CN105628181A - Micro-seismic earthquake sound monitoring instrument - Google Patents

Micro-seismic earthquake sound monitoring instrument Download PDF

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Publication number
CN105628181A
CN105628181A CN201510989263.4A CN201510989263A CN105628181A CN 105628181 A CN105628181 A CN 105628181A CN 201510989263 A CN201510989263 A CN 201510989263A CN 105628181 A CN105628181 A CN 105628181A
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CN
China
Prior art keywords
power amplifier
mcu microcontroller
circuit
power supply
transmission
Prior art date
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Pending
Application number
CN201510989263.4A
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Chinese (zh)
Inventor
王爱莲
郭晓红
高劲松
刘春莲
伍伟丽
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Taiyuan University of Technology
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Taiyuan University of Technology
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Filing date
Publication date
Application filed by Taiyuan University of Technology filed Critical Taiyuan University of Technology
Priority to CN201510989263.4A priority Critical patent/CN105628181A/en
Publication of CN105628181A publication Critical patent/CN105628181A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H17/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups
    • GPHYSICS
    • G08SIGNALLING
    • G08CTRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link

Abstract

The present invention provides a micro-seismic earthquake sound monitoring instrument which comprises a housing, a sound sensor, a power amplifier, a MCU microcontroller, a wireless signal transmission circuit, a power supply, a storage battery, a battery management circuit, and a printed circuit board. The printed circuit board is fixed at the bottom of the housing through a screw, and other components are fixed on the printed circuit board. The sound sensor is connected to the power amplifier which is connected to the MCU microcontroller. The MCU microcontroller is connected to the wireless signal transmission circuit. The power supply is connected to the sound sensor, the power amplifier, the MCU microcontroller, the wireless signal transmission circuit, and the battery management circuit. The battery management circuit is connected to the storage battery. According to the micro-seismic earthquake sound monitoring instrument, the radio transmission of a signal, the built-in storage battery, multi-point monitoring, a wireless ad hoc network and intelligent joint calculation are employed, the accuracy of a monitoring signal is improved, the interference of the monitoring signal is reduced, the reliability of the monitoring system is greatly improved, and the digitalization and intelligence of mine underground rock deformation monitoring are realized.

