CN1056340C - Thermal head - Google Patents
Thermal head Download PDFInfo
- Publication number
- CN1056340C CN1056340C CN93101762A CN93101762A CN1056340C CN 1056340 C CN1056340 C CN 1056340C CN 93101762 A CN93101762 A CN 93101762A CN 93101762 A CN93101762 A CN 93101762A CN 1056340 C CN1056340 C CN 1056340C
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- Prior art keywords
- heating
- substrate
- heating portion
- electrode wiring
- common electrode
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Abstract
To provide a thermal head formed on a smaller substrate, in which the lowering of the drop in voltage applied to a heating resistor is minimized. A circuit having a heating resistor is provided on the surface of a head substrate and a circuit having other electronic part is also provided to the rear of the substrate. Common electrodes are respectively formed on the surface and rear of the substrate and connector pins coming into contact with the common electrodes and connector pins coming into contact with the common electrodes 22b are attached to both rear side ends of the substrate and the common electrodes are connected to the front side end parts of the substrate at an equal interval by terminals.
Description
The present invention relates to be pressed in the heating head that uses on the printing platen.
In facsimile machine and printer, be a lot of being pressed on that the heating head that uses under the printing platen state is applied to print.Real the opening of disclosed Japanese patent application of the flat 5-38826 of disclosed Japanese Patent Application Laid-Open on February 19 in 1993, the flat 5-8420 of disclosed Japanese Patent Application Laid-Open on January 19, the flat 5-42695 of disclosed Japanese Patent Application Laid-Open on February 23 in 1993 in 1993 and on April 6th, 1993 this heating head is disclosed among the flat 5-26394 for example.Fig. 7 and Fig. 8 are the schematic diagram of traditional this heating head, wherein, on the front of the heating head substrate 50 of insulating properties, form: the heating resistor 51 of assortment on print scanned direction, drive this heating resistor 51 IC (usually just with integrated) 52, reach the conductor 53 that the two is with this.These heating resistors 51, IC52, other electronic units and the predetermined loop of conductor 53 formations that links electronic unit, this loop forms on the front of heating head substrate 50.The conductor wiring in loop (for example conductor 53) extends to heating head substrate 50 than the rear side end of length direction, is connected with the pin 54 that is connected that near being installed in rear side end central authorities the outside as plug receptacle connects usefulness.In addition, IC52 is covered, is protected by resin cover 55, and heating head substrate 50 does not use separately, is fixed on usually on the support plate of double as heat transmission.
Such heating head is that a heating head substrate 50 is pressed on the printing platen (not shown on the figure), is heated by heating resistor 51 and prints being sent to print papers such as heat sensitive paper between printing platen and the heating resistor 51.
, in the occasion that makes heating resistor 51 heatings, generally be voltage to be added to make the resistance heating that is equivalent to each seal point on common electrode and the individual electrode.Individual electrode has the number of seal point so many, common electrode and all heating resistor 51 is relevant has only, and the voltage of being scheduled to is added on it from the two ends of common electrode.But, so because the cause of voltage landing along with the central auxiliary voltage that proceeds to heating resistor 51 step-down gradually, near the heating of the resistance the central authorities becomes insufficient, the reason that print quality that Here it is is low.
On the other hand, light, thin, short, littleization along with recent various electronic equipments, make the parts of the equipment of being built in more small-sized, the trend of light weight risen, heating is no exception,, improves print quality if near the central authorities resistance is fully generated heat the heating head is maximized, like this, for heating head, guarantee print quality, the miniaturization of attempting to dwindle heating head substrate 50 particular importance that seems.
The purpose of this invention is to provide and to suppress to apply the heating head that can also dwindle the heating head substrate when voltage reduces to heating resistor.
Above-mentioned purpose is reached with the heating head that connects pin by of the present invention.Be that heating head of the present invention is a feature with following each point: the loop that will have the conductor of the heating resistor on the configuration scanning direction, the IC that drives this heating resistor and communication heating resistor and IC separately is arranged on the obverse and reverse of substrate; Couple together in the return conductors wiring of the side end of substrate substrate front side and reverse side; The return conductors wiring of the front of substrate and/or reverse side is connected to the outside than the side end of length direction that is installed in substrate to be connected on the connection pin of usefulness.Can consider the individual electrode wiring is located at the obverse and reverse of substrate, connect with connecting portion; Also can consider the common electrode wiring is located at the obverse and reverse of substrate, connect with connecting portion; Individual electrode wiring and common electrode can also be connected up and be located at the front and the reverse side of substrate, and the electrode wiring of substrate front side and the electrode wiring of substrate reverse side be coupled together accordingly with connecting portion.
