CN105635534A - Image acquisition apparatus, electronic device, and manufacturing method of electronic device - Google Patents
Image acquisition apparatus, electronic device, and manufacturing method of electronic device Download PDFInfo
- Publication number
- CN105635534A CN105635534A CN201511001328.6A CN201511001328A CN105635534A CN 105635534 A CN105635534 A CN 105635534A CN 201511001328 A CN201511001328 A CN 201511001328A CN 105635534 A CN105635534 A CN 105635534A
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- wafer scale
- outer lens
- scale camera
- noumenon
- electronics
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses an image acquisition apparatus, an electronic device, and a manufacturing method of the electronic device. The image acquisition apparatus includes: a wafer-grade pick-up head and an outer lens, wherein the outer lens is overlapped above a lens of the wafer-grade pick-up head; an optical axis of the lens of the wafer-grade pick-up head is coincided with that of the outer lens; and the outer lens can gather the light reflected by a shooting object, so that the gathered light can reach an image sensor of the wafer-grade pick-up head through the lens of the wafer-grade pick-up head and an infrared optical filter to generate a first image.
Description
Technical field
The present invention relates to electronic technology field, in particular to the making method of a kind of image collecting device, electronics and electronics.
Background technology
Along with the development of science and technology, electronics have also been obtained development at full speed, the design of LED of electronics increasing, frame design more and more narrow.
In prior art, narrow frame notebook, with the use of wafer scale camera, gathers video image. But present inventor is in the process realizing inventive technique scheme in the embodiment of the present application, find that above-mentioned technology at least exists following technical problem: in prior art the camera in narrow frame notebook due to frame design very narrow, it is very thin that notebook thickness designs, the camera used is very little, and the comparatively small amt of eyeglass in camera. So the picture clarity of camera shooting is lower in prior art.
Summary of the invention
The embodiment of the present invention provides the making method of a kind of image collecting device, electronics and electronics, for solving in prior art the lower technical problem of the picture clarity caused because using general wafer level camera.
The embodiment of the present application provides a kind of image collecting device on the one hand, comprising:
Wafer scale camera;
Outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens;
Wherein, described outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives described wafer scale camera by the eyeglass of described wafer scale camera, infrared absorption filter mating plate generates the first image.
Optionally, the material of described outer lens is rigid light transmissive material.
The embodiment of the present application provides a kind of electronics on the other hand, comprising:
The first noumenon;
2nd body;
Coupling device, described the first noumenon is connected to described 2nd body by described coupling device, and wherein, the angle value between described the first noumenon and described 2nd body changes by rotating around described coupling device;
Image collecting device, described image collecting device is arranged on the frame of described the first noumenon, comprise wafer scale camera and outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens; Described outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives described wafer scale camera by the eyeglass of described wafer scale camera, infrared absorption filter mating plate generates the first image.
Optionally, the material of described outer lens is rigid light transmissive material.
Optionally, described electronics also comprises:
Protection screen, is arranged on described the first noumenon, and described protection screen is arranged between described outer lens and described wafer scale camera, is used for protecting described the first noumenon.
Optionally, described electronics also comprises:
Flexible printed circuit board, described flexible printed circuit board is connected with described wafer scale camera;
Described flexible printed circuit board also comprises extension portion, and the extension portion of described flexible printed circuit board is arranged in the cavity between the side of described wafer scale camera and the side of described the first noumenon.
Optionally, described electronics also comprises;
Groove, is arranged on the frame of described 2nd body, is used for accommodating described outer lens.
Optionally, it is provided with flexible material in described groove.
The embodiment of the present application another further aspect provides the making method of a kind of electronics, comprising:
By coupling device, the first noumenon being connected to the 2nd body, wherein, the angle value between described the first noumenon and described 2nd body changes by rotating around described coupling device;
Image collecting device is arranged on the frame of described the first noumenon, wherein, described image collecting device comprises wafer scale camera and outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens; Described outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives described wafer scale camera by the eyeglass of described wafer scale camera, infrared absorption filter mating plate generates the first image.
