CN105671538A - Compound organic solderability preservatives (OSP) treating agent for lead-free printed circuit board (PCB) - Google Patents
Compound organic solderability preservatives (OSP) treating agent for lead-free printed circuit board (PCB) Download PDFInfo
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- CN105671538A CN105671538A CN201610008997.4A CN201610008997A CN105671538A CN 105671538 A CN105671538 A CN 105671538A CN 201610008997 A CN201610008997 A CN 201610008997A CN 105671538 A CN105671538 A CN 105671538A
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- osp
- treating agent
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- printed circuit
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a compound organic solderability preservatives (OSP) treating agent for a lead-free printed circuit board (PCB). The compound OSP treating agent comprises, by weight, 0.5%-5% of 1H-Benzotriazole, 0.5%-2.5% of 2-Ethylbenzimidazole, 1%-5% of 2-heptyl-5nitrobenzimidazole, 0.2%-1.4% of 1-phenyl-5-sulfenyl tetrazole, 1%-4% of sulfanilamide thioglycoic acid, 0.1%-0.5% of copper acetate, 0.1%-0.5% of copper formate, 1%-5% of potassium iodide, 0.1%-1% of ammonia water, 4%-12% of organic acid, 1%-8% of a solubilizer, 0.1%-1% of a buffering agent, and the balance water. By means of the compound OSP treating agent, OSP which are high in adhesive force, resistant to oxidation, resistant to high temperatures, compact and transparent can be smoothly formed on the surface of a copper circuit on the PCB, a formed film is uniform and flat, heat shock resistance is good, and the treating agent is suitable for machining of single-faced and double-faced boards; a solution is stable, maintenance is easy, the operation temperature of the aqueous solution can be controlled to be 80 DEG C or lower, bending deformation of a substrate is avoided, operation cost is low, and the rate of finished products is high.
Description
Technical field
The present invention relates to lead-free printed circuit board technical field, particularly relate to a kind of compound OSP treating agent for lead-free printed circuit board.
Background technology
Along with light, thin, short, the miniaturization of electronic product, multifunction direction are developed by people, printed wiring board develops towards high precision, slimming, multiple stratification, aperture direction, especially the fast development of SMT, so that SMT high density thin plate (such as printed boards such as IC-card, mobile phone, notebook computer, tuners) development so that hot air leveling technology is more and more not suitable with above-mentioned requirements. The Sn-Pb solder that hot air leveling technology uses simultaneously does not meet environmental requirement yet, formal enforcement along with RoHS Directive on July 1st, 2006, industry is badly in need of seeking the unleaded alternative that PCB surface processes, and most common is organic solder resistant (OSP), electroless nickel plating gold immerses (ENIG), silver immerses and stannum immerses.
OSP is a kind of technique meeting RoHS command request that printed circuit board (PCB) (PCB) copper foil surface processes. OSP is the abbreviation of OrganicSolderabilityPreservatives, in be translated into organic guarantor and weld film, also known as copper-protection agent, English is also referred to as Preflux. Briefly, OSP is exactly on clean naked copper surface, grows one layer of organic coating with the method for chemistry. This tunic has anti-oxidation, heat shock resistance, moisture-proof, get rusty in order to protect copper surface not continue in normal environment (oxidation or sulfuration etc.); But in follow-up welding high temperature, this kind of protecting film must be easy to again be removed rapidly by scaling powder, the clean copper surface exposed so can be made to be able within the extremely short time and melted scolding tin is combined into firmly solder joint immediately.
Being common several PCB surface processing modes, soak the Performance comparision of Ag, leaching Sn, OSP, ENIG (ENIG), wherein latter 4 kinds are applicable to lead-free process. Can be seen that the technique of OSP is simple, cost is low, so being increasingly subject to the welcome of industry. Briefly OSP is exactly on clean naked copper surface, grows one layer of organic coating with the method for chemistry, and this tunic has anti-oxidation, heat shock resistance, moisture-proof, get rusty in order to protect copper surface not continue in normal environment (oxidation or sulfuration etc.);But in follow-up welding high temperature, this kind of protecting film must be easy to again be removed rapidly by scaling powder, the clean copper surface exposed so can be made to be able in very short time and melted scolding tin is combined into firmly solder joint immediately.
OSP is not new technique in fact, and it has actually had more than 35 years, also longer than SMT history. OSP possesses many benefits, for instance burnishing surface is good, and does not have IMC to be formed between the copper of pad, it is allowed to during welding, solder and copper directly weld (wettability is good), the processing technique of low temperature, cost low (can lower than HASL), and the energy use adding man-hour is lacked etc. OSP technology early stage is very welcome in Japan, has the single sided board of about 4 one-tenth to use this technology, and dual platen also has nearly 3 one-tenth to use it. In the U.S., OSP technology also played surge in 1997, increased to 35% in 1999 from about 10% consumption before 1997.
