CN105636756A - Mold-cooling system and mold-cooling method - Google Patents
Mold-cooling system and mold-cooling method Download PDFInfo
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- CN105636756A CN105636756A CN201480054502.0A CN201480054502A CN105636756A CN 105636756 A CN105636756 A CN 105636756A CN 201480054502 A CN201480054502 A CN 201480054502A CN 105636756 A CN105636756 A CN 105636756A
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- 238000001816 cooling Methods 0.000 title claims abstract description 145
- 239000002826 coolant Substances 0.000 claims abstract description 196
- 238000000034 method Methods 0.000 claims description 63
- 230000002411 adverse Effects 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 description 56
- 239000000463 material Substances 0.000 description 15
- 238000011144 upstream manufacturing Methods 0.000 description 12
- 238000001514 detection method Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 8
- 239000012530 fluid Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 238000009834 vaporization Methods 0.000 description 6
- 230000008016 vaporization Effects 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 101000911390 Homo sapiens Coagulation factor VIII Proteins 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005276 aerator Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 102000057593 human F8 Human genes 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 229940047431 recombinate Drugs 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D30/00—Cooling castings, not restricted to casting processes covered by a single main group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/06—Permanent moulds for shaped castings
- B22C9/065—Cooling or heating equipment for moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
- B22D17/2218—Cooling or heating equipment for dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D45/00—Equipment for casting, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D46/00—Controlling, supervising, not restricted to casting covered by a single main group, e.g. for safety reasons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/007—Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids
Abstract
A mold-cooling system (1) for cooling a heated mold (2) by supplying a cooling medium from a cooling-medium supply source (10) to a medium-flow channel (4) provided in the mold, wherein a discharge-side channel (15) connected on the discharge-port (5) side of the medium-flow channel of the mold is configured so as to be connected to a heat exchanger (20) for condensing the vaporized cooling medium discharged from the medium flow channel.
Description
Technical field
The present invention relates to the mold cooling system of the mould that cooling has been heated and mould cooling means.
Background technology
In the past, it is understood that carry the mold cooling system (equipment for cooling die) of the cooling mediums such as Cooling Water to the medium circulation path arranged in a mold in order to cool down the mould being heated. There is the cooling medium provided in the medium circulation path of the mould being heated to high temperature and vaporize in medium circulation path in such mold cooling system, the problem that its steam is discharged.
Such as, in following patent documentation 1, disclose the mould temperature-adjusting device of following structure: will provide for the liquid supply conduit of Normal Atmospheric Temperature Liquid and discharging tube is connected on the liquid circulation path of the fluid passage of connecting mold and the fluid passage composition of temperature adjuster, by connecting these liquid supply conduit and discharging tubes with throttling passage, the Normal Atmospheric Temperature Liquid that have passed through throttling passage is supplied to discharging tube, it is suppressed that the generation of steam.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2002-52538 publication
The summary of invention
The problem that invention to solve
But, recently, along with the variation etc. of the maximization of products formed and moulding material, expect that such as cooling is heated to the system of the mould of 150 DEG C��300 DEG C of such high temperature. If cooling medium is transported in the medium circulation path of mould by such cooling system, then this cooling medium instant vaporization in the medium circulation path of mould, pressure rise, the thermal capacity adding mold is relatively larger, it is believed that carry out cooling medium to become difficulty from cooling medium supply source side to the conveying of the medium circulation path of mould, cool time increases, it is necessary to the pump that discharge pressure is high. Such as, although consider to provide liquid to carry out condensing to the path of the discharge side of mould as above-mentioned patent documentation 1, it is believed that owing to pressure the same as medium conveying side rises, carry out the supply difficulty of liquid, and need the pump that discharge pressure is high.
Summary of the invention
The present invention makes in view of above-mentioned practical situation, its object is to provide the discharge that can suppress vaporized cooling medium, can improve mold cooling system and the mould cooling means of cooling effectiveness simultaneously.
For solving the means of problem
In order to achieve the above object, the mold cooling system of the present invention is for providing the cooling medium from cooling medium supply source to cool down the system of this mould being heated to arranging medium circulation path in a mold, it is characterised in that: make the discharge side path being connected to the outlet side of the medium circulation path of above-mentioned mould and connect with the heat exchanger making the vaporized above-mentioned cooling medium condensation discharged from above-mentioned medium circulation path.
In the present invention, following structure can also be adopted: the medium circulation path being connected to above-mentioned mould inlet side, from the supply side path that above-mentioned cooling medium supply source starts, being connected to the path providing steam or air from vapour source or air source; Possessing control portion, this control portion controls the supply of this steam or this air and the supply of above-mentioned cooling medium, after the medium circulation path of above-mentioned mould is provided above-mentioned steam or above-mentioned air, provides above-mentioned cooling medium to the medium circulation path of above-mentioned mould.
In the present invention, following structure can also be adopted: the medium circulation path being connected to above-mentioned mould inlet side, from the supply side path that above-mentioned cooling medium supply source starts, being connected to the path providing steam or air from vapour source or air source; Possessing control portion, this control portion controls the supply of this steam or this air and the supply of above-mentioned cooling medium, after the medium circulation path of above-mentioned mould is provided above-mentioned cooling medium, provides above-mentioned steam or above-mentioned air to the medium circulation path of above-mentioned mould.
Further, in the present invention, it is also possible on the discharge side path in the downstream of above-mentioned heat exchanger, be provided with the adverse current preventing portion preventing adverse current.
And, in order to reach above-mentioned purpose, the mould cooling means of the present invention method for providing cooling medium this mould that cooling has been heated to the medium circulation path arranged in a mold, it is characterized in that: the discharge side path of the outlet side making to be connected to the medium circulation path of above-mentioned mould connects with heat exchanger, makes the vaporized above-mentioned cooling medium discharged from above-mentioned medium circulation path condense this heat exchanger.
In the present invention, it is also possible to after the pre-cooling working procedure performing the medium circulation path that steam or air are supplied to above-mentioned mould, above-mentioned cooling medium is provided to the medium circulation path of above-mentioned mould.
Further, in the present invention, it is also possible to after the 1st refrigerating work procedure that the above-mentioned cooling medium of offer of the medium circulation path to above-mentioned mould is provided, perform to be supplied to steam or air the 2nd refrigerating work procedure of the medium circulation path of above-mentioned mould.
