CN105627688A - Refrigeration control method and system of thermoelectric container - Google Patents
Refrigeration control method and system of thermoelectric container Download PDFInfo
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- CN105627688A CN105627688A CN201610013325.2A CN201610013325A CN105627688A CN 105627688 A CN105627688 A CN 105627688A CN 201610013325 A CN201610013325 A CN 201610013325A CN 105627688 A CN105627688 A CN 105627688A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/003—Arrangement or mounting of control or safety devices for movable devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2600/00—Control issues
- F25D2600/02—Timing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2700/00—Means for sensing or measuring; Sensors therefor
- F25D2700/12—Sensors measuring the inside temperature
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a refrigeration control method and system of a thermoelectric container. The method comprises the following steps: acquiring the internal temperature T1 of the thermoelectric container; if that the temperature T1 is higher than a preset high temperature is determined, controlling the supply voltage of a refrigeration plate of the thermoelectric container at a full voltage; if that the temperature T1 stays within a preset temperature reduction range is determined, controlling the supply voltage of the refrigeration plate at a first lower voltage; and if that the temperature T1 stays within a preset holding temperature range is determined, controlling the supply voltage of the refrigeration plate at a second lower voltage, wherein the first low voltage is less than the full voltage and greater than the second low voltage. According to the invention, by acquiring the internal temperature T1 of the thermoelectric container and controlling the value of the supply voltage of the refrigeration plate of according to the temperature T1, frequent control of the on and off of the refrigeration plate is avoided, the on-off frequency of the refrigeration plate is effectively reduced, the internal temperature of the thermoelectric container is evener, temperature fluctuation is reduced, the service life of the refrigeration plate is prolonged, and meanwhile noise and energy consumption are effectively reduced.
Description
Technical field
The present invention relates to refrigeration technology field, particularly relate to refrigeration control method and the system of a kind of semiconductor cooling-heating box.
Background technology
Along with the raising of the level of consumption of resident, people increasingly advocate the life of high-quality, and cool and hot box is increasingly becoming the basic configuration of people's daily life. Semiconductor cooling-heating box occupies bigger market because its volume is little, cost is low, be easy to the advantage leisure area out of doors such as movement. The refrigeration control method of conventional refrigeration hot tank adopts the method for " arrive shutoff temperature and just stop cooling piece, treat that temperature recovery just opens cooling piece to turn-on temperature ", causes that switching on and shutting down are frequent, and in refrigerator, temperature fluctuation is bigger; Core parts cooling piece step-down in service life; Energy consumption is big. The present invention is by obtaining the temperature T1 within cool and hot box, the magnitude of voltage of the supply voltage of the cooling piece of cool and hot box is controlled according to temperature T1, avoid and control being turned on and off of cooling piece frequently, effectively reduce the on-off times of cooling piece, make the temperature in cool and hot box more uniform, temperature fluctuation reduces, and extends cooling piece service life, effectively reduces energy consumption simultaneously.
Summary of the invention
The present invention is by obtaining the temperature T1 within cool and hot box, the magnitude of voltage of the supply voltage of the cooling piece of cool and hot box is controlled according to temperature T1, avoid and control being turned on and off of cooling piece frequently, effectively reduce the on-off times of cooling piece, make the temperature in cool and hot box more uniform, temperature fluctuation reduces, and extends cooling piece service life, effectively reduces energy consumption simultaneously.
For reaching this purpose, the present invention by the following technical solutions:
First aspect, the present invention proposes refrigeration control method and the system of a kind of semiconductor cooling-heating box, including:
Obtain the temperature T1 within cool and hot box;
If it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head;
If it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure;
If it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure;
Wherein, total head > the first low pressure > the second low pressure.
Wherein, the supply voltage of the described cooling piece of described control is after the second low pressure, also includes:
Determining that the persistent period that supply voltage is the second low pressure controlling described cooling piece is be more than or equal to the preset low-voltage temperature-keeping time, the supply voltage controlling described cooling piece is the 3rd low pressure;
Determine that the persistent period that supply voltage is the 3rd low pressure of described cooling piece is be more than or equal to preset stopping cooling time, closes the power supply of described cooling piece;
Wherein, the second low pressure > the 3rd low pressure.
Wherein, after the temperature T1 within described acquisition cool and hot box, also include:
If it is determined that described temperature T1 is less than or equal to preset low temperature temperature, the supply voltage controlling described cooling piece is the 3rd low pressure;
Determine that the persistent period that supply voltage is the 3rd low pressure of described cooling piece is be more than or equal to preset stopping cooling time, closes the power supply of described cooling piece;
Wherein, the second low pressure > the 3rd low pressure.
Wherein, described if it is determined that described temperature T1 is more than, after preset high-temperature temperature, also including: to control the rotating speed of fan of described cool and hot box for setting high rotating speed in advance;
Described if it is determined that after described temperature T1 is in preset cooling scope, also include: the rotating speed controlling the fan of described cool and hot box is the preset slow-speed of revolution;
Described if it is determined that after described temperature T1 is in preset heat-preserving range, also include: the rotating speed controlling the fan of described cool and hot box is the preset slow-speed of revolution;
Described if it is determined that described temperature T1 is less than or equal to, after preset low temperature temperature, also including: the fan controlling described cool and hot box quits work.