Optionally, on the described frame that image collecting device is arranged on described the first noumenon, specifically comprise:
Arranging protection screen on described the first noumenon, described protection screen is arranged between described outer lens and described wafer scale camera, is used for protecting described the first noumenon.
Optionally, described arrange on described the first noumenon protection screen after, also comprise:
Arranging at least one contraposition on described protection screen protruding, wherein, the alignment grooves that at least one contraposition described convexes to form is used for accommodating described wafer scale camera so that the optical axis of the eyeglass of described wafer scale camera and the optical axis coincidence of described outer lens.
Optionally, after on the described frame that image collecting device is arranged on described the first noumenon, also comprise:
Flexible printed circuit board is connected with described wafer scale camera;
Described flexible printed circuit board also comprises extension portion, and the extension portion of described flexible printed circuit board is arranged in the cavity between the side of described wafer scale camera and the side of described the first noumenon.
Optionally, after on the described frame that image collecting device is arranged on described the first noumenon, also comprise:
The frame of described 2nd body arranges a groove, and flexible material is set in described groove, be used for accommodating described outer lens.
Above-mentioned one or more technical scheme in the embodiment of the present application, at least has one or more technique effects following:
1, due to the technical scheme in the embodiment of the present application, owing to adopting a kind of image collecting device, comprising: wafer scale camera; Outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the technique means of the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens, like this, outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives wafer scale camera by the eyeglass of wafer scale camera, infrared absorption filter mating plate generates the first image. Because the outer lens added has the effect of converged light, it is possible to correct aberration and distortion better, so, efficiently solve the technical problem that picture clarity in prior art is lower. Achieve the technique effect improving picture imaging sharpness.
2, due to the technical scheme in the embodiment of the present application, owing to adopting flexible printed circuit board, described flexible printed circuit board is connected with described wafer scale camera; Described flexible printed circuit board also comprises extension portion, and the extension portion of described flexible printed circuit board is arranged on the technical scheme in the cavity between the side of described wafer scale camera and the side of described the first noumenon. So, it is achieved that reduce electronics frame, increase screen accounting, reduce the effect of electronics weight.
3, due to the technical scheme in the embodiment of the present application, owing to adopting groove, it is arranged on the frame of described 2nd body, it is used for the technical scheme of accommodating described outer lens. It it is the display screen protruding from electronics due to outer lens, like this, the frame of the 2nd body arranges a groove, can be in a groove accommodating by outer lens when electronics is closed, solve due to add outer lens cause cannot closed electronic equipment, be inconvenient to the technical problem carried.
4, due to the technical scheme in the embodiment of the present application, owing to adopting the technical scheme being provided with flexible material in groove. Like this; outer lens after closure can with groove friction; outer lens causes scraping affect the translucent effect of outer lens, after adding flexible material in groove like this, solves the technical problem of outer lens scraping, it is achieved that the technique effect of protection electronics outer lens.
5, due to the technical scheme in the embodiment of the present application; owing to adopting, at least one contraposition projection is set on described protection screen; wherein; the alignment grooves that at least one contraposition described convexes to form is used for accommodating described wafer scale camera so that the technical scheme of the optical axis of the eyeglass of described wafer scale camera and the optical axis coincidence of described outer lens. Like this, on the protection screen of electronics, setting solves the inaccurate technical problem of wafer scale camera contraposition. Achieve the technique effect improving image definition.
Accompanying drawing explanation
In order to the technical scheme being illustrated more clearly in the embodiment of the present application or prior art, in embodiment being described below, the required accompanying drawing used is briefly described, it is clear that ground, the accompanying drawing in the following describes is only some embodiments of the present invention.
The sectional view of a kind of image collecting device that Fig. 1 is the embodiment of the present application one, provide in embodiment two;
Fig. 2 is the structure iron of a kind of electronics of offer in the embodiment of the present application two;
Fig. 3 is the sectional view of the first noumenon in Fig. 2;
Fig. 4 is the schema of the making method of a kind of electronics of offer in the embodiment of the present application three;
Fig. 5 a-5c is the schematic diagram of alignment grooves in the embodiment of the present application three.