The effect of invention
The mold cooling system of the present invention and mould cooling means are by adopting said structure, it is possible to suppress the discharge of vaporized cooling medium, and can improve cooling effectiveness.
Accompanying drawing explanation
Fig. 1 is the outline system construction drawing of an example of the mold cooling system showing schematically one embodiment of the present invention;
Fig. 2 is the outline time diagram of an example of the basic acts being schematically illustrated in above-mentioned mold cooling system to perform;
Fig. 3 is the outline system construction drawing of an example of the mold cooling system showing schematically other embodiments of the present invention;
Fig. 4 is the outline time diagram of an example of the basic acts being schematically illustrated in above-mentioned mold cooling system to perform;
Fig. 5 is the outline system construction drawing of an example of the mold cooling system showing schematically another embodiment of the present invention.
Detailed description of the invention
The embodiment of the present invention is described with reference to the accompanying drawings.
It addition, Fig. 1, Fig. 3 and Fig. 5 schematically show the pipeline (pipeline) etc. becoming the path that medium etc. passes through with solid line.
Further, the outline time diagram in Fig. 2 and Fig. 4 schematically show the ON/OFF action of each equipment, on-off action etc.
Fig. 1 and Fig. 2 is the explanation figure of the mould cooling means for the mold cooling system of the 1st embodiment and its execution of use are described.
The mold cooling system 1 of this embodiment adopts the structure of the mould 2 that the medium circulation path 4 being arranged in mould 2 provides the cooling medium from cooling medium supply source 10, cooling have been heated. As it is shown in figure 1, this mold cooling system 1 adopts the structure that the discharge side path 15 of outlet 5 sides of the medium circulation path 4 making to be connected to mould 2 connects with the heat exchanger 20 making the vaporized cooling medium discharged from medium circulation path 4 condense.
Further, this embodiment makes the mold cooling system 1 mould heating and cooling system 1 for being also heated except the cooling carrying out mould 2.
Mould 2 adopts the structure such as with fixed half and moving half, is respectively arranged with the medium circulation path 4,4 making cooling medium circulate on these fixed half and moving halfs. It is connected to supply side path (media conveying path) 13 in entrance (medium conveying connector) 3,3 sides of these medium circulation paths 4,4, is connected to discharge side path (medium return path) 15 in outlet (medium return connector) 5,5 sides of medium circulation path 4,4.
The entrance 3,3 of supply side path 13 and medium circulation path 4,4 can also adopt the structure that connects of line member by single supply side path 13 is branched off into multiple manifold portion, the flexible pipe being connected on multiple connectors of this manifold portion, pipe etc. with flexibility.
Further, the outlet 5,5 of discharge side path 15 and medium circulation path 4,4 also substantially same can employing has the structure that the line member of flexibility connects by single discharge side path 15 is branched off into multiple manifold portion, the flexible pipe being connected on multiple connectors of this manifold portion, pipe etc.
Further, in mould 2, it is provided with the temperature sensor 6 of detecting device as the temperature detecting this mould 2. It addition, this temperature sensor 6 can also as the position near the outlet 5 of detection medium circulation path 4, the device exporting the temperature of the medium (cooling medium) of outlet 5 sides such as position near 5 downstreams.
Further, in mould 2, it is provided with the die heater 7 as the heater heating this mould 2. Illustrated example illustrates the example of design in the fixed half and moving half that die heater 7,7 is imbedded mould 2 respectively.
Heating target temperature (the heating setpoint temperature of the mould 2 heated as the die heater 7 of heater by this, with reference to Fig. 2) can according to the size of products formed, shape, the kind etc. of moulding material, and suitably set from the raising fillibility of melted material, die cavity towards the viewpoint grade of the transferability (transferring rate) of products formed. When such as products formed be comparison large-scale, both this heating target temperature can have been made to be high temperature 150 DEG C��about 300 DEG C, it is also possible to be 200 DEG C��about 300 DEG C.
And, the cooling target temperature (cooling setpoint temperature, with reference to Fig. 2) of the mould 2 cooled down by the cooling medium from cooling medium supply source 10 described later can also solidify from above-mentioned same viewpoint, melted material, seek to shorten the viewpoints such as molding cycle goes out to send suitable setting. As long as this cooling target temperature is lower than above-mentioned heating target temperature just passable, if but it is too low, the thermal capacity adding mold 2 is big, has the time lengthening reaching cooling target temperature and the tendency that the time arriving heating target temperature in next heating process lengthens. From such viewpoint etc., above-mentioned cooling target temperature both can be made to be such as 100 DEG C��about 200 DEG C, it is also possible to be 150 DEG C��about 200 DEG C. Further, when to make heating target temperature as described above be the high temperature of comparison, it is also possible to using��the temperature of about 120 DEG C lower 40 DEG C than heating target temperature as cooling target temperature.
Additionally, forming machine as this mould 2, both can adopt wait the melted synthetic resin as material to be filled in the die cavity that is made up of the fixed half and moving half of mould 2 etc. in cylinder from the injection such as nozzle, the Jet forming machine etc. of gradually moulding moulded product, and other forming machines such as compacting shape machine can also be adopted. Further, as moulding material, it is possible to use comprise the fibre strengthening synthetic resin material etc. of the reinforcing fiber such as carbon fiber, glass fibre in synthetic resin material.
Further, the device as heating mould 2 is not limited to above-mentioned die heater 7, it is also possible to the medium circulation path that is arranged in mould 2 will provide what add thermal medium add thermal medium supply source as heater. In this case, both can carry in the medium circulation path identical with cooling medium and added thermal medium, it is also possible to take conveying in the medium circulation path of heating medium-specific to add the form of thermal medium. In addition, it is also possible to adopt various heater. Moreover, it is also possible to the heat of the melted material self in utilizing the die cavity injecting to mould 2 is to carry out the heating of mould 2.
Cooling medium supply source 10 can adopt suitable supply source according to the kind of cooling medium, the temperature of necessary cooling medium self, cooling target temperature etc. but it also may adopts the structure of the cooling medium supply pump 11 (reference Fig. 2) of the reservoir (storage tank) such as possessing storage cooling medium and cooling medium from this reservoir to mould 2 side that provide (conveying) to be stored in. In this case, in order to make the cooling medium being stored in reservoir maintain predetermined temperature set in advance, it is also possible to carry out temperature control with coolers etc. such as suitable condensers.