Wherein, this method also includes:
Periodically obtain the electric current of described cooling piece, it is determined that the described electric current not number of times within the scope of preset running current exceedes predetermined times threshold value, sends cooling piece fault-signal;
Periodically obtain the rotating speed of described fan, it is determined that described rotating speed, less than preset minimum speed, sends fan failure signal.
Wherein, described preset high-temperature temperature=cool and hot box design temperature Ts+0.5 DEG C; Described preset cooling ranges for: (Ts-0.5 DEG C, Ts+0.5 DEG C]; Described preset heat-preserving range is: (Ts-1 DEG C, Ts-0.5 DEG C]; Described preset low temperature temperature=cool and hot box design temperature Ts-1 DEG C; Described preset running current ranges for: (2.5A, 6.5A).
Second aspect, the present invention proposes the refrigeration control method of another kind of semiconductor cooling-heating box, including:
Confirmation cool and hot box is normal-power; Perform above-mentioned refrigeration control method;
Confirmation cool and hot box is low-power mode; Obtain the temperature T2 within cool and hot box; If it is determined that described temperature T2 is more than preset low temperature threshold value, the supply voltage controlling described cooling piece is the second low pressure; If it is determined that described temperature T2 is less than or equal to preset low temperature threshold value, the supply voltage controlling described cooling piece is the 3rd low pressure;
Wherein, the second low pressure > the 3rd low pressure.
Wherein, described confirmation cool and hot box is before low-power mode, also includes: confirm the enabling signal being not detected by described cool and hot box in preset time span.
Wherein, after the temperature T2 within described acquisition cool and hot box, also include: if it is determined that described temperature T2 is be more than or equal to prepattern switching temperature, then cool and hot box is converted to normal-power by low-power mode.
The third aspect, the present invention proposes the refrigeration control system of a kind of semiconductor cooling-heating box, including: the first temperature acquisition module, total head cooling module, low pressure cooling module and the first low-voltage temperature-keeping module;
Described first temperature acquisition module: for obtaining the temperature T1 within cool and hot box;
Described total head cooling module: for if it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head;
Described low pressure cooling module: for if it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure;
Described first low-voltage temperature-keeping module: for if it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure.
Wherein, native system also includes: insulation timing module, the second low-voltage temperature-keeping module, cooling piece turn off module, fan height rotational speed control module, fan slow-speed of revolution control module, fan stopping modular, cooling piece fault detection module and fan failure detection module;
Described insulation timing module: for determining that the persistent period that supply voltage is the second low pressure controlling described cooling piece is be more than or equal to the preset low-voltage temperature-keeping time, the supply voltage controlling described cooling piece is the 3rd low pressure;
Described second low-voltage temperature-keeping module: for if it is determined that described temperature T1 is less than or equal to preset low temperature temperature, the supply voltage controlling described cooling piece is the 3rd low pressure;
Described cooling piece turns off module: is used for the persistent period that supply voltage is the 3rd low pressure determining described cooling piece be more than or equal to preset stopping cooling time, closes the power supply of described cooling piece;
Described fan height rotational speed control module: be used for the rotating speed controlling the fan of described cool and hot box for setting high rotating speed in advance;
The described fan slow-speed of revolution controls module: the rotating speed of the fan for controlling described cool and hot box is the preset slow-speed of revolution;
Described fan stopping modular: the fan for controlling described cool and hot box quits work;
Described cooling piece fault detection module: for periodically obtaining the electric current of described cooling piece, it is determined that the described electric current not number of times within the scope of preset running current exceedes predetermined times threshold value, sends cooling piece fault-signal;
Described fan failure detection module: for periodically obtaining the rotating speed of described fan, it is determined that described rotating speed, less than preset minimum speed, sends fan failure signal.
Fourth aspect, the present invention proposes the refrigeration control system of another kind of semiconductor cooling-heating box, including: normal-power confirms that module, the first temperature acquisition module, total head cooling module, low pressure cooling module, the first low-voltage temperature-keeping module, low-power mode confirm module, the second temperature acquisition module, the second low-voltage temperature-keeping module, the 3rd low-voltage temperature-keeping module and mode switch module;
Described normal-power confirms module: be used for confirming that cool and hot box is normal-power;
Described first temperature acquisition module: for obtaining the temperature T1 within cool and hot box;
Described total head cooling module: for if it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head;
Described low pressure cooling module: for if it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure;
Described first low-voltage temperature-keeping module: for if it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure;
Described low-power mode confirms module: be used for confirming that cool and hot box is low-power mode;
Described second temperature acquisition module: for obtaining the temperature T2 within cool and hot box;
Described second low-voltage temperature-keeping module: for if it is determined that described temperature T2 is more than preset low temperature threshold value, the supply voltage controlling described cooling piece is the second low pressure;
Described 3rd low-voltage temperature-keeping module: for if it is determined that described temperature T2 is less than or equal to preset low temperature threshold value, the supply voltage controlling described cooling piece is the 3rd low pressure;
Shown mode switch module: for if it is determined that described temperature T2 is be more than or equal to prepattern switching temperature, then cool and hot box being converted to normal-power by low-power mode.
