CN105633569A - LTCCC laminated wideband microstrip staggered triangle array antenna - Google Patents
LTCCC laminated wideband microstrip staggered triangle array antenna Download PDFInfo
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- CN105633569A CN105633569A CN201610130541.5A CN201610130541A CN105633569A CN 105633569 A CN105633569 A CN 105633569A CN 201610130541 A CN201610130541 A CN 201610130541A CN 105633569 A CN105633569 A CN 105633569A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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Abstract
The invention belongs to the technical field of antennas, and provides an LTCC laminated wideband microstrip staggered triangle array antenna. The LTCC laminated wideband microstrip staggered triangle array antenna is used for overcoming the disadvantages of an existing microstrip patch antenna in the aspects of giving consideration to high gain, wide frequency band and miniaturization. The antenna comprises an upper radiation metal patch antenna array, a lower radiation metal patch antenna array, an upper dielectric substrate, a lower dielectric substrate, a welding hole, a feed network, a grounding metal layer and a coaxial connector probe, and is characterized in that the upper dielectric substrate, the lower dielectric substrate and the grounding metal layer are respectively in the shapes of rectangles with teeth; the upper metal patch antenna array and the lower metal patch antenna array are respectively composed of upper unit metal patches and lower unit metal patches in the arrangement of staggered triangles; and the upper unit metal patches and the lower unit metal patches are respectively in the shapes of rectangles provided with semi-U-shaped grooves. The LTCC laminated wideband microstrip staggered triangle array antenna provided by the invention can well give the consideration to the performance requirements of the microstrip patch antenna such as high gain, wide frequency band and miniaturization, and is relatively simple in structure.
Description
Technical field
The invention belongs to antenna technical field, it is specifically related to the staggered triangular array antenna of a kind of LTCC lamination broad frequency micro-band.
Background technology
Microstrip antenna theory was extensively studied from the seventies in last century, and since obtaining large development, owing to it has that weight is light, section is low, volume is little, is easy to conformal, the advantages of simple structure and simple with carrier and is more and more subject to the favor of people, obtain the application got more and more in machine load, spaceborne, missile-borne antenna and medical microwave and the civilian field such as communicate. In current navigation communication system, microstrip antenna has almost accounted for more than half; But micro-strip paster antenna frequency band is very narrow, for solve this problem currently conventional approach comprise and adopt thick substrate or stepped appearance substrate, reduce substrate dielectric constant, increase substrate loss tangent, take multilayered structure, additional impedance coupling or passive paster etc.; But these modes are all the thickness to increase antenna or area as cost, are unfavorable for the development demand of the conformal and miniaturization of micro-strip paster antenna and carrier so that antenna complex structure, cannot take into account the demand of antenna widebandization with miniaturization.
LTCC (LTCC) technology is passive integration and the hybrid circuit encapsulation technology of a kind of advanced person. LTCC technology has numerous advantage, can play a great role for raising radar scanner level of integrated system, LTCC technology multiple stratification process have employed curtain coating and through hole technology, make easy to process, and layer thickness control more better than conventional baseplate material can be provided, the array antenna prepared by LTCC technology combines tightr between layers, solve because the existence of the gas cloud problem that makes the physical strength of antenna itself reduce, thus it is expected to the micro-strip paster antenna creation condition of the low section for development of new, wideband. The lamination advantage of LTCC technique changes the Design Mode of tradition microstrip antenna, and LTCC technique and microstrip antenna are combined into new research focus.
Summary of the invention
It is an object of the invention to overcome existing micro-strip paster antenna and taking into account the deficiency in high gain, broadband and miniaturization, a kind of lamination broad frequency micro-band based on LTCC technology is provided to interlock triangular array antenna, this antenna can take into account the performance requriements of micro-strip paster antenna high gain, broadband and miniaturization better, and structure is simpler.