The cooling medium provided by this cooling medium supply source 10 is liquid in supply side, and this embodiment is water (pure water) but it also may with ethanol or other ethanol, other cooling medium. And, it would however also be possible to employ boiling point cooling medium below 100 DEG C at ambient pressure.
It addition, the temperature from the cooling medium of this cooling medium supply source 10 offer both can be about room temperature, and it can also be such as 5 DEG C��about 90 DEG C, it is also possible to be 10 DEG C��about 50 DEG C.
And, it is not limited to above-mentioned supply source as cooling medium supply source 10, can also use and possess the supply source not carrying out temperature controlled reservoir, or can also using cooling tower of being arranged on factory etc. etc. as cooling medium supply source, and then can also by tap water (industrial tap water, upper hose) as cooling medium supply source.
And, in this embodiment, mould heating and cooling system 1 adopts following structure: entrance 3 side of the medium circulation path 4 being connected to mould 2, from cooling medium supply source 10 start supply side path 12,13, be connected to the path 18,19 that steam and air from vapour source 8 and air source 9 are provided respectively.
Can adopt as vapour source 8 and add hot liquid (liquid that preferably kind is identical with the cooling medium of the medium circulation path 4 being supplied to mould 2 from cooling medium supply source 10) with thermal source so that it is evaporation, the boiler etc. vaporized.
On the steam supply side path 18 of the steam of this vapour source 8, the steam valve 18a being made up of electromagnetic valve etc. providing or blocking the steam from vapour source 8 it is provided with providing. The one end in steam supply side path 18 is connected on vapour source 8, and its other end is connected on supply side path 13 by suitable joint etc. It addition, the temperature from the steam of this vapour source 8 offer suitably can set according to above-mentioned cooling target temperature, for instance can be and the temperature of above-mentioned cooling target temperature same degree, or can also be the temperature lower than cooling target temperature.
As air source 9, the device of the structure blowing air etc. with aerator can be used, or such as pass through the storages such as aftercooler, sluicing separator, hair-dryer by compressed air sources such as the air accumulators of the gas (gases at high pressure) of the compressor compresses such as compressor.
Provide from the air supply side path 19 of the air of this air source 9 is provided for or block the air from air source 9, the air cock 19a that is made up of electromagnetic valve etc. The one end in air supply side path 19 is connected in air source 9, and its other end is connected on supply side path 13 by suitable joint etc.
The supply side path 12,13 of the entrance 3 of the medium circulation path 4 of connection cooling medium supply source 10 and mould 2 adopts to possess leans on the supply side path 12 of upstream side (cooling medium supply source 10 side) and the structure in the supply side path 13 than this connecting portion downstream (mould 2 side) than the connecting portion in above-mentioned steam supply side path 18 and air supply side path 19.
The supply side path 12 of the upstream side in this supply side path 12,13 is provided with and provides or block the cooling medium from cooling medium supply source 10, the cooling medium valve 12a that is made up of electromagnetic valve etc. Further, the supply side path 12 of this upstream side is configured with above-mentioned cooling medium supply pump 11. Additionally, the detecting device such as temperature sensor of the temperature detecting the cooling medium carried to the medium circulation path 4 of mould 2 can also be set in the supply side path 12 of this upstream side, above-mentioned reservoir etc., make the temperature of cooling medium carry out temperature adjustment with above-mentioned cooler etc. with becoming predetermined temperature set in advance according to the detected value of this detecting device.
The structure of heat exchanger 20 is, as high temperature fluid, conveying is made this high temperature fluid to be cooled down and be made the cooling path 14 of its cryogen condensed connect the cooling medium of conveying in the discharge side path 15 being connected in the outlet 5 of medium circulation path 4 of mould 2. The structure on these discharge side paths 15 and cooling path 14 are connected respectively to heat exchanger 20 high temperature side stream and low temperature side stream can also be adopted.
In this heat exchanger 20, via being heated to the medium circulation path 4 of mould 2 of high temperature vaporized cooling medium by the cryogen heat absorption cooling of conveying in cooling path 14, it is condensed and liquefies.
Further, in this embodiment, the cooling path 14 structure for being transported to by the cooling medium provided from cooling medium supply source 10 in the low temperature side stream of heat exchanger 20 is made. That is, adopt structure as the supply source dual-purpose that the low temperature side stream of heat exchanger 20 is provided cooling medium of the cooling medium supply source 10 that provides cooling medium to the medium circulation path 4 of mould 2. According to such structure, compared with the structure arranging heat exchanger 20 cooling medium supply source separately, it is possible to become simple structure.
This cooling path 14 is connected to the ratio in the supply side path 12 of upstream side and is provided with the side by the upstream, position of cooling medium valve 12a by suitable joint etc. In other words, the supply side path 12 of upstream side, in the cooling path 14 being branched off into the supply side path 12 to mould 2 side and heat exchanger 20 side than side by the upstream, the position being provided with cooling medium valve 12a.
Further, this cooling path 14 is provided with provides or block the cooling medium from cooling medium supply source 10, the cools down valve 14a that is made up of electromagnetic valve etc.
This cooling path 14 is connected to the medium of cooling medium supply source 10 and returns to side.
And, in this embodiment, adopt in the outlet 5 of the medium circulation path 4 by being connected to mould 2, be connected to the structure of the medium return side of cooling medium supply source 10 via the discharge side path 15 (the discharge side path 15 of the side, downstream of heat exchanger 20) of heat exchanger 20. That is, employing makes the cooling medium being supplied to the medium circulation path 4 of mould 2 become the structure circulated between cooling medium supply source 10 loop-likely. According to such structure, impurity etc. is difficult to be mixed into, it is possible to easily carry out the quality management of cooling medium.
The example of the structure being connected with illustrating the interflow, cooling path 14 with the downstream of heat exchanger 20, the discharge side path 15 in the downstream making heat exchanger 20 in illustrated example.
Further, in this embodiment, the structure being provided with the adverse current preventing portion 16 preventing adverse current in the discharge side path 15 in the downstream of heat exchanger 20 is adopted.
This adverse current preventing portion 16 adopts permission fluid to flow from heat exchanger 20 side to cooling medium supply source 10 side in this embodiment, stop the check valve (check-valves, check valve) that fluid flows from heat exchanger 20 side, cooling medium supply source 10 side on the other hand. By such check valve is adopted as adverse current preventing portion 16, with such as using open and close valve etc. compared with the structure that adverse current preventing portion is arranged, discharging when (return medium) need not open and close controlling etc., it is possible to prevent adverse current with simple control.