Embodiment
The embodiment of the present invention provides a kind of image collecting device, and electronics, and the making method of electronics, in order to solve the lower technical problem of the picture clarity photographed in prior art.
Technical scheme in the embodiment of the present invention is solve above-mentioned technical problem, it is provided that a kind of image collecting device, and general thought is as follows:
Wafer scale camera;
Outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens;
Wherein, described outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives described wafer scale camera by the eyeglass of described wafer scale camera, infrared absorption filter mating plate generates the first image.
Technical scheme in the embodiment of the present application with the addition of outer lens above the eyeglass of wafer scale camera, owing to outer lens can converge the light of reference object reflection, it is possible to corrects difference and distortion better. So, efficiently solve the technical problem that the picture clarity photographed in prior art is lower.
Below in conjunction with accompanying drawing, the main of the embodiment of the present application technical scheme is realized principle, embodiment and the useful effect that should be able to reach it is explained in detail.
Embodiment one
Please refer to Fig. 1, it be the sectional view of a kind of image collecting device of offer in the embodiment of the present application one, comprising:
Wafer scale camera 12, outer lens 11, outer lens 11 overlaps above the eyeglass of wafer scale camera 12, and the optical axis coincidence of the optical axis of the eyeglass 121 of wafer scale camera and outer lens 11, wherein, outer lens 11 can converge the light of reference object reflection so that the image sensor 123 that the light after convergence arrives wafer scale camera by the eyeglass 121 of wafer scale camera, infrared absorption filter mating plate 122 generates the first image.
Optionally, the material of described outer lens 11 is rigid light transmissive material.
In a particular embodiment, outer lens 11 is rigid light transmissive material, such as the glass etc. of silica glass, sapphire, resin material or synthetic, it is possible to determine according to practical situation, and at this, the application does not limit.
In a particular embodiment, outer lens 11 is plano-convex lens, and plano-convex lens has the effect of converged light. From the optical design of camera lens, many group multi-disc camera lenses can better correct aberration and distortion. Namely the eyeglass number increased is more many, and the imaging effect of image is more good. Due in narrow frame notebook, the lens design of wafer scale camera 12 smaller, optical mirror slip is few, cause the image imaging effect taking out not good, above the eyeglass 121 of wafer scale camera 12 after an overlapping outer lens 11, owing to adding eyeglass number, the image collecting device in the application is made can better to correct aberration and distortion, the light that reference object can reflect after adding outer lens 121 123 converges on the image sensor more accurately so that imaging effect is better. So the application adds the not high problem of picture clarity that outer lens 11 solves the shooting of traditional images gathering device.
In a particular embodiment, wafer scale camera is made up of eyeglass 121, infrared absorption filter mating plate 122 and image sensor 123. outer lens 11 is arranged on wafer scale camera in the one side of interior eyeglass, when user uses image collecting device, the light of reference object reflection can through the outer lens 11 of image collecting device, enter wafer scale camera 12, through the eyeglass 121 of wafer scale camera, infrared absorption filter mating plate 122 arrives the image sensor 123 of wafer scale camera, according to certain arrangement mode, reference object resolved into pixel one by one, these pixels constitute the electronics image corresponding to reference object, numerary signal is converted to again by A/D converter, then could store in data mode. numerary signal is compressed by following microprocessor, and is converted to specific picture format, and the image file finally existed with numerary signal can be stored in built-in storer with the form specified, and generates the image of reference object.
Embodiment two
Please refer to Fig. 1, it is the sectional view of a kind of image collecting device of offer in the embodiment of the present application two; Fig. 2 is the structure iron of a kind of electronics that the application provides.
Based on the invention identical with the embodiment of the present application one design, the application implements two and additionally provides a kind of electronics, comprising:
The first noumenon 2;
2nd body 3;
Coupling device 4, described the first noumenon 2 is connected to described 2nd body 3 by described coupling device 4, and wherein, the angle value between described the first noumenon 2 and described 2nd body 3 is by rotating and change around described coupling device 4;
Image collecting device 1, described image collecting device 1 is arranged on the frame of described the first noumenon 2, comprise wafer scale camera 12 and outer lens 11, wherein, described outer lens 11 overlaps above the eyeglass 121 of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass 121 of described wafer scale camera and described outer lens 11; Described outer lens 11 can converge the light of reference object reflection so that the image sensor 123 that the light after convergence arrives described wafer scale camera by the eyeglass 121 of described wafer scale camera, infrared absorption filter mating plate 122 generates the first image.
