CN105619689A - Injection molding technology for carrier tape discs - Google Patents
Injection molding technology for carrier tape discs Download PDFInfo
- Publication number
- CN105619689A CN105619689A CN201610001891.1A CN201610001891A CN105619689A CN 105619689 A CN105619689 A CN 105619689A CN 201610001891 A CN201610001891 A CN 201610001891A CN 105619689 A CN105619689 A CN 105619689A
- Authority
- CN
- China
- Prior art keywords
- temperature
- injection
- heated
- section
- injection tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76531—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2025/00—Use of polymers of vinyl-aromatic compounds or derivatives thereof as moulding material
- B29K2025/04—Polymers of styrene
- B29K2025/06—PS, i.e. polystyrene
Abstract
The invention discloses an injection molding technology for carrier tape discs. The injection molding technology comprises steps as follows: a, PS (polystyrene) plastic is selected; b, an injection molding machine with the jet velocity being 470-480 mm/s is selected; c, a first section of an injection barrel is heated to the temperature of 328-332 DEG C, a second section of the injection barrel is heated to the temperature of 328-332 DEG C, a third section of the injection barrel is heated to the temperature of 313-317 DEG C, a fourth section of the injection barrel is heated to the temperature of 249-251 DEG C, and a nozzle is heated to the temperature of 268-272 DEG C; d, a flow distribution plate is heated to the temperature of 250-270 DEG C, a hot nozzle is divided into two parts, the part, close to a hot plate, of the hot nozzle has the temperature of 270-290 DEG C, and the part, far away from the hot plate, of the hot nozzle has the temperature of 230-240 DEG C; e, an injection mold with two cavities is selected, and both a male mold and a female mold are cooled to the temperature of 10-13 DEG C; f, the plastic in the step a is subjected to treatment in the step c, the step d and the step e sequentially by the aid of the injection molding machine in the step b, and the injection molding time of the injection molding machine is 0.5 s; g, pressure maintaining is performed: the pressure maintaining pressure is 350-380 bar, and the pressure maintaining time is 0.15-0.25 s; h, cooling molding is performed; i, demolding is performed: the male mold and the female mold are separated after products are cooled, the injection-molded products are taken out, and the yield is high.
Description
Technical field
The present invention relates to a kind of mechanical field, more specifically, it relates to a kind of carrier band dish Shooting Technique.
Background technology
Carrier band dish, is primarily adapted for use in the packaging of the mounting technology of thin film, electronic devices and components, quasiconductor patch capacitor resistance electron-like part, carrying and conveying, during use, by thinfilms on carrier band dish, facilitates transport and the use of thin film.
If application number is the Chinese patent of 201520096313.1, it discloses a kind of carrier band dish, this carrier band dish includes dish axle and is arranged on positive card and the helical cast face at dish axle two ends, and owing to main the played effect of positive card and helical cast face is when winding film is on dish axle time, thin film can be played one and block effect by positive card and helical cast face, prevent from causing thin film damaged in the processes such as transport, storage, and the intensity that words so just align card and helical cast face does not have great requirement. And in order to save material as much as possible, reduce cost, for the thickness of positive card and helical cast face, yes gets over Bao Yuehao.
Owing to carrier band dish is injection molding molding, therefore for the processing mode of carrier band dish, the mode of injection molding is adopted to be processed often, if application number is the Chinese patent of 201310602649.6, it discloses a kind of injection molding process, by this Shooting Technique, can effectively simplify procedure of processing, save material, shorten molding cycle, automaticity is high, but the raw material that this moulding process adopts is ABS, and the decomposition temperature of ABS is at 250 DEG C, therefore in its adapted to injection system preprocessing process, what its temperature adopted will less than 250 DEG C, and owing to the melt temperature of ABS is at 217-237 DEG C, therefore heating system is wanted then to need the regular hour by melted for ABS, this jet velocity also having resulted in injection machine can not be too fast, and the words that the jet velocity of injection machine is slow, then cause that the ABS mobility when entering mold cavity forming is very poor, if and to process the relatively thin positive card of wall thickness and helical cast face, then can cause that ABS easily condenses, and then cause that yield rate is low.
