitted using least square method and obtains second benchmark
Second plane equation in face.
S23：It is calculated according to second plane equation and obtains the plane of V spacer region to second reference plane
5th altitude information.
S24：Choose the minimum value in the 5th altitude information.
S25：The second spacer thickness is calculated on the basis of the minimum value, by the plane of second reference plane and carrier
It levels up.
As a preferred embodiment of the above technical solution, it is characterised in that：
The U values are 800, and the V values are 6.
As a preferred embodiment of the above technical solution, the step S4 specifically comprises the following steps：
S41：It is fitted according to the theoretical offset value in step S3 and obtains best offset plane.
S42：The best offset plane is subjected to leveling processing.
S43：Calculate and obtain the gasket of needs and the first offset value after adjustment.
S44：It is calculated according to the tolerance intervening value of TrackPad and TopCase assemblings and obtains theoretical spacer height.
The beneficial effects of the present invention are：Its height by measuring TrackPad and TopCase respectively obtains best quasi-
It closes plane and calculates the spacer thickness for leveling up needs, the theoretical offset value after being assembled, then carry out quadratic fit fine tuning, obtain
Theoretical spacer thickness chooses immediate gasket, predicts practical offset value.The present invention is calculated by the detection to parts
Go out best match part data, by the final assembling of theoretical data calculating prediction as a result, reaching precision assembly purpose, we
Method algorithmic stability, strong interference immunity, assembly precision is high, is suitble to large-scale industrial production.
Description of the drawings：
The following drawings are only intended to schematically illustrate and explain the present invention, not delimit the scope of the invention.Wherein：
Fig. 1 is the measurement system structural schematic diagram of one embodiment of the invention；
Fig. 2 is computer TrackPad and TopCase measurement and its offset prediction technique flow of one embodiment of the invention
Figure；
The first height that Fig. 3 is the measurements TrackPad of one embodiment of the invention simultaneously calculates the first spacer thickness of acquisition
Method flow diagram；
The second height that Fig. 4 is the measurements TopCase of one embodiment of the invention simultaneously calculates the second spacer thickness of acquisition
Method flow diagram；
Fig. 5 is the method flow diagram that the theoretical spacer height of one embodiment of the invention obtains；
Fig. 6 is second of computer TrackPad and TopCase measurements and its offset prediction side of one embodiment of the invention
Method flow chart.
Description of the drawings：
1-TrackPad, 2-TopCase, 3- first laser head, 4-2D controllers, the first reference planes of 5-, 6- second lasers
Head, 7-3D controllers.
Specific implementation mode：
Embodiment 1
As shown in Figure 1 and Figure 2, a kind of computer TrackPad of the invention and TopCase measurements and its offset prediction technique,
Include the following steps：
S1：The first height for measuring and obtaining TrackPad carries out best fit plane fitting according to first height, and counts
Calculate the first spacer thickness for obtaining and leveling up needs.As shown in figure 3, the step S1 specifically comprises the following steps：
S11：The first altitude information and the first benchmark of M point on the glass surface A of TrackPad are obtained using 2D laser heads
The second altitude information of face R.In the present embodiment, the M values are 20.It is obtained using 2D controllers 4 and first laser head 3
Second altitude information of the first altitude information and the first reference plane 5 of M point on the glass surface of TtrackPad1.
S12：The first altitude information of 20 points is fitted using least square method and obtains the glass surface
The first plane equation.
S13：The coordinate of N number of point on TrackPad is substituted into first plane equation, the third of N number of corresponding points is obtained
Altitude information.In the present embodiment, the N values are 6.
S14：Choose the maximum value in the third height data of N number of corresponding points.
S15：The first spacer thickness is calculated on the basis of the maximum value, by the glass surface and first reference plane
It levels up.
S2：The second height for measuring and obtaining TopCase carries out best fit plane fitting according to second height, and counts
Calculate the second spacer thickness for obtaining and leveling up needs.As shown in figure 4, the step S2 specifically comprises the following steps：
S21：The 4th altitude information of U point on the second reference plane D of TopCase is obtained using 3D laser heads.This implementation
In example, the 4th altitude information of U point in the second reference plane of TopCase2 is obtained using 3D controllers 7 and second laser head 6.