Optionally, the material of described outer lens 11 is rigid light transmissive material.
Please refer to Fig. 3, optionally, described electronics also comprises:
Protection screen 21, is arranged on described the first noumenon 2, and described protection screen 21 is arranged between described outer lens 11 and described wafer scale camera 12, is used for protecting described the first noumenon 2.
In a particular embodiment, in order to protect the components and parts of the display screen 22 of electronics, wafer scale camera 12 and inside, arranging a protection screen 21 on the surface of the first noumenon display screen 22 side, it is rigid light transmissive material that described protection shields 21. This protection screen 21 is arranged between wafer scale camera 12 and outer lens 11, and namely outer lens 11 is arranged on the outside of the first noumenon protection screen 21, can reduce the thickness of the first noumenon 2 like this.
Optionally, described electronics also comprises:
Flexible printed circuit board 23, described flexible printed circuit board 23 is connected with described wafer scale camera 12;
Described flexible printed circuit board 23 also comprises extension portion 231, and the extension portion 231 of described flexible printed circuit board is arranged in the cavity between the side of described wafer scale camera 12 and the side of described the first noumenon 2.
Flexible printed circuit board, also known as " soft board ", is the printed wiring made with flexible insulating substrate. Flexible print circuit provides excellent electrical property, can meet design needs that are more small-sized and more high-density installation, also contributes to reducing assembling procedure and strengthening reliability. It is meet miniaturization of electronic products and the mobile only solution required. Flexible printed circuit board can freely bend, reels, fold, the dynamic bending of millions of times can be born and do not damage wire, can require to arrange arbitrarily according to space layout, and move arbitrarily at three-dimensional space and stretch, thus reach the integration that components and parts assembling connects with wire; Flexible printed circuit board can reduce the volume and weight of electronic product greatly, is suitable for the needs that electronic product develops to high-density, miniaturization, highly reliable direction. These advantages of flexible printed circuit board are applied in electronics by the application just, then can realize reducing electronics weight, reduce the thickness of electronics, reduce the frame of electronics, increase the multiple beneficial effect of screen accounting.
In a particular embodiment, between image sensor 123 side of flexible printed circuit board 23 and wafer scale camera and the frame of the first noumenon, because the area of wafer scale camera 12 is less than the area of flexible printed circuit board, so, flexible printed circuit board 23 has the outside that extension portion 231 extends in wafer scale camera 12, because the flexible printed circuit board 23 used in the application can bend and fold, so the extension portion 231 of flexible printed circuit board is bent in the cavity between wafer scale camera 12 side and the first noumenon side, so just can reduce the frame of the first noumenon, the screen accounting of display screen 22 is increased, the consumptive material of electronics can also be reduced simultaneously.
Optionally, described electronics also comprises;
Groove 31, is arranged on the frame of described 2nd body, is used for accommodating described outer lens 11.
In a particular embodiment, owing to outer lens 11 is arranged on the outside of the first noumenon 2, protrude from the first noumenon 2, when closing electronics, the first noumenon and the 2nd body cannot close, and outer lens 11 also can be worn because of contacting with the 2nd body 3 simultaneously, on the frame of the 2nd body 3, a groove 31 is set, it is possible to accommodating outer lens 11.
Optionally, it is provided with flexible material in described groove 31.
In a particular embodiment, in order to protect outer lens 11 better, avoid, when folding electronics, outer lens 11 is produced abrasion; being provided with flexible material in groove 31, flexible material comprises the material such as leather, foamed cotton, it is possible to determine according to practical situation; at this, the application does not limit.