It addition, the heat exchanger of all heat exchange methods such as Double-wall-tube heat exchanger, heat-exchangers of the plate type, shell-and-tube exchanger, horizontal fin (crossfin) formula heat exchanger can be adopted as above-mentioned heat exchanger 20. And, although illustrated example illustrates the heat exchanger 20 of parallel flow type but it also may adopt to the heat exchanger such as flow pattern, positive AC type.
Further, Automatic steam trap Trap etc. can also be suitably arranged as required in the discharge side path 15 (leaning on the discharge side path 15 of upstream side than adverse current preventing portion 16) in the downstream of heat exchanger 20.
And, the example of the respectively independent open and close valve (ON/OFF valve) of the valve in the supply side path 12 of opening and closing upstream side, cooling path 14, steam supply side path 18 and air supply side path 19 is made but it also may take to constitute whole in them or structure that certain is several with multiport multiposition type switching valve etc. described in illustrated example.
Further, mould heating and cooling system 1 possesses the control dish 21 with the control portion 22 controlling above-mentioned die heater 7, cooling medium supply pump 11, each valve 12a, 14a, 18a, 19a.
This control dish 21 possesses: the control portion 22 being made up of CPU etc.; It is connected respectively in this control portion 22 by holding wire etc., is configured to set, input or show the display part of various settings etc. and the display operating portion 24 of operating portion; Preserve set by the operation of this display operating portion 24, input impose a condition, input value, for performing the various programs such as the control program of various actions described later etc., various operation condition set in advance, and various tables of data etc., the storage part 23 being made up of various memorizeies etc.
Control portion 22 adopts possesses time set, the arithmetic processing section etc. such as clock timer, is connected with above-mentioned die heater 7, cooling medium supply pump 11, each valve 12a, 14a, 18a, 19a by holding wire etc., controls their structure. Further, this control portion 22 is connected with the temperature sensor 6 of above-mentioned mould 2 also by holding wire etc.
In this embodiment, control portion 22 adopts the structure of the supply of supply and the cooling medium controlling above-mentioned steam and air.
Further, in this embodiment, as in figure 2 it is shown, control portion 22 adopts after providing steam to the medium circulation path 4 of mould 2, to the structure that the medium circulation path 4 of mould 2 is controlled with providing cooling medium.
Further, in this embodiment, as in figure 2 it is shown, control portion 22 adopts after providing cooling medium to the medium circulation path 4 of mould 2, to the structure that the medium circulation path 4 of mould 2 is controlled with providing air.
Additionally, as the equipment for cooling die constituting this mould heating and cooling system 1, can shown in the double dot dash line of Fig. 1, grasp as the device possessing the open and close valve 12a, 14a, 18a, 19a, adverse current preventing portion 16, heat exchanger 20 and the control dish 21 that are disposed in above-mentioned each path 12,14,18,19, it is also possible to grasp as the device of at least one possessed again in addition in vapour source 8, air source 9 and cooling medium supply source 10. And, it is also possible to as except such equipment for cooling die, the mould heating-cooling device of the heater 7 being also equipped with heating mould 2 is grasped.
In adopting the mould heating and cooling system 1 of this embodiment of said structure, if making die heater 7 start, then carry out the heating of mould 2. This die heater 7 can make the temperature of mould 2 be carried out the energising controls such as PID control by control portion 22 with becoming heating target temperature set in advance according to the measurement temperature signal (detection temperature) of the temperature sensor 6 of mould 2. It addition, this heating target temperature can pass through to show that operating portion 24 inputs, sets.
Further, if make cooling medium supply pump 11 start, open cooling medium valve 12a, then carry out from the cooling medium of cooling medium supply source 10 toward the offer (this embodiment is that circulation provides) of the medium circulation path 4 of mould 2.
Further, if making cooling medium supply pump 11 start, open cools down valve 14a, then the low temperature side stream of heat exchanger 20 it is provided to from the cooling medium of cooling medium supply source 10. This cools down valve 14a according to the measurement temperature signal (detection temperature) of detection with the temperature sensor of the temperature of the side, heat exchanger 20 downstream in the discharge side path 15 of the high temperature side fluid communication of heat exchanger 20, can also make the temperature of the cooling medium of return be carried out the open and close controlling such as PID control by control portion 22 with becoming return dielectric object temperature set in advance. It addition, this return dielectric object temperature can be passed through to show that operating portion 24 inputs, sets.
Further, if making steam valve 18a open, then the medium circulation path 4 of mould 2 it is provided to from the steam of vapour source 18.
Further, if making air cock 19a open, then the medium circulation path 4 of mould 2 it is provided to from the air of air source 19.
Then, illustrate to be taken as an example of mould heating cooling means (mould cooling means) of an example of the basic acts of execution in the mould heating and cooling system 1 of this embodiment of said structure according to Fig. 2.
It addition, in the curve chart of Fig. 2, using transverse axis as time shaft, the longitudinal axis as the detection temperature of temperature sensor 6, schematically illustrate its passage.
It is possible, firstly, to make die heater 7 start, perform the mould 2 of room temperature degree is preheating to the preheating procedure become about cooling target temperature. If so preheated, then become dormant state.
And, although eliminate diagram, but carry out 2-in-1 for mould mould in the forming machine of mould 2, penetrate the melted materials such as resin and be filled in the die cavity being arranged in mould 2 and suitably pressurize, if melted material solidifies, then carry out die sinking, take out products formed. In such a succession of molding procedure, in order to make the solidification of melted material postpone, successfully it is filled with, performs mould heating process, in order to perform this mould heating process, use the mould heating and cooling system 1 of this embodiment. Further, after melted material is filled in die cavity, in order to make melted material rapid solidification, perform mould refrigerating work procedure, in order to perform this mould refrigerating work procedure, use the mould heating and cooling system 1 of this embodiment. Use mould heating process that this mould heating and cooling system 1 performs and mould refrigerating work procedure can also interlock with the forming action of forming machine, for instance to perform (start and stop) according to the matched moulds signal of forming machine or injection signal, pressurize signal, die sinking signal etc.
Being preheated as described above, under dormant state, if receiving signal or other the heating commencing signal of forming machine side, then perform the heating process of heating mould 2, make mould 2 be heated with becoming heating target temperature set in advance. This heating process both can terminate when receiving signal or other the heating termination signal of forming machine side, or can also terminate after the scheduled time after arriving heating target temperature.
