CN105609599A - Packaging material for blue chip and white LED packaging method - Google Patents
Packaging material for blue chip and white LED packaging method Download PDFInfo
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- CN105609599A CN105609599A CN201610088997.XA CN201610088997A CN105609599A CN 105609599 A CN105609599 A CN 105609599A CN 201610088997 A CN201610088997 A CN 201610088997A CN 105609599 A CN105609599 A CN 105609599A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/55—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing beryllium, magnesium, alkali metals or alkaline earth metals
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/57—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing manganese or rhenium
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Abstract
The invention discloses a packaging material for a blue chip and a white LED packaging method. The packaging material is prepared from the following raw materials in percentage by weight: 10%-30% of green phosphor, 0.5%-7.5% of red phosphor, 0.1%-10% of K<2>SiF<6>:Mn<4+> powder and the balance of a pouring sealant. The packaging method comprises the following steps: mixing the green phosphor, the red phosphor, the K<2>SiF<6>:Mn<4+> powder and the pouring sealant evenly; and uniformly coating the mixture on the blue chip for packaging to obtain a white LED. The special color rendering index of the white light can be improved under the condition of ensuring that the luminous efficiency of the white LED is essentially constant. The packaging method and the packaging method can effectively improve the special color rendering index R9 of the white light, improve the color saturation of the white light, and simultaneously keep good luminous efficiency, so that the white LED has a good application prospect in the fields of shop window lighting, reading lighting, medical lighting and the like.
Description
Technical field
The present invention relates to the encapsulating material field of light source, be specifically related to a kind of encapsulation material for blue chipMaterial and method for packaging white LED thereof.
Background technology
Colour rendering index is the evaluation index of the colour developing ability of light source to object. Colour rendering index is divided into general aobviousColour index and special colour rendering index, general colour rendering index is 8 kinds that light source specifies International Commission on IlluminationThe mean value of the special colour rendering index of sample of colour, eight kinds of medium standard color samples of chroma of R1～R8. These are 8 years oldPlant sample of colour and be selected from Munsell colour scale, comprise various representational tones, they have medium chromaAnd lightness. Special colour rendering index is the colour rendering index of light source to a certain selected Standard Colors sample. InternationalThe illumination committee is except 8 kinds of tinctorial patterns that regulation calculating general colour rendering index is used, and also having replenished regulations, it is special to calculateThe sample of colour that different colour rendering index is used, the colour of skin of R9～R15 red, yellow, green, blue, American-European young women,Leaf green, Asian Youth women's the colour of skin.
Along with the development of LED technology, the application of white light LEDs is also shone from large screen display, viewThe special source applications such as bright, indicator lamp are stepped into the field such as room lighting, medical illumination, light source graduallyLight efficiency, colour rendering index seem more and more important. But the light efficiency and colour rendering index phase of white light LEDs at presentRestriction is mutually difficult to reach very high requirement simultaneously. The colour rendering of current evaluation light source is only considered objectColor fidelity, does not consider the color saturation of object, has ignored the colour rendering index of high saturation colorThe special colour rendering index R9 of R9-R14, particularly saturated red to the visual evaluation of colour rendering quality particularlyImportant. In practical application, color saturation but has larger impact for measurement effect, if this is because letterSinglely front 8 low saturated or medium saturated colour rendering indexs are averaged and obtain general colour rendering index,Likely obtain a high Ra value, but in fact poor to the color representation of high saturation color, noCan reflect real color effect.
At present, white light LEDs uses blue chip to excite yellow fluorescent powder more, but owing to lacking ruddinessThe problem such as point cause the colour temperature of white light LEDs higher, luminous efficiency is lower, colour rendering index is low, therefore canAdd red fluorescence powder with blue chip excited blue-green fluorescent powder, reduce colour temperature to reach, improve colour developing and refer toThe object of number. But the general colour rendering index of these schemes (Ra) is between 80-90, special colour rendering index(R9) but still very low, make the color saturation of white light inadequate, comprehensive colour rendering index is lower, cannotReach requirement application requirements.
Current red fluorescence powder wavelength, generally at 630-670nm, as the light efficiency of need raising white light, needsBy wavelength blue shift to about 605-630nm.