Summary of the invention
For the deficiency that prior art exists, it is an object of the invention to provide a kind of carrier band dish Shooting Technique that can improve processed finished products rate.
For achieving the above object, the technical scheme is that a kind of carrier band dish Shooting Technique, comprise the steps:
A, select PS plastics;
B, selection jet velocity are the injection machine of 470-480mm/s;
C, injection tube heat: injection tube first paragraph is heated to 328-332 DEG C, and injection tube second segment is heated to 328-332 DEG C, and injection tube the 3rd section is heated to 313-317 DEG C, and injection tube the 4th section is heated to 249-251 DEG C, and nozzle is heated to 268-272 DEG C;
D, hot flow path heat: heating flow distribution plate to 250-270 degree Celsius, Jiang Rezui is divided into two parts, and hot mouth is 270-290 DEG C near the temperature of thermal plate portion, and hot mouth is 230-240 DEG C away from the temperature of thermal plate portion;
E, injection mold pretreatment: select the injection mold in mould two chamber, and the punch of mould and die are all cooled to 10-13 degree;
F, by the injection machine in step b, the plastics in step a being passed sequentially through step c, step d and step e, the injection time of injection machine is 0.5s;
G, pressurize: dwell pressure is 350-380bar, the dwell time is 0.15-0.25s;
H, cooling molding;
I, the demoulding: after product cooling, punch separates with die, is taken out by the product of injection formed.
Preferably, in step c, the temperature of injection tube first paragraph is 330 DEG C.
Preferably, in step c, the temperature of injection tube first paragraph is identical with the temperature of injection tube second segment.
Preferably, in step c, the temperature of injection tube the 3rd section is 315 DEG C.
Preferably, in step c, the temperature of injection tube the 4th section is 250 DEG C.
Preferably, in step d, the temperature of flow distribution plate is 260 DEG C.
Preferably, in step d, hot mouth is 280 degrees Celsius near the temperature of thermal plate portion.
Preferably, in step d, hot mouth is 235 DEG C away from the temperature of thermal plate portion.
Compared with prior art, the invention have the benefit that by selecting PS, owing to PS and ABS compares, it has good mobility in the molten state, it is thus possible to be quickly covered with die cavity in the process of injection molding, prevent from causing that plastics are for occurring as soon as solidification phenomenon when being covered with die cavity owing to plastics flow over slow, raising yield rate. and when selecting injection machine, what select is the injection machine of jet velocity up to 470-480mm/s, product can be made to have bigger speed when entering die cavity, so that product can better be covered with die cavity, and the decomposition temperature 280 DEG C than PS of the temperature setting of injection tube is high, even if therefore PS is mobile very fast in injection tube, but through first paragraph, second segment, after the high-temperature heating of the 3rd section, product can be made to melt but be unlikely to make Disassembling Products fall, although and the temperature of injection tube the 4th section is than above several sections of low spots, but also it is higher than the melting temperature of PS, and then reach the effect of a further thawing, and inject temperature and be higher than the temperature of the 4th section, the mobility when PS that can make nozzle place comes in is low, mobility when going out is fast, thus PS piles up at nozzle place and causes nozzle to block. when PS is after going out from nozzle, it enters into and adds heat fusing in flow distribution plate further, then Re Zuichu is entered into again through flow distribution plate, and hot mouth is divided into two sections, hot mouth is higher than the hot mouth temperature away from flow distribution plate place near the temperature of flow distribution plate one section, thus mobility when reaching to make PS to enter hot mouth away from flow distribution plate one section is slack-off suddenly, so that hot mouth can be full of PS away from one section of place of flow distribution plate in the moment, it is prevented that the formed product failure that the PS deficiency sprayed due to hot mouth causes. and PS is after spurting into die cavity through hot mouth, it is possible to have bigger speed. by this processing technique, machined carrier band dish out, the thickness in its positive card and helical cast face can be little of 0.8mm, and it becomes flat rate up to more than 90%.
Detailed description of the invention
Below in conjunction with embodiment, describe the present invention.
