CN105633568B - A kind of LTCC lamination broad frequency micro-band array antennas of special feed form - Google Patents

A kind of LTCC lamination broad frequency micro-band array antennas of special feed form Download PDF

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Publication number
CN105633568B
CN105633568B CN201610130279.4A CN201610130279A CN105633568B CN 105633568 B CN105633568 B CN 105633568B CN 201610130279 A CN201610130279 A CN 201610130279A CN 105633568 B CN105633568 B CN 105633568B
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metal patch
layer
antenna array
ltcc
patch antenna
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CN105633568A (en
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张怀武
李丽君
李贵栋
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems

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  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

The invention belongs to antenna technical fields, a kind of LTCC lamination broad frequency micro-band array antennas of special feed form are provided, to overcome the shortcomings of existing micro-strip paster antenna in terms of taking into account high-gain, broadband and miniaturization.The antenna includes upper layer radiation metal patch antenna array, lower layer's radiation metal patch antenna array, upper layer medium substrate, layer dielectric substrate, welding hole, feeding network and ground metal layer, the upper layer radiation metal patch antenna array, lower metal patch antenna array are arranged to make up by upper unit metal patch, lower unit metal patch by staggered triangles respectively, the upper unit metal patch is the quadrangle rectangle with corner cut, and the corner cut is isosceles triangle;One jiao of the lower unit metal patch is connect by tilting microstrip line with feeding network.The present invention can preferably take into account micro-strip paster antenna high-gain, broadband and the performance requirement of miniaturization, and structure is simpler.