Embodiment three
Please refer to Fig. 4, the embodiment of the present application provides the making method of a kind of electronics, and described method comprises:
S101: the first noumenon is connected to the 2nd body by coupling device, wherein, the angle value between described the first noumenon and described 2nd body changes by rotating around described coupling device;
S102: image collecting device is arranged on the frame of described the first noumenon, wherein, described image collecting device comprises wafer scale camera and outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens; Described outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives described wafer scale camera by the eyeglass of described wafer scale camera, infrared absorption filter mating plate generates the first image.
In a particular embodiment, being connected with the 2nd body with the first noumenon by coupling device, the first noumenon is that axle rotates around the 2nd body taking coupling device; Image collecting device is arranged on the frame of the first noumenon, image collecting device comprises outer lens and wafer scale camera, outer lens overlaps above the eyeglass of wafer scale camera, outer lens is plano-convex lens, wafer scale camera comprises eyeglass, infrared absorption filter mating plate and image sensor, when image collecting device works, the light of reference object reflection passes through outer lens, it is pooled to the eyeglass of wafer scale camera, arrive image sensor by infrared absorption filter mating plate again, then can generate the image of reference object.
Optionally, on the described frame that image collecting device is arranged on described the first noumenon, specifically comprise:
Arranging protection screen on described the first noumenon, described protection screen is arranged between described outer lens and described wafer scale camera, is used for protecting described the first noumenon.
Optionally, described arrange on described the first noumenon protection screen after, also comprise:
Arranging at least one contraposition on described protection screen protruding, wherein, the alignment grooves that at least one contraposition described convexes to form is used for accommodating described wafer scale camera so that the optical axis of the eyeglass of described wafer scale camera and the optical axis coincidence of described outer lens.
Optical axis, is called for short the medullary ray of light beam, or the symmetry axis of optical system. When light beam rotates on optical axis, any optical characteristics of light beam can not change. Optical lens must ensure the absolute coincidence of the optical axis of each eyeglass, otherwise, once deviation occurs, just there will be the inaccurate problem of serious focusing, the object photographed is very unclear. So to be ensured that the optical axis of outer lens and the lens light axis of wafer scale camera overlap in this application. Both the accurate location of wafer scale camera and outer lens had been ensured.
In the embodiment of the present application; the making processes of electronics arranges at least one contraposition in the inner side of protection screen protruding; at least one contraposition projection can form an alignment grooves; this alignment grooves just can accommodating wafer scale camera; wafer scale camera is made accurately to be fixed on protection screen; protection screen and outer lens are marked with the invisible signature identification of naked eyes, are coincided together by the signature identification of outer lens and protection screen by aligning machine platform so that outer lens is accurately fitted on protection screen. So just can ensure that wafer scale camera and outer lens are accurately fitted on protection screen.
In the embodiment of the present application, contraposition projection can be set to multiple pattern, such as, the pattern that contraposition projection 211 can be set in Fig. 5 a-5c, in Fig. 5 a, contraposition projection 211 can be set to the annular protrusion of square, and the alignment grooves of the protruding intermediate formation of contraposition just can accommodating wafer scale camera 12; In Fig. 5 b, contraposition projection can be set to be set to the projection of four broken line shapes, and the alignment grooves of the protruding intermediate formation of contraposition just can accommodating wafer scale camera 12; In Fig. 5 c, it is protruding that contraposition projection 211 is set to two broken line shapes, and the alignment grooves of the protruding intermediate formation of contraposition just can accommodating wafer scale camera 12. In this application, it is possible to set the pattern of contraposition projection according to practical situation, at this, the application does not limit.
In the embodiment of the present application, alignment grooves can lithographically, or contraposition projection is arranged on protection screen by the method such as laminating method, it is possible to determining according to practical situation, at this, the application does not limit.
Optionally, after on the described frame that image collecting device is arranged on described the first noumenon, also comprise:
Flexible printed circuit board is connected with described wafer scale camera;
Described flexible printed circuit board also comprises extension portion, and the extension portion of described flexible printed circuit board is arranged in the cavity between the side of described wafer scale camera and the side of described the first noumenon.
Optionally, after on the described frame that image collecting device is arranged on described the first noumenon, also comprise:
The frame of described 2nd body arranges a groove, and flexible material is set in described groove, be used for accommodating described outer lens.