A kind of carrier band dish Shooting Technique, first quantitative PS plastics are weighed, PS plastics are compared with ABS, although it is more not good enough than ABS in its performance, but PS is when melted, its mobility is higher than ABS, and therefore PS is in entering into die cavity when molding, PS can be enable to flow to each place of die cavity faster, thus ensureing the yield rate of the carrier band dish processed. And owing to PS is transparent material, and somewhat poorer in performance, therefore can mix some HIPS in PS plastics, can effectively be adjusted the transparency of carrier band dish by HIPS, and the performance of the carrier band dish processed can be improved.
Then selecting jet velocity is the injection machine of 470-480mm/s, then the injection tube in this injection machine is heated and hot flow path is heated processing, the punch being arranged on injection machine and die are carried out cooling process. then joining in injection moulding injection machine by the PS plastics of above-mentioned select, PS can enter in injection tube and dissolve. due to injection machine jet velocity quickly, therefore injection machine can drive plastics from injection tube quickly through, and owing to injection tube being divided into four sections, therefore PS can be introduced in the first paragraph of injection tube, and the temperature of first paragraph is 328-332 degree Celsius, and the decomposition temperature of PS is at 280 DEG C, if PS is long-time heating at this temperature, can cause that PS is decomposed, and due to injection machine jet velocity quickly, therefore the velocity of rotation of injection tube inner screw is quickly, accordingly, PS can quickly pass through from the first paragraph of injection tube, and PS can be carried out preliminary thawing by the high temperature of first paragraph, but more than 280 degrees Celsius will not be heated to, and screw rod is when driving PS motion, can make to occur between PS relative movement, so that PS is heated evenly, if the temperature of first paragraph is less than 328 degree, it is accomplished by the rotating speed step-down of screw rod accordingly, so that working (machining) efficiency step-down, and as a preferred version, show according to a large amount of test data, the first paragraph of injection moulding cylinder is heated to 330 DEG C be best, and when the temperature of first paragraph is higher than 332 DEG C time, the increase in processing cost can be caused, and when temperature is too high time, the heating for PS exists uncontrollability. subsequently, PS can be sent in the second segment of injection tube by screw rod, and it is contemplated that PS is simply through first paragraph, it is difficult to be heated to PS its melt temperature 240 degree, it is thus desirable to again by PS through high-temperature heating, therefore the present embodiment selects the temperature of injection tube is set to 328-332 DEG C, this temperature is also above 280 degree, PS can be made again to melt, certainly identical with first paragraph as preferably the temperature of second segment being arranged to, the PS not melted ensure that melted plastics have good mobility, so that can be melted fully. subsequently, PS enters back in the 3rd section of injection tube, and the temperature of the 3rd section is 313-317 DEG C, this temperature is still higher than 280 degree, PS further can be melted, but this temperature will lower than the temperature of first paragraph and second segment, the PS of partial melting can be made after so arranging when entering in the 3rd section, the mobility of reduction PS that can be suitable, and then reduce the 3rd section of heating efficiency for PS, from without making the 3rd section by PS heating to its decomposition temperature, if and the temperature in the 3rd section is lower than 313 degree, can cause that PS is after by the 3rd section, still PS greatly is had not melt, if and the temperature in the 3rd section higher than 317 DEG C time, PS can be caused heating, and according to experiment surface, temperature in 3rd section is set to 315 DEG C of the bests. although PS enters back in the 4th section and is heated, and the temperature in the 4th section is 249-251, this temperature decomposition temperature less than PS, from without PS is caused damage, but this temperature is higher than again the melting temperature of PS, it is thus possible to PS is melted further, if and when the 4th section temperature higher than 251 DEG C time, the waste on the energy can be caused, if and temperature less than 249 DEG C time, then causing that the melting ability to PS declines, and show according to great many of experiments, the temperature of the 4th section is set to 250 DEG C is best.And PS is after injection tube the 4th section, PS can enter in nozzle, and the temperature in nozzle is 268-272 DEG C, this temperature is higher than the temperature of the 4th section, therefore, it is possible to make PS after entering nozzle, the mobility of PS can increase, so that PS can quickly go out from material mouth, and the temperature that PS is at nozzle place is higher than its temperature in the 4th section, it is possible to prevent nozzle place due to the PS nozzle blocking occurred slowly gone out soon entered. And if the temperature at nozzle place is arranged higher than 272 DEG C, owing to this temperature is too close to the resolution problem of PS, therefore still PS can be caused a degree of damage, if and the temperature at nozzle place less than 268 DEG C time, can cause that the PS flow velocity at nozzle place and its poor fluidity at the 4th section of place are from not quite, it is impossible to well alleviate the pressure that the PS material at material mouth place is too much.