S22：The 4th altitude information of the U point is fitted using least square method and obtains second benchmark
Second plane equation in face.
S23：It is calculated according to second plane equation and obtains the plane of V spacer region to the second reference plane D
The 5th altitude information.
S24：Choose the minimum value in the 5th altitude information.
S25：The second spacer thickness is calculated on the basis of the minimum value, by the plane of second reference plane and carrier
It levels up.
The U values are 800, and the V values are 6.
S3：The theoretical offset value after assembling is obtained according to first spacer thickness and second spacer thickness.
S4：Theoretical offset value in step S3 is subjected to quadratic fit, obtains theoretical spacer height.As shown in figure 5, described
Step S4 specifically comprises the following steps：
S41：It is fitted according to the theoretical offset value in step S3 and obtains best offset plane.
S42：The best offset plane is subjected to leveling processing.
S43：Calculate and obtain the gasket of needs and the first offset value (process for as above calculating TP) after adjustment.
S44：It is calculated according to the tolerance intervening value Spec of TrackPad and TopCase assemblings and obtains theoretical spacer height.
S5：Immediate gasket is chosen according to the theoretical spacer height.
S6：Practical offset value is predicted according to the immediate gasket.By obtained theoretical spacer height and 0,0.25,
0.05...0.4 it makes the difference and takes absolute value, the minimum practical Shim height as chosen of absolute value.
A kind of computer TrackPad and TopCase described in the present embodiment is measured and its offset prediction technique.It is by dividing
Not Ce Liang TrackPad and TopCase height, obtain best-fitting plane and simultaneously calculate and level up the spacer thicknesses of needs, acquisition group
Theoretical offset value after dress, then quadratic fit fine tuning is carried out, theoretical spacer thickness is obtained, immediate gasket is chosen, prediction is real
Border offset value.The present invention calculates best match part data by the detection to parts, is calculated by theoretical data
Final assembling is predicted as a result, reaching precision assembly purpose, this method algorithmic stability, strong interference immunity, assembly precision is high, is suitble to
Large-scale industrial production.
Embodiment 2
As shown in fig. 6, a kind of computer TrackPad and TopCase of the present invention are measured and its offset prediction technique, including
Following steps：
T1：TrackPad is measured, and is to take upper 20 points of TrackPad glass surfaces A and the reference plane R high number of degrees using 2D is radium-shine
According to least square fitting at a plane equation, then the coordinate of upper 6 points of TrackPad being brought into plane equation, obtained
To the height of corresponding points.Then the maximum value in 6 points is taken, the Shim thickness of 6 positions needs is gone out as benchmark, it will
Plane A is leveled up with plane R.
Specific algorithm flow is as follows：
Measure the height TP of 20 points around TrackPadraw,1,TPraw,2...TPraw,20；
The glass planar PlaneA of least square fitting TrackPad, obtains plane equation:
A1x+B1y+C1z+D1=0
The coordinate of 6 contact surfaces is substituted into TrackPad plane equations and obtains the Z-Hight of corresponding position：hp1,hp2,hp3,
hp4,hp5,hp6；
Distance d of 20 points of calculating to plane Ap1,dp2...dp20；
Plane A and plane R are leveled up, the spacer height that 6 positions need is calculated
STP,1,STP,2...STP,6It is as follows；
Obtain leveling up the equation of rear A：
Z=hmax
PlaneA=PlaneR+z (hmax)
Calculate the height TP for leveling up rear 20 pointspro,1,TPpro,2...TPpro,20：
T2：TopCase is measured, and is to use least square method using the radium-shine altitude informations for taking upper 800 points of TopCase of 3D
The reference plane D plane equations of TopCase are fitted, then the plane of 6 spacer regions is calculated to reference plane respective heights.