If this heating process terminates, have passed through the scheduled time, or receive the signal of forming machine side or other cooling commencing signals, then perform the refrigerating work procedure of cooling mould 2, make mould 2 cool down with becoming cooling target temperature set in advance. It addition, this cooling target temperature can pass through to show that operating portion 24 inputs, sets.
In this embodiment, owing to being provided with the cools down valve 14a providing or blocking cryogenic media (cooling medium) as described above in the low temperature side stream of heat exchanger 20, in performing refrigerating work procedure, therefore carry out the open and close controlling of this cools down valve 14a. Additionally, as the 2nd embodiment described later and the 3rd embodiment when could be used without the form arranging such cools down valve 14a, the form etc. that cryogenic media (cooling medium) is provided always can also be adopted to the low temperature side stream of heat exchanger 20.
Further, in this action example, it is also possible to first carried out the pre-cooling working procedure that steam is provided to medium circulation path 4 before providing cooling medium to medium circulation path 4. That is, the open steam valve 18a when locking cooling medium valve 12a, provides steam to medium circulation path 4. If so providing steam, along with the contact etc. of the inner peripheral surface to medium circulation path 4, absorbing its heat and carrying out pre-cooling, and arrive heat exchanger 20 and be condensed. Thus, supply side path 13, pressure in each path of medium circulation path 4 and discharge side path 15 decline. That is, the cooling medium vaporization that steam is first-class with the inner peripheral surface being attached to medium circulation path 4, be condensed liquefaction successively in heat exchanger 20, arranges adverse current preventing portion 16 by so adding, and the pressure in above-mentioned each path sharply declines.
This pre-cooling working procedure can also perform in supply side path 13, medium circulation path 4 and discharge side path 15 with being substantially filled with steam. And, this pre-cooling working procedure can also go to through the predetermined time always, or the measured pressure signal (detection pressure) of the detecting device of the pressure in the detection path such as some interior pressure transducer that can also always go to be arranged in supply side path 13, medium circulation path 4 and discharge side path 15 is in predetermined pressure set in advance (threshold value) below. That is, if below predetermined pressure, then can from providing steam to be switched to offer cooling medium. This predetermined pressure both can be the pressure that the cooling medium such as next time provided can provide, it is also possible to the capacity (discharge pressure) etc. supplying pump 11 according to cooling medium suitably sets. It addition, this predetermined pressure can be passed through to show that operating portion 24 inputs, sets.
Further, in this pre-cooling working procedure, it is possible to being mixed into by a small amount of cooling medium in steam provides, or offer steam can also be provided and air is provided, in this case, it is also possible to a small amount of cooling medium or steam being mixed in air provides.
After so performing pre-cooling working procedure, perform to provide the main refrigerating work procedure of cooling medium to the medium circulation path 4 of mould 2. That is, cooling medium supply pump 11 is made to start, and locking steam valve 18a, open cooling medium valve 12a. Consider described in illustrated example that startup time etc. makes the example that cooling medium supply pump 11 starts more earlyly than open cooling medium valve 12a.
Further, in this action example, after performing the 1st refrigerating work procedure being made up of this main refrigerating work procedure, perform to supply the air to the 2nd refrigerating work procedure of the medium circulation path 4 of mould 2. That is, locking cooling medium valve 12a, open air valve 19a, provide air to medium circulation path 4. It addition, when locking cooling medium valve 12a, it is possible to so that cooling medium supply pump 11 stops. And, can also adopt and the bypass path connecting supply side path 12 and discharge side path 15 (for cooling path 14 in illustrated example) is set, make the opening and closing contrary opening and closing linkedly of bypass valve and the cooling medium valve 12a being arranged in this bypass path, by so making cooling medium supply pump 11 be in the form of a direct acting in principle.
Cooling medium in order to enable by execution the 2nd refrigerating work procedure in medium circulation path 4 is substantially discharged (emptying), is not produced sub-cooled, namely not being significantly less than cooling target temperature when refrigerating work procedure terminates, these the 1st refrigerating work procedures and the 2nd refrigerating work procedure can go to through the scheduled time respectively always. And, it is also possible to it is switched to the 2nd refrigerating work procedure according to the detection temperature of temperature sensor 6 from the 1st refrigerating work procedure, or terminates the 2nd refrigerating work procedure, i.e. latching air valve 19a.
It addition, in the 2nd refrigerating work procedure, it is also possible to replace air or than air, provide a small amount of cooling medium like that off and on also like the action example of aftermentioned 2nd embodiment, and steam can also be provided. When so providing steam, it is possible to a small amount of cooling medium is provided in addition to steam more off and on. Further, when so providing steam, a small amount of cooling medium, it is possible to make almost all to vaporize in medium circulation path 4 when the 2nd refrigerating work procedure terminates, the medium amount in medium circulation path 4 that remains in suitably carries out supply control almost without ground. Such as, the heat that the internal face from medium circulation path 4 distributes can be calculated, it is considered to the heat of vaporization of these factors and medium, cooling target temperature etc. are determined by experiment or even rule of thumb according to mold temperature before and after the melted materials such as the volume of medium circulation path 4, potting resin etc. Furthermore, it is contemplated that also vaporize when die sinking and removal process, therefore can there is the residual medium that comparison is a small amount of.
After performing this refrigerating work procedure, mould 2 is properly carried out die sinking, takes out products formed, repeatedly perform heating process, refrigerating work procedure.
So, the refrigerating work procedure of the heating process and cooling mould 2 by performing heating mould 2, it is possible to increase die cavity is towards the transferability (transferring rate) of products formed, and can shorten molding cycle.
The mold cooling system (mould heating and cooling system) 1 of this embodiment and use mould cooling means (mould heating cooling means) that it performs by adopting structure as described above, the discharge of the cooling medium of vaporization can not only be suppressed, additionally it is possible to improve cooling effectiveness.
That is, the discharge side path 15 being connected to outlet 5 sides of the medium circulation path 4 of mould 2 is made to connect with the heat exchanger 20 making the vaporized cooling medium discharged from medium circulation path 4 condense. Therefore, it is possible to make vaporized cooling medium condense in heat exchanger 20, it is possible to suppress the discharge of vaporized cooling medium. Further, by condensing in heat exchanger 20, it is possible to make the pressure risen because of cooling medium vaporization decline. Thus, cooling medium is carried to become easy to medium circulation path 4, it is possible to shorten cool time, it is possible to increase cooling effectiveness.