Technical solution of the present invention is as follows:
The staggered triangular array antenna of a kind of LTCC lamination broad frequency micro-band, comprising: upper strata radiation metal patch antenna array (1), lower floor's radiation metal patch antenna array (2), upper layer medium substrate (3), layer dielectric substrate (4), welding hole (5), feed network (6), ground metal layer (7) and with shaft adapter probe (9); Described ground metal layer (7) is positioned at the lower surface of layer dielectric substrate (4), lower floor's radiation metal patch antenna array (2) and feed network (6) are all positioned at the upper surface of layer dielectric substrate (4), lower floor's radiation metal patch antenna array (2) is by feed network (6) feed, described feed network (6) connects same shaft adapter by the same shaft adapter probe (9) through layer dielectric substrate (4), and upper strata radiation metal patch antenna array (1) is positioned at the upper surface of upper layer medium substrate (3); Described upper strata radiation metal patch antenna array (1), lower floor's radiation metal patch antenna array (2) and ground metal layer (7) are arranged in parallel, and the corresponding limit of three is parallel to each other; Described upper layer medium substrate (3) is offered welding hole (5), to expose same shaft adapter probe (9), described ground metal layer (7) punching (10) is to pass with shaft adapter probe (9), and keeps insulating mutually with shaft adapter probe (9) and ground metal layer (7); It is characterized in that, described upper layer medium substrate (3), layer dielectric substrate (4) and ground metal layer (7) are the rectangle with sawtooth, described upper strata radiation metal patch antenna array (1), lower metal patch antenna array (2) are made up of upper unit metal patch, the lower unit metal patch in staggered rounded projections arranged respectively, and upper and lower layer unit metal patch is the rectangle being provided with half U type groove (8); Wherein, the half U type groove of upper unit metal patch is spliced by upper strata horizontal direction rectangular tank (13) is vertical with upper vertical direction rectangular tank (14), the non-splice ends of upper strata horizontal direction rectangular tank extends to metal patch lateral edges, is 2.5mm��3.5mm apart from metal patch upper limb (i.e. L2), and rectangular tank non-splice ends in upper vertical direction is apart from metal patch upper limb (i.e. L1) 0.5mm��1.5mm; The half U type groove of lower unit metal patch is spliced by lower floor's horizontal direction rectangular tank (15) is vertical with lower vertical direction rectangular tank (16), the two non-splice ends of rectangular tank are distance metal patch edge (i.e. L3, L4) 0.5mm��1.5mm respectively, rectangular tank center, lower vertical direction and lower unit metal patch center superposition.
Further, the microstrip line right angle turn of described feed network (6) adopts corner cut (11), and the T-shaped branch of microstrip line adopts cuts angle (12).
Described layer dielectric substrate (4) and upper layer medium substrate (3) adopt LTCC stupalith, and its relative permittivity is 2��100.
Described layer dielectric substrate (4) adopts LTCC curtain coating ceramic diaphragm lamination with upper layer medium substrate (3) and becomes, described feed network (6), ground metal layer (7), upper strata radiation metal patch antenna array (1) and lower floor's radiation metal patch antenna array (2) adopt silver slurry to be printed in respective media substrate surface, the staggered triangular array antenna of whole LTCC lamination broad frequency micro-band through curtain coating, printing, lamination, punch, fill out silver, isostatic pressed and sintering process after formed.
It should be understood that
In the present invention, the live width of the microstrip line of feed network should be optimized adjustment according to the specific inductivity size of substrate and thickness, to guarantee microstrip line intrinsic impedance and unit metal paster matches impedances. The size of upper unit metal patch and lower unit metal patch should make the center frequency points of the staggered triangular array antenna of whole LTCC lamination broad frequency micro-band and bandwidth reach index. And half U type groove (8) size of upper strata radiation metal patch antenna array and lower floor's radiation metal patch antenna array is optimized adjustment according to the specific inductivity size of substrate and thickness, tuning-points and the increase along with slot length can be increased, antenna resonant frequency reduces, when groove size is suitable, it is possible to expand bandwidth to a certain extent.
