CN105651358A - Temperature-difference temperature measuring device - Google Patents
Temperature-difference temperature measuring device Download PDFInfo
- Publication number
- CN105651358A CN105651358A CN201410638197.1A CN201410638197A CN105651358A CN 105651358 A CN105651358 A CN 105651358A CN 201410638197 A CN201410638197 A CN 201410638197A CN 105651358 A CN105651358 A CN 105651358A
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- CN
- China
- Prior art keywords
- heat
- heat conducting
- conducting
- sensor
- temperature measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000523 sample Substances 0.000 claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 229920000742 Cotton Polymers 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 5
- 230000036039 immunity Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Abstract
Provided is a temperature-difference temperature measuring device, comprising a liquidometer. The liquidometer is provided with a sensor array. The sensors in the sensor array comprise sensor probes. The sensor probe is provided with a heat conducting structure. The heat conducting structure comprises a flexible heat conducting layer, and the flexible heat conducting layer is adhered to a first heat conducting portion. The first heat conducting portion and a second heat conducting portion are connected through a connecting piece. The second heat conducting portion is connected with the sensor probes. Using the above structure, through installing the heat conducting structure on the sensor probe, the sensor probe indirectly contacts with an object heat source through the heat conducting structure, and the heat conducting structure ensures good heat conducting effect and effectively prevents generation of thermal contact resistance, and preferably ensures detection sensitivity of the sensors.
Description
Technical field
The present invention relates to a kind of industrial detection apparatus field, be specifically related to a kind of thermal type liquid level emasuring device.
Background technology
Existing thermal type temperature measuring equipment generally comprises liquidometer, liquidometer includes sensor signal detection module and sensor signal processing module, can converting the change of various thing positions, liquid level medium level to standard current signal, teletransmission carries out centralized displaying to operation control room for secondary meter or computer installation, reports to the police or automatically control.
The Chinese patent that notification number is CN2625860Y discloses a kind of thermal type liquid level meter, it includes sensor, electronic signal process circuit and temperature display circuit, in use, by at least two temperature sensor is mounted on liquid container wall surface, and make temperature sensor become on liquid container wall to be distributed up and down, so can guarantee that sensor obtains more accurate measurement data.
But owing to thermal contact resistance can be produced when sensor probe contacts with target location, so it is easy to affect sensor and obtains more accurate measurement data.
Summary of the invention
The technical problem to be solved is for above-mentioned the deficiencies in the prior art, and a kind of thermal type temperature measuring equipment provided, it is effectively prevented the generation of thermal contact resistance by conductive structure, well ensures that sensor obtains reliable data.
The purpose of invention is achieved in that
A kind of thermal type temperature measuring equipment, it includes liquidometer, liquidometer is provided with sensor array, sensor in described sensor array includes sensor probe, sensor probe is provided with conductive structure, and conductive structure includes flexible heat-conducting layer, and flexible heat-conducting layer is affixed on the first heat-conducting part, first heat-conducting part and the second heat-conducting part are connected by connector, and the second heat-conducting part is connected with sensor probe.
Further, the first heat-conducting part, the second heat-conducting part, connector form U-shape structure, are provided with elastic component in U-shape structure.
Concrete, flexible heat-conducting layer is layer of silica gel.
Optionally, the first conducting-heat elements, the second conducting-heat elements, connector are metal material.
Optionally, the first conducting-heat elements, the second conducting-heat elements, connector are the non-metallic material that heat conductivity equals to or more than 55.
Optionally, elastic component is silica gel or rubber, foamed cotton.
The present invention achieves following technique effect:
Adopt said structure, by installing conductive structure on sensor probe, sensor probe is contacted with target thermal source indirectly by conductive structure, and conductive structure can guarantee that good heat-conducting effect and can effectively prevent the generation of thermal contact resistance, well ensure that the detection sensitivity of sensor;
Adopting the first heat-conducting part, the second heat-conducting part, connector to form U-shape structure, be provided with the structure of elastic component in U-shape structure, conductive structure so can be made to have preferably can immunity.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is the structural representation of the present invention;
Fig. 2 is the structural representation of conductive structure in the present invention.
Detailed description of the invention
A kind of thermal type temperature measuring equipment as depicted in figs. 1 and 2, it includes liquidometer 1, liquidometer 1 is provided with sensor array 2, sensor in described sensor array 2 includes sensor probe, sensor probe is provided with conductive structure, and conductive structure includes flexible heat-conducting layer 301, and flexible heat-conducting layer 301 is affixed on the first heat-conducting part 302, first heat-conducting part 302 is connected by connector 304 with the second heat-conducting part 303, and the second heat-conducting part 303 is connected with sensor probe 201.
Described first heat-conducting part the 302, second heat-conducting part 303, connector 304 form U-shape structure, are provided with elastic component 4 in U-shape structure.
Described flexible heat-conducting layer 301 is layer of silica gel.
Described first conducting-heat elements the 302, second conducting-heat elements 303, connector 304 are metal material.
Described first conducting-heat elements the 302, second conducting-heat elements 303, connector 304 equal to or more than the non-metallic material of 55 for heat conductivity.