The method have the benefit that the present invention passes through to obtain the temperature T1 within cool and hot box, the magnitude of voltage of the supply voltage of the cooling piece of cool and hot box is controlled according to temperature T1, avoid and control being turned on and off of cooling piece frequently, effectively reduce the on-off times of cooling piece, make the temperature in cool and hot box more uniform, temperature fluctuation reduces, and extends cooling piece service life, effectively reduces energy consumption simultaneously.
Accompanying drawing explanation
Fig. 1 is the method flow diagram of the embodiment of the method one of the refrigeration control method of semiconductor cooling-heating box provided by the invention.
Fig. 2 is the method flow diagram of the embodiment of the method two of the refrigeration control method of semiconductor cooling-heating box provided by the invention.
Fig. 3 is the method flow diagram of a kind of optimal way of embodiment of the method two provided by the invention.
Fig. 4 is the method flow diagram of the another kind of optimal way of embodiment of the method two provided by the invention.
Fig. 5 is the method flow diagram of the embodiment of the method four of the refrigeration control method of semiconductor cooling-heating box provided by the invention.
Fig. 6 is the functional block diagram of the system embodiment one of the refrigeration control system of semiconductor cooling-heating box provided by the invention.
Fig. 7 is the functional block diagram of the system embodiment two of the refrigeration control system of semiconductor cooling-heating box provided by the invention.
Fig. 8 is the functional block diagram of the system embodiment three of the refrigeration control system of semiconductor cooling-heating box provided by the invention.
Fig. 9 is the refrigerating method effect comparison diagram with the refrigerating method effect of the semiconductor cooling-heating box of the present invention of conventional semiconductors cool and hot box.
Detailed description of the invention
Below in conjunction with accompanying drawing, further illustrate technical scheme by specific embodiment.
Embodiment one
With reference to Fig. 1, present embodiments provide the refrigeration control method of a kind of semiconductor cooling-heating box, including:
S101, acquisition temperature T1 within cool and hot box.
Periodically obtain the temperature T1 within cool and hot box, in order to control cool and hot box refrigeration more accurately, obtain the cycle as far as possible smaller, in order to guarantee the real-time temperature got within cool and hot box, the acquisition cycle in the present embodiment, best was the 1-10 second in seconds.
Obtain the temperature T1 within cool and hot box, temperature T1 and cool and hot box design temperature Ts is compared, the step performed after determining according to comparative result, control the temperature within cool and hot box and be maintained in the scope of [Ts-0.5 DEG C, Ts+0.5 DEG C].
S102 is if it is determined that described temperature T1 is more than preset high-temperature temperature, and the supply voltage controlling the cooling piece of described cool and hot box is total head.
If temperature T1 is more than preset high-temperature temperature, then the supply voltage of the cooling piece of described cool and hot box is total head, high-power cool and hot box is lowered the temperature; Preset high-temperature temperature is cool and hot box design temperature Ts+0.5 DEG C. The input voltage that total head is system is identical, and the magnitude of voltage of the input voltage of system is not specifically limited by the present invention, it is preferred that when the supply voltage of the cooling piece of the cool and hot box in the present embodiment is total head, the supply voltage of the cooling piece of cool and hot box is 12V.
S103 is if it is determined that described temperature T1 is in preset cooling scope, and the supply voltage controlling described cooling piece is the first low pressure.
If temperature T1 is in preset cooling scope, then the supply voltage of the cooling piece of described cool and hot box is the first low pressure, the suitable power reducing cooling piece; Preset cooling range for (Ts-0.5 DEG C, Ts+0.5 DEG C]. Wherein, by the input voltage of system is carried out suitable blood pressure lowering process, the supply voltage making final cooling piece is reduced to the first low pressure according to certain ratio on the basis of the input voltage of system, total head in the present invention > the first low pressure, in the present embodiment, the first low pressure is 8.5V; The supply voltage voltage reduction method on the basis of the input voltage of system realizing cooling piece is not particularly limited by the present embodiment, adopts reduction voltage circuit to realize blood pressure lowering in the present embodiment.
S104 is if it is determined that described temperature T1 is in preset heat-preserving range, and the supply voltage controlling described cooling piece is the second low pressure.
If temperature T1 is in preset heat-preserving range, illustrate that the temperature of now cool and hot box is of a sufficiently low, it is not necessary to provide too high voltage to the cooling piece of cool and hot box again, then the supply voltage of the cooling piece of cool and hot box is the second low pressure, the suitable power reducing cooling piece; Preset heat-preserving range be (Ts-1 DEG C, Ts-0.5 DEG C]. By the input voltage of system is carried out suitable blood pressure lowering process, the supply voltage making final cooling piece is reduced to the second low pressure according to certain ratio on the basis of the input voltage of system, first low pressure in the present invention > the second low pressure, it is preferred that the second low pressure is 5.5V; The supply voltage voltage reduction method on the basis of the input voltage of system realizing cooling piece is not particularly limited by the present embodiment, adopts reduction voltage circuit to realize blood pressure lowering in the present embodiment.