OSP has the material of three major types: rosin based (Rosin), reactive resin class (ActiveResin) and azole (Azole), currently used the widest be azole OSP. Azole OSP has already been through the improvement in about 5 generations, and this five generation is BTA, IA, BIA, SBA by name and up-to-date APA respectively.
The core of OSP technical recipe is the aqueous solution configured, and this solution can form the organic protective film of the hydrophobicity of a layer thickness 0.2-0.5 μm by chemical reaction on copper surface, plays effect that is anti-oxidation and that help weldering. Current OSP supplier adopts imidazole derivative to be dissolved in acidic aqueous solution so that it is acts on copper face in uniform temperature and pH value range, generates organic copper complex thin film, play a protective role. The quality of OSP filming performance as can be seen here, the imidazoles kind selected with OSP aqueous solution has much relations, the facing operation person of various countries has done substantial amounts of research work on imidazoles used by OSP for a long time, develop different imidazole derivatives and be applied in OSP process technique, pb-free solder technique replaces traditional leaded welding procedure substantially, and the temperature of now copper face welding has very big raising. And adopting traditional OSP technique, although the organic complex film of formation can play anti-oxidation effect, but be easy to decomposition under the welding temperature of pb-free solder and vapor away; can not effectively protecting copper face, thus causing that copper face solderability worsens, wettability is bad; solder joint comes off, component failure. In this case it is necessary to optimize OSP technique, adopt novel imidazolium compounds, to improve the resistance to elevated temperatures of OSP film.
Summary of the invention
Based on the technical problem that background technology exists, the present invention proposes a kind of compound OSP treating agent for lead-free printed circuit board.
A kind of compound OSP treating agent for lead-free printed circuit board that the present invention proposes, raw material including following percentage by weight: phenylpropyl alcohol triazole: 0.5-5%, 2-is base benzimidazole: 0.5-2.5%, 2-heptyl-5-nitrobenzimidazole: 1-5%, 1-phenyl-5 sulfenyl tetrazole: 0.2-1.4%, sulfanilamide plug sulfo-glycolic acid: 1-4%, Schweinfurt green: 0.1-0.5%, Tubercuprose.: 0.1-0.5%, potassium iodide: 1-5%, ammonia: 0.1-1%, organic acid: 4-12%, solubilizing agent: 1-8%, buffer agent: 0.1-1%, surplus is water.
Preferably, described compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 1.5-3.5%, 2-is base benzimidazole: 1-2%, 2-heptyl-5-nitrobenzimidazole: 2-4%, 1-phenyl-5 sulfenyl tetrazole: 0.6-1.2%, sulfanilamide plug sulfo-glycolic acid: 1.5-3.5%, Schweinfurt green: 0.2-0.4%, Tubercuprose.: 0.2-0.4%, potassium iodide: 2-4%, ammonia: 0.3-0.8%, organic acid: 6-10%, solubilizing agent: 2-6%, buffer agent: 0.3-0.7%, surplus is water.
Preferably, described compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 2.5%, and 2-is base benzimidazole: 1.5%, 2-heptyl-5-nitrobenzimidazole: 3%, 1-phenyl-5 sulfenyl tetrazole: 0.8%, sulfanilamide plug sulfo-glycolic acid: 2.5%, Schweinfurt green: 0.3%, Tubercuprose.: 0.3%, potassium iodide: 3%, ammonia: 0.5%, organic acid: 8%, solubilizing agent: 4%, buffer agent: 0.5%, surplus is water.
Preferably, described organic acid includes formic acid and acetic acid.
Preferably, described solubilizing agent be can dissolve each other with water lower alcohol, sodium lauryl sulphate, dimethyl sulfoxide, at least one in acetone.
Described buffer agent is one or several in ammonium salt, acetate, citrate
In the present invention, printed circuit board (PCB) (PCB) copper foil surface can be processed by compound OSP treating agent for lead-free printed circuit board, under the acetic acid in organic acid catalyst mantoquita in antioxidant, form acetic anhydride, acetic anhydride and 2-base benzimidazole reacts the isomer generating keto-acid and enol form, both isomers only lose with ammonia after changing could and microetch after chelating copper ions on printed panel, naked copper generates the organic chelate oxidation-resistant film of one layer of firm copper, at the organic membrane that the Surface Creation of naked copper is a layer firm, this organic membrane can protect copper face not continue to oxidation in normal environment, under welding high temperature afterwards, protecting film is easily removed by scaling powder, firmly solder joint can be formed with molten tin in very short time, BTA is as the part of printed wiring board surface metal copper, the copper ion free with printed wiring board surface forms nitrogen azoles coordination compound, thus forming the organic coordination compound nano-level thin-membrane of even compact, this organic coordination compound nano-level thin-membrane can dissolve in follow-up OSP acidity film forming solution, rapidly by the 2-in OSP film forming solution base benzimidazole, 2-heptyl-5-nitrobenzimidazole is replaced with the complex of copper ion, thus the copper wire surface on printed wiring board to form adhesive force smoothly strong, antioxidation, high temperature resistant, fine and close transparent OSP, film forming uniform ground, thermal shock resistance is good, it is suitable for single dual platen processing, solution-stabilized, it is easily maintained, aqueous solution operation temperature control lives less than 80 DEG C, do not result in substrate flexural deformation, running cost is low, yield rate is high.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention done further explanation.