Description

A kind of LTCC lamination broad frequency micro-band array antennas of special feed form
Technical field
The invention belongs to antenna technical fields, and in particular to a kind of LTCC lamination broad frequency micro-band arrays of special feed form Antenna.
Background technology
With flourishing for modern information technologies and new military revolution, future war will be towards land, sea, air, outer space, electricity five Dimension one development.For radar as electromagnetic wave detection equipment, the effect played on future battlefield will be more and more important.Array day Line emits as radar system and receives the component of electromagnetic wave, and the quality of performance directly affects the standard of radar detection result True property, so for radar system, the design of array antenna is particularly important.Array antenna has diversified form, And microstrip antenna has apparent advantage compared to other microwave antennas:It is small, light-weight, it is low section, easily conformal with carrier, Greatest irradiation direction is easily controllable with polarization, easily integrated with active/passive device etc..The array day formed with microstrip element Line, it is small, integrated level is high, and may be implemented to improve gain, enhancing directionality, improve radiation efficiency, reduce secondary lobe, formed The characteristics such as shaped-beam and multi-beam.As the gradually development of correlation theory and technology is perfect, micro-strip array antenna extensive use In fields such as radar system, communication, remote sensing.
LTCC (low-temperature co-fired ceramics) technology is a kind of advanced passive integration and hybrid circuit encapsulation technology.LTCC technology There are many merits, can play a great role for improving radar antenna system integrated level, be adopted during LTCC technology multiple stratification With curtain coating and through-hole technology so that it is easy to process, and layer thickness control more better than conventional base plate material can be provided, pass through Array antenna prepared by LTCC technology combines even closer between layers, solves because the presence of air layer makes antenna sheet The problem of mechanical strength of body reduces, thus be expected to create item to develop the micro-strip paster antenna of novel low section, wideband Part.The lamination advantage of LTCC techniques changes the design pattern of conventional microstrip antenna, for microstrip antenna miniaturization, widebandization one All it has been the hot spot studied both at home and abroad since straight, LTCC technology is combined with microstrip antenna to be beneficial to improve antenna performance, therefore, LTCC technology is combined with microstrip antenna has become new research hotspot.
Invention content
It is an object of the invention to overcome existing micro-strip paster antenna in terms of taking into account high-gain, broadband and miniaturization Deficiency, provide a kind of LTCC lamination broad frequency micro-band array antennas of special feed form, which can preferably take into account micro- With paster antenna high-gain, broadband and the performance requirement of miniaturization, and structure is simpler.
Technical solution of the present invention is as follows:
A kind of LTCC lamination broad frequency micro-band array antennas of special feed form, including:Upper layer radiation metal paster antenna Array (1), lower layer's radiation metal patch antenna array (2), upper layer medium substrate (3), layer dielectric substrate (4), welding hole (5), feeding network (6) and ground metal layer (7), the ground metal layer (7) are located at the lower surface of layer dielectric substrate (4), Lower layer's radiation metal patch antenna array (2) is respectively positioned on the upper surface of layer dielectric substrate (4), lower layer's spoke with feeding network (6) Radioglold category patch antenna array (2) is fed by feeding network (6), and upper layer radiation metal patch antenna array (1) is located at upper layer The upper surface of medium substrate (3);Medium substrate (3) side opens up welding hole (5) corresponding to feeding network (6), is presented for side;Institute It is mutual to state upper layer radiation metal patch antenna array (1), lower layer's radiation metal patch antenna array (2) and ground metal layer (7) Parallel, the corresponding sides of three are mutually parallel;It is characterized in that, the upper layer radiation metal patch antenna array (1), lower metal Patch antenna array (2) is arranged to make up by upper unit metal patch, lower unit metal patch by staggered triangles respectively, institute State upper unit metal patch be quadrangle rectangle with corner cut (8), the corner cut (8) be isosceles triangle, waist a length of 0.2~ 1mm;One jiao of the lower unit metal patch is connect by tilting microstrip line (11) with feeding network (6), the inclination micro-strip Line (11) angle of inclination is 45 degree, and length is 1.7~2.5mm.
Further, the upper layer medium substrate (3), layer dielectric substrate (4) and ground metal layer (7) are rectangle. The upper unit metal patch is correspondingly arranged with lower unit metal patch, and unit metal patch center overlaps.
The microstrip line right angle turn of the feeding network (6) uses corner cut (9), microstrip line T-type branch to use top rake (10)。
Using LTCC ceramic materials, relative dielectric constant is for the layer dielectric substrate (4) and upper layer medium substrate (3) 2~100.
The layer dielectric substrate (4) and upper layer medium substrate (3) are formed using LTCC curtain coating ceramic diaphragm laminations, described Feeding network (6), ground metal layer (7), upper layer radiation metal patch antenna array (1) and lower layer's radiation metal patch antenna array Row (2) are printed in respective media substrate surface using silver paste, the LTCC lamination broad frequency micro-band arrays day of entire special feed form Line through curtain coating, printing, lamination, punch, fill out silver, isostatic pressed and sintering process after formed.
It should be noted that:
In the present invention, the line width of the microstrip line of feeding network should be optimized according to the dielectric constant size and thickness of substrate It adjusts, to ensure microstrip line characteristic impedance and unit metal patch matches impedances.It should ensure that each lower layer is single in feeding network First metal patch obtains equal amplitude feed.From operation principle, inventive antenna structure uses staggered triangles array generation For conventional rectangular array, in the case of same element number, the effective size for reducing antenna;In addition, traditional feed form Feed placement is located at unit metal patch centre position, but by symmetry principle, and the present invention uses the LTCC of special shape feed Lamination broad frequency micro-band array antenna, unit metal patch size are the half of conventional metals patch size, and according to substrate Dielectric constant size and thickness carry out appropriate optimizing regulation;The feed placement of lower unit metal patch is located at metal patch simultaneously One end, and the inclination feed microstrip line for being 45 degree by angle of inclination, such feeding classification are ensureing that microstrip antenna is original simple A feed placement is increased on the basis of structure so that resonant frequency increases, and expands the beamwidth of antenna to a certain extent.
To sum up, the beneficial effects of the present invention are:
1) inventive antenna structure replaces conventional rectangular array using staggered triangles array, effectively saves radiation element Number and reduce the size of antenna;2) according to symmetry principle, feed placement is changed into one end of microband paste unit, is being protected In the case of demonstrate,proving antenna performance, microband paste size is reduced;3) it uses instead and tilts microstrip line as metal patch feed, in a disguised form increase Feed points while ensureing simple in structure, increase resonance points, extend microstrip antenna bandwidth.In addition, this day micro USB Divide and the advanced laminations of LTCC and layer thickness control technology is utilized, ensure that the close gapless between different laminations combines, formed Fine and close integral structure, improves the stability and reliability of antenna.The present invention is based on organic media or pottery relative to conventional The LTCC micro-strip array antennas of the micro-strip paster antenna of porcelain substrate and traditional feed placement can get the broader beamwidth of antenna and more Add miniaturization.
Description of the drawings
Fig. 1 is the structure expanded schematic diagram of the LTCC lamination broad frequency micro-band array antennas of the special feed form of the present invention.
Fig. 2 is the top surface structure schematic diagram of the LTCC lamination broad frequency micro-band array antennas of the special feed form of the present invention.
Fig. 3 is lower layer's radiation metal patch knot of the LTCC lamination broad frequency micro-band array antennas of the special feed form of the present invention Structure schematic diagram.
Fig. 4 is that the structure of the ground metal layer of the LTCC lamination broad frequency micro-band array antennas of the special feed form of the present invention is shown It is intended to.
Fig. 5 is the LTCC laminations broad frequency micro-band array antenna working frequency and reflection loss of the special feed form of the present invention Relationship between S11.
Specific implementation mode
The present invention is described in further detail with reference to the accompanying drawings and examples, but embodiments of the present invention are unlimited In this.
As shown in figure 5, the center of the LTCC lamination broad frequency micro-band array antennas of special feed form provided in this embodiment Frequency point is 9.93GHz, receives and dispatches common antenna for microband paste, the present embodiment can realize that the micro-strip that impedance bandwidth is 1.71GHz is pasted Chip antenna.
In the present embodiment, the LTCC lamination broad frequency micro-band array antennas of a kind of special feed form, structure such as Fig. 1 is extremely Shown in Fig. 4, including:
Upper layer medium substrate 3:The substrate uses 10 thickness for 0.1mm, and the LTCC tape casting diaphragms that dielectric constant is 5.9 are folded Piece forms, and upper surface of base plate prints upper layer radiation metal patch antenna array 1, and lower layer's feeding network is corresponded in top substrate layer right end Rectangular window is opened at 6, size 2mm*3mm exposes one section of microstrip line, facilitates welding;
Layer dielectric substrate 4:The substrate uses 10 thickness for 0.1mm, and the LTCC tape casting diaphragms that dielectric constant is 5.9 are folded Piece forms, and ground metal layer 7 is printed in lower surface, and lower layer's radiation metal patch antenna array 2 and feeding network are printed in upper surface 6, the line width of microstrip line ensures that microstrip line characteristic impedance is 50 ohm by optimization, and properties is made to reach requirement index;
The unit metal patch shape of upper layer radiation metal patch antenna array 1 and lower layer's radiation metal patch antenna array 2 The heart overlaps, and upper unit metal patch size is 6.9mm*4.7mm, the long 0.6mm of 8 waist of corner cut, lower unit metal patch size For 6.4mm*4.2mm, inclination 11 size of microstrip line is the long 2.4mm of bevel edge, width 0.9mm, microstrip line 12,17 rulers in feeding network 6 Very little identical, specially 3.8mm*0.47mm, microstrip line 13,16 sizes are identical, are specially 3.5mm*0.47mm, microstrip line 14,15 Size is identical, is specially 4.6mm*0.47mm.The LTCC lamination broad frequency micro-band array antennas of above-mentioned special feed form are carried out Test, the results are shown in Figure 5.
The above description is merely a specific embodiment, any feature disclosed in this specification, except non-specifically Narration, can be replaced by other alternative features that are equivalent or have similar purpose;Disclosed all features or all sides Method or in the process the step of, other than mutually exclusive feature and/or step, can be combined in any way.

Claims (6)

1. a kind of LTCC lamination broad frequency micro-band array antennas of special feed form, including:Upper layer radiation metal patch antenna array Arrange (1), lower layer's radiation metal patch antenna array (2), upper layer medium substrate (3), layer dielectric substrate (4), welding hole (5), Feeding network (6) and ground metal layer (7), the ground metal layer (7) are located at the lower surface of layer dielectric substrate (4), lower layer Radiation metal patch antenna array (2) is respectively positioned on the upper surface of layer dielectric substrate (4), lower layer's radiation gold with feeding network (6) Belong to patch antenna array (2) to feed by feeding network (6), upper layer radiation metal patch antenna array (1) is located at top dielectric The upper surface of substrate (3);Medium substrate (3) side opens up welding hole (5) corresponding to feeding network (6), is presented for side;On described Layer radiation metal patch antenna array (1), lower layer's radiation metal patch antenna array (2) are mutually parallel with ground metal layer (7), The corresponding sides of three are mutually parallel;It is characterized in that, the upper layer radiation metal patch antenna array (1), lower metal patch Aerial array (2) is arranged to make up by upper unit metal patch, lower unit metal patch by staggered triangles respectively, it is described on Layer unit metal patch is the quadrangle rectangle with corner cut (8), and the corner cut is isosceles triangle, a length of 0.2~1mm of waist;Institute It states one jiao of lower unit metal patch to connect with feeding network (6) by tilting microstrip line (11), the inclination microstrip line (11) Angle of inclination is 45 degree, and length is 1.7~2.5mm.
2. by the LTCC lamination broad frequency micro-band array antennas of special feed form described in claim 1, which is characterized in that on described Layer medium substrate (3), layer dielectric substrate (4) and ground metal layer (7) are rectangle.
3. by the LTCC lamination broad frequency micro-band array antennas of special feed form described in claim 1, which is characterized in that on described Layer unit metal patch is correspondingly arranged with lower unit metal patch, and unit metal patch center overlaps.
4. by the LTCC lamination broad frequency micro-band array antennas of special feed form described in claim 1, which is characterized in that the feedback The microstrip line right angle turn of electric network (6) uses corner cut (9), microstrip line T-type branch to use top rake (10).
5. by the LTCC lamination broad frequency micro-band array antennas of special feed form described in claim 1, which is characterized in that under described It is 2~100 that layer medium substrate (4) and upper layer medium substrate (3), which use LTCC ceramic materials, relative dielectric constant,.
6. by the LTCC lamination broad frequency micro-band array antennas of special feed form described in claim 1, which is characterized in that under described Layer medium substrate (4) and upper layer medium substrate (3) are formed using LTCC curtain coating ceramic diaphragm laminations, and the feeding network (6) connects Ground metal layer (7), upper layer radiation metal patch antenna array (1) and lower layer's radiation metal patch antenna array (2) use silver paste Be printed in respective media substrate surface, the LTCC lamination broad frequency micro-band array antennas of entire special feed form through curtain coating, printing, Lamination, punch, fill out silver, isostatic pressed and sintering process after formed.
CN201610130279.4A 2016-03-08 2016-03-08 A kind of LTCC lamination broad frequency micro-band array antennas of special feed form Expired - Fee Related CN105633568B (en)

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CN106646868B (en) * 2017-01-18 2022-07-22 河南师范大学 Near-field optical antenna with uniformly enhanced magnetic field
CN109390663A (en) * 2017-08-08 2019-02-26 京信通信系统(中国)有限公司 A kind of micro-strip radiating element and its antenna
CN107768842B (en) * 2017-09-14 2023-10-17 深圳市信维通信股份有限公司 Antenna unit and array antenna for 5G mobile communication
CN108539401B (en) * 2018-03-08 2020-07-21 电子科技大学 L TCC double-layer single-feed circularly polarized microstrip patch array antenna unit
CN109687122A (en) * 2018-11-27 2019-04-26 重庆秦嵩科技有限公司 A kind of broadband low minor lobe array antenna
CN110167245B (en) * 2019-05-24 2021-07-20 南京邮电大学 Plasma density measurement sensor based on LTCC antenna
CN112864606B (en) * 2019-11-12 2022-10-18 比亚迪股份有限公司 Antenna component and vehicle
CN111710994B (en) * 2020-06-17 2021-09-28 北京邮电大学 Thin 5G and next generation mobile terminal oriented broadband millimeter wave antenna array
CN113555678A (en) * 2021-06-21 2021-10-26 中国科学院重庆绿色智能技术研究院 Solar cell circularly polarized transparent satellite antenna based on transparent conductive film

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