Further, this embodiment adopts the discharge side path 15 in the downstream making heat exchanger 20 to return to the structure of cooling medium supply source 10, namely adopts the structure making cooling medium circulate. Therefore, provide with not making cooling medium circulation compared with new cooling medium the structure discharged, it is possible to reduce the accumulation being included in the medium circulation path 4 etc. to mould 2 such as the silicon dioxide in cooling medium, oxide skin due to cooling medium vaporization. Thereby, it is possible to reduce the maintenance frequency etc. of medium circulation path 4.
Further, in this embodiment, adopt and the adverse current preventing portion 16 preventing adverse current is set on the discharge side path 15 in the downstream of heat exchanger 20. Therefore, when the condensation of the cooling medium being vaporized in heat exchanger 20, it is possible to more effectively make the pressure in path decline. Thus, cooling medium is carried to become easier to medium circulation path 4, it is possible to shorten cool time further, it is possible to be greatly enhanced cooling effectiveness.
It addition, be not limited to check valve as illustrated example as adverse current preventing portion 16, it is also possible to be by the open and close valve etc. of control portion 22 open and close controlling. In this case, following form can be adopted: decline with the pressure with condensation in the detection heat exchangers 20 such as pressure transducer, or decline by detection temperature such as temperature sensors, if below predetermined value, then open open and close valve, makes the cooling medium of liquefaction discharge (return medium).
And, following structure can also be adopted: possess and the offer of steam or air and the offer of cooling medium are provided as above-mentioned example, the control portion 22 of cooling medium is provided to the medium circulation path 4 of mould 2 after providing steam or air to the medium circulation path 4 of mould 2. Namely, it is also possible to after steam or air are supplied in execution the pre-cooling working procedure of medium circulation path 4 of mould 2, provide cooling medium to the medium circulation path 4 of mould 2. According to such structure, it is possible to steam or air precooling mould 2, then more easily carry cooling medium to medium circulation path 4. Namely, it is possible to be mixed in steam or air with medium and the heat of medium circulation path 4 of vaporized Absorption of Medium mould 2. Further, it is mixed into by medium in steam or air and vaporized medium condenses in heat exchanger 20, it is possible to make pressure decline, carry cooling medium to medium circulation path 4 with being thus also easier to.
And, following structure can also be adopted: possess and the offer of steam or air and the offer of cooling medium are provided as above-mentioned example, the control portion 22 of steam or air is provided to the medium circulation path 4 of mould 2 after providing cooling medium to the medium circulation path 4 of mould 2. Namely, it is also possible to after execution provides the 1st refrigerating work procedure of cooling medium to the medium circulation path 4 of mould 2, perform to be supplied to steam or air the 2nd refrigerating work procedure of the medium circulation path 4 of mould 2. According to such structure, it is possible to emptying remains in the cooling medium in the medium circulation path 4 of mould 2, by the heat absorption such as contact with medium circulation path 4, mould 2 can be cooled down simultaneously. Further, it is possible to the residual medium reducing in the medium circulation path 4 remaining in mould 2, it is possible to effectively heat.
One example of the example that the mold cooling system of other embodiments of the present invention is then described and the mould cooling means using it to perform.
Fig. 3 and Fig. 4 is the explanation figure of the mould cooling means for the mold cooling system of the 2nd embodiment and its execution of use are described.
It addition, the main difference illustrated with the 1st embodiment, for identical structure, add identical labelling, omit or its explanation is described briefly. Further, for the action identical with above-mentioned action example, also omit or its explanation is described briefly.
In this embodiment, making mold cooling system 1A is the mould heating and cooling system 1A being also heated except the cooling carrying out mould 2.
And, this embodiment is mainly different from above-mentioned 1st embodiment in some grade following: not will provide for the steam supply side path 18 of the steam from vapour source 8 and is connected to this point on supply side path 13, cools down valve 14a this point is not set on the cooling path 14 with the low temperature side fluid communication of heat exchanger 20, and adverse current preventing portion 16 this point is not set in the discharge side path 15 in the downstream of heat exchanger 20.
Further, in this embodiment, the structure of the quantity delivered that can increase and decrease the cooling medium from cooling medium supply source 10 is adopted. Illustrative example adopts to carry at the medium being connected to cooling medium supply source 10 and arranges low discharge path 12b side by side on the upstream side supply side path 12 of side, arranges the structure of a small amount of valve 12c of cooling medium providing or blocking cooling medium on the 12b of this low discharge path. Namely, adopt following structure: using the supply side path 12 of upstream side as main path, if locking is arranged on a small amount of valve 12c of cooling medium of the cooling medium valve 12a on this supply side path 12, open low discharge path 12b, then carry out the offer of the relatively cooling medium of low discharge. This cooling medium a small amount of valve 12c is the same with other valve to be connected in control portion 22 by holding wire etc., control portion 22 carry out open and close controlling.
Alternatively, it is also possible to replace such form, adopt the flow control valve that can carry out aperture control etc. as the cooling medium valve 12a form etc. arranged.
Then, illustrate that the mould of the example as the basic acts performed in adopting the mould heating and cooling system 1A of this embodiment of said structure heats an example of cooling means (mould cooling means) according to Fig. 4.
It addition, also same as above in the curve chart of Fig. 4, using transverse axis as time shaft, using the longitudinal axis detection temperature as temperature sensor 6, its passage is schematically described.
It is possible, firstly, to execution preheating procedure same as above, heating process.
Then, it is possible to perform the refrigerating work procedure of cooling mould 2.
In this action example, do not perform to be supplied to steam or air the pre-cooling working procedure of the medium circulation path 4 of mould 2, cooling medium is supplied to the medium circulation path 4 of mould 2. That is, cooling medium supply pump 11 is made to start, and open cooling medium valve 12a, the cooling medium from cooling medium supply source 10 is supplied to the medium circulation path 4 of mould 2. Illustrative example describes as described above, it is considered to the startup time etc. makes the example that cooling medium supply pump 11 starts more earlyly than open cooling medium valve 12a.