In heating of the present invention head,, the loop suitably is configured in the obverse and reverse of substrate respectively, so the free degree of loop design becomes quite big because effectively utilize the area of the obverse and reverse of substrate.Thereby also shown in following embodiment, because dispensing loop suitably, the setting of selected common electrode wiring not only can the inhibition of certain degree ground applies the reduction of voltage to heating resistor, and it also is possible dwindling substrate.
The loop that is arranged on substrate front side and reverse side is made of the electronic unit of heating resistor and IC etc. and the conductor of communication electronic unit, be built up in the obverse and reverse which face thing preferably about these electronic units, in fact the substrate front side that is located at of heating resistor is appropriate.Again, because the loop of the obverse and reverse of substrate couples together at the side end of substrate, the connection pin is received in the front of substrate and/or the wiring of the return conductors of reverse side, so all the loop all couples together, the signal of telecommunication is outside by connecting the loop that pin imports substrate front side and reverse side from substrate.
Below, illustrate of the present invention with the heating head that connects pin based on embodiment.
Fig. 1 is the plane (front elevation) of the heating head of relevant one embodiment of the invention.
Fig. 2 is for the figure to the alive situation of heating resistor in heating head shown in Figure 1 is described.
Fig. 3 is the profile (Fig. 3 C) of front elevation (Fig. 3 A), reverse side figure (Fig. 3 B) and the pith of the heating head of relevant another embodiment of the present invention.
Fig. 4 is the front elevation (Fig. 4 A) and the reverse side figure (Fig. 4 B) of the heating head of relevant further embodiment of this invention.
Fig. 5 is the partial view of expression for an example of the conductor wiring in the loop of the positive and negative that are located at substrate in the heating head of the present invention.
Fig. 6 is that expression possesses the generate heat sectional drawing of formation of printing equipment of head of relevant the present invention.
Fig. 7 is the plane (front elevation) about the head of example heating before.
Fig. 8 is the profile of A-A section among Fig. 7.
Fig. 1 represents the plane (front elevation) about the heating head of one of them embodiment.Heating resistor 11 is configured on the print scanned direction on heating head substrate 10 fronts of insulating properties.Drive the obverse and reverse that the IC (not shown) of this heating resistor 11 and other electronic units suitably are distributed in substrate 10, be located at respectively on conductor wiring separately.In this embodiment, the positive upper edge substrate 10 at heating head substrate 10 forms common electrode 12 than the front side end of length direction and left and right sides side.Can understand that from Fig. 1 common electrode 12 extends in its front side along heating resistor 11, on common electrode 12 parts on the both sides of the rear side end of substrate 10, be housed outside the connection with connecting pin 15.Also have, the cardinal principle centre of the front side end of substrate 10 is equipped with the connection pin 16 that is connected usefulness with the other outside of common electrode 12 contacts.Connect pin 15,16 by these, separately be connected, constitute whole whole loops in the front of substrate 10 and the return conductors wiring of reverse side.
In such heating head, as shown in Figure 2, utilize and for example connect pin 15,16, the voltage of 24V is applied to the occasion of heating resistor 11 by common electrode 12 and individual electrode (not shown), because can be near the making alive central substantially position of heating resistor 11, the common electrode 12 own resistance of facing heating resistor 11 become considerably consistent.Consequently voltage reduces little (being about in the past half) of comparing in the past, and it is excellent that the heating efficiency of heating resistor becomes, and print quality improves.
In Fig. 3 A the expression another embodiment generate heat the head front elevation, Fig. 3 B represents its reverse side figure.Here, the embodiment with the front on the front of heating head substrate 20 is the same as heating resistor 21 formation common electrode 22a, also forms the common electrode 22b of same wiring simultaneously at reverse side.The connection pin of installing on the rear side end both sides of heating head substrate 20 25 and positive common electrode 22a and the common electrode 22b of reverse side contacts, and 26 of connection pins contact with the common electrode 22b of reverse side.In the present embodiment, common electrode 22a, 22b couple together (referring to Fig. 3 C) with the suitable terminal 27 that is arranged on heating head substrate 20 anterior end at regular intervals.In this heating head, the area of common electrode comes down to have increased, so the voltage drop on common electrode 22a, the 22b can be as much as possible little.
Reduce voltage as one and reduce to purpose change example, figure of no use represents, it is not located at common electrode the front and the reverse side of heating base plate 20, and heating resistor 21 is configured in the middle of substrate 20 leans on, the zone of heating resistor 21 front sides increases, and the area increase of a common electrode so part is favourable.
In the embodiment of Fig. 3 A, 3B, 3C, because the common electrode of heating head substrate front, reverse side connects with terminal, the part of the common electrode that the side place, the left and right sides of heating head substrate exists can be omitted, and such embodiment is shown in Fig. 4 A, 4B.The same with the embodiment of Fig. 3 A, 3B, 3C, form common electrode 32a, 32b on the positive and negative of heating head substrate 30, do not establish common electrode at the left and right sides of substrate.Like this, can shorten shared part of common electrode of left and right sides of heating head substrate 30, the dwindling of the head substrate of just can realizing generating heat.In addition, connect the cardinal principle middle position that pin 35 is installed in heating head substrate 30 rear side end, the link circuit conductor wiring.
Fig. 5 represents to be located at an example that is used for the conductor wiring of strobe signal among the return conductors wiring of positive and negative of heating head substrate 40.Here, the conductor wiring of positive and negative of heating head substrate 40 is common, be located at the positive quadrifid conductor wiring that is used for strobe signal be expressed as 1.～4., represent to be separated into the occasion of two parts with the conductor wiring 48,49 that is located at reverse side.That is, 1., 3. conductor wiring is used in terminal 47 short circuits of substrate-side end with conductor wiring 48, conductor wiring 2., 4. with the 47 ' short circuit of conductor wiring 49 usefulness terminals.Therefore, conductor wiring positive, reverse side routinizes.In addition, the connection pin (not shown) of conducting return conductors wiring is contained on the central substantially position of heating head substrate 40 rear side end.
In above each embodiment, can with done in the past like that, the additional preheating heating resistor is the purpose heater in the loop of the front of heating head substrate or reverse side.If heater, can fully heat heating resistor before beginning to print, printing bad being difficult to when beginning to print takes place, the time marquis in cold is effective especially.
Here, Fig. 6 is that expression possesses the generate heat figure of formation of printing equipment of head about the present invention.In this printing equipment 140, have: with the insertion mouth 144 of paper spare 142 insertions; Transfer the feed rollers 146 of this paper spare; Read the image sensor 148 of content on this paper spare; The printing portion 150 that prints; With the record pressing plate roller 152 of these printing portion 150 adjacency, and then on paper used for recording 154, carry out and print.Therefore, this device moves with the energy of power supply 156, and from inserting mouthful 144 insertion paper spares 142, paper spare 142 is separately delivered to image sensor 148 one by one by separator 143.Image transform is the signal of telecommunication on the front of paper spare 142 in this image sensor 148, carries out printing on record-paper in printing portion 150 based on this signal of telecommunication.Also have, corresponding to printing then this device use colour band 162 of coarse paper.Again, this figure is the device of the expression duplicator, facsimile machine etc. that are equipped with reading mechanism, also can be used on the printer that does not have reading mechanism about heating of the present invention.
In addition, Fig. 6 has represented to use pressing plate roller 152, the head that will generate heat is fixing and record-paper is delivered to the situation of the mode of roller, and heating head of the present invention is for using ribbon cartridge, heating head mobile mode (serial printer) on plate shaped pressing plate also can use.
Heating of the present invention head as above-mentionedly belong to small-sized and heating property is good.Thereby concerning the printing equipment of the heating head of invention with the application, this heating head with the application's device is except that simple to operate, and is also cheap and functional.
More than, enumerated the example of thinking the suitable embodiment of the present invention, the invention is not restricted to this, all changes and the improvement that much less do not break away from the essence of the technology of the present invention thought are possible.
Of the present invention with the heating head that connects pin, as described above, on the front of substrate, reverse side, the loop is set, the conductor wiring in the loop of positive, reverse side is coupled together at the side end of substrate, conductor wiring received with outside is connected on the connection pin of usefulness, thus dispensing loop suitably, the setting that selected common electrode connects up, can prevent to apply to heating resistor the reduction of voltage incessantly, it also is possible dwindling the heating head substrate as far as possible.