Description

Microseism ground sound monitor
Technical field
The invention belongs to seismic monitoring instrument field, relate to a kind of microseism ground sound monitor, it adopts radio transmissioning signal, and the intelligentized sound wave produced when territory, mine worked-out section subterranean strata is deformed upon is monitored and early warning.
Background technology
As long as there being mining behavior, goaf will be formed, and be adopt how many Ores or coal will form the goaf in how many spaces, coal annual in recent years and Ore Yield are more than several hundred million tons, because of the goaf caused and the geology subsidence disaster thus caused of digging up mine, in expansion trend on area, population suffered from disaster increases year by year, if occurring consequence of earthquake hardly imaginable especially.
Existing generally being processed substation by front end sound probe and data for mine down-hole ground sound monitor and form, data substation is generally made up of filter amplification circuit, converter, power supply changeover device, and data substation can support to access many group front ends sound probe; External power source is adopted to be powered during use, adopt the analogue signal that front end sound is popped one's head in by cable to transmit to data substation simultaneously, data substation processes the analogue signal from front end sound probe, analogue signal is amplified, filters and convert digital signal to, then pass through other digital signal cables and send data to computer.
And current existing ground sound monitor generally has the disadvantages that (1) sensor adopts cable mode output analogue signal, interference free performance is poor, accuracy is low; (2) commonly used external power source is powered and wire cable transmission signal, due to mine down-hole bad environments, it is easy to makes power supply or signal line short circuit or open circuit, reduces the reliability of monitoring system.
Summary of the invention
It is an object of the invention to overcome the deficiency of above-mentioned prior art, it is provided that a kind of microseism ground sound monitor, be based on digitized and radio signal transmission, built-in power sound monitor intelligently.
The present invention be employed technical scheme comprise that to achieve these goals,
A kind of microseism ground sound monitor, including shell, sound transducer, power amplifier, MCU microcontroller, transmission of wireless signals circuit, power supply, accumulator, battery management circuit and printed circuit board, sound transducer, power amplifier, MCU microcontroller, transmission of wireless signals circuit, power supply, accumulator, battery management circuit are installed on printed circuit board (PCB)
Sound transducer adopts the double; two electric capacity of 4522P type all referring to electret capacitor miaow head,
Power amplifier adopts the LM386 type low voltage power amplifier of TexasInstruments company of the U.S.
MCU microcontroller adopts the STM32F103 chip of ST company,
Transmission of wireless signals circuit adopts XBee-PRO (S2) module of DigiInternational company of the U.S., XBee-PRO (S2) module adopts Ember company EM250 chip, EM250 chip adopts Zigbee communication agreement and is internally integrated MCU controller, XBee-PRO (S2) module supply voltage is 2.1-3.6V, wireless radio transmission distance is more than 100m, there is UART communication interface
3rd foot (signal input) of described LM386 type low voltage power amplifier connects the positive pole of the double; two electric capacity miaow head of 4522P type, realizes amplification and the filtering of acoustical signal at other pin of LM386 connection electric capacity and resistance,
Accumulator adopts model to be the ferric phosphate lithium cell of 26650,
Battery management circuit adopts model to be CN3705 polymorphic type battery charging management integrated circuit,
5th foot of described LM386 type low voltage power amplifier connects the 14th foot (PA0) of MCU microcontroller STM32F103, it is achieved ADC analog-digital conversion function.
16th foot of MCU microcontroller STM32F103, the 17th foot connect the 2nd foot and the 3rd foot of XBee-PRO (S2) module, it is achieved the communication function of MCU microcontroller and transmission of wireless signals circuit.
The lithium iron phosphate storage battery unification of 26650 powers to each functional circuit through CN3705 polymorphic type battery charging management integrated circuit.
The invention has the beneficial effects as follows:
(1) present invention is by adopting the mode of radio transmissioning signal to improve the accuracy of monitor signal, reduces the interference of monitor signal.
(2) present invention is greatly improved the reliability of monitoring system by the mode of transmission of wireless signals mode and internal battery.
(3) present invention is monitored by multiple spot and wireless self-networking and intelligence combined calculation, improves the deformation of mine down-hole rock stratum about the reliability of sound wave monitoring and accuracy, it is achieved that the digitized of mine down-hole rock stratum deformation monitoring and intellectuality.
Accompanying drawing explanation
Fig. 1 is frame for movement schematic diagram of the present invention.
Fig. 2 is the present invention plane of arrangement figure at monitoring field.
Fig. 3 is sensor circuit connection diagram in the present invention.
Fig. 4 is electric power management circuit connection diagram in the present invention.
In figure: 1, shell; 2, sound transducer; 3, power amplifier; 4, MCU microcontroller; 5, transmission of wireless signals circuit; 6, power supply; 7, accumulator; 8, battery management circuit; 9, printed circuit board; 10, the mined out region of mine down-hole; 11, rock stratum, mine down-hole goaf; 12, microseism ground sound monitor.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described further:
Microseism ground sound monitor, as shown in Figure 1, including shell 1, sound transducer 2, power amplifier 3, MCU microcontroller 4, transmission of wireless signals circuit 5, power supply 6, accumulator 7, battery management circuit 8 and printed circuit board 9, described shell 1 adopts plastic production to form, printed circuit board 9 is screwed in the bottom of shell 1, sound transducer 2, power amplifier 3, MCU microcontroller 4, transmission of wireless signals circuit 5, power supply 6 and battery management circuit 8 are welded on printed circuit board (PCB) 9, accumulator 7 is fixing on a printed circuit board by battery fixed bin.
Sound transducer 2 adopts the double; two electric capacity of 4522P type all referring to electret capacitor miaow head, and resonant frequency range is 20-16,000Hz, and operating voltage range is 2-10V, and signal to noise ratio is be more than or equal to 58dBA, and sensitivity is-36dB��-50dB; Sound transducer 2 is connected with the input of power amplifier 3 and power supply 6;
Power amplifier 3 adopts the LM386 type low voltage power amplifier of TexasInstruments company of the U.S., and supply district is 5-18V, and voltage gain is 20 to 200, and the distortion factor is 0.2%; 3rd foot (signal input) of power amplifier 3 connects the positive pole of the double; two electric capacity miaow head of 4522P type, and the 1st foot of power amplifier 3, the 5th foot, the 7th foot, the 8th foot weld the wave filter being made up of resistance and electric capacity, it is achieved filtering of signal noise;
MCU microcontroller 4 adopts the STM32F103 chip of ST company, supply voltage is 2.0-3.6V, operation frequency is 72MHz, built-in FLASH is 64K, built-in SRAM is 20K, 12-Bit ADC analog-to-digital conversion device, and the 14th foot (PA0) of the ADC analog-digital converter interface STM32F103 of MCU microcontroller 4 connects the 5th foot of power amplifier 3, realize the conversion of analogue signal and digital signal
Transmission of wireless signals circuit 5 adopts XBee-PRO (S2) module of DigiInternational company of the U.S., XBee-PRO (S2) module adopts Ember company EM250 chip, EM250 chip adopts Zigbee communication agreement and is internally integrated MCU controller, XBee-PRO (S2) module supply voltage is 2.1-3.6V, this module carries wireless antenna, wireless radio transmission distance is more than 100m, there is UART communication interface, the UART communication interface of transmission of wireless signals circuit 5 is connected to the UART pin of MCU microcontroller 4, i.e. the 16th foot of the 2nd foot of XBee-PRO (S2) module and the 3rd foot and STM32F103, 17th foot connects, realize the communication function of MCU microcontroller and transmission of wireless signals circuit, concrete circuit connects as shown in Figure 3.
The input of power supply 6 is provided by accumulator 7, and accumulator 7 adopts model to be 26650 lithium iron phosphate storage batteries, and the rated voltage of output is 3.3V, power supply 6 is divided into secondary voltage conversion, first order employing IC chip LM2731 realizes 3V and turns 5V voltage, LM2731 connected mode connects according to suggestion circuit in chip data handbook, second level employing IC chip TP54231 realizes 5V and turns 3.3V voltage, the 5V power supply of power supply 6 part is supplied to sound transducer 2, power amplifier 3, transmission of wireless signals circuit 5, the 3.3V power supply of power supply 6 part is supplied to MCU microcontroller 4, battery management circuit 8 adopts model to be CN3705 polymorphic type battery charging management integrated circuit, input voltage is 7.5V to 28V, it is connected with accumulator 7, realize the management of charging and discharging to accumulator 7, the unified CN3705 chip through battery management circuit 8 of accumulator 7 powers to each functional circuit, battery management circuit 8 externally leaves binding post, realize accumulator 7 from external charging, concrete circuit connects as shown in Figure 4.
After microseism ground sound monitor completes according to above-mentioned process Installation, connect external power source, the software firmware of preprogrammed is downloaded in MCU microcontroller 4 and transmission of wireless signals circuit 5, and lithium iron phosphate storage battery 7 is charged, namely onsite application it is mountable to after lithium iron phosphate storage battery 7 is fully charged, first the mode of microseism ground sound monitor fixed mount is installed on monitoring point predetermined near mine down-hole goaf, computer connects the adapter of transmission of wireless signals circuit 5, receive the data after microseism ground sound monitor ready-made program algorithm calculates by the software kit on computer and show the acoustical signal of this monitoring point and analyze result.
When territory, mine worked-out section formation variations is monitored, multiple monitoring point can be set, it is referred to shown in Fig. 2 during site layout project microseism ground sound monitor, microseism ground sound monitor 12 is arranged near the rock stratum, mine down-hole goaf 11 that mine down-hole mined out region 10 is monitored, each monitoring point forms wireless data transmission network by Zigbee wireless self-networking agreement and realizes the transfer function of each data of monitoring point, when there is metamorphosis in rock stratum, by the MCU microcontroller 4 within microseism ground sound monitor and specific intelligence algorithm, the acoustic signals of monitoring is carried out intellectual analysis calculating, analyze degree and the position of rock stratum 11 deformation of mine down-hole goaf, analyzed the approximate range of rock stratum deformation by the combined calculation of multiple monitoring points simultaneously, realize the intellectuality of rock stratum 11, mine down-hole goaf deformation monitoring, increase substantially reliability and the accuracy of rock stratum 11, mine down-hole goaf deformation monitoring.