Further, in this action example, after performing the 1st refrigerating work procedure that is made up of this main refrigerating work procedure, perform to be intermittently supplied to the cooling medium of low discharge and air the 2nd refrigerating work procedure of the medium circulation path 4 of mould 2. This action example adopts following structure: locking cooling medium valve 12a, the cooling medium of low discharge is intermittently supplied to the medium circulation path 4 of mould 2 by the open a small amount of valve 12c of cooling medium off and on, and then air is intermittently supplied to the medium circulation path 4 of mould 2 by open air valve 19a off and on. It addition, when a small amount of valve 12c of locking cooling medium, it is possible to so that cooling medium supply pump 11 stops. And, above-mentioned form can also be replaced, adopt following structure: air is intermittently supplied to the medium circulation path 4 of mould 2 at the 2nd refrigerating work procedure discontinuous ground open air valve 19a, and then the cooling medium of low discharge is intermittently supplied to the medium circulation path 4 of mould 2 by the open a small amount of valve 12c of cooling medium off and on. Moreover, it is also possible to adopt after this off and on open air valve 19a air is intermittently supplied to the structure of the medium circulation path 4 of mould 2. And, it is also possible to adopt following structure: alternatively open cooling medium a small amount of valve 12c and air cock 19a, the cooling medium of low discharge and air are alternatively supplied to the medium circulation path 4 of mould 2.
Further, in this action example, if the detected value of said temperature sensor 6 is at predetermined threshold (switching threshold) below, then it is switched to the 2nd refrigerating work procedure from the 1st refrigerating work procedure. The execution with the 2nd refrigerating work procedure that sets of this switching threshold controls as described above, in order to substantially discharge the cooling medium in (emptying) medium circulation path 4 by performing the 2nd refrigerating work procedure, do not produce supercooling etc., namely, in order to not be significantly less than cooling target temperature when refrigerating work procedure terminates, it is possible to be properly carried out setting, controlling. It addition, above-mentioned switching threshold can pass through to show that operating portion 24 inputs, sets.
Further, in above-mentioned 2nd refrigerating work procedure, it is possible to replace above-mentioned air, or also provide for steam except above-mentioned air.
Further, this action example can also perform pre-cooling working procedure as described above.
Further, in this action example also after performing refrigerating work procedure, mould 2 is properly carried out the taking-up of die sinking, products formed, is repeatedly carried out heating process, refrigerating work procedure.
In the effect that mold cooling system (mould heating and cooling system) 1A of this embodiment is roughly the same with above-mentioned 1st embodiment and action example thereof with acquirement in the mould cooling means (mould heating cooling means) using it to perform.
One example of the example that the mold cooling system of another one embodiment of the present invention is then described and the mould cooling means using it to perform.
Fig. 5 is the explanation figure of the mould cooling means for the mold cooling system of the 3rd embodiment and its execution of use are described.
It addition, the main difference illustrated with above-mentioned each embodiment, for identical structure, add identical labelling, omit or its explanation is described briefly.
In this embodiment, making mold cooling system 1B is the mould heating and cooling system 1B being also heated except the cooling carrying out mould 2.
And, this embodiment adopts following structure: make the low temperature side stream to heat exchanger 20A provide the cooling path 14A of cooling medium not provide the cooling medium supply source 10 of cooling medium to connect with to the medium circulation path 4 of mould 2, and connect with the cooling medium supply source 17 of heat exchanger 20A. According to such structure, it is possible to such as making cooling medium supply source 17 is the cooling tower etc. being arranged on factory etc., make cooling medium supply source 10 for not carry out temperature controlled reservoir etc., it is possible to realize simplifying the structure of cooling medium supply source 10.
Additionally, in the mould heating and cooling system 1B of this embodiment, it is able to carry out the action (mould heating cooling means (mould cooling means)) roughly the same with above-mentioned each action example, and the effect roughly the same with above-mentioned each embodiment and action example thereof can be obtained.
Additionally, it is not restricted to the form that low temperature side stream conveying cooling medium carries out cooling down as heat exchanger 20,20A, can also adopt and such as make the structure of conveying the condensation of vaporized cooling medium in high temperature side stream with coolings such as fans, namely adopt the structure of air-cooled type.
And it is possible to suitably recombinate, combine or be applied in mutually different structure, the action etc. that illustrated in above-mentioned each embodiment. In this case, it is possible to be properly carried out deformation according to necessity.
And, although the example of the form adopt the medium that the discharge side path 15 of heat exchanger 20, the downstream of 20A is connected to cooling medium supply source 10 to return to side described in above-mentioned each embodiment, making cooling medium circulate but it also may adopt the medium that the discharge side path 15 of heat exchanger 20, the downstream of 20A is not connected to cooling medium supply source 10 to return to side and as the form of draining discharge.
And, although the mould heating and cooling system 1 that is also heated except the cooling carrying out mould 2 described in above-mentioned each embodiment, the example of 1A, 1B but it also may be by the mold cooling system 1 of the cooling of mould 2,1A, 1B. In this case, it is also possible to arrange and the mold heating system (mold heating device) carrying out mould 2 heating of the mold cooling system 1 of each embodiment, the separately performed control of 1A, 1B.
And, although adopting the example performing to be supplied to steam or air the structure of the 2nd refrigerating work procedure of the medium circulation path 4 of mould 2 after performing the medium circulation path 4 to mould 2 and provide the 1st refrigerating work procedure of cooling medium described in above-mentioned each action example but it also may do not perform such 2nd refrigerating work procedure. In this case, both can adopt and in refrigerating work procedure, perform pre-cooling working procedure as described above, then perform the structure of main refrigerating work procedure, it is also possible to adopt the structure only carrying out main refrigerating work procedure. Namely, following structure can be adopted: the discharge side path 15 of outlet 5 sides making to be connected to the medium circulation path 4 of mould 2 connects with heat exchanger 20,20A, the vaporized cooling medium discharged from medium circulation path 4 is made to condense among heat exchanger 20,20A, by so making pressure decline, cooling medium is provided effectively, cools down.
The explanation of symbol
1,1A, 1B-mould heating and cooling system (mold cooling system); 2-mould; 3-entrance; 4-medium circulation path; 5-exports; 8-vapour source; 9-air source; 10-cooling medium supply source; 12,13-supply side path; 15-discharge side path; 16-adverse current preventing portion; 18-steam supply side path; 19-air supply side path; 20,20A-heat exchanger; 22-control portion.