Described elastic component 4 is silica gel or rubber, foamed cotton.
Adopt said structure, during use, sensor array is affixed on target wall surface, by installing conductive structure on sensor probe, sensor probe is contacted with target thermal source indirectly by conductive structure, conductive structure can guarantee that good heat-conducting effect and can effectively prevent the generation of thermal contact resistance, well ensure that the detection sensitivity of sensor;
Forming U-shape structure by the first heat-conducting part, the second heat-conducting part, connector, be provided with the structure of elastic component in U-shape structure, conductive structure so can be made to have preferably can immunity.
Claims (6)
1. a thermal type temperature measuring equipment, it includes liquidometer (1), liquidometer (1) is provided with sensor array (2), it is characterized in that: the sensor in described sensor array (2) includes sensor probe, sensor probe is provided with conductive structure, conductive structure includes flexible heat-conducting layer (301), flexible heat-conducting layer (301) is affixed on the first heat-conducting part (302), first heat-conducting part (302) is connected by connector (304) with the second heat-conducting part (303), and the second heat-conducting part (303) is connected with sensor probe (201).
2. thermal type temperature measuring equipment according to claim 1, it is characterised in that: described first heat-conducting part (302), the second heat-conducting part (303), connector (304) form U-shape structure, are provided with elastic component (4) in U-shape structure.
3. thermal type temperature measuring equipment according to claim 1, it is characterised in that: described flexible heat-conducting layer (301) is layer of silica gel.
4. thermal type temperature measuring equipment according to claim 1 and 2, it is characterised in that: described first conducting-heat elements (302), the second conducting-heat elements (303), connector (304) they are metal material.
5. thermal type temperature measuring equipment according to claim 1 and 2, it is characterised in that: described first conducting-heat elements (302), the second conducting-heat elements (303), connector (304) equal to or more than the non-metallic material of 55 for heat conductivity.
6. thermal type temperature measuring equipment according to claim 2, it is characterised in that: described elastic component (4) is silica gel or rubber, foamed cotton.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410638197.1A CN105651358A (en) | 2014-11-13 | 2014-11-13 | Temperature-difference temperature measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410638197.1A CN105651358A (en) | 2014-11-13 | 2014-11-13 | Temperature-difference temperature measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105651358A true CN105651358A (en) | 2016-06-08 |
Family
ID=56478618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410638197.1A Pending CN105651358A (en) | 2014-11-13 | 2014-11-13 | Temperature-difference temperature measuring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105651358A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2625860Y (en) * | 2003-07-07 | 2004-07-14 | 武汉大学 | Thermal type liquid level meter |
| DE202009012292U1 (en) * | 2009-09-11 | 2009-11-19 | Temperaturmeßtechnik Geraberg GmbH | Temperature sensor with test channel |
| CN201892578U (en) * | 2010-11-18 | 2011-07-06 | 哈尔滨量具刃具集团有限责任公司 | Temperature sensor device |
| CN102435257A (en) * | 2011-09-30 | 2012-05-02 | 广东天际电器股份有限公司 | Liquid level sensor and liquid level detection method thereof |
| JP2013096772A (en) * | 2011-10-31 | 2013-05-20 | Mitsubishi Electric Corp | Liquid level detecting device |
| CN203337269U (en) * | 2013-06-17 | 2013-12-11 | 长沙高升电子电器科技有限公司 | A packaging structure and a temperature measuring probe of a temperature sensor |
| CN203490005U (en) * | 2013-08-29 | 2014-03-19 | 中国电子科技集团公司第四十八研究所 | Wafer array heat flux sensor |
| CN204269188U (en) * | 2014-11-13 | 2015-04-15 | 湖北中孚化工集团有限公司 | A kind of thermal type temperature measuring equipment |
-
2014
- 2014-11-13 CN CN201410638197.1A patent/CN105651358A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2625860Y (en) * | 2003-07-07 | 2004-07-14 | 武汉大学 | Thermal type liquid level meter |
| DE202009012292U1 (en) * | 2009-09-11 | 2009-11-19 | Temperaturmeßtechnik Geraberg GmbH | Temperature sensor with test channel |
| CN201892578U (en) * | 2010-11-18 | 2011-07-06 | 哈尔滨量具刃具集团有限责任公司 | Temperature sensor device |
| CN102435257A (en) * | 2011-09-30 | 2012-05-02 | 广东天际电器股份有限公司 | Liquid level sensor and liquid level detection method thereof |
| JP2013096772A (en) * | 2011-10-31 | 2013-05-20 | Mitsubishi Electric Corp | Liquid level detecting device |
| CN203337269U (en) * | 2013-06-17 | 2013-12-11 | 长沙高升电子电器科技有限公司 | A packaging structure and a temperature measuring probe of a temperature sensor |
| CN203490005U (en) * | 2013-08-29 | 2014-03-19 | 中国电子科技集团公司第四十八研究所 | Wafer array heat flux sensor |
| CN204269188U (en) * | 2014-11-13 | 2015-04-15 | 湖北中孚化工集团有限公司 | A kind of thermal type temperature measuring equipment |
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