By an embodiment in the above-described embodiment in the present invention or multiple embodiment, following technique effect at least can be realized:
1, due to the technical scheme in the embodiment of the present application, owing to adopting a kind of image collecting device, comprising: wafer scale camera; Outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the technique means of the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens, like this, outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives wafer scale camera by the eyeglass of wafer scale camera, infrared absorption filter mating plate generates the first image. So, efficiently solve the technical problem that picture clarity in prior art is lower. Achieve the technique effect improving picture imaging sharpness.
2, due to the technical scheme in the embodiment of the present application, owing to adopting flexible printed circuit board, described flexible printed circuit board is connected with described wafer scale camera; Described flexible printed circuit board also comprises extension portion, and the extension portion of described flexible printed circuit board is arranged on the technical scheme in the cavity between the side of described wafer scale camera and the side of described the first noumenon. So, it is achieved that reduce electronics frame, increase screen accounting, reduce the effect of electronics weight.
3, due to the technical scheme in the embodiment of the present application, owing to adopting groove, it is arranged on the frame of described 2nd body, it is used for the technical scheme of accommodating described outer lens. It it is the display screen protruding from electronics due to outer lens, like this, the frame of the 2nd body arranges a groove, can be in a groove accommodating by outer lens when electronics is closed, solve due to add outer lens cause cannot closed electronic equipment, be inconvenient to the technical problem carried. Achieve the technique effect of the convenient closed electronics being provided with outer lens.
4, due to the technical scheme in the embodiment of the present application, owing to adopting the technical scheme being provided with flexible material in groove. Like this; outer lens after closure can with groove friction; outer lens causes scraping affect the translucent effect of outer lens, after adding flexible material in groove like this, solves the technical problem of outer lens scraping, it is achieved that the technique effect of protection electronics outer lens.
5, due to the technical scheme in the embodiment of the present application; owing to adopting, at least one contraposition projection is set on described protection screen; wherein; the alignment grooves that at least one contraposition described convexes to form is used for accommodating described wafer scale camera so that the technical scheme of the optical axis of the eyeglass of described wafer scale camera and the optical axis coincidence of described outer lens. Like this, on the protection screen of electronics, setting solves the inaccurate technical problem of wafer scale camera contraposition. Achieve the accurate contraposition of outer lens and wafer scale camera optical axis, thus improve the technique effect of image definition.
Although having described the preferred embodiments of the present invention, but those skilled in the art once the substantially creative concept of cicada, then these embodiments can be made other change and amendment. Therefore, it is intended that the appended claims shall be construed comprise preferred embodiment and fall into all changes and the amendment of the scope of the invention.
Obviously, the present invention can be carried out various change and modification and not depart from the spirit and scope of the present invention by the technician of this area. Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these change and modification.
Claims (13)
1. an image collecting device, comprising:
Wafer scale camera;
Outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens;
Wherein, described outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives described wafer scale camera by the eyeglass of described wafer scale camera, infrared absorption filter mating plate generates the first image.
2. image collecting device as claimed in claim 1, it is characterised in that, the material of described outer lens is rigid light transmissive material.
3. an electronics, comprising:
The first noumenon;
2nd body;
Coupling device, described the first noumenon is connected to described 2nd body by described coupling device, and wherein, the angle value between described the first noumenon and described 2nd body changes by rotating around described coupling device;
Image collecting device, described image collecting device is arranged on the frame of described the first noumenon, comprise wafer scale camera and outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens; Described outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives described wafer scale camera by the eyeglass of described wafer scale camera, infrared absorption filter mating plate generates the first image.
4. electronics as claimed in claim 3, it is characterised in that, the material of described outer lens is rigid light transmissive material.
5. electronics as claimed in claim 3, it is characterised in that, described electronics also comprises:
Protection screen, is arranged on described the first noumenon, and described protection screen is arranged between described outer lens and described wafer scale camera, is used for protecting described the first noumenon.
6. electronics as claimed in claim 3, it is characterised in that, described electronics also comprises:
Flexible printed circuit board, described flexible printed circuit board is connected with described wafer scale camera;
Described flexible printed circuit board also comprises extension portion, and the extension portion of described flexible printed circuit board is arranged in the cavity between the side of described wafer scale camera and the side of described the first noumenon.