Claims (7)
1. a mold cooling system, provides the cooling medium from cooling medium supply source to cool down this mould being heated to arranging medium circulation path in a mold, it is characterised in that:
The discharge side path being connected to the outlet side of the medium circulation path of above-mentioned mould is made to connect with the heat exchanger making the vaporized above-mentioned cooling medium discharged from above-mentioned medium circulation path condense.
2. mold cooling system as claimed in claim 1, it is characterised in that:
Adopt following structure: the medium circulation path being connected to above-mentioned mould inlet side, from the supply side path that above-mentioned cooling medium supply source starts, being connected to the path providing steam or air from vapour source or air source;
Possessing control portion, this control portion controls the supply of this steam or this air and the supply of above-mentioned cooling medium, after the medium circulation path of above-mentioned mould is provided above-mentioned steam or above-mentioned air, provides above-mentioned cooling medium to the medium circulation path of above-mentioned mould.
3. mold cooling system as claimed in claim 1 or 2, it is characterised in that:
Adopt following structure: the medium circulation path being connected to above-mentioned mould inlet side, from the supply side path that above-mentioned cooling medium supply source starts, being connected to the path providing steam or air from vapour source or air source;
Possessing control portion, this control portion controls the supply of this steam or this air and the supply of above-mentioned cooling medium, after the medium circulation path of above-mentioned mould is provided above-mentioned cooling medium, provides above-mentioned steam or above-mentioned air to the medium circulation path of above-mentioned mould.
4. the mold cooling system as described in any one in claims 1 to 3, it is characterised in that: on the discharge side path in the downstream of above-mentioned heat exchanger, it is provided with the adverse current preventing portion preventing adverse current.
5. a mould cooling means, provides cooling medium to cool down this mould being heated the medium circulation path arranged in a mold, it is characterised in that:
Make the discharge side path being connected to the outlet side of the medium circulation path of above-mentioned mould connect with heat exchanger, make the vaporized above-mentioned cooling medium discharged from above-mentioned medium circulation path condense this heat exchanger.
6. mould cooling means as claimed in claim 5, it is characterised in that: after the pre-cooling working procedure performing the medium circulation path that steam or air are supplied to above-mentioned mould, provide above-mentioned cooling medium to the medium circulation path of above-mentioned mould.
7. the mould cooling means as described in claim 5 or 6, it is characterized in that: after the 1st refrigerating work procedure that the above-mentioned cooling medium of offer of the medium circulation path to above-mentioned mould is provided, perform to be supplied to steam or air the 2nd refrigerating work procedure of the medium circulation path of above-mentioned mould.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013210178A JP5991678B2 (en) | 2013-10-07 | 2013-10-07 | Mold cooling system and mold cooling method |
| JP2013-210178 | 2013-10-07 | ||
| PCT/JP2014/076514 WO2015053179A1 (en) | 2013-10-07 | 2014-10-03 | Mold-cooling system and mold-cooling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105636756A true CN105636756A (en) | 2016-06-01 |
Family
ID=52812995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480054502.0A Pending CN105636756A (en) | 2013-10-07 | 2014-10-03 | Mold-cooling system and mold-cooling method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20160250685A1 (en) |
| JP (1) | JP5991678B2 (en) |
| CN (1) | CN105636756A (en) |
| WO (1) | WO2015053179A1 (en) |
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| CN106003628A (en) * | 2016-06-06 | 2016-10-12 | 上海熙视光电科技有限公司 | Indirect-cooling water type temperature control system |
| CN106738729A (en) * | 2016-12-14 | 2017-05-31 | 宁波市百鸽智能科技有限公司 | Die heater and its temprature control method |
| CN108526405A (en) * | 2018-07-18 | 2018-09-14 | 重庆双龙机械配件有限公司 | Motorcycle front fork casting equipment |
| CN109093893A (en) * | 2018-09-27 | 2018-12-28 | 孙美玲 | A kind of silica gel mould with quick cooling function |
| CN112276048A (en) * | 2020-10-09 | 2021-01-29 | 东风本田发动机有限公司 | Mold cooling system, control method and control device thereof, and computer equipment |
| CN112659416A (en) * | 2020-12-22 | 2021-04-16 | 珠海格力智能装备有限公司 | Steam control method and mold heating system |
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| JP6667261B2 (en) * | 2015-11-02 | 2020-03-18 | 株式会社松井製作所 | Temperature control device |
| CN109812832A (en) * | 2017-11-21 | 2019-05-28 | 吴鲜家 | High-effect combustion control system and its method |
| CN110480966A (en) * | 2018-05-15 | 2019-11-22 | 泰科电子(上海)有限公司 | Injection mould cooling system |
| JP2020046978A (en) * | 2018-09-19 | 2020-03-26 | 株式会社松井製作所 | Temperature control device |
| CN109128121A (en) * | 2018-10-30 | 2019-01-04 | 苏州奥天诚机械有限公司 | Cooling structure for liquid metal solidification |
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| JP2000246778A (en) * | 1999-03-01 | 2000-09-12 | Matsui Sdi:Kk | Mold cooler for injection molding machine |
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| JP3721329B2 (en) * | 2001-12-28 | 2005-11-30 | みのる化成株式会社 | Heating and cooling method of plastic molding die and plastic molding apparatus |
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- 2013-10-07 JP JP2013210178A patent/JP5991678B2/en active Active
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- 2014-10-03 CN CN201480054502.0A patent/CN105636756A/en active Pending
- 2014-10-03 US US15/027,411 patent/US20160250685A1/en not_active Abandoned
- 2014-10-03 WO PCT/JP2014/076514 patent/WO2015053179A1/en active Application Filing
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| CN114226685A (en) * | 2021-12-25 | 2022-03-25 | 江苏绿创新材料科技有限公司 | Be used for aluminium alloy die casting welded internal stay heat abstractor |
| CN114226685B (en) * | 2021-12-25 | 2024-05-03 | 中芯晟捷(江苏)精密科技有限公司 | Internal support heat dissipation device for welding aluminum alloy die castings |
| CN116274940A (en) * | 2023-01-16 | 2023-06-23 | 宁波博大机械有限公司 | Engine cylinder body die-casting system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015053179A1 (en) | 2015-04-16 |
| US20160250685A1 (en) | 2016-09-01 |
| JP2015074111A (en) | 2015-04-20 |
| JP5991678B2 (en) | 2016-09-14 |
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Application publication date: 20160601 |