Wherein, step S102, step S103, step S104 select one carry out according to the temperature T1 obtained in step S101.
The present embodiment is by obtaining the temperature T1 within cool and hot box, the magnitude of voltage of the supply voltage of the cooling piece of cool and hot box is controlled according to temperature T1, avoid and control being turned on and off of cooling piece frequently, effectively reduce the on-off times of cooling piece, make the temperature in cool and hot box more uniform, temperature fluctuation reduces, and extends cooling piece service life, effectively reduces energy consumption simultaneously; Proving according to test data, the temperature fluctuations of cool and hot box can be controlled within 1 DEG C by the present embodiment.
Embodiment two
With reference to Fig. 2, present embodiments provide the refrigeration control method of another kind of semiconductor cooling-heating box, including:
S201, acquisition temperature T1 within cool and hot box.
S202 is if it is determined that described temperature T1 is more than preset high-temperature temperature, and the supply voltage controlling the cooling piece of described cool and hot box is total head.
S203 is if it is determined that described temperature T1 is in preset cooling scope, and the supply voltage controlling described cooling piece is the first low pressure.
S204 is if it is determined that described temperature T1 is in preset heat-preserving range, and the supply voltage controlling described cooling piece is the second low pressure.
Wherein, step S201, step S202, step S203, step S204 are identical with step S101, step S102, step S103, step S104 respectively, repeat no more herein; Wherein, step S202, step S203, step S204 select one carry out according to the temperature T1 obtained in step S201.
S205, determining that the persistent period that supply voltage is the second low pressure controlling described cooling piece is be more than or equal to the preset low-voltage temperature-keeping time, the supply voltage controlling described cooling piece is the 3rd low pressure.
Now, although the supply voltage of cooling piece is relatively low, but still in cooling state; In order to avoid the temperature within cool and hot box continues for reducing, the temperature within cool and hot box is enable to be maintained at [Ts-0.5 DEG C, Ts+0.5 DEG C] scope in, the persistent period that supply voltage is the second low pressure of record cooling piece, when the persistent period that supply voltage is the second low pressure of cooling piece more than the preset low-voltage temperature-keeping time time, reduce further the supply voltage of cooling piece. The preset low-voltage temperature-keeping time is not particularly limited by the present invention, it is preferred that the preset low-voltage temperature-keeping set of time in the present embodiment is 60 minutes.
By the input voltage of system is carried out suitable blood pressure lowering process so that the supply voltage of final cooling piece is reduced to the 3rd low pressure, the second low pressure in the present invention > the 3rd low pressure, wherein, the 3rd low pressure is 3V; The supply voltage voltage reduction method on the basis of the input voltage of system realizing cooling piece is not particularly limited by the present embodiment, adopts reduction voltage circuit to realize blood pressure lowering in the present embodiment.
S206, determine that persistent period that supply voltage is the 3rd low pressure of described cooling piece is be more than or equal to preset stopping cooling time, closes the power supply of described cooling piece.
When the supply voltage of cooling piece is three low pressure, still in cooling state, the persistent period that supply voltage is the 3rd low pressure of cooling piece is recorded, when the persistent period that supply voltage is the 3rd low pressure of cooling piece be more than or equal to preset stopping cooling time time, close the power supply of described cooling piece. Preset stopping cooling time being not particularly limited by the present invention, it is preferred that the preset stopping cooling time in the present embodiment is set to 5 minutes, additionally could be arranged to 10 minutes or 15 minutes.
After closing the power supply of described cooling piece, cooling piece quits work, and the temperature within cool and hot box can rise to some extent, when temperature is raised, according to the temperature T1 within the cool and hot box obtained, perform above-mentioned steps S201, step S202, step S203, step S204, step S205.
As shown in Figure 3, it is preferred that, after step S201, step S206 also includes:
Step S207 is if it is determined that described temperature T1 is less than or equal to preset low temperature temperature, and the supply voltage controlling described cooling piece is the 3rd low pressure.
If temperature T1 is less than or equal to preset low temperature temperature, illustrate that the temperature of now cool and hot box is of a sufficiently low, need not provide too high voltage to the cooling piece of cool and hot box again, then the supply voltage of the cooling piece of cool and hot box is the 3rd low pressure, the suitable power reducing cooling piece; Preset low temperature temperature is Ts-1 DEG C.
Wherein step S205 and step S206 is the 3rd low pressure for controlling the supply voltage of described cooling piece, and alternatively carries out.
As shown in Figure 4, the present embodiment also includes after step S202:
S208, control the rotating speed of fan of described cool and hot box for setting high rotating speed in advance.
If it is determined that described temperature T1 is more than preset high-temperature temperature in step S202, the supply voltage controlling the cooling piece of described cool and hot box is total head; Now the supply voltage of cooling piece is relatively big, and the power of cooling piece is higher, causes that cooling piece can produce higher heat, it is therefore desirable to control the rotating speed of fan of described cool and hot box for setting high rotating speed in advance, for cooling piece is effectively dispelled the heat.
Set high rotating speed in advance and be the rated speed of fan, the rated speed 2000rpm of the present embodiment fan.