7. electronics as claimed in claim 3, it is characterised in that, described electronics also comprises;
Groove, is arranged on the frame of described 2nd body, is used for accommodating described outer lens.
8. electronics as claimed in claim 7, it is characterised in that, it is provided with flexible material in described groove.
9. a making method for electronics, comprising:
By coupling device, the first noumenon being connected to the 2nd body, wherein, the angle value between described the first noumenon and described 2nd body changes by rotating around described coupling device;
Image collecting device is arranged on the frame of described the first noumenon, wherein, described image collecting device comprises wafer scale camera and outer lens, wherein, described outer lens overlaps above the eyeglass of described wafer scale camera, and the optical axis coincidence of the optical axis of the eyeglass of described wafer scale camera and described outer lens; Described outer lens can converge the light of reference object reflection so that the image sensor that the light after convergence arrives described wafer scale camera by the eyeglass of described wafer scale camera, infrared absorption filter mating plate generates the first image.
10. method as claimed in claim 9, it is characterised in that, on the described frame that image collecting device is arranged on described the first noumenon, specifically comprise:
Arranging protection screen on described the first noumenon, described protection screen is arranged between described outer lens and described wafer scale camera, is used for protecting described the first noumenon.
11. methods as claimed in claim 10, it is characterised in that, described arrange on described the first noumenon protection screen after, also comprise:
Arranging at least one contraposition on described protection screen protruding, wherein, the alignment grooves that at least one contraposition described convexes to form is used for accommodating described wafer scale camera so that the optical axis of the eyeglass of described wafer scale camera and the optical axis coincidence of described outer lens.
12. methods as claimed in claim 9, it is characterised in that, after on the described frame that image collecting device is arranged on described the first noumenon, also comprise:
Flexible printed circuit board is connected with described wafer scale camera;
Described flexible printed circuit board also comprises extension portion, and the extension portion of described flexible printed circuit board is arranged in the cavity between the side of described wafer scale camera and the side of described the first noumenon.
13. methods as claimed in claim 9, it is characterised in that, after on the described frame that image collecting device is arranged on described the first noumenon, also comprise:
The frame of described 2nd body arranges a groove, and flexible material is set in described groove, be used for accommodating described outer lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511001328.6A CN105635534B (en) | 2015-12-28 | 2015-12-28 | Image acquisition device, electronic equipment and manufacturing method of electronic equipment |
Applications Claiming Priority (1)
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| WO2018019159A1 (en) * | 2016-07-25 | 2018-02-01 | 维沃移动通信有限公司 | Mobile terminal and manufacturing method thereof |
| CN107888813A (en) * | 2017-12-11 | 2018-04-06 | 广东欧珀移动通信有限公司 | CCD camera assembly and there is its electronic installation |
| CN109729251A (en) * | 2019-01-08 | 2019-05-07 | 京东方科技集团股份有限公司 | A kind of camera module and electronic equipment |
| WO2019114513A1 (en) * | 2017-12-11 | 2019-06-20 | Oppo广东移动通信有限公司 | Camera assembly and electronic device having same |
| CN110602280A (en) * | 2019-08-26 | 2019-12-20 | 武汉华星光电半导体显示技术有限公司 | Cover plate and display device |
| CN112444933A (en) * | 2019-08-14 | 2021-03-05 | 宁波舜宇光电信息有限公司 | Under-screen camera shooting assembly, camera shooting module, optical lens and manufacturing method of optical lens |
| US20230140342A1 (en) * | 2021-10-29 | 2023-05-04 | Flir Commercial Systems, Inc. | Wide field of view imaging systems and methods |
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| CN112444933A (en) * | 2019-08-14 | 2021-03-05 | 宁波舜宇光电信息有限公司 | Under-screen camera shooting assembly, camera shooting module, optical lens and manufacturing method of optical lens |
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| US20230140342A1 (en) * | 2021-10-29 | 2023-05-04 | Flir Commercial Systems, Inc. | Wide field of view imaging systems and methods |
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