CN105647448A - Epoxy phenolic resin technology - Google Patents
Epoxy phenolic resin technology Download PDFInfo
- Publication number
- CN105647448A CN105647448A CN201410473057.3A CN201410473057A CN105647448A CN 105647448 A CN105647448 A CN 105647448A CN 201410473057 A CN201410473057 A CN 201410473057A CN 105647448 A CN105647448 A CN 105647448A
- Authority
- CN
- China
- Prior art keywords
- mass parts
- parts
- adhesive
- phenolic resin
- technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to a technology for an epoxy phenolic resin adhesive. The adhesive produced by the technology generates volatile substances during curing, so that a porous combination is formed and plays a role in filling pores of adhered substances. Thus, the adhesive is particularly effective when being used for adhering assembled substances with relatively large gaps. The adhesive is harmless to human, is free of toxicity, side effects and adverse stimulation and is safe and reliable. The adhesive power is powerful, the cost is low, the raw materials are readily available, the process is simple, the applicable range is wide, and the effect is durable. According to the technology, the adhesive is prepared from the raw materials in parts by mass: 100 parts of phenolic resin, 50 parts of epoxy resin, 149 parts of aluminum powder, 100 parts of dicyanodiamide and 1.5 parts of copper 8-hydroxyquinoline.
Description
Art:
The present invention relates to a kind of article adhesive factory formula technical field, particularly to a kind of low cost epoxy phenolics technology of preparing
Technical background:
The epoxy phenolics adhesive adopted in the market is of a great variety, also different according to the formula that purposes difference adopts, but the adhesive really with filling pore effect is few, and whether environmental issue can be up to standard. Along with price rises steadily, make many factories profit micro-or be only capable of this operation short. Most complex process, relatively costly, and effect is respectively arranged with difference easily.
Summary of the invention:
The present invention is aiming on market Problems existing and provides a kind of epoxy phenolics glue bond techniques. The binding agent that this technology produces has volatility goods and materials to produce when solidifying, thus forms the combination of Porous, plays filling effect to by the hole of binder. So being particularly effective in order to the assemblage that bond gap is bigger. And harmless no side effects and pessimal stimulation, safe and reliable. And bonding strong with joint efforts, with low cost, raw material is easy to get, and technique is simple, and applied widely, effect is lasting.
The proportioning raw materials of this technology is:
Phenolic resin-100 mass parts,
Epoxy resin-50 mass parts,
Aluminium powder-149 mass parts,
Dicyandiamide-100 mass parts,
Copper 8-quinolinolate-1.5 mass parts.
This product is prepared by following method:
By phenolic resin-100 mass parts, epoxy resin-50 mass parts, aluminium powder-149 mass parts, dicyandiamide-100 mass parts, copper 8-quinolinolate-1.5 mass parts, join in the reactor with heating and mixing plant in the lump, heat temperature raising about 70 degree, after raw material dissolves, strong stirring makes its mix homogeneously, and is cooled to room temperature and is this product.
Claims (2)
1. an epoxy phenolics technology: its proportioning raw materials is, phenolic resin-100 mass parts, epoxy resin-50 mass parts, aluminium powder-149 mass parts, dicyandiamide-100 mass parts, copper 8-quinolinolate-1.5 mass parts.
2. it is characterized in that: by phenolic resin-100 mass parts, epoxy resin-50 mass parts, aluminium powder-149 mass parts, dicyandiamide-100 mass parts, copper 8-quinolinolate-1.5 mass parts, join in the reactor with heating and mixing plant in the lump, heat temperature raising about 70 degree, after raw material dissolves, strong stirring makes its mix homogeneously, and is cooled to room temperature and is this product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410473057.3A CN105647448A (en) | 2014-09-04 | 2014-09-04 | Epoxy phenolic resin technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410473057.3A CN105647448A (en) | 2014-09-04 | 2014-09-04 | Epoxy phenolic resin technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105647448A true CN105647448A (en) | 2016-06-08 |
Family
ID=56482667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410473057.3A Pending CN105647448A (en) | 2014-09-04 | 2014-09-04 | Epoxy phenolic resin technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105647448A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107603256A (en) * | 2017-09-25 | 2018-01-19 | 安徽华祺汽车装饰有限公司 | A kind of vegetable fiber environmental protection material with fire-retardant heat insulation performance |
-
2014
- 2014-09-04 CN CN201410473057.3A patent/CN105647448A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107603256A (en) * | 2017-09-25 | 2018-01-19 | 安徽华祺汽车装饰有限公司 | A kind of vegetable fiber environmental protection material with fire-retardant heat insulation performance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX2017000726A (en) | Improved binder compositions and uses thereof. | |
| JP2019503406A5 (en) | ||
| WO2011130657A3 (en) | Phase change material-containing composition and related products and methods | |
| WO2014020447A3 (en) | Protein adhesives | |
| WO2014009298A3 (en) | Two component cement composition | |
| BR112017011389A2 (en) | process for producing a compacted material, compacted material, uses of a compacted material and polymer composition, polymer composition, polymer product, and article. | |
| WO2018117670A8 (en) | Electrical steel sheet adhesive coating composition, electrical steel sheet product, and manufacturing method therefor | |
| CN106634714A (en) | Adhesive for plywood and preparation method thereof | |
| CN104449509A (en) | High temperature resistant adhesive | |
| CN105647448A (en) | Epoxy phenolic resin technology | |
| MY183187A (en) | Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device | |
| CN105731892A (en) | Efficient ceramic tile adhesive | |
| MX2015007923A (en) | Waterborne adhesives. | |
| CN103897611A (en) | Preparation raw materials and method of aldehyde-free environmentally-friendly adhesive for artificial boards | |
| CN106085296A (en) | Food-grade adhesive | |
| WO2011073422A3 (en) | Crimping fold bond | |
| CN103923597B (en) | Aluminium look minute surface special adhesive | |
| CN104449467A (en) | Preparation method of hot-melt adhesive for book and periodical binding | |
| CN105885774A (en) | Asphalt-natural rubber bonding agent | |
| CN106085348A (en) | Natural adhesive | |
| CN105733251A (en) | Nylon composite material | |
| CN104762027A (en) | Core sand bonding technology | |
| TH154052A (en) | Methods for producing resin molded parts, method for producing resin compositions, resin forming parts, resin composition, low dust resin powder and resin dusting method. | |
| CN105733483A (en) | Composite plate adhesive | |
| CN104293286A (en) | Novel wood viscose glue |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160608 |
|
| WD01 | Invention patent application deemed withdrawn after publication |