Also include after step S203:
S209, the rotating speed controlling the fan of described cool and hot box are the preset slow-speed of revolution.
If it is determined that described temperature T1 is in preset cooling scope in step S203, the supply voltage controlling the cooling piece of described cool and hot box is the first low pressure; Now the supply voltage of cooling piece is less, the power of cooling piece is relatively low, but cooling piece still can produce corresponding heat, it is therefore desirable to the rotating speed controlling the fan of described cool and hot box is the preset slow-speed of revolution, cooling piece effectively can be dispelled the heat, and bigger noise will not be sent simultaneously; The preset slow-speed of revolution in this enforcement is 1500rpm.
Also include after step s 204:
S2010, the rotating speed controlling the fan of described cool and hot box are the preset slow-speed of revolution.
Step S2010 is identical with step S209, repeats no more herein.
Also include after step S205 or step S207:
S2011, the fan controlling described cool and hot box quit work.
The supply voltage controlling described cooling piece in step S205 is the 3rd low pressure, now the supply voltage of cooling piece is only 3V, the power of cooling piece is relatively low, and the supply voltage of shown cooling piece will be closed when step S206, the heat that now cooling piece produces can be ignored, be no longer necessary to cooling piece is dispelled the heat, then the fan controlling described cool and hot box quits work, and efficiency reduces energy consumption.
The present embodiment also includes:
S2012, periodicity obtain the electric current of described cooling piece, it is determined that the described electric current not number of times within the scope of preset running current exceedes predetermined times threshold value, sends cooling piece fault-signal.
The cycle that obtains of the electric current of cooling piece can be identical with the acquisition cycle of the temperature T1 within cool and hot box, it is also possible to differing, can be adjusted according to the actual demand of user, in the present embodiment, the acquisition cycle of the electric current of cooling piece is 30 minutes. Preset running current ranges for [2.5A, 6.5A]; Predetermined times threshold value can be adjusted according to the actual demand of user, and in the present embodiment, predetermined times threshold value is three times. Determine that the described electric current not number of times within the scope of preset running current can also be able to be discontinuous number of times for continuous print number of times, more reasonably, it is determined that it is determine that the continuous not number of times within the scope of preset running current of described electric current exceedes predetermined times threshold value that the described electric current not number of times within the scope of preset running current exceedes predetermined times threshold value.
S2013, periodicity obtain the rotating speed of described fan, it is determined that described rotating speed, less than preset minimum speed, sends fan failure signal.
The acquisition cycle obtaining the temperature T1 within cycle, cool and hot box of the cycle that the obtains electric current with cooling piece of the rotating speed of fan can be identical, can also differ, actual demand according to user can be adjusted, and in the present embodiment, the acquisition cycle of the electric current of cooling piece is 3 minutes. Preset minimum speed can be adjusted according to the actual demand of user, and in this enforcement, preset minimum speed is the 80% of fan's rated speed.
The present embodiment, by controlling the rotating speed of fan according to the temperature T1 obtained within cool and hot box, effectively reduces energy consumption, reduces noise; The fault that simultaneously can effectively judge cool and hot box is fan failure or cooling piece fault; According to test data, the present embodiment can effectively reduce the energy consumption of 10%, average reduction noise 3dB.
Embodiment three
With reference to Fig. 5, present embodiments provide the refrigeration control method of another kind of semiconductor cooling-heating box, including:
S301, confirm to be not detected by the enabling signal of described cool and hot box in preset time span.
The enabling signal of cool and hot box is detected by micro-control module, if being not detected by the enabling signal of described cool and hot box in preset time span, then illustrate that the utilization rate of cool and hot box is relatively low in preset time span, it is not necessary to high-power work, now, then step S302 is continued executing with. Wherein, preset time span can be adjusted according to the actual demand of user, and time span preset in the present embodiment is 72 hours.
S302, determine that cool and hot box is low-power mode.
The refrigeration control method of the cool and hot box of embodiment one to embodiment two is defined as normal-power; When micro-control module is not detected by the enabling signal of described cool and hot box in preset time span, then controls cool and hot box and enter low-power mode.
S303, acquisition temperature T2 within cool and hot box.
After controlling cool and hot box entrance low-power mode, still the temperature within cool and hot box is obtained, it is now periodically obtain the temperature T2 within cool and hot box, the acquisition cycle of the temperature T2 within cool and hot box is different from the acquisition cycle of the temperature T1 within cool and hot box, temperature T2 within cool and hot box obtains the acquisition cycle more than the temperature T1 within cool and hot box in the cycle, in the present embodiment, the acquisition cycle of the temperature T2 within cool and hot box is 24 hours.
Obtain the temperature T2 within cool and hot box, temperature T2 and cool and hot box design temperature Ts is compared, select how next step performs according to comparative result.
S304 is if it is determined that described temperature T2 is more than preset low temperature threshold value, and the supply voltage controlling described cooling piece is the second low pressure.
When temperature T2 is more than preset low temperature threshold value, the supply voltage controlling described cooling piece is the second low pressure, enables cool and hot box to lower the temperature under low-power; Wherein, preset low temperature threshold value can be adjusted according to the actual demand of user, and in the present embodiment, preset low temperature threshold value is Ts-1 DEG C.