Then the minimum value in 6 points is taken, the thickness of the Shim of needs is gone out as benchmark, by the planar pad of plane D and carrier
It is flat.
Specific algorithm flow is as follows：
With the radium-shine each point heights for measuring the regions to be measured TopCase of 3D；
The plane of least square fitting region D is as TopCase reference planes PlaneD；
Distance d of 20 points of calculating to PlaneDc1,dc2...dc20；
Distance h of each plane of zoning C1, C2...C6 to plane Dc1,hc2....hc6；
PlaneD levels up row as reference plane, by pocket and PlaneD, calculates the spacer height S of 6 positionsTC,1,
STC,2...STC,6：
Calculating levels up rear 20 points to pocket height TCHT,1,TCHT,2...TCHT,20：
T3：Prediction theory Offset calculates theory Shim height, calculates Offset initial after TP and TC is assembled, and be fitted
Best Offset planes, by the plane leveling of fitting, and the Shim and the Offset after adjustment that calculate needs (as above calculate TP
Process).Bring the tolerance Spec intervening values of TP and TC assemblings into again, you can the Shim thickness that computational theory needs.
Specific algorithm flow is as follows：
Calculate TPpro–TCHTInitial Offset is obtained, the best fit plane of Offset is fitted；
By the plane leveling of fitting, and calculate the gasket of needs and Offset (the as above mistakes of calculating TP after adjustment
Journey)；
By-the 0.1 of best fit plane movement, if amount of movement is SFit；
If the maximum value for Offset occur is more than 0.03, Offset is moved down, it is ensured that maximum value 0.03, if mobile
Amount is SShift；
Obtain final spacer height：
SHT,1=STP,1+SHT,1+Sdiff,1+Sfit+Sshift
SHT,2=STP,2+SHT,2+Sdiff,2+Sfit+Sshift
SHT,6=STP,6+SHT,6+Sdiff,3+Sfit+Sshift
T4：Obtained theoretical Shim height is made the difference with 0,0.25,0.05...0.4 and is taken absolute value, absolute value minimum is
For the practical Shim height of selection.
Specific algorithm flow is as follows：It makes the difference and takes absolute value by obtained theoretical spacer height and 0,0.25,0.05...0.4,
The minimum actual pad height as chosen of absolute value
Min(Abs(SHT-0),Abs(SHT-0.025),...Abs(SHT-0.4))
Obtain Sreal,1,Sreal,2,...Sreal,6；
ΔS1=Sreal,1-SHT,1
ΔS2=Sreal,2-SHT,2
ΔS6=Sreal,6-SHT,6
With Δ S1,ΔS2,...ΔS6Fit Plane PlaneS；
It brings 20 FAI points into plane PlaneS, obtains ZHight：Zs,1,Zs,2,...Zs,20
Offsetreal,1=Offsetideal,1+Zs,1
Offsetreal,2=Offsetideal,2+Zs,2
Offset real,20=Offsetideal,20+Zs,20
The present embodiment measures the height of TrackPad and TopCase respectively, and obtaining best-fitting plane and calculating to level up needs
The spacer thickness wanted, the theoretical offset value after being assembled, then quadratic fit fine tuning is carried out, theoretical spacer thickness is obtained, is chosen
Immediate gasket predicts practical offset value.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (6)
1. a kind of computer TrackPad and TopCase is measured and its offset prediction technique, which is characterized in that include the following steps：
S1：The first height for measuring and obtaining TrackPad carries out best fit plane fitting according to first height, and calculates and obtain
Take the first spacer thickness for leveling up needs；
S2：The second height for measuring and obtaining TopCase carries out best fit plane fitting according to second height, and calculates and obtain
Take the second spacer thickness for leveling up needs；
S3：The theoretical offset value after assembling is obtained according to first spacer thickness and second spacer thickness；
S4：Theoretical offset value in step S3 is subjected to quadratic fit, obtains theoretical spacer height；
S5：Immediate gasket is chosen according to the theoretical spacer height；
S6：Practical offset value is predicted according to the immediate gasket.