Claims (4)
1, a kind of heating head has:
Substrate,
Be located at the heating portion on the substrate, heating portion contain configuration a plurality of heating resistors,
Driving be included in the heating resistor in the heating portion drive division,
Connect drive division and heating portion and individually to be included in heating resistor in the heating portion carry out alive individual electrode wiring and
Connect drive division and heating portion and all carry out alive common electrode wiring together what be included in heating resistor in the heating portion,
Print by the heating of heating portion, it is characterized in that,
The wiring of above-mentioned individual electrode is located at the front and the reverse side of aforesaid substrate, and has the connecting portion that the individual electrode wiring that will be located at substrate front side and the individual electrode wiring that is located at the substrate reverse side couple together.
2, a kind of heating head has
Substrate,
Be located at the heating portion on the substrate, heating portion contain configuration a plurality of heating resistors,
Driving be included in the heating resistor in the heating portion drive division,
Connect drive division and heating portion and individually to be included in heating resistor in the heating portion carry out alive individual electrode wiring and
Connect drive division and heating portion and all carry out alive common electrode wiring together what be included in heating resistor in the heating portion,
Print by the heating of heating portion, it is characterized in that,
The wiring of above-mentioned common electrode is located at the front and the reverse side of aforesaid substrate, and has the connecting portion that the common electrode wiring that will be located at substrate front side and the common electrode wiring that is located at the substrate reverse side couple together.
3, a kind of heating head has
Substrate,
Be located at the heating portion on the substrate, heating portion contain configuration a plurality of heating resistors,
Driving be included in the heating resistor in the heating portion drive division,
Connect drive division and heating portion and individually to be included in heating resistor in the heating portion carry out alive individual electrode wiring and
Connect drive division and heating portion and all carry out alive common electrode wiring together what be included in heating resistor in the heating portion,
Print by the heating of heating portion, it is characterized in that
Wiring of above-mentioned individual electrode and common electrode wiring are located at the front and the reverse side of aforesaid substrate, and have the connecting portion that electrode wiring that will be located at substrate front side and the electrode wiring that is located at the substrate reverse side couple together.
4,, it is characterized in that in individual electrode wiring and/or common electrode wiring, the outside connection pin that connects usefulness being housed according to the heating head of claim 1 or 2 or 3.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5009492A JP3241790B2 (en) | 1992-03-09 | 1992-03-09 | Thermal head with connector pins |
| JP050094/1992 | 1992-03-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1077162A CN1077162A (en) | 1993-10-13 |
| CN1056340C true CN1056340C (en) | 2000-09-13 |
Family
ID=12849472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN93101762A Expired - Fee Related CN1056340C (en) | 1992-03-09 | 1993-03-09 | Thermal head |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3241790B2 (en) |
| CN (1) | CN1056340C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1323845C (en) * | 2002-10-29 | 2007-07-04 | 罗姆股份有限公司 | Thermal print head |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637161A (en) * | 1986-06-26 | 1988-01-13 | Aisin Seiki Co Ltd | Brushless motor |
| JPH03169567A (en) * | 1989-11-29 | 1991-07-23 | Rohm Co Ltd | Manufacture of thick film thermal head |
| JPH03272867A (en) * | 1990-03-22 | 1991-12-04 | Rohm Co Ltd | Thermal head |
| JPH03272870A (en) * | 1990-03-22 | 1991-12-04 | Rohm Co Ltd | Thick film type thermal head |
-
1992
- 1992-03-09 JP JP5009492A patent/JP3241790B2/en not_active Expired - Fee Related
-
1993
- 1993-03-09 CN CN93101762A patent/CN1056340C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637161A (en) * | 1986-06-26 | 1988-01-13 | Aisin Seiki Co Ltd | Brushless motor |
| JPH03169567A (en) * | 1989-11-29 | 1991-07-23 | Rohm Co Ltd | Manufacture of thick film thermal head |
| JPH03272867A (en) * | 1990-03-22 | 1991-12-04 | Rohm Co Ltd | Thermal head |
| JPH03272870A (en) * | 1990-03-22 | 1991-12-04 | Rohm Co Ltd | Thick film type thermal head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1323845C (en) * | 2002-10-29 | 2007-07-04 | 罗姆股份有限公司 | Thermal print head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05246063A (en) | 1993-09-24 |
| JP3241790B2 (en) | 2001-12-25 |
| CN1077162A (en) | 1993-10-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20000913 Termination date: 20100309 |