S305, the rotating speed controlling the fan of described cool and hot box are the preset slow-speed of revolution.
S306 is if it is determined that described temperature T2 is less than or equal to preset low temperature threshold value, and the supply voltage controlling described cooling piece is the 3rd low pressure.
When temperature T2 is less than or equal to preset low temperature threshold value, now cool and hot box needs not continue to cooling, then the supply voltage controlling described cooling piece is the 3rd low pressure; Preset low temperature threshold value can be adjusted according to the actual demand of user, and in the present embodiment, preset low temperature threshold value is Ts-1.
S307, the fan controlling described cool and hot box quit work.
Cool and hot box if it is determined that described temperature T2 is be more than or equal to prepattern switching temperature, is then converted to as normal-power by S308 by low-power mode.
Owing to cool and hot box is when low-power mode, substantially no longer lower the temperature, temperature within cool and hot box can rise to some extent, in order to keep the temperature within cool and hot box can relative constancy, temperature T2 is be more than or equal to prepattern switching temperature, then cool and hot box is converted to normal-power by low-power mode, performs by embodiment one to embodiment two step.
S309, periodicity obtain the electric current of described cooling piece, it is determined that the described electric current not number of times within the scope of preset running current exceedes predetermined times threshold value, sends cooling piece fault-signal.
S3010, periodicity obtain the rotating speed of described fan, it is determined that described rotating speed, less than preset minimum speed, sends fan failure signal.
Wherein, step S309, step S3010 are identical with step S2012, step S2013 respectively, repeat no more herein.
Present embodiments provide the refrigeration control method of a kind of low-power mode, make cool and hot box reduce energy consumption further when not using for a long time.
Embodiment four
With reference to Fig. 6, present embodiments provide the refrigeration control system of a kind of semiconductor cooling-heating box.
The refrigeration control system present embodiments providing a kind of semiconductor cooling-heating box includes:
First temperature acquisition module 101: for obtaining the temperature T1 within cool and hot box.
Total head cooling module 102: for if it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head.
Low pressure cooling module 103: for if it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure.
First low-voltage temperature-keeping module 104: for if it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure.
The present embodiment is by obtaining the temperature T1 within cool and hot box, the magnitude of voltage of the supply voltage of the cooling piece of cool and hot box is controlled according to temperature T1, avoid and control being turned on and off of cooling piece frequently, effectively reduce the on-off times of cooling piece, make the temperature in cool and hot box more uniform, temperature fluctuation reduces, and extends cooling piece service life, effectively reduces energy consumption simultaneously.
Embodiment five
With reference to Fig. 7, present embodiments providing the refrigeration control system of a kind of semiconductor cooling-heating box, corresponding with the refrigeration control method of the semiconductor cooling-heating box that embodiment two provides, not yet detailed part is referred to embodiment two.
The refrigeration control system present embodiments providing a kind of semiconductor cooling-heating box includes:
First temperature acquisition module 201: for obtaining the temperature T1 within cool and hot box.
Total head cooling module 202: for if it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head.
Low pressure cooling module 203: for if it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure.
First low-voltage temperature-keeping module 204: for if it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure.
Insulation timing module 205: for determining that the persistent period that supply voltage is the second low pressure controlling described cooling piece is be more than or equal to the preset low-voltage temperature-keeping time, the supply voltage controlling described cooling piece is the 3rd low pressure.
Second low-voltage temperature-keeping module 206: for if it is determined that described temperature T1 is less than or equal to preset low temperature temperature, the supply voltage controlling described cooling piece is the 3rd low pressure.
Cooling piece turns off module 207: is used for the persistent period that supply voltage is the 3rd low pressure determining described cooling piece be more than or equal to preset stopping cooling time, closes the power supply of described cooling piece.
Fan height rotational speed control module 208: be used for the rotating speed controlling the fan of described cool and hot box for setting high rotating speed in advance.
The fan slow-speed of revolution controls module 209: the rotating speed of the fan for controlling described cool and hot box is the preset slow-speed of revolution.
Fan stopping modular 210: the fan for controlling described cool and hot box quits work.
Cooling piece fault detection module 211: for periodically obtaining the electric current of described cooling piece, it is determined that the described electric current not number of times within the scope of preset running current exceedes predetermined times threshold value, sends cooling piece fault-signal.
Fan failure detection module 212: for periodically obtaining the rotating speed of described fan, it is determined that described rotating speed, less than preset minimum speed, sends fan failure signal.
The present embodiment, by controlling the rotating speed of fan according to the temperature T1 obtained within cool and hot box, effectively reduces energy consumption, reduces noise; The fault that simultaneously can effectively judge cool and hot box is fan failure or cooling piece fault.
Embodiment six
With reference to Fig. 8, present embodiments providing the refrigeration control system of a kind of semiconductor cooling-heating box, the video broadcasting method of the help refresh memory provided with embodiment four is corresponding, and not yet detailed part is referred to embodiment four.
The refrigeration control system present embodiments providing a kind of semiconductor cooling-heating box includes:
Normal-power confirms module 301: be used for confirming that cool and hot box is normal-power.