Summary of the invention
Low for solving white light LEDs special colour rendering index, cause the problems such as color developing effect is poor, the present invention carriesSupplied a kind of encapsulating material for blue chip and method for packaging white LED thereof, this encapsulating material is logicalCross in the combination of green emitting phosphor (510-530nm) and red fluorescence powder (620-640nm) and addA certain amount of K2SiF6:Mn4+Powder, this method for packing can ensure white light LEDs luminous efficiency substantially notIn situation about becoming, improve the special colour rendering index R9 of white light, thereby improve the colour rendering index of white light.
For an encapsulating material for blue chip, made by the raw material of following weight percent weight:
The present invention, for the encapsulating material of blue chip, encapsulates blue chip (460nm), logicalCross in the combination of green emitting phosphor (510-530nm) and red fluorescence powder (620-640nm) and addA certain amount of K2SiF6:Mn4+Powder. K2SiF6:Mn4+Powder is realized wavelength 631 under blue-light excitedThe ruddiness of nm, the wide only 3nm of half-wave, can effectively improve the R9 value of white light, thereby improves combining of white lightClose colour rendering index. The blue chip of this encapsulating material encapsulation, can ensure white light LEDs luminous efficiency baseIn this constant situation, improve the special colour rendering index R9 of white light, thereby improve the colour rendering index of white light.
Described green emitting phosphor is Lu2.98Al5O12:0.02Ce3+。
Described red fluorescence powder is Sr2Si5N8:Eu2+。
Casting glue can adopt prior art, and described casting glue can be the one in epoxy resin, silica gel etc.Or two kinds, be epoxy resin through one-step optimization.
Further preferably, the described encapsulating material for blue chip, by following weight percent weightRaw material is made:
Employing, for a method for packaging white LED for the encapsulating material of blue chip, comprises following stepRapid:
By green emitting phosphor (500～540nm, preferably 520nm), red fluorescence powder (600～660nm,Preferably 630nm) and K2SiF6:Mn4+Powder evenly mixes with casting glue, is then evenly coated in blue light(430～490nm, preferably 460nm) is upper for chip, encapsulates, and obtains white light LEDs.
Described green emitting phosphor is Lu2.98Al5O12:0.02Ce3+, described preparation method comprises: according toStoichiometric proportion Lu2.98Al5O12:0.02Ce3+, weigh Lu2O3Powder, Al2O3、CeO2Be placed in agateGrind in alms bowl, mix, employing is full of reducing atmosphere and carries out high temperature sintering, and calcining heat is900～1400 DEG C, the time is 2～6h, carries out annealing in process after sintering, obtains Lu2.98Al5O12:0.02Ce3+Fluorescent material. Further optimize, calcining heat is 1000 DEG C, and calcination time is 3h.
Described red fluorescence powder is Sr2Si5N8:Eu2+, described preparation method comprises: with SrCO3、SiO2、Si3N4、Eu2O3For raw material, according to stoichiometric proportion Sr2Si5N8:Eu2+Weigh, and will pass throughThe raw material mixing is warming up to 1400～1600 DEG C under reducing atmosphere, and reaction 5～9h is to be sintered completeAfter carry out annealing in process, obtain Sr2Si5N8:Eu2+Fluorescent material. Preparation Sr2Si5N8:Eu2+Forging of fluorescent materialBurning temperature is 1400～1600 DEG C, reaction 5～9h, and being further optimized for calcining heat is 1500 DEG C, anti-Between seasonable, be 6h.
Described K2SiF6:Mn4+The preparation method of powder comprises: according to K2SiF6:Mn4+StoichiometryRatio, by SiO2Put into HF/KMnO4In the aqueous solution, leave standstill and obtain K2SiF6:Mn4+。
Described blue chip can adopt prior art, as GaN, InGaN etc., further optimizes and can beGaN chip.
Described reducing atmosphere can be nitrogen or nitrogen and hydrogen mixture, is further optimized for nitrogen and hydrogen mixture,By the N of percent by volume 95%2With 5% H2Composition.
Described degeneration processing is to carry out in Muffle furnace, and sintering temperature is 400 DEG C～600, and the time is1～3h, further, sintering temperature is 500 DEG C, the time is 2h, mainly can by low-temperature sintering remove because ofPyrocarbon pipe furnace calcining and the impurity such as the carbon dust that brings, improve the purity of sample.
The present invention adds K in red fluorescence powder, green emitting phosphor and blue chip encapsulation2SiF6:Mn4+PowderPhysical efficiency improves the colour rendering index of white light LEDs effectively, improves the lighting quality of LED, to LED lightLearn the development of illumination and play important progradation.
Compared with prior art, tool of the present invention has the following advantages:
In the present invention by adding a certain amount of K2SiF6:Mn4+Powder, with red fluorescence powder and green glimmeringLight powder is coated on blue chip and encapsulates together, can keep under the prerequisite of good luminous efficiency,Effectively improve saturated ruddiness colour rendering index R9, and and then improve the colour rendering index of white light, solve at presentThe red area not enough problem that develops the color that in blue chip encapsulation technology, white light LEDs occurs on the market. WithTime, adopt packaged type of the present invention, can reduce within the specific limits the colour temperature of white light LEDs, make LEDThe light sending allows people feel more warm. The powder that the present invention uses mainly containsLu2.98Al5O12:0.02Ce3+Fluorescent material, Sr2Si5N8:Eu2+Fluorescent material and K2SiF6:Mn4+Powder, three kindsPowder has stable physical property, can under energy emission, keep good optical property for a long time.And the preparation technology that three kinds of powders adopt is simple, with low cost, has good market value. ThisIn invention, the special colour rendering index R9 that new fluorescent powder packaging method can improve white light effectively, carriesThe color saturation of high white light keeps good luminous efficiency simultaneously, and white light LEDs is shone at show windowThe fields such as bright, reading lighting, medical illumination have a good application prospect.
Brief description of the drawings
Fig. 1 is the white-light LED fluorescence spectrogram obtaining in embodiment 1 (being comparative example 1);
Fig. 2 is the white-light LED fluorescence spectrogram obtaining in embodiment 2;
Fig. 3 is the white-light LED fluorescence spectrogram obtaining in embodiment 3;
Fig. 4 is the white-light LED fluorescence spectrogram obtaining in embodiment 4;
Fig. 5 is the white-light LED fluorescence spectrogram obtaining in embodiment 5 (being comparative example 2).
Detailed description of the invention
Embodiment 1 (as a comparison case 1)
LuAG (520nm) green emitting phosphor of the upper coating of blue chip (460nm) 0.255g withThe Sr of 0.036g2Si5N8:Eu2+Red fluorescence powder (630nm), encapsulates.
1) according to stoichiometric proportion Lu2.98Al5O12:0.02Ce3+, accurately weigh Lu2O3Powder, Al2O3、CeO2Be placed in agate and grind alms bowl, mix, after sieving, move in crucible, adopt and be full of reducing gasesAtmosphere (percent by volume 95%N2、5％H2) pyrocarbon pipe furnace carry out high temperature sintering (1000 DEG C, 3h),After sintering, carry out annealing in process (500 DEG C, 2h) putting into Muffle furnace, obtain purity highLu2.98Al5O12:0.02Ce3+Fluorescent material (being LuAG green emitting phosphor).
2) with SrCO3、SiO2、Si3N4、Eu2O3For raw material, according to stoichiometric proportion Sr2Si5N8:Eu2+Weigh, and by putting into pyrocarbon pipe furnace through the raw material mixing, at reducing atmosphere (volume percentageCompare 95%N2、5％H2) under be warming up to 1500 DEG C reaction 6h. To be sinteredly put into Muffle furnace after complete and enteredRow annealing in process (500 DEG C, 2h), obtains Sr2Si5N8:Eu2+Fluorescent material.
3) accurately weigh the Lu that 0.255g prepares2.98Al5O12:0.02Ce3+Fluorescent material, 0.036g systemThe standby Sr obtaining2Si5N8:Eu2+Fluorescent material evenly mixes with the casting glue of 1g, is then evenly coated in blue light coreThe surface of sheet (460nm), encapsulates.
Embodiment 2
LuAG (520nm) green emitting phosphor of the upper coating of blue chip (460nm) 0.255g withThe Sr of 0.036g2Si5N8:Eu2+Red fluorescence powder (630nm), then add the K of 0.01g2SiF6:Mn4+Red fluorescence powder (630nm), encapsulates.
1) according to stoichiometric proportion Lu2.98Al5O12:0.02Ce3+, accurately weigh Lu2O3Powder, Al2O3、CeO2Be placed in agate and grind alms bowl, mix, after sieving, move in crucible, adopt and be full of reducing gasesAtmosphere (percent by volume 95%N2、5％H2) pyrocarbon pipe furnace carry out high temperature sintering, calcining heat is1000 DEG C, the time is 3h. After sintering, carry out annealing in process (500 DEG C, 2h) putting into Muffle furnace,Obtain the Lu that purity is high2.98Al5O12:0.02Ce3+Fluorescent material (being LuAG green emitting phosphor).
2) with SrCO3、SiO2、Si3N4、Eu2O3For raw material, according to stoichiometric proportion Sr2Si5N8:Eu2+Weigh, and by putting into pyrocarbon pipe furnace through the raw material mixing, at reducing atmosphere (volume percentageCompare 95%N2、5％H2) under be warming up to 1500 DEG C, reaction 6h. To be sinteredly put into Muffle furnace after completeCarry out annealing in process (500 DEG C, 2h), obtain Sr2Si5N8:Eu2+Fluorescent material.
3) according to K2SiF6:Mn4+Stoichiometric proportion, by SiO2Put into HF/KMnO4In the aqueous solution,At 25 DEG C of normal temperature, leave standstill and can obtain needed K2SiF6:Mn4+。
4) the above-mentioned Lu preparing of accurate weighing 0.255g2.98Al5O12:0.02Ce3+Fluorescent material, 0.036gSr2Si5N8:Eu2+The K of fluorescent material and 0.01g2SiF6:Mn4+Powder evenly mixes with the casting glue of 1g,Then the surface that is evenly coated in blue chip, encapsulates.
Fig. 1, Fig. 2 are respectively embodiment 1 (being comparative example 1) and the prepared white light LEDs of embodiment 2Fluorescence spectrum figure. As seen from the figure, the encapsulation of Xiang Hong, green fluorescence powder coating blue-light LED chipIn technology, add K2SiF6:Mn4+Powder, can improve saturated ruddiness R9 aobvious of white light LEDs effectivelyColour index, improves the ruddiness regional percentage that white light LEDs sends, and then has improved the aobvious of white light LEDsColour index.
Embodiment 3
LuAG (520nm) green emitting phosphor of the upper coating of blue chip (460nm) 0.255g withThe Sr of 0.036g2Si5N8:Eu2+Red fluorescence powder (630nm), then add the K of 0.04g2SiF6:Mn4+Red fluorescence powder (630nm), encapsulates.
1) according to stoichiometric proportion Lu2.98Al5O12:0.02Ce3+, accurately weigh Lu2O3Powder, Al2O3、CeO2Be placed in agate and grind alms bowl, mix, after sieving, move in crucible, adopt and be full of reducing gasesAtmosphere (percent by volume 95%N2、5％H2) pyrocarbon pipe furnace carry out high temperature sintering, calcining heat is1000 DEG C, the time is 3h. After sintering, carry out annealing in process (500 DEG C, 2h) putting into Muffle furnace,Obtain the Lu that purity is high2.98Al5O12:0.02Ce3+Fluorescent material (being LuAG green emitting phosphor).
2) with SrCO3、SiO2、Si3N4、Eu2O3For raw material, according to stoichiometric proportion Sr2Si5N8:Eu2+Weigh, and by putting into pyrocarbon pipe furnace through the raw material mixing, at reducing atmosphere (volume percentageCompare 95%N2、5％H2) under be warming up to 1500 DEG C, reaction 6h. To be sinteredly put into Muffle furnace after completeCarry out annealing in process (500 DEG C, 2h), obtain Sr2Si5N8:Eu2+Fluorescent material.
3) according to K2SiF6:Mn4+Stoichiometric proportion, by SiO2Put into HF/KMnO4In the aqueous solution,At 25 DEG C of normal temperature, leave standstill and can obtain needed K2SiF6:Mn4+。
4) accurately weigh the Lu that 0.255g prepares2.98Al5O12:0.02Ce3+Fluorescent material, 0.036g'sSr2Si5N8:Eu2+The K of fluorescent material and 0.04g2SiF6:Mn4+Powder evenly mixes with the casting glue of 1g, soThe surface that is evenly coated in afterwards blue chip (460nm), encapsulates.
Embodiment 4
LuAG (520nm) green emitting phosphor of the upper coating of blue chip (460nm) 0.255g withThe Sr of 0.036g2Si5N8:Eu2+Red fluorescence powder (630nm), then add the K of 0.08g2SiF6:Mn4+Red fluorescence powder (630nm), encapsulates.
1) according to stoichiometric proportion Lu2.98Al5O12:0.02Ce3+, accurately weigh Lu2O3Powder, Al2O3、CeO2Be placed in agate and grind alms bowl, mix, after sieving, move in crucible, adopt and be full of reducing gasesAtmosphere (percent by volume 95%N2、5％H2) pyrocarbon pipe furnace carry out high temperature sintering, calcining heat is1000 DEG C, the time is 3h. After sintering, carry out annealing in process (500 DEG C, 2h) putting into Muffle furnace,Obtain the Lu that purity is high2.98Al5O12:0.02Ce3+Fluorescent material (being LuAG green emitting phosphor).
2) with SrCO3、SiO2、Si3N4、Eu2O3For raw material, according to stoichiometric proportion Sr2Si5N8:Eu2+Weigh, and by putting into pyrocarbon pipe furnace through the raw material mixing, at reducing atmosphere (volume percentageCompare 95%N2、5％H2) under be warming up to 1500 DEG C, reaction 6h. To be sinteredly put into Muffle furnace after completeCarry out annealing in process (500 DEG C, 2h), obtain Sr2Si5N8:Eu2+Fluorescent material.
3) according to K2SiF6:Mn4+Stoichiometric proportion, by SiO2Put into HF/KMnO4In the aqueous solution,At 25 DEG C of normal temperature, leave standstill and can obtain needed K2SiF6:Mn4+。
4) accurately weigh the Lu that 0.255g prepares2.98Al5O12:0.02Ce3+Fluorescent material, 0.036g'sSr2Si5N8:Eu2+The K of fluorescent material and 0.08g2SiF6:Mn4+Powder evenly mixes with casting glue, then equalThe even surface that is coated in blue chip (460nm), encapsulates.
Fig. 2, Fig. 3, Fig. 4 are respectively embodiment 2, embodiment 3, the prepared white light of embodiment 4The fluorescence spectrum figure of LED. There is figure to find out, within the specific limits along with K2SiF6:Mn4+Powder is mixedThe increase of assorted amount, the raising gradually of the colour rendering index of white light LEDs.
Embodiment 5 (as a comparison case 2)
LuAG (520nm) green emitting phosphor of the upper coating of blue chip (460nm) 0.255g withThe K of 0.08g2SiF6:Mn4+Red fluorescence powder (630nm), encapsulates.
LuAG (520nm) green emitting phosphor of the upper coating of blue chip (460nm) 0.255g withThe Sr of 0.036g2Si5N8:Eu2+Red fluorescence powder (630nm) applies, then adds the K of 0.01g2SiF6:Mn4+Red fluorescence powder (630nm), encapsulates.
1) according to stoichiometric proportion Lu2.98Al5O12:0.02Ce3+, accurately weigh Lu2O3Powder, Al2O3、CeO2Be placed in agate and grind alms bowl, mix, after sieving, move in crucible, adopt and be full of reducing gasesThe pyrocarbon pipe furnace of atmosphere carries out high temperature sintering, and calcining heat is 1000 DEG C, and the time is 3h. After sinteringPut into Muffle furnace and carry out annealing in process (500 DEG C, 2h), obtain the Lu that purity is high2.98Al5O12:0.02Ce3+Fluorescent material.
2) according to K2SiF6:Mn4+Stoichiometric proportion, by SiO2Put into HF/KMnO4In the aqueous solution,Under normal temperature, leave standstill and can obtain needed K2SiF6:Mn4+。
3) accurately weigh the Lu that 0.255g prepares2.98Al5O12:0.02Ce3+Fluorescent material and 0.08g'sK2SiF6:Mn4+Powder evenly mixes with 1g casting glue, is then evenly coated in the surface of LED chip,Encapsulate.
Fig. 5 is the fluorescence spectrum figure of the prepared white light LEDs of embodiment 5 (as a comparison case 2), willIts Fig. 4 contrasts discovery, K2SiF6:Mn4+The light that powder is launched, in ruddiness region, still needsNarrow band of light, if by K2SiF6:Mn4+Powder, green emitting phosphor and blue chip encapsulate, and makeWhite light LEDs luminous intensity low, colour rendering is poor. Therefore, K2SiF6:Mn4+Powder is in white light LEDsPlay and improve the effect of saturated ruddiness colour rendering index, and then solve in white-light LED encapsulation ruddiness region notThe problem of foot.
Claims (10)
1. for an encapsulating material for blue chip, it is characterized in that, by following weight percent weightRaw material make:
2. the encapsulating material for blue chip according to claim 1, is characterized in that, byThe raw material of following weight percent weight is made:
3. the encapsulating material for blue chip according to claim 1 and 2, is characterized in that,Described green emitting phosphor is Lu2.98Al5O12:0.02Ce3+。
4. the encapsulating material for blue chip according to claim 1 and 2, is characterized in that,Described red fluorescence powder is Sr2Si5N8:Eu2+。
5. the encapsulating material for blue chip according to claim 1 and 2, is characterized in that,Described casting glue is one or both in epoxy resin, silica gel.
6. a method for packaging white LED, is characterized in that, adopts claim 1～5 any one instituteThe encapsulating material for blue chip of stating, comprises the following steps:
By green emitting phosphor, red fluorescence powder and K2SiF6:Mn4+Powder evenly mixes with casting glue, soEvenly be coated on blue chip afterwards, encapsulate, obtain white light LEDs.
7. method for packaging white LED according to claim 6, is characterized in that, described is greenLook fluorescent material is Lu2.98Al5O12:0.02Ce3+, described preparation method comprises: according to stoichiometric proportionLu2.98Al5O12:0.02Ce3+, weigh Lu2O3Powder, Al2O3、CeO2Be placed in agate and grind alms bowl, mixedClose evenly, employing is full of reducing atmosphere and carries out high temperature sintering, and calcining heat is 900～1400 DEG C, and the time is2～6h, carries out annealing in process after sintering, obtain Lu2.98Al5O12:0.02Ce3+Fluorescent material.
8. method for packaging white LED according to claim 6, is characterized in that, described is redLook fluorescent material is Sr2Si5N8:Eu2+, described preparation method comprises: with SrCO3、SiO2、Si3N4、 Eu2O3For raw material, according to stoichiometric proportion Sr2Si5N8:Eu2+Weigh, and by former through what mixMaterial is warming up to 1400～1600 DEG C under reducing atmosphere, and reaction 5～9h to be sinteredly carry out annealing place after completeReason, obtains Sr2Si5N8:Eu2+Fluorescent material.
9. according to the method for packaging white LED described in claim 7 or 8, it is characterized in that, described inReducing atmosphere be nitrogen or nitrogen and hydrogen mixture;
Described degeneration processing is to carry out in Muffle furnace, and sintering temperature is 400 DEG C～600, and the time is1～3h。
10. method for packaging white LED according to claim 6, is characterized in that, describedK2SiF6:Mn4+The preparation method of powder comprises: according to K2SiF6:Mn4+Stoichiometric proportion, by SiO2Put into HF/KMnO4In the aqueous solution, leave standstill and obtain K2SiF6:Mn4+。
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| JP2019129323A (en) * | 2018-01-23 | 2019-08-01 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ | Optoelectronic device |
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Application publication date: 20160525 Assignee: NINGBO SUNPU OPTO CO., LTD. Assignor: China University of Metrology Contract record no.: X2019330000043 Denomination of invention: Packaging material for blue chip and white LED packaging method Granted publication date: 20180629 License type: Common License Record date: 20191111 |