Claims (2)

1. a microseism ground sound monitor, it is characterized in that: include shell (1), sound transducer (2), power amplifier (3), MCU microcontroller (4), transmission of wireless signals circuit (5), power supply (6), accumulator (7), battery management circuit (8) and printed circuit board (9), described printed circuit board (9) is screwed in the bottom of shell (1), described sound transducer (2), power amplifier (3), MCU microcontroller (4), transmission of wireless signals circuit (5), power supply (6) and battery management circuit (8) are welded on printed circuit board (PCB) 9, accumulator (7) is fixed on printed circuit board (9) by battery fixed bin, sound transducer (2) is connected with power amplifier (3), power amplifier connects MCU microcontroller, MCU microcontroller connects transmission of wireless signals circuit, power supply (6) connects sound transducer (2), power amplifier (3), MCU microcontroller (4), transmission of wireless signals circuit (5) and battery management circuit (8), and battery management circuit (8) is connected with accumulator (7).
2. a kind of microseism ground according to claim 1 sound monitor, it is characterised in that: described sound transducer (2) adopts the double, two electric capacity of 4522P type all referring to electret capacitor miaow head, described power amplifier (3) adopts the LM386 type low voltage power amplifier of TexasInstruments company of the U.S., 3rd foot of LM386 type low voltage power amplifier connects the positive pole of the double, two electric capacity miaow head of 4522P type, 1st foot of LM386 type low voltage power amplifier, the 5th foot, the 7th foot, the 8th foot weld the wave filter being made up of resistance and electric capacity, it is achieved filtering of signal noise, described MCU microcontroller (4) adopts the STM32F103 chip of ST company, built-in FLASH and SRAM are also integrated with ADC analog-to-digital conversion device, 14th foot of the ADC analog-digital converter interface STM32F103 of described MCU microcontroller (4) connects the 5th foot of power amplifier (3), it is achieved the conversion of analogue signal and digital signal, described transmission of wireless signals circuit 5 adopts XBee-PRO (S2) module of DigiInternational company of the U.S., described XBee-PRO (S2) module adopts Ember company EM250 chip, EM250 chip adopts Zigbee communication agreement and is internally integrated controller, XBee-PRO (S2) module carries wireless antenna, there is UART communication interface, the UART communication interface of described transmission of wireless signals circuit (5) is connected to the UART pin of MCU microcontroller (4), it is achieved the communication function of MCU microcontroller (4) and transmission of wireless signals circuit (5), described accumulator (7) adopts model to be 26650 lithium iron phosphate storage batteries, and the rated voltage of output is 3.3V, the input of described power supply (6) is provided by accumulator (7), power supply (6) is divided into secondary voltage conversion, first order employing IC chip LM2731 realizes 3V and turns 5V voltage, second level employing IC chip TP54231 realizes 5V and turns 3.3V voltage, the 5V power supply of power supply (6) is supplied to sound transducer (2), power amplifier (3) and transmission of wireless signals circuit (5), the 3.3V power supply of power supply (6) is supplied to MCU microcontroller (4), described battery management circuit (8) adopts model to be CN3705 polymorphic type battery charging management integrated circuit, realize the management of charging and discharging to accumulator (7), described battery management circuit (8) is to being outside equipped with binding post, realize accumulator (7) from external charging.
CN201510989263.4A 2015-12-28 2015-12-28 Micro-seismic earthquake sound monitoring instrument Pending CN105628181A (en)

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CN107786932A (en) * 2016-08-26 2018-03-09 深圳市赛音电子有限公司 A kind of audio test system
CN108731794A (en) * 2018-05-22 2018-11-02 南方电网科学研究院有限责任公司 A kind of multifunctional tester

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107786932A (en) * 2016-08-26 2018-03-09 深圳市赛音电子有限公司 A kind of audio test system
CN108731794A (en) * 2018-05-22 2018-11-02 南方电网科学研究院有限责任公司 A kind of multifunctional tester

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Application publication date: 20160601