First temperature acquisition module 302: for obtaining the temperature T1 within cool and hot box.
Total head cooling module 303: for if it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head.
Low pressure cooling module 304: for if it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure.
First low-voltage temperature-keeping module 305: for if it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure.
Low-power mode confirms module 306: be used for confirming that cool and hot box is low-power mode.
Second temperature acquisition module 307: for obtaining the temperature T2 within cool and hot box.
Second low-voltage temperature-keeping module 308: for if it is determined that described temperature T2 is more than preset low temperature threshold value, the supply voltage controlling described cooling piece is the second low pressure.
3rd low-voltage temperature-keeping module 309: for if it is determined that described temperature T2 is less than or equal to preset low temperature threshold value, the supply voltage controlling described cooling piece is the 3rd low pressure.
Mode switch module 310: for if it is determined that described temperature T2 is be more than or equal to prepattern switching temperature, then cool and hot box being converted to normal-power by low-power mode.
Present embodiments provide the refrigeration control method of a kind of low-power mode, make cool and hot box reduce energy consumption further when not using for a long time.
The refrigeration control method present invention of semiconductor cooling-heating box provided by the invention is by obtaining the temperature T1 within cool and hot box, the magnitude of voltage of the supply voltage of the cooling piece of cool and hot box is controlled according to temperature T1, avoid and control being turned on and off of cooling piece frequently, effectively reduce the on-off times of cooling piece, make the temperature in cool and hot box more uniform, temperature fluctuation reduces, and extends cooling piece service life; Control the rotating speed of the fan of cool and hot box according to temperature T1 simultaneously, effectively reduce fan energy consumption, reduce the noise of cool and hot box simultaneously, the fault that the detection of the electric current of cooling piece and the rotating speed of fan can preferentially judge cool and hot box is to be caused by cooling piece fault or fan failure, it is simple to the maintenance of cool and hot box; According to it have been experienced that energy consumption can be reduced by more than 10% by the refrigeration control method of semiconductor cooling-heating box provided by the invention, when not using cool and hot box for a long time, energy consumption reduction becomes apparent from; The internal temperature of cool and hot box is more uniform, and the floating of the internal temperature of cool and hot box can control �� less than 1 DEG C, and average noise can reduce 3dB.
The know-why of the embodiment of the present invention is described above in association with specific embodiment; these describe and are intended merely to the principle explaining the embodiment of the present invention; and the restriction to embodiment of the present invention protection domain can not be construed to by any way; those skilled in the art need not pay performing creative labour can associate other detailed description of the invention of the embodiment of the present invention, and these modes fall within the protection domain of the embodiment of the present invention.
Claims (10)
1. the refrigeration control method of a semiconductor cooling-heating box, it is characterised in that including:
Obtain the temperature T1 within cool and hot box;
If it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head;
If it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure;
If it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure;
Wherein, total head > the first low pressure > the second low pressure.
2. refrigeration control method according to claim 1, it is characterised in that the supply voltage of the described cooling piece of described control is after the second low pressure, also includes:
Determining that the persistent period that supply voltage is the second low pressure controlling described cooling piece is be more than or equal to the preset low-voltage temperature-keeping time, the supply voltage controlling described cooling piece is the 3rd low pressure;
Determine that the persistent period that supply voltage is the 3rd low pressure of described cooling piece is be more than or equal to preset stopping cooling time, closes the power supply of described cooling piece;
Wherein, the second low pressure > the 3rd low pressure.
3. refrigeration control method according to claim 1, it is characterised in that after the temperature T1 within described acquisition cool and hot box, also include:
If it is determined that described temperature T1 is less than or equal to preset low temperature temperature, the supply voltage controlling described cooling piece is the 3rd low pressure;
Determine that the persistent period that supply voltage is the 3rd low pressure of described cooling piece is be more than or equal to preset stopping cooling time, closes the power supply of described cooling piece;
Wherein, the second low pressure > the 3rd low pressure.
4. refrigeration control method according to claim 3, it is characterised in that:
Described if it is determined that described temperature T1 is more than, after preset high-temperature temperature, also including: to control the rotating speed of fan of described cool and hot box for setting high rotating speed in advance;
Described if it is determined that after described temperature T1 is in preset cooling scope, also include: the rotating speed controlling the fan of described cool and hot box is the preset slow-speed of revolution;
Described if it is determined that after described temperature T1 is in preset heat-preserving range, also include: the rotating speed controlling the fan of described cool and hot box is the preset slow-speed of revolution;
Described if it is determined that described temperature T1 is less than or equal to, after preset low temperature temperature, also including: the fan controlling described cool and hot box quits work.
5. refrigeration control method according to claim 4, it is characterised in that also include:
Periodically obtain the electric current of described cooling piece, it is determined that the described electric current not number of times within the scope of preset running current exceedes predetermined times threshold value, sends cooling piece fault-signal;
Periodically obtain the rotating speed of described fan, it is determined that described rotating speed, less than preset minimum speed, sends fan failure signal;
Described preset high-temperature temperature=cool and hot box design temperature Ts+0.5 DEG C;
Described preset cooling ranges for: (Ts-0.5 DEG C, Ts+0.5 DEG C];
Described preset heat-preserving range is: (Ts-1 DEG C, Ts-0.5 DEG C];
Described preset low temperature temperature=cool and hot box design temperature Ts-1 DEG C;
Described preset running current ranges for: (2.5A, 6.5A).