The useful effect of the present invention is:
1) antenna structure of the present invention adopts staggered triangular array to replace conventional rectangular array, it is possible to effectively saves the number of radiation element (unit metal paster) and reduces the size of antenna; 2) by offering half U type groove on radiation metal paster, the resonance adding antenna is counted, the efficient extn bandwidth of microstrip antenna; 3) fluting is adopted to be half U type groove, compared with conventional U-type groove aperture antenna, due to structural symmetry, metallic surface electric current is symmetrical, reduce half size, on its surface current, tuning-points almost without impact, can effectively realize the miniaturization of array antenna; 4) adopt parallel feed network, make each unit of antenna obtain equally distributed constant amplitude cophase excitation, make antenna structure simple. In addition, this antenna takes full advantage of lamination and the layer thickness control technology of LTCC advanced person, ensure that the tight gapless between different lamination combines, form fine and close integrated structure, it is to increase the stability of antenna and reliability. The present invention based on the LTCC micro-strip array antenna of the micro-strip paster antenna of organic medium or ceramic substrate and conventional rectangular arranged, can obtain wider bandwidth of an antenna and miniaturization more relative to routine.
Accompanying drawing explanation
The structure that Fig. 1 is the staggered triangular array antenna of LTCC lamination broad frequency micro-band of the present invention launches schematic diagram.
Fig. 2 is the top surface structure schematic diagram of the staggered triangular array antenna of LTCC lamination broad frequency micro-band of the present invention.
Fig. 3 is lower floor's radiation metal paster structure schematic diagram of the staggered triangular array antenna of LTCC lamination broad frequency micro-band of the present invention.
Fig. 4 is the structural representation of the ground metal layer of the staggered triangular array antenna of LTCC lamination broad frequency micro-band of the present invention.
Fig. 5 is lower floor's radiation metal paster detailed structure schematic diagram of the staggered triangular array antenna of LTCC lamination broad frequency micro-band of the present invention.
Fig. 6 is the upper unit metal patch structural representation of the staggered triangular array antenna of LTCC lamination broad frequency micro-band of the present invention.
Fig. 7 is the lower unit metal patch structural representation of the staggered triangular array antenna of LTCC lamination broad frequency micro-band of the present invention.
Fig. 8 is the staggered relation schematic diagram between triangular array operating frequency of antenna and reflection loss S11 of LTCC lamination broad frequency micro-band of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail, but embodiments of the present invention are not limited to this.
As shown in Figure 8, the center frequency point of the staggered triangular array antenna of the LTCC lamination broad frequency micro-band that the present embodiment provides is 9.98GHz, and for microband paste receives and dispatches public antenna, the present embodiment can realize the micro-strip paster antenna that impedance bandwidth is 1.36GHz.
In the present embodiment, the staggered triangular array antenna of a kind of LTCC lamination broad frequency micro-band, its structure as shown in Figures 1 to 7, comprising:
Layer dielectric substrate (4): this substrate adopts 10 thickness to be 0.1mm, specific inductivity be 5.9 LTCC tape casting diaphragm lamination become; Base lower surface adopts silver slurry printing ground metal layer (7); Upper surface of base plate printing lower floor's radiation metal patch antenna array (2) and feed network (6), through optimization, the live width of microstrip line guarantees that microstrip line intrinsic impedance is 50 ohm, and make every performance reach requirement index; Upper corresponding to shaft adapter probe (9) position punching (10) at feed network (6), diameter 0.6mm; At the corresponding circle not matel coated layer with the reserved diameter 3mm in shaft adapter probe (9) position of ground metal layer, ensure to insulate mutually with shaft adapter probe (9) and ground metal layer (7);
Upper layer medium substrate (3): this substrate adopts 10 thickness to be 0.1mm, specific inductivity be 5.9 LTCC tape casting diaphragm lamination become; Its upper surface printing upper strata radiation metal patch antenna array (1), upper layer medium substrate (3) offers welding hole (3) corresponding to same shaft adapter probe (9) position in lower floor's feed network (6), the hole of pore area ratio layer dielectric substrate is big, diameter is 1.5mm, to expose layer dielectric substrate with shaft adapter probe (9), convenient welding, to realize lower floor's radiation metal patch antenna array (2) by being connected with same shaft adapter through feed network with shaft adapter probe (9);
Upper strata radiation metal patch antenna array (1) is made up of in staggered rounded projections arranged 64 upper unit metal patches, each upper unit metal patch length is 6.5mm, width is 4.1mm, upper strata horizontal direction rectangular tank (13) length of composition half U type groove is 1.23mm, width is 0.85mm, is 3.17mm apart from metal patch upper limb distance (L2); Upper vertical direction rectangular tank (14) length is 3.32mm, width is 0.96mm, and distance metal patch upper limb (L1) is 1.08mm;
In interlocking, rounded projections arranged is formed the same lower unit metal patch corresponding with upper unit metal patch by 64 of lower floor's radiation metal patch antenna array (2), lower metal paster length is 4.8mm, width is 3.7mm, the length of lower floor's horizontal direction rectangular tank (15) of composition half U type groove be 1mm, wide be 0.5mm, be 0.85mm apart from metal patch left side edge (L4); The length in lower vertical direction rectangular tank (16) be 1.86mm, wide be 0.5mm, be 1.47mm apart from metal patch upper limb (L3). Being tested by the staggered triangular array antenna of above-mentioned LTCC lamination broad frequency micro-band, its result is as shown in Figure 8.