Embodiment one
In the present embodiment, a kind of compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 0.5%, and 2-is base benzimidazole: 0.5%, 2-heptyl-5-nitrobenzimidazole: 1%, 1-phenyl-5 sulfenyl tetrazole: 0.2%, sulfanilamide plug sulfo-glycolic acid: 1%, Schweinfurt green: 0.1%, Tubercuprose.: 0.1%, potassium iodide: 1%, ammonia: 0.1%, organic acid: 4%, solubilizing agent: 1%, buffer agent: 0.1%, surplus is water.
Embodiment two
In the present embodiment, a kind of compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 1.5%, and 2-is base benzimidazole: 1%, 2-heptyl-5-nitrobenzimidazole: 2%, 1-phenyl-5 sulfenyl tetrazole: 0.6%, sulfanilamide plug sulfo-glycolic acid: 1.5%, Schweinfurt green: 0.2%, Tubercuprose.: 0.2%, potassium iodide: 2%, ammonia: 0.3%, organic acid: 6%, solubilizing agent: 2%, buffer agent: 0.3%, surplus is water.
Embodiment three
In the present embodiment, a kind of compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 2%, and 2-is base benzimidazole: 1.2%, 2-heptyl-5-nitrobenzimidazole: 2.5%, 1-phenyl-5 sulfenyl tetrazole: 0.7%, sulfanilamide plug sulfo-glycolic acid: 2%, Schweinfurt green: 0.25%, Tubercuprose.: 0.25%, potassium iodide: 2.5%, ammonia: 0.4%, organic acid: 7%, solubilizing agent: 3%, buffer agent: 0.4%, surplus is water.
Embodiment four
In the present embodiment, a kind of compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 2.5%, and 2-is base benzimidazole: 1.5%, 2-heptyl-5-nitrobenzimidazole: 3%, 1-phenyl-5 sulfenyl tetrazole: 0.8%, sulfanilamide plug sulfo-glycolic acid: 2.5%, Schweinfurt green: 0.3%, Tubercuprose.: 0.3%, potassium iodide: 3%, ammonia: 0.5%, organic acid: 8%, solubilizing agent: 4%, buffer agent: 0.5%, surplus is water.
Embodiment five
In the present embodiment, a kind of compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 3%, and 2-is base benzimidazole: 1.8%, 2-heptyl-5-nitrobenzimidazole: 3.5%, 1-phenyl-5 sulfenyl tetrazole: 1%, sulfanilamide plug sulfo-glycolic acid: 3%, Schweinfurt green: 0.35%, Tubercuprose.: 0.35%, potassium iodide: 3.5%, ammonia: 0.7%, organic acid: 9%, solubilizing agent: 5%, buffer agent: 0.6%, surplus is water.
Embodiment six
In the present embodiment, a kind of compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 3.5%, and 2-is base benzimidazole: 2%, 2-heptyl-5-nitrobenzimidazole: 4%, 1-phenyl-5 sulfenyl tetrazole: 1.2%, sulfanilamide plug sulfo-glycolic acid: 3.5%, Schweinfurt green: 0.4%, Tubercuprose.: 0.4%, potassium iodide: 4%, ammonia: 0.8%, organic acid: 10%, solubilizing agent: 6%, buffer agent: 0.7%, surplus is water.
Embodiment seven
In the present embodiment, a kind of compound OSP treating agent for lead-free printed circuit board includes the raw material of following percentage by weight: phenylpropyl alcohol triazole: 5%, and 2-is base benzimidazole: 2.5%, 2-heptyl-5-nitrobenzimidazole: 5%, 1-phenyl-5 sulfenyl tetrazole: 1.4%, sulfanilamide plug sulfo-glycolic acid: 4%, Schweinfurt green: 0.5%, Tubercuprose.: 0.5%, potassium iodide: 5%, ammonia: 1%, organic acid: 12%, solubilizing agent: 8%, buffer agent: 1%, surplus is water.
The above; it is only the present invention preferably detailed description of the invention; but protection scope of the present invention is not limited thereto; any those familiar with the art is in the technical scope that the invention discloses; it is equal to replacement according to technical scheme and inventive concept thereof or is changed, all should be encompassed within protection scope of the present invention.