6. the refrigeration control method of a semiconductor cooling-heating box, it is characterised in that including:
Confirmation cool and hot box is normal-power; Perform the refrigeration control method described in claim 1 to 5 any one;
Confirmation cool and hot box is low-power mode; Obtain the temperature T2 within cool and hot box; If it is determined that described temperature T2 is more than preset low temperature threshold value, the supply voltage controlling described cooling piece is the second low pressure; If it is determined that described temperature T2 is less than or equal to preset low temperature threshold value, the supply voltage controlling described cooling piece is the 3rd low pressure;
Wherein, the second low pressure > the 3rd low pressure.
7. refrigeration control method according to claim 6, it is characterised in that described confirmation cool and hot box is before low-power mode, also includes:
Confirm the enabling signal being not detected by described cool and hot box in preset time span;
After temperature T2 within described acquisition cool and hot box, also include:
If it is determined that described temperature T2 is be more than or equal to prepattern switching temperature, then cool and hot box is converted to normal-power by low-power mode.
8. the refrigeration control system of a semiconductor cooling-heating box, it is characterised in that including: the first temperature acquisition module, total head cooling module, low pressure cooling module and the first low-voltage temperature-keeping module;
Described first temperature acquisition module: for obtaining the temperature T1 within cool and hot box;
Described total head cooling module: for if it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head;
Described low pressure cooling module: for if it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure;
Described first low-voltage temperature-keeping module: for if it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure.
9. refrigeration control system according to claim 8, it is characterized in that, also include: insulation timing module, the second low-voltage temperature-keeping module, cooling piece turn off module, fan height rotational speed control module, fan slow-speed of revolution control module, fan stopping modular, cooling piece fault detection module and fan failure detection module;
Described insulation timing module: for determining that the persistent period that supply voltage is the second low pressure controlling described cooling piece is be more than or equal to the preset low-voltage temperature-keeping time, the supply voltage controlling described cooling piece is the 3rd low pressure;
Described second low-voltage temperature-keeping module: for if it is determined that described temperature T1 is less than or equal to preset low temperature temperature, the supply voltage controlling described cooling piece is the 3rd low pressure;
Described cooling piece turns off module: is used for the persistent period that supply voltage is the 3rd low pressure determining described cooling piece be more than or equal to preset stopping cooling time, closes the power supply of described cooling piece;
Described fan height rotational speed control module: be used for the rotating speed controlling the fan of described cool and hot box for setting high rotating speed in advance;
The described fan slow-speed of revolution controls module: the rotating speed of the fan for controlling described cool and hot box is the preset slow-speed of revolution;
Described fan stopping modular: the fan for controlling described cool and hot box quits work;
Described cooling piece fault detection module: for periodically obtaining the electric current of described cooling piece, it is determined that the described electric current not number of times within the scope of preset running current exceedes predetermined times threshold value, sends cooling piece fault-signal;
Described fan failure detection module: for periodically obtaining the rotating speed of described fan, it is determined that described rotating speed, less than preset minimum speed, sends fan failure signal.
10. the refrigeration control system of a semiconductor cooling-heating box, it is characterized in that, including: normal-power confirms that module, the first temperature acquisition module, total head cooling module, low pressure cooling module, the first low-voltage temperature-keeping module, low-power mode confirm module, the second temperature acquisition module, the second low-voltage temperature-keeping module, the 3rd low-voltage temperature-keeping module and mode switch module;
Described normal-power confirms module: be used for confirming that cool and hot box is normal-power;
Described first temperature acquisition module: for obtaining the temperature T1 within cool and hot box;
Described total head cooling module: for if it is determined that described temperature T1 is more than preset high-temperature temperature, the supply voltage controlling the cooling piece of described cool and hot box is total head;
Described low pressure cooling module: for if it is determined that described temperature T1 is in preset cooling scope, the supply voltage controlling described cooling piece is the first low pressure;
Described first low-voltage temperature-keeping module: for if it is determined that described temperature T1 is in preset heat-preserving range, the supply voltage controlling described cooling piece is the second low pressure;
Described low-power mode confirms module: be used for confirming that cool and hot box is low-power mode;
Described second temperature acquisition module: for obtaining the temperature T2 within cool and hot box;
Described second low-voltage temperature-keeping module: for if it is determined that described temperature T2 is more than preset low temperature threshold value, the supply voltage controlling described cooling piece is the second low pressure;
Described 3rd low-voltage temperature-keeping module: for if it is determined that described temperature T2 is less than or equal to preset low temperature threshold value, the supply voltage controlling described cooling piece is the 3rd low pressure;
Shown mode switch module: for if it is determined that described temperature T2 is be more than or equal to prepattern switching temperature, then cool and hot box being converted to normal-power by low-power mode.
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| CN111174515A (en) * | 2020-01-16 | 2020-05-19 | 天津商业大学 | Intelligent control system for refrigeration house according to temperature fluctuation |
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