2. computer TrackPad according to claim 1 and TopCase is measured and its offset prediction technique, feature exist
In the step S1 specifically comprises the following steps：
S11：The second high of the first altitude information of M point and reference plane on the glass surface of TrackPad is obtained using 2D laser heads
Degrees of data；
S12：The first altitude information of the M point is fitted and is obtained the first of the glass surface using least square method
Plane equation；
S13：The coordinate of N number of point on TrackPad is substituted into first plane equation, the third height of N number of corresponding points is obtained
Data；
S14：Choose the maximum value in the third height data of N number of corresponding points；
S15：The first spacer thickness is calculated on the basis of the maximum value, and the glass surface and reference plane are leveled up.
3. computer TrackPad according to claim 2 and TopCase is measured and its offset prediction technique, feature exist
In：
The M values are 20, and the N values are 6.
4. computer TrackPad according to claim 1 and TopCase is measured and its offset prediction technique, feature exist
In the step S2 specifically comprises the following steps：
S21：The 4th altitude information of U point in the reference plane of TopCase is obtained using 3D laser heads；
S22：The 4th altitude information of the U point is fitted and is obtained the second of the reference plane using least square method
Plane equation；
S23：It is calculated according to second plane equation and obtains the plane of V spacer region to the 5th height of the reference plane
Data；
S24：Choose the minimum value in the 5th altitude information；
S25：The second spacer thickness is calculated on the basis of the minimum value, and the plane of the reference plane and carrier is leveled up.
5. computer TrackPad according to claim 4 and TopCase is measured and its offset prediction technique, feature exist
In：
The U values are 800, and the V values are 6.
6. computer TrackPad according to claim 1 and TopCase is measured and its offset prediction technique, feature exist
In the step S4 specifically comprises the following steps：
S41：It is fitted according to the theoretical offset value in step S3 and obtains best offset plane；
S42：The best offset plane is subjected to leveling processing；
S43：Calculate and obtain the gasket of needs and the first offset value after adjustment；
S44：It is calculated according to the tolerance intervening value of TrackPad and TopCase assemblings and obtains theoretical spacer height.
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| CN201610034223.9A CN105674898B (en) | 2016-01-19 | 2016-01-19 | A kind of computer TrackPad and TopCase is measured and its offset prediction technique |
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| CN105674898B true CN105674898B (en) | 2018-09-21 |
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| CN113340215B (en) * | 2021-06-04 | 2022-11-04 | 工极智能科技（苏州）有限公司 | Plane offset on-line measuring method based on parallel constraint |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201548207U (en) * | 2009-09-18 | 2010-08-11 | 东莞东聚电子电讯制品有限公司 | Touch panel layer gap detection equipment |
| GB2499388A (en) * | 2012-02-13 | 2013-08-21 | Touchnetix Ltd | A touch sensors that maintain uniform touch sensitivity on a touch sensor with a non uniform cover |
| CN104061870A (en) * | 2013-03-18 | 2014-09-24 | 神讯电脑(昆山)有限公司 | Clearance measuring method |
-
2016
- 2016-01-19 CN CN201610034223.9A patent/CN105674898B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201548207U (en) * | 2009-09-18 | 2010-08-11 | 东莞东聚电子电讯制品有限公司 | Touch panel layer gap detection equipment |
| GB2499388A (en) * | 2012-02-13 | 2013-08-21 | Touchnetix Ltd | A touch sensors that maintain uniform touch sensitivity on a touch sensor with a non uniform cover |
| CN104061870A (en) * | 2013-03-18 | 2014-09-24 | 神讯电脑(昆山)有限公司 | Clearance measuring method |
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Address after: The Wujiang economic and Technological Development Zone West Road Wujiang District of Suzhou City, Jiangsu Province, No. 666 215200 Applicant after: Bo Seiko Polytron Technologies Inc Address before: The Wujiang economic and Technological Development Zone West Road Wujiang District of Suzhou City, Jiangsu Province, No. 666 215200 Applicant before: Suzhou Bozhong Precision Industry Technology Co., Ltd. |
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