The above, be only the specific embodiment of the present invention, any feature disclosed in this specification, unless specifically stated otherwise, all can be replaced by other equivalences or the alternative features with similar object; Step in disclosed all features or all methods or process, except mutually exclusive feature and/or step, all can be combined in any way.
Claims (4)
1. the staggered triangular array antenna of LTCC lamination broad frequency micro-band, comprising: upper strata radiation metal patch antenna array (1), lower floor's radiation metal patch antenna array (2), upper layer medium substrate (3), layer dielectric substrate (4), welding hole (5), feed network (6), ground metal layer (7) and with shaft adapter probe (9); Described ground metal layer (7) is positioned at the lower surface of layer dielectric substrate (4), lower floor's radiation metal patch antenna array (2) and feed network (6) are all positioned at the upper surface of layer dielectric substrate (4), lower floor's radiation metal patch antenna array (2) is by feed network (6) feed, described feed network (6) connects same shaft adapter by the same shaft adapter probe (9) through layer dielectric substrate (4), and upper strata radiation metal patch antenna array (1) is positioned at the upper surface of upper layer medium substrate (3); Described upper strata radiation metal patch antenna array (1), lower floor's radiation metal patch antenna array (2) and ground metal layer (7) are arranged in parallel, and the corresponding limit of three is parallel to each other; Described upper layer medium substrate (3) is offered welding hole (5), to expose same shaft adapter probe (9), described ground metal layer (7) punching (10) is to pass with shaft adapter probe (9), and keeps insulating mutually with shaft adapter probe (9) and ground metal layer (7); It is characterized in that, described upper layer medium substrate (3), layer dielectric substrate (4) and ground metal layer (7) are the rectangle with sawtooth, described upper strata radiation metal patch antenna array (1), lower metal patch antenna array (2) are made up of upper unit metal patch, the lower unit metal patch in staggered rounded projections arranged respectively, and upper and lower layer unit metal patch is the rectangle being provided with half U type groove (8); Wherein, the half U type groove of upper unit metal patch is spliced by upper strata horizontal direction rectangular tank (13) is vertical with upper vertical direction rectangular tank (14), the non-splice ends of upper strata horizontal direction rectangular tank extends to metal patch lateral edges, is 2.5mm��3.5mm apart from metal patch upper limb, and rectangular tank non-splice ends in upper vertical direction is apart from metal patch upper limb 0.5mm��1mm; The half U type groove of lower unit metal patch is spliced by lower floor's horizontal direction rectangular tank (15) is vertical with lower vertical direction rectangular tank (16), the two non-splice ends of rectangular tank are distance metal patch edge 0.5mm��1mm respectively, rectangular tank center, lower vertical direction and lower unit metal patch center superposition.
2. by the staggered triangular array antenna of LTCC lamination broad frequency micro-band described in claim 1, it is characterized in that, the microstrip line right angle turn of described feed network (6) adopts corner cut (11), and the T-shaped branch of microstrip line adopts cuts angle (12).