Subsequently, the PS of dissolving can be expected to be injected in hot flow path by nozzle, melted PS enters in flow distribution plate, and due to the existence of hot plate, PS in flow distribution plate can be carried out isothermal holding, prevent PS from melting in flow distribution plate, and owing to this mould is mould two chamber, therefore this hot flow path needs two Re Zui and two blocks of hot plates, and the temperature of two blocks of hot plates is identical, it it is all 250-270 degree, this temperature is less than 280 degree, PS will not be caused decomposition, and this temperature is approximate with the temperature at nozzle place, time PS enters in flow distribution plate, the mobility of PS can not be subject to bigger change. if and time the temperature of flow distribution plate is set smaller than 250 degree, flow distribution plate then can be caused excessive with the temperature spread of nozzle, thus causing that in flow distribution plate, the speed of charging is quickly, and the plastics of discharging are excessively slow, in turn result in a large amount of PS to pile up in flow distribution plate, space in flow distribution plate can all be fully supported by final PS, thus causing the paralysis of system, if and the temperature in flow distribution plate more than 270 DEG C time, owing to getting too close to 280 degree, thus causing the decomposition of PS, and as a most preferably scheme, the temperature of hot plate is arranged to 260 DEG C of the bests, and when PS is by after flow distribution plate, PS can enter in hot mouth, and hot mouth is divided into two sections, PS can be introduced into hot mouth near a section of flow distribution plate, and the temperature at this place is 270-290 DEG C, and there is the situation more than 280 DEG C in this place's temperature, the purpose so arranged is to heat for the last time to from flow distribution plate PS out, ensure that PS makes to be in a higher melt temperature after going out from hot mouth, and owing to the length of material mouth itself is just comparatively short, the length of this part then can be shorter, the flow velocity of PS also ratio is comparatively fast, thus without moment by PS heating to its decomposition temperature, and the temperature at this place is also greater than the hot mouth temperature away from flow distribution plate place, PS by hot mouth after a section of flow distribution plate, can with the bigger hot mouth of velocity shock away from the PS in flow distribution plate side, so that increasing the speed of hot mouth injection PS. and when working as the hot mouth temperature near flow distribution plate side less than 270 degree, in flow distribution plate, the flow velocity of PS is much the same with material mouth near the flow velocity of flow distribution plate side PS, therefore it is unable to reach quickly by the effect derived of PS in flow distribution plate, and when the hot mouth temperature near flow distribution plate side is higher than 290 DEG C time, then PS can be caused decomposition, and according to experiments show that, hot mouth is set to 280 DEG C of the bests near the temperature of flow distribution plate one section.
Subsequently, hot mouth one end away from flow distribution plate can be entered near the PS of flow distribution plate one section through overheated mouth, owing to the temperature at this place is 230-240 degree Celsius, first PS can be played certain cooling effect herein, reduce after molding, the cool time of mould, and hot mouth is less than the hot mouth flow velocity near the PS at flow distribution plate place away from the flow velocity of flow distribution plate place PS, so that hot mouth is filled with PS's all the time away from one section of flow distribution plate place, it is prevented that the neutral gear phase of injection moulding occurs. When hot mouth away from the temperature at flow distribution plate place less than 230 degree time, then PS can be made cooled many, thus being unfavorable for injection molding; And when working as the hot mouth temperature away from flow distribution plate place more than 240 degree, one can make PS in hot mouth out after still have higher temperature, thus lengthening cool time, two can make hot mouth be more or less the same near the flow velocity of flow distribution plate place PS with hot mouth away from the flow velocity of the PS at flow distribution plate place, thus be extremely difficult to by hot mouth away from flow distribution plate place one section of space be full of purpose, and show according to great many of experiments, away from the temperature at flow distribution plate place, hot mouth is set to 235 DEG C is best.