Claims (6)
1. a compound OSP treating agent for lead-free printed circuit board, it is characterized in that, raw material including following percentage by weight: phenylpropyl alcohol triazole: 0.5-5%, 2-is base benzimidazole: 0.5-2.5%, 2-heptyl-5-nitrobenzimidazole: 1-5%, 1-phenyl-5 sulfenyl tetrazole: 0.2-1.4%, sulfanilamide plug sulfo-glycolic acid: 1-4%, Schweinfurt green: 0.1-0.5%, Tubercuprose.: 0.1-0.5%, potassium iodide: 1-5%, ammonia: 0.1-1%, organic acid: 4-12%, solubilizing agent: 1-8%, buffer agent: 0.1-1%, surplus is water.
2. a kind of compound OSP treating agent for lead-free printed circuit board according to claim 1, it is characterized in that, raw material including following percentage by weight: phenylpropyl alcohol triazole: 1.5-3.5%, 2-is base benzimidazole: 1-2%, 2-heptyl-5-nitrobenzimidazole: 2-4%, 1-phenyl-5 sulfenyl tetrazole: 0.6-1.2%, sulfanilamide plug sulfo-glycolic acid: 1.5-3.5%, Schweinfurt green: 0.2-0.4%, Tubercuprose.: 0.2-0.4%, potassium iodide: 2-4%, ammonia: 0.3-0.8%. organic acid: 6-10%, solubilizing agent: 2-6%, buffer agent: 0.3-0.7%, surplus is water.
3. a kind of compound OSP treating agent for lead-free printed circuit board according to claim 1, it is characterized in that, raw material including following percentage by weight: phenylpropyl alcohol triazole: 2.5%, 2-is base benzimidazole: 1.5%, 2-heptyl-5-nitrobenzimidazole: 3%, 1-phenyl-5 sulfenyl tetrazole: 0.8%, sulfanilamide plug sulfo-glycolic acid: 2.5%, Schweinfurt green: 0.3%, Tubercuprose.: 0.3%, potassium iodide: 3%, ammonia: 0.5% organic acid: 8%, solubilizing agent: 4%, buffer agent: 0.5%, surplus is water.
4. a kind of compound OSP treating agent for lead-free printed circuit board according to claim 1, it is characterised in that described organic acid includes formic acid and acetic acid.
5. a kind of compound OSP treating agent for lead-free printed circuit board according to claim 1, it is characterised in that described solubilizing agent be can dissolve each other with water lower alcohol, sodium lauryl sulphate, dimethyl sulfoxide, at least one in acetone.
6. a kind of compound OSP treating agent for lead-free printed circuit board according to claim 1, it is characterised in that described buffer agent is one or several in ammonium salt, acetate, citrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008997.4A CN105671538A (en) | 2016-01-08 | 2016-01-08 | Compound organic solderability preservatives (OSP) treating agent for lead-free printed circuit board (PCB) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008997.4A CN105671538A (en) | 2016-01-08 | 2016-01-08 | Compound organic solderability preservatives (OSP) treating agent for lead-free printed circuit board (PCB) |
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| CN105671538A true CN105671538A (en) | 2016-06-15 |
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| CN201610008997.4A Pending CN105671538A (en) | 2016-01-08 | 2016-01-08 | Compound organic solderability preservatives (OSP) treating agent for lead-free printed circuit board (PCB) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109797384A (en) * | 2019-02-27 | 2019-05-24 | 信丰正天伟电子科技有限公司 | A kind of printed wiring board copper antioxidation agent and preparation method thereof |
| CN111954378A (en) * | 2020-07-20 | 2020-11-17 | 上海空间电源研究所 | Reduction repairing agent for copper oxide layer on surface of copper bonding pad and normal-temperature in-situ reduction repairing method |
| CN112492770A (en) * | 2020-11-24 | 2021-03-12 | 绍兴德汇半导体材料有限公司 | OSP (organic solderability preservative) processing method applied to copper-clad ceramic substrate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109797384A (en) * | 2019-02-27 | 2019-05-24 | 信丰正天伟电子科技有限公司 | A kind of printed wiring board copper antioxidation agent and preparation method thereof |
| CN111954378A (en) * | 2020-07-20 | 2020-11-17 | 上海空间电源研究所 | Reduction repairing agent for copper oxide layer on surface of copper bonding pad and normal-temperature in-situ reduction repairing method |
| CN112492770A (en) * | 2020-11-24 | 2021-03-12 | 绍兴德汇半导体材料有限公司 | OSP (organic solderability preservative) processing method applied to copper-clad ceramic substrate |
| CN112492770B (en) * | 2020-11-24 | 2022-03-01 | 绍兴德汇半导体材料有限公司 | OSP (organic solderability preservative) processing method applied to copper-clad ceramic substrate |
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Application publication date: 20160615 |