3. by the staggered triangular array antenna of LTCC lamination broad frequency micro-band described in claim 1, it is characterised in that, described layer dielectric substrate (4) and upper layer medium substrate (3) adopt LTCC stupalith, and its relative permittivity is 2��100.
4. by the staggered triangular array antenna of LTCC lamination broad frequency micro-band described in claim 1, it is characterized in that, described layer dielectric substrate (4) adopts LTCC curtain coating ceramic diaphragm lamination with upper layer medium substrate (3) and becomes, described feed network (6), ground metal layer (7), upper strata radiation metal patch antenna array (1) and lower floor's radiation metal patch antenna array (2) adopt silver slurry to be printed in respective media substrate surface, the staggered triangular array antenna of whole LTCC lamination broad frequency micro-band is through curtain coating, printing, lamination, punching, fill out silver, formed after isostatic pressed and sintering process.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610130541.5A CN105633569A (en) | 2016-03-08 | 2016-03-08 | LTCCC laminated wideband microstrip staggered triangle array antenna |
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| CN201610130541.5A CN105633569A (en) | 2016-03-08 | 2016-03-08 | LTCCC laminated wideband microstrip staggered triangle array antenna |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108134203A (en) * | 2017-07-28 | 2018-06-08 | 电子科技大学 | Big unit spacing large-angle scanning phased array antenna based on electromagnetic bandgap structure |
| CN108198788A (en) * | 2017-12-13 | 2018-06-22 | 深圳市时代速信科技有限公司 | A kind of ltcc substrate that transmission performance is vertically interconnected with firing frequency signal |
| CN110167245A (en) * | 2019-05-24 | 2019-08-23 | 南京邮电大学 | A kind of plasma density measurement sensor based on LTCC antenna |
| WO2020155498A1 (en) * | 2019-01-31 | 2020-08-06 | 深圳市威富通讯技术有限公司 | Multiple-input multiple-output antenna and system |
| CN112134011A (en) * | 2020-09-24 | 2020-12-25 | 上海安费诺永亿通讯电子有限公司 | Probe antenna array and device for millimeter wave array antenna calibration |
| GB2587828A (en) * | 2019-01-31 | 2021-04-14 | Shenzhen Wave Telecommunication Tech Co Ltd | Multiple-Input Multiple-Output Antenna and System |
| CN114498011A (en) * | 2021-12-29 | 2022-05-13 | 中电科创智联(武汉)有限责任公司 | High-performance microstrip array antenna |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108134203A (en) * | 2017-07-28 | 2018-06-08 | 电子科技大学 | Big unit spacing large-angle scanning phased array antenna based on electromagnetic bandgap structure |
| CN108198788A (en) * | 2017-12-13 | 2018-06-22 | 深圳市时代速信科技有限公司 | A kind of ltcc substrate that transmission performance is vertically interconnected with firing frequency signal |
| WO2020155498A1 (en) * | 2019-01-31 | 2020-08-06 | 深圳市威富通讯技术有限公司 | Multiple-input multiple-output antenna and system |
| GB2587828A (en) * | 2019-01-31 | 2021-04-14 | Shenzhen Wave Telecommunication Tech Co Ltd | Multiple-Input Multiple-Output Antenna and System |
| CN110167245A (en) * | 2019-05-24 | 2019-08-23 | 南京邮电大学 | A kind of plasma density measurement sensor based on LTCC antenna |
| CN110167245B (en) * | 2019-05-24 | 2021-07-20 | 南京邮电大学 | Plasma density measurement sensor based on LTCC antenna |
| CN112134011A (en) * | 2020-09-24 | 2020-12-25 | 上海安费诺永亿通讯电子有限公司 | Probe antenna array and device for millimeter wave array antenna calibration |
| CN114498011A (en) * | 2021-12-29 | 2022-05-13 | 中电科创智联(武汉)有限责任公司 | High-performance microstrip array antenna |
| CN114498011B (en) * | 2021-12-29 | 2023-12-15 | 中电科创智联(武汉)有限责任公司 | High-performance microstrip array antenna |
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Application publication date: 20160601 |