When PS from hot mouth out after, owing to now PS has higher temperature, and the flow velocity of PS also ratio is comparatively fast, therefore, in order to reduce the cool time after carrier band disc molding, the present embodiment selects that punch and die do cooling and processes, and the temperature of punch Yu die is all cooled to 10-13 degree, namely the smooth molding of carrier band dish will not be hampered, the cool time after carrier band disc molding can be effectively reduced again. And when temperature is less than 10 DEG C time, the decrease in yield of carrier band dish can be caused; When temperature is more than 13 degrees Celsius time, then can extend the cool time of carrier band dish.
And after injection moulding, product is carried out pressurize process, dwell pressure in the present embodiment is 350-380bar, dwell time is 0.15-0.25s, due to product rate of cooling can ratio comparatively fast, therefore can cause product that shrinkage phenomenon occurs, therefore by arranging the pressure of 350-380bar, carry out the pressurize of 0.15-0.25s, it is thus possible to prevent product from shrinkage phenomenon occurring, when pressure is less than 350bar time, can cause that depression occurs in product, the problems such as bubble, in turn result in the decrease in yield of product, and when pressure is more than 380bar time, product stripping difficulty can be caused.
After pressurize completes, chiller in mould is operated, the present embodiment can adopt lays water route in a mold to make carrier band dish cool down, after carrier band dish has cooled down, punch separates with die, can be taken out by the carrier band dish of injection mo(u)lding, by this processing technique, machined carrier band dish out, the thickness in its positive card and helical cast face can be little of 0.8mm, and it becomes flat rate up to more than 90%.
The above is only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to above-described embodiment, and all technical schemes belonged under thinking of the present invention belong to protection scope of the present invention. It should be pointed out that, for those skilled in the art, some improvements and modifications without departing from the principles of the present invention, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (8)
1. a carrier band dish Shooting Technique, it is characterised in that comprise the steps:
A, select PS plastics;
B, selection jet velocity are the injection machine of 470-480mm/s;
C, injection tube heat: injection tube first paragraph is heated to 328-332 DEG C, and injection tube second segment is heated to 328-332 DEG C, and injection tube the 3rd section is heated to 313-317 DEG C, and injection tube the 4th section is heated to 249-251 DEG C, and nozzle is heated to 268-272 DEG C;
D, hot flow path heat: heating flow distribution plate to 250-270 degree Celsius, Jiang Rezui is divided into two parts, and hot mouth is 270-290 DEG C near the temperature of thermal plate portion, and hot mouth is 230-240 DEG C away from the temperature of thermal plate portion;
E, injection mold pretreatment: select the injection mold in mould two chamber, and the punch of mould and die are all cooled to 10-13 degree;
F, by the injection machine in step b, the plastics in step a being passed sequentially through step c, step d and step e, the injection time of injection machine is 0.5s;
G, pressurize: dwell pressure is 350-380bar, the dwell time is 0.15-0.25s;
H, cooling molding;
I, the demoulding: after product cooling, punch separates with die, is taken out by the product of injection formed.
2. carrier band dish Shooting Technique according to claim 1, is characterized in that: in step c, the temperature of injection tube first paragraph is 330 DEG C.
3. carrier band dish Shooting Technique according to claim 1 and 2, is characterized in that: in step c, the temperature of injection tube first paragraph is identical with the temperature of injection tube second segment.
4. carrier band dish Shooting Technique according to claim 1, is characterized in that: in step c, the temperature of injection tube the 3rd section is 315 DEG C.
5. carrier band dish Shooting Technique according to claim 1, is characterized in that: in step c, the temperature of injection tube the 4th section is 250 DEG C.
6. carrier band dish Shooting Technique according to claim 1, is characterized in that: in step d, the temperature of flow distribution plate is 260 DEG C.
7. carrier band dish Shooting Technique according to claim 1, is characterized in that: in step d, hot mouth is 280 degrees Celsius near the temperature of thermal plate portion.
8. carrier band dish Shooting Technique according to claim 1, is characterized in that: in step d, hot mouth is 235 DEG C away from the temperature of thermal plate portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610001891.1A CN105619689B (en) | 2016-01-05 | 2016-01-05 | Carry disk Shooting Technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610001891.1A CN105619689B (en) | 2016-01-05 | 2016-01-05 | Carry disk Shooting Technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105619689A true CN105619689A (en) | 2016-06-01 |
| CN105619689B CN105619689B (en) | 2017-07-11 |
Family
ID=56035213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610001891.1A Active CN105619689B (en) | 2016-01-05 | 2016-01-05 | Carry disk Shooting Technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105619689B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106113150A (en) * | 2016-07-06 | 2016-11-16 | 成都格虹电子科技有限责任公司 | A kind of carrier band moulding technique |
| CN116118113A (en) * | 2023-01-09 | 2023-05-16 | 广东恒成科技股份有限公司 | Process for improving injection head yield of injection molding machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202729473U (en) * | 2012-07-30 | 2013-02-13 | 江苏泰氟隆科技有限公司 | Carrier tape reel used for integrated electronic component |
| CN103612361A (en) * | 2013-11-23 | 2014-03-05 | 诸暨市泰昂机械有限公司 | Injection molding process |
| CN204474055U (en) * | 2015-02-10 | 2015-07-15 | 苏州天裕塑胶有限公司 | Plastic carrier dish |
| CN204474050U (en) * | 2015-02-10 | 2015-07-15 | 苏州天裕塑胶有限公司 | Carrier band dish |
-
2016
- 2016-01-05 CN CN201610001891.1A patent/CN105619689B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202729473U (en) * | 2012-07-30 | 2013-02-13 | 江苏泰氟隆科技有限公司 | Carrier tape reel used for integrated electronic component |
| CN103612361A (en) * | 2013-11-23 | 2014-03-05 | 诸暨市泰昂机械有限公司 | Injection molding process |
| CN204474055U (en) * | 2015-02-10 | 2015-07-15 | 苏州天裕塑胶有限公司 | Plastic carrier dish |
| CN204474050U (en) * | 2015-02-10 | 2015-07-15 | 苏州天裕塑胶有限公司 | Carrier band dish |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106113150A (en) * | 2016-07-06 | 2016-11-16 | 成都格虹电子科技有限责任公司 | A kind of carrier band moulding technique |
| CN116118113A (en) * | 2023-01-09 | 2023-05-16 | 广东恒成科技股份有限公司 | Process for improving injection head yield of injection molding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105619689B (en) | 2017-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20200061878A1 (en) | Rotary high speed low compression thermoplastic molding method and apparatus | |
| CN102490330B (en) | Temperature control method based on phase-transition energy-accumulation material | |
| CN103934951A (en) | Injection molding process for car bumpers | |
| CN104960136A (en) | Injection molding process | |
| CN105555497A (en) | Injection molding machine | |
| CN105365173A (en) | Quick thermoplastic forming process | |
| CN107803967A (en) | One kind injection high smooth product is without pressurize moulding process | |
| CN105619689A (en) | Injection molding technology for carrier tape discs | |
| CN102785324A (en) | Injection moulding process of polyethylene (PE) material pieces for infusion apparatus | |
| CN105235125A (en) | Poly ethylene (PE) material injection molding process | |
| US9381674B2 (en) | Apparatus and method for producing plastics material pre-forms from a thermoplastic plastics material | |
| US20200276738A1 (en) | Method and apparatus for producing objects made of polymeric material | |
| CN110614745A (en) | Rapid gas-assisted forming precision injection molding process for ABS alloy injection molding part | |
| CN106903835A (en) | A kind of injection molding process | |
| CN201728801U (en) | Plastic mould hot runner device | |
| CN210590446U (en) | Plastic mold capable of being rapidly cooled and formed | |
| CN103009559A (en) | Injection molding mold | |
| CN109849256A (en) | Instrument housing resin injection molding technique | |
| CN105346036A (en) | Multicavity mold injection molding process of PC slender rod | |
| CN106217762A (en) | A kind of plastic injection technique | |
| CN104626450A (en) | Injection molding process for mold with multiple cavities and injection molding equipment thereof | |
| KR20130005726U (en) | Mold for injection molding | |
| CN109693334A (en) | A kind of injection molding process of salad service plate | |
| CN102785340A (en) | Plastic injection process for PVC (polyvinyl chloride) parts of infusion apparatuses | |
| TWI686283B (en) | Thick plastic injection mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |