CN105603501A - Electrolytic copper foil surface treatment additive, preparation method, treatment method and device - Google Patents
Electrolytic copper foil surface treatment additive, preparation method, treatment method and device Download PDFInfo
- Publication number
- CN105603501A CN105603501A CN201610032586.9A CN201610032586A CN105603501A CN 105603501 A CN105603501 A CN 105603501A CN 201610032586 A CN201610032586 A CN 201610032586A CN 105603501 A CN105603501 A CN 105603501A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- negative electrode
- treatment
- electrolytic copper
- cell body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
- C25F3/22—Polishing of heavy metals
Abstract
The invention discloses an electrolytic copper foil surface treatment additive. The electrolytic copper foil surface treatment additive is characterized in that each liter of additive solution comprises, by mass, 1-2mg of cellulose, 30-40mg of glucose, 6-8mg of titanium sulfate, 8-10mg of sodium tungstate, 20-25mg of glycerol, 500-600mg of alcohol, 5-10mg of polypropylene glycol and the balance of water. The invention further discloses a preparation method of the electrolytic copper foil surface treatment additive, an electrolytic copper foil surface treatment method adopting the additive, and a copper foil surface treatment device applying the electrolytic copper foil surface treatment method. The electrolytic copper foil surface treatment additive is good in effect and high in stability; by using the electrolytic copper foil surface treatment method, single-side-smooth copper foil with one side highly smooth and the other side uniformly coarse can be obtained and has excellent performance.
Description
Technical field
The present invention relates to Copper Foil manufacturing technology field, be specifically related to the interpolation for electrolytic copper foil surface processingThe dress of the preparation method of agent, additive, the surface treatment method of Copper Foil and enforcement method for surface treating copper foilPut.
Background technology
Copper Foil English is electrodepositedcopperfoil, is copper-clad plate (CCL) and printed circuit board (PCB)The important material of manufacturing. In current electronics and information industry high speed development, electrolytic copper foil is called as: electricity" neutral net " of sub-product signal and electric power transfer, communication. Within 2002, play Chinese printed circuit boardProduction value intruded the 3rd, the world, as the baseplate material of PCB---copper-clad plate also becomes in the worldThe 3rd large producing country. Also make thus Chinese electrolytic copper foil industry have the development of advancing by leaps and bounds in recent years.
Industrial Copper Foil can commonly be divided into rolled copper foil (RA Copper Foil) and electrolytic copper foil (ED Copper Foil) twoLarge class, wherein rolled copper foil has the characteristics such as good ductility, is early stage soft board processing procedure Copper Foil used,Electrolytic copper foil is to have the advantage that manufacturing cost is low compared with rolled copper foil. Because rolled copper foil is soft boardImportant raw material, so the improvement of the characteristic of rolled copper foil and price change have a certain impact to soft board industry.
Because the production firm of rolled copper foil is less, and technical also resting in part manufacturer hand, thereforeClient is lower to the grasp degree of price and supply, therefore not affecting under the prerequisite of product expression, use electrolysisIt is feasible settling mode that Copper Foil substitutes rolled copper foil. If but over the next several years because the thing of this body structure of Copper FoilReason characteristic will affect etched factor, and in the product of graph thinning or slimming, high frequency product is because of electricity in additionNews are considered, and the importance of rolled copper foil likely will promote again.
But, no matter be rolled copper foil (RA Copper Foil) and electrolytic copper foil (ED Copper Foil), it is in applicationBefore, in order to obtain better application performance, generally all need to carry out surface treatment, namely follow-upAfter-treatment, obtain suitable surface property, and this follow-up surface treatment is generally electrolysis mode,That is to say the surperficial electrolytic treatments of Copper Foil, obtain surface flatness or the roughness of expection. The surface of Copper FoilProcess and be mainly divided into two kinds of dual light, machine glazings. Dual light is located the two sides of Copper Foil simultaneouslyReason, technique is relatively easy to control, only Copper Foil need to be entered to the electric field environment for the treatment of fluid in treatment troughIn, allow two sides all contact treatment fluid, be placed in the smooth effect that chases after rear acquisition, because not existing togetherReason liquid and different treatment process and different. But in some application, one-sided smooth processing and anotherThe Copper Foil of the coarse processing of face is more excellent than the Copper Foil performance of double treatment, higher and equal because hair side hasEven roughness, has better, uniform coating performance.
Traditional electrolytic copper foil surface additive, is generally divided into gelatin and adds class and cellulose interpolationClass, this two classes additive respectively has quality, but, to process in application and find at industrial Copper Foil, these are two years oldAll there is common deficiency in class additive, that is the passing along with the processing time, and pre-process and post-process goes outThe copper foil surface quality of coming there are differences. Find through research, main cause has following 2 points: one,In additive, the concentration of solute can, along with the use of additive, slowly change, and causes electrolysis placeThere is incongruous situation in the effect of reason, that is to say, just started the treatment fluid concentration that mixes upFor rationally, so surface treatment is best in quality, but just can be slowly not as front with the Copper Foil of post processingFace, has so just caused the front and back of copper foil surface Disposal quality to be differed, and affects the overall quality of Copper Foil(Copper Foil makes need to be graduate according to surperficial smoothness, and the Copper Foil of different smoothness is often appliedDifferent); Two, traditional treatment fluid, owing to there being the molten of colloidal sol, cellulose of excessive concentration and so onMatter exists, and easily causes treatment fluid unstable, particularly, along with the continuous electrolytic treatments of Copper Foil, mixesOther impurity, slowly just can cause the situations such as muddiness, floccule, precipitation to occur, affect surfaceReason effect.
In sum, corresponding problem be solved, certain situation need to be considered. First: Yi ZhongxiangTo stable electrolytic copper foil surface additive, reduce gelatin or cellulosic concentration, make treatment fluid warpMust play that stirring, vibration are moving, variations in temperature, the impact such as leave standstill, remain active with evenly, to the greatest extentAmount avoids occurring the situations such as muddiness, sediment. The second, improve relevant surfaces treatment facility and technique,Eliminate cell body and the relatively standing treatment fluid of traditional relative sealing, try every possible means to improve treatment fluidMobility, substitutes in time, tries every possible means to promote the activity for the treatment of fluid, avoids staticly settling thing and occurs.The 3rd, for one-sided smooth and the coarse Copper Foil of another side, carry out reasonably structure design.
Summary of the invention
For prior art deficiency, the object of the invention is, provide a kind of electrolytic copper foil surface to process and addAgent, it is the additive that a kind of cellulose adds class, reduces the concentration of cellulose solute, increases phase simultaneouslyClose auxiliary solute or solution, make it in thering is good electrolytic copper foil surface handling property, canIn process of surface treatment process, remain stable, avoid the situations such as muddiness, sediment to occur. This fiberThe additive that element adds class can be used alone as treatment fluid, also can mix and make with other conventional additiveBe used as treatment fluid.
The present invention also provides the preparation method of electrolytic copper foil surface treatment additive.
The present invention also provides a kind of method of copper foil surface processing, and it adopts above-mentioned electrolytic copper foil surface processingBest results when additive, certainly, adopts even if do not adopt above-mentioned electrolytic copper foil surface treatment additiveTraditional additive also can, just quality is slightly poor. The method of this kind of copper foil surface processing can obtain one sideRoughness smooth and Copper Foil, particularly matsurface that another side is coarse is very even, and unevenBe shaped as by the square cone that is uniformly distributed corner angle and form.
The present invention also provides the device of the method for implementing copper foil surface processing.
The technical scheme that the present invention adopted is for achieving the above object: a kind of electrolytic copper foil surface processing is addedAdd agent, it is characterized in that, in every liter of additive solution, comprise the component of following quality:
A preparation method who prepares electrolytic copper foil surface treatment additive described in claim 1, its feature existsIn, it comprises the following steps:
1) take each solute component by following mass fraction: cellulose 1-2; Glucose 30-40; Sulfuric acidTitanium 6-8; Sodium tungstate 8-10; Glycerine 20-25; Ethanol 500-600; Polypropylene glycol 5-10;
2) by step 1) each solute component of taking is dissolved in the water, and makes the concentration range of each solute be:Cellulose 1-2mg/L; Glucose 30-40mg/L; Titanium sulfate 6-8mg/L; Sodium tungstate 8-10mg/L; ThirdTriol 20-25mg/L; Ethanol 500-600mg/L; Polypropylene glycol 5-10mg/L;
3) mixed solution is placed in to the airtight container that prevents volatilization, under 1.5-2 atmospheric condition,Reciprocally heating and cooling 3-5 time from 0 DEG C to 100 DEG C, naturally cooling after, filter not tolerantly, make electrolytic copper foilSurface treating additive.
An electrolytic copper foil surface processing method that adopts described additive, is characterized in that, comprises as followsStep:
1) copper foil surface treating apparatus is set, comprises that treatment trough, electrode mechanism, charging deflector roll and discharging leadRoller, described charging deflector roll, discharging deflector roll are positioned at both sides, treatment trough top, the charging side of corresponding Copper Foil respectivelyTo with discharging direction, guiding Copper Foil into and out of cell body, described electrode mechanism comprises negative electrode cylinder and positive electricityPole plate part, described negative electrode cylinder is located at treatment trough upper position, and described positive electrode plate is located at treatment troughLower position, the upside of described positive electrode plate is corresponding with the downside of negative electrode cylinder, between the two shapeBecome electric field, the surface of described negative electrode cylinder is rough matsurface, and its roughness Ra is 300-500;Described treatment trough is strip cell body, and the two ends of cell body are respectively equipped with inlet and liquid outlet, the side of cell bodyPars intramuralis is evenly laid with heating wire;
2) by electrolytic copper foil surface treatment additive formation processing liquid, flow to by inlet, through treatment troughCell body, then flowed out by liquid outlet, keep treatment fluid to flow, and positive electrode plate is all flooded and is coveredLid, and will be under negative electrode cylinder part flood covering, make the upper part of negative electrode cylinder be exposed to treatment fluidOutside liquid level; The heating wire of opening groove body sidewall inside, makes it to carry out heating work, ensures in cell bodyThe temperature for the treatment of fluid is at 40-50 DEG C;
3) Copper Foil is imported to cell body by charging deflector roll, be close to negative electrode cylinder and enter treatment fluid, through positive electricityAfter electric field between pole plate part and negative electrode cylinder, derive cell body by discharging deflector roll, leave treatment fluid, completeThe surface treatment of Copper Foil in pairs.
Further, step 1) in, described treatment trough is connected with vibrator; Step 2) in, guarantee placeThe cell body of reason groove continues vibrations with vibration frequency, the 0.3mm Oscillation Amplitude of 200HZ/S.
Further, step 1) in, the rough matsurface of described negative electrode cylinder, for by multiple allThe pyramid shape of even distribution convexes to form, and this pyramid shape projection is square cone, high 300-500mm,Wide 300-500mm (bottom square width).
Further, step 1) in, the both sides of described negative electrode cylinder are provided with block edge structure, and negative electrode is rolledThe surface of cylinder is inner concavity, and the medial surface that described block edge structure is is intilted faceted pebble, described faceted pebbleUpper cover has sealing shroud; Step 3) in, the matsurface of the width of described Copper Foil and negative electrode cylinder is suitable,And the both sides of the edge of Copper Foil are corresponding with the sealing shroud on faceted pebble in block edge structure, form hermetically-sealed construction, makeTreatment fluid in cell body cannot enter in the space between matsurface and the Copper Foil contact-making surface of negative electrode cylinder.
Further, step 1) in, the cell body bottom of described treatment trough is provided with heavy by what produce in processing procedureShallow lake thing is adsorbed on the adsorbent equipment of bottom, and this adsorbent equipment is absorbent charcoal adsorber.
An electrolytic copper foil surface treating apparatus of implementing described method, is characterized in that, comprise treatment trough,Electrode mechanism, charging deflector roll and discharging deflector roll, described charging deflector roll, discharging deflector roll are positioned at treatment trough topBoth sides, feedstock direction and the discharging direction of corresponding Copper Foil respectively, guides Copper Foil into and out of cell body, described electricityUtmost point mechanism comprises negative electrode cylinder and positive electrode plate, and described negative electrode cylinder is located at treatment trough upper position,Described positive electrode plate is located at treatment trough lower position, the upside of described positive electrode plate and negative electrode cylinderDownside corresponding, form electric field between the two, the surface of described negative electrode cylinder is rough thickExasperate, described rough matsurface is convexed to form by multiple equally distributed pyramid shapes, described goldThe tower-like projection of word is square cone, high 300-500mm, wide 300-500mm; Described treatment trough is for longStrip cell body, the two ends of cell body are respectively equipped with inlet and liquid outlet, and the interior of cell body is evenly laidThere is heating wire.
Further, the both sides of described negative electrode cylinder are provided with block edge structure, and the surface of negative electrode cylinder isInner concavity, the medial surface that described block edge structure is is intilted faceted pebble, on described faceted pebble, cover has sealingCover.
Further, described treatment trough is connected with vibrator; The cell body bottom of described treatment trough is provided with and will locatesThe sediment producing in reason process is adsorbed on the adsorbent equipment of bottom, and this adsorbent equipment is charcoal absorption dressPut.
Further, described discharging deflector roll is positioned at Copper Foil below, and coated bed of cloth, corresponding Copper Foil downsideCarry out draining.
Further, described positive electrode plate is that the cross section corresponding with the bottom of negative electrode cylinder is curvedStrip member.
Advantage of the present invention is: this electrolytic copper foil surface treatment additive is the additive that cellulose adds class,But significantly reduce the concentration of cellulose solute, increased relevant auxiliary solute or solution, particularly simultaneouslyEthanol, glycerine and glucose, make additive have the same of good electrolytic copper foil surface handling propertyTime, can make to remain stable in additive process of surface treatment process, avoid muddy, sedimentOccur etc. situation. The additive that this cellulose adds class can be used alone as treatment fluid, also can and itsHe is used as treatment fluid at conventional additive mixing, because the solvability of ethanol, glycerine can be effectiveGround increases the stability for the treatment of fluid. In addition, in the preparation process of this electrolytic copper foil surface treatment additive,In advance under hyperbaric environment, through high low temperature circulation change, then cross its stabilizing solution conduct of leachingAdditive, even if ensure that additive solution itself also still can muddy, generation precipitation at evil environment slightlyThing. This electrolytic copper foil surface processing method is by custom-designed copper foil surface treating apparatus, coarse negative electricityUtmost point cylinder and positive electrode plate, realize the coarse copper foil surface processing of one-sided smooth one side, and in this mistakeCheng Zhong, mobile treatment fluid, avoids in processing procedure, and electrolyte solution concentration changes, and ensuresCopper foil surface Disposal quality consistently, ensures that treatment fluid temperature, 50 DEG C of left and right, increases one's share of expenses for a joint undertaking activity,Further avoid sediment to occur, and can also improve the surface treatment quality of Copper Foil shiny surface. Coarse negativeThe matsurface of electrode cylinder adopts equally distributed square cone, can make Copper Foil corresponding surface copy phaseThe matsurface of answering, and through evidence, must be the matsurface the convexing to form ability of pyramid shapeCan have so good effect, if adopt cone to substitute, effect is unsatisfactory, non-all not as good as employingEven matsurface. In addition, ensure that the sealing between Copper Foil and negative electrode cylinder matsurface is also extremely important,No person, can cause the roughness of Copper Foil matsurface both sides and the roughness at middle part inconsistent, affects wholeWeight.
Below in conjunction with brief description of the drawings and detailed description of the invention, the invention will be further described.
Brief description of the drawings
Fig. 1 is the structural representation of copper foil surface treating apparatus;
Fig. 2 is another visual angle structural representation of copper foil surface treating apparatus;
In figure: treatment trough 1; Charging deflector roll 2; Discharging deflector roll 3; Copper Foil 4; Negative electrode cylinder 5; JustElectrode plate 6; Rough matsurface 7; Heating wire 8; Block edge structure 9; Adsorbent equipment 10.
Detailed description of the invention
Embodiment 1
The electrolytic copper foil surface treatment additive that the present embodiment provides, in every liter of additive solution, under comprisingThe component of row quality:
The preparation method of electrolytic copper foil surface treatment additive described in preparation claim 1,1) by following matterAmount umber takes each solute component: cellulose 1-2; Glucose 30-40; Titanium sulfate 6-8; Sodium tungstate 8-10;Glycerine 20-25; Ethanol 500-600; Polypropylene glycol 5-10;
2) by step 1) each solute component of taking is dissolved in the water, and makes the concentration range of each solute be:Cellulose 1-2mg/L; Glucose 30-40mg/L; Titanium sulfate 6-8mg/L; Sodium tungstate 8-10mg/L; ThirdTriol 20-25mg/L; Ethanol 500-600mg/L; Polypropylene glycol 5-10mg/L;
3) mixed solution is placed in to the airtight container that prevents volatilization, under 1.5-2 atmospheric condition,Reciprocally heating and cooling 3-5 time from 0 DEG C to 100 DEG C, naturally cooling after, filter not tolerantly, make electrolytic copper foilSurface treating additive.
The electrolytic copper foil surface processing method that adopts described additive, comprises the steps:
1) copper foil surface treating apparatus is set, comprises treatment trough 1, electrode mechanism, charging deflector roll 2 and dischargingDeflector roll 3, described charging deflector roll 2, discharging deflector roll 3 are positioned at treatment trough 1 both sides, top, respectively corresponding Copper Foil 4Feedstock direction and discharging direction, guiding Copper Foil 4 into and out of cell body, described electrode mechanism comprises that negative electrode rollsCylinder 5 and positive electrode plate 6, described negative electrode cylinder 5 is located at treatment trough 1 upper position, described positive electrode platePart 6 is located at treatment trough 1 lower position, the downside phase of the upside of described positive electrode plate 6 and negative electrode cylinder 5Correspondence, forms electric field between the two, and the surface of described negative electrode cylinder 5 is rough matsurface 7,Its roughness Ra is 300-500; Described treatment trough 1 is strip cell body, the two ends of cell body be respectively equipped with intoLiquid mouth and liquid outlet, the interior of cell body is evenly laid with heating wire 8;
2) by electrolytic copper foil surface treatment additive formation processing liquid, flow to by inlet, through treatment trough1 cell body, is then flowed out by liquid outlet, keeps treatment fluid to flow, and positive electrode plate 6 is all floodedCover, and 5 times parts of negative electrode cylinder are flooded to covering, make the upper part of negative electrode cylinder 5 be exposed to processingOutside the liquid level of liquid; The heating wire 8 of opening groove body sidewall inside, makes it to carry out heating work, ensures cell bodyThe temperature of interior treatment fluid is at 40-50 DEG C;
3) Copper Foil 4 is imported to cell body by charging deflector roll 2, be close to negative electrode cylinder 5 and enter treatment fluid, processAfter electric field between positive electrode plate 6 and negative electrode cylinder 5, derive cell body by discharging deflector roll 3, leave processingLiquid, completes the surface treatment to Copper Foil 4.
Particularly, step 1) in, described treatment trough 1 is connected with vibrator; Step 2) in, guarantee placeThe cell body of reason groove continues vibrations with vibration frequency, the 0.3mm Oscillation Amplitude of 200HZ/S.
Particularly, step 1) in, the rough matsurface 7 of described negative electrode cylinder 5, for by multipleEqually distributed pyramid shape convexes to form, and this pyramid shape projection is square cone, height300-500mm, wide 300-500mm.
Particularly, step 1) in, the both sides of described negative electrode cylinder 5 are provided with block edge structure 9, make negative electrodeThe surface of cylinder 5 is inner concavity, and the medial surface that described block edge structure 9 is is intilted faceted pebble, described inOn faceted pebble, cover has sealing shroud; Step 3) in, the matsurface phase of the width of described Copper Foil 4 and negative electrode cylinder 5Adaptation, and the both sides of the edge of Copper Foil 4 are corresponding with the sealing shroud on the interior faceted pebble of block edge structure 9, form sealingStructure, cannot enter between the matsurface and Copper Foil 4 contact-making surfaces of negative electrode cylinder 5 treatment fluid in cell bodySpace in.
Particularly, step 1) in, the cell body bottom of described treatment trough is provided with heavy by what produce in processing procedureShallow lake thing is adsorbed on the adsorbent equipment of bottom, and this adsorbent equipment is absorbent charcoal adsorber.
The electrolytic copper foil surface treating apparatus of implementing described method, comprises treatment trough 1, electrode mechanism, chargingDeflector roll 2 and discharging deflector roll 3, described charging deflector roll 2, discharging deflector roll 3 are positioned at treatment trough 1 both sides, top, respectivelyFeedstock direction and the discharging direction of corresponding Copper Foil 4, guide Copper Foil 4 into and out of cell body, described electrode mechanism bagDraw together negative electrode cylinder 5 and positive electrode plate 6, described negative electrode cylinder 5 is located at treatment trough 1 upper position, instituteState positive electrode plate 6 and be located at treatment trough 1 lower position, the upside of described positive electrode plate 6 and negative electrode cylinder5 downside is corresponding, forms electric field between the two, and the surface of described negative electrode cylinder 5 is roughMatsurface 7, described rough matsurface 7 is convexed to form by multiple equally distributed pyramid shapes, instituteState pyramid shape projection for square cone, high 300-500mm, wide 300-500mm; Described treatment trough 1For strip cell body, the two ends of cell body are respectively equipped with inlet and liquid outlet, and the interior of cell body is evenBe laid with heating wire 8.
Particularly, the both sides of described negative electrode cylinder 5 are provided with block edge structure 9, make the surface of negative electrode cylinder 5Be inner concavity, the medial surface that described block edge structure 9 is is intilted faceted pebble, and on described faceted pebble, cover has closeBig envelope.
Particularly, described treatment trough 1 is connected with vibrator; The cell body bottom of described treatment trough is provided with and will locatesThe sediment producing in reason process is adsorbed on the adsorbent equipment 10 of bottom, and this adsorbent equipment is charcoal absorptionDevice.
Particularly, described discharging deflector roll 3 is positioned at Copper Foil 4 belows, and coated bed of cloth, corresponding copperPaper tinsel 4 downsides carry out draining.
Particularly, described positive electrode plate 6 is the cross section corresponding with the bottom of negative electrode cylinder 5Curved strip member.
Embodiment 2
The present embodiment is substantially the same manner as Example 1, and its difference is: electrolytic copper foil surface is processed and addedAgent, in every liter of additive solution, comprises the component of following quality:
The preparation method of electrolytic copper foil surface treatment additive described in preparation claim 1,1) by following matterAmount umber takes each solute component: cellulose 1; Glucose 30; Titanium sulfate 6; Sodium tungstate 8; Glycerine 20;Ethanol 500-; Polypropylene glycol 5;
2) by step 1) each solute component of taking is dissolved in the water, and makes the concentration range of each solute be:Cellulose 1mg/L; Glucose 30mg/L; Titanium sulfate 6mg/L; Sodium tungstate 8mg/L; Glycerine 20mg/L;Ethanol 500mg/L; Polypropylene glycol 5mg/L;
3) mixed solution is placed in to the airtight container that prevents volatilization, under 1.5 atmospheric conditions,The reciprocally heating and cooling 3 times from 0 DEG C to 100 DEG C, naturally cooling after, filter not tolerantly, make electrolytic copper foilSurface treating additive.
Embodiment 3
The present embodiment is substantially the same manner as Example 1, and its difference is: electrolytic copper foil surface is processed and addedAgent, in every liter of additive solution, comprises the component of following quality:
The preparation method of electrolytic copper foil surface treatment additive described in preparation claim 1,1) by following matterAmount umber takes each solute component: cellulose 2; Glucose 40; Titanium sulfate 8; Sodium tungstate 10; Glycerine25; Ethanol 600; Polypropylene glycol 10;
2) by step 1) each solute component of taking is dissolved in the water, and makes the concentration range of each solute be:Cellulose 2mg/L; Glucose 40mg/L; Titanium sulfate 8mg/L; Sodium tungstate 10mg/L; Glycerine 25mg/L;Ethanol 600mg/L; Polypropylene glycol 10mg/L;
3) mixed solution is placed in to the airtight container that prevents volatilization, under 2 atmospheric conditions, pastThe heating and cooling 5 times from 0 DEG C to 100 DEG C again, naturally cooling after, filter not tolerantly, make electrolytic copper foil tableFace treatment additive.
Embodiment 4
Electrolytic copper foil surface treatment additive, in every liter of additive solution, comprises the component of following quality:
The preparation method of electrolytic copper foil surface treatment additive described in preparation claim 1,1) by following matterAmount umber takes each solute component: cellulose 1.5; Glucose 35; Titanium sulfate 7; Sodium tungstate 9; Glycerine23; Ethanol 550; Polypropylene glycol 7;
2) by step 1) each solute component of taking is dissolved in the water, and makes the concentration range of each solute be:Cellulose 1.5mg/L; Glucose 35mg/L; Titanium sulfate 7mg/L; Sodium tungstate 9mg/L; Glycerine23mg/L; Ethanol 550mg/L; Polypropylene glycol 710mg/L;
3) mixed solution is placed in to the airtight container that prevents volatilization, under 1.8 atmospheric conditions,The reciprocally heating and cooling 4 times from 0 DEG C to 100 DEG C, naturally cooling after, filter not tolerantly, make electrolytic copper foil tableFace treatment additive.
The foregoing is only better possible embodiments of the present invention, not in order to limit to patent model of the present inventionEnclose, therefore the same as the previously described embodiments or similar technical scheme of all employings reaches other of the object of the inventionScheme, all within invention protection domain.
Claims (10)
1. an electrolytic copper foil surface treatment additive, is characterized in that, in every liter of additive solution, and bagDraw together the component of following quality:
2. prepare a preparation method for electrolytic copper foil surface treatment additive described in claim 1, its spyLevy and be, it comprises the following steps:
1) take each solute component by following mass fraction: cellulose 1-2; Glucose 30-40; Sulfuric acidTitanium 6-8; Sodium tungstate 8-10; Glycerine 20-25; Ethanol 500-600; Polypropylene glycol 5-10;
2) by step 1) each solute component of taking is dissolved in the water, and makes the concentration range of each solute be:Cellulose 1-2mg/L; Glucose 30-40mg/L; Titanium sulfate 6-8mg/L; Sodium tungstate 8-10mg/L;Glycerine 20-25mg/L; Ethanol 500-600mg/L; Polypropylene glycol 5-10mg/L;
3) mixed solution is placed in to the airtight container that prevents volatilization, under 1.5-2 atmospheric condition,Reciprocally heating and cooling 3-5 time from 0 DEG C to 100 DEG C, naturally cooling after, filter not tolerantly, make cathode copperPaper tinsel surface treating additive.
3. an electrolytic copper foil surface processing method that adopts additive described in claim 1, its feature existsIn, comprise the steps:
1) copper foil surface treating apparatus is set, comprises treatment trough, electrode mechanism, charging deflector roll and go outMaterial deflector roll, described charging deflector roll, discharging deflector roll are positioned at both sides, treatment trough top, corresponding Copper Foil respectivelyFeedstock direction and discharging direction, guiding Copper Foil into and out of cell body, described electrode mechanism comprises negative electricityUtmost point cylinder and positive electrode plate, described negative electrode cylinder is located at treatment trough upper position, described positive electricityPole plate part is located at treatment trough lower position, under the upside of described positive electrode plate and negative electrode cylinderSide is corresponding, forms electric field between the two, and the surface of described negative electrode cylinder is rough thickExasperate, its roughness Ra is 300-500; Described treatment trough is strip cell body, the two ends of cell bodyBe respectively equipped with inlet and liquid outlet, the interior of cell body is evenly laid with heating wire;
2) by electrolytic copper foil surface treatment additive formation processing liquid, flow to by inlet, through processingThe cell body of groove, is then flowed out by liquid outlet, keeps treatment fluid to flow, and by whole positive electrode plateFlood covering, and part under negative electrode cylinder is flooded to covering, the upper part of negative electrode cylinder is revealedOutside the liquid level for the treatment of fluid; The heating wire of opening groove body sidewall inside, makes it to carry out heating work,Ensure that the temperature of the treatment fluid in cell body is at 40-50 DEG C;
3) Copper Foil is imported to cell body by charging deflector roll, be close to negative electrode cylinder and enter treatment fluid, warpCross after the electric field between positive electrode plate and negative electrode cylinder, derive cell body by discharging deflector roll, leaveTreatment fluid, completes the surface treatment to Copper Foil.
4. electrolytic copper foil surface processing method according to claim 3, is characterized in that step 1)In, described treatment trough is connected with vibrator; Step 2) in, ensure treatment trough cell body withVibration frequency, the 0.3mm Oscillation Amplitude of 200HZ/S continue vibrations.
5. electrolytic copper foil surface processing method according to claim 3, is characterized in that step 1)In, the rough matsurface of described negative electrode cylinder, for by multiple equally distributed pyramidsShape convexes to form, and this pyramid shape projection is square cone, and high 300-500mm is wide300-500mm。
6. according to the electrolytic copper foil surface processing method described in claim 3 or 5, it is characterized in that,Step 1) in, the both sides of described negative electrode cylinder are provided with block edge structure, make the surface of negative electrode cylinderBe inner concavity, the medial surface that described block edge structure is is intilted faceted pebble, on described faceted pebble, overlapsThere is sealing shroud; Step 3) in, the matsurface of the width of described Copper Foil and negative electrode cylinder is suitable,And the both sides of the edge of Copper Foil are corresponding with the sealing shroud on faceted pebble in block edge structure, form sealed junctionStructure, cannot enter between the matsurface and Copper Foil contact-making surface of negative electrode cylinder the treatment fluid in cell bodySpace in.
7. electrolytic copper foil surface processing method according to claim 5, is characterized in that step 1)In, the cell body bottom of described treatment trough is provided with the suction that the sediment producing in processing procedure is adsorbed on to bottomAdsorption device, this adsorbent equipment is absorbent charcoal adsorber.
8. implement the claims an electrolytic copper foil surface treating apparatus for one of 3 to 7 described methods,It is characterized in that, comprise treatment trough, electrode mechanism, charging deflector roll and discharging deflector roll, described chargingDeflector roll, discharging deflector roll are positioned at both sides, treatment trough top, feedstock direction and the discharging of corresponding Copper Foil respectivelyDirection, guiding Copper Foil is into and out of cell body, and described electrode mechanism comprises negative electrode cylinder and positive electrode platePart, described negative electrode cylinder is located at treatment trough upper position, and described positive electrode plate is located at treatment troughLower position, the upside of described positive electrode plate is corresponding with the downside of negative electrode cylinder, both itBetween form electric field, the surface of described negative electrode cylinder is rough matsurface, described concavo-convexFlat matsurface is convexed to form by multiple equally distributed pyramid shapes, and described pyramid shape projection isSquare cone, high 300-500mm, wide 300-500mm; Described treatment trough is strip cell body,The two ends of cell body are respectively equipped with inlet and liquid outlet, and the interior of cell body is evenly laid with electric heatingSilk.
9. electrolytic copper foil surface treating apparatus according to claim 8, is characterized in that, instituteThe both sides of stating negative electrode cylinder are provided with block edge structure, make the surface of negative electrode cylinder be inner concavity, instituteThe medial surface of stating block edge structure and being is intilted faceted pebble, and on described faceted pebble, cover has sealing shroud.
10. electrolytic copper foil surface treating apparatus according to claim 8, is characterized in that, instituteStating treatment trough is connected with vibrator; The cell body bottom of described treatment trough is provided with and will in processing procedure, producesSediment be adsorbed on bottom adsorbent equipment, this adsorbent equipment is absorbent charcoal adsorber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610032586.9A CN105603501A (en) | 2016-01-17 | 2016-01-17 | Electrolytic copper foil surface treatment additive, preparation method, treatment method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610032586.9A CN105603501A (en) | 2016-01-17 | 2016-01-17 | Electrolytic copper foil surface treatment additive, preparation method, treatment method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105603501A true CN105603501A (en) | 2016-05-25 |
Family
ID=55983827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610032586.9A Pending CN105603501A (en) | 2016-01-17 | 2016-01-17 | Electrolytic copper foil surface treatment additive, preparation method, treatment method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105603501A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053818A (en) * | 1989-09-13 | 1991-08-14 | 古尔德有限公司 | The processing method and the electrolytic solution that are used for the controlled paillon foil of printed circuit board (PCB) and its character and produce this paillon foil |
| CN1563502A (en) * | 2004-03-25 | 2005-01-12 | 上海晶宝铜箔有限公司 | Electrolytic copper foil in use for high accuracy lithium cell smaller than 12 micros and preparation method |
| CN2767458Y (en) * | 2004-12-30 | 2006-03-29 | 北京远创铜箔设备有限公司 | Electrolytic copper foil production apparatus |
| CN201321499Y (en) * | 2008-12-30 | 2009-10-07 | 梅县金象铜箔有限公司 | Sealing device for cathode roll and anode groove in production of electrolytic copper foil |
| CN102002737A (en) * | 2010-11-24 | 2011-04-06 | 山东金宝电子股份有限公司 | Composite additive for producing electrolytic copper foil with high bending resistance and low outline |
| CN201801614U (en) * | 2010-09-28 | 2011-04-20 | 灵宝华鑫铜箔有限责任公司 | Novel cathode roller foil forming machine |
-
2016
- 2016-01-17 CN CN201610032586.9A patent/CN105603501A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053818A (en) * | 1989-09-13 | 1991-08-14 | 古尔德有限公司 | The processing method and the electrolytic solution that are used for the controlled paillon foil of printed circuit board (PCB) and its character and produce this paillon foil |
| CN1563502A (en) * | 2004-03-25 | 2005-01-12 | 上海晶宝铜箔有限公司 | Electrolytic copper foil in use for high accuracy lithium cell smaller than 12 micros and preparation method |
| CN2767458Y (en) * | 2004-12-30 | 2006-03-29 | 北京远创铜箔设备有限公司 | Electrolytic copper foil production apparatus |
| CN201321499Y (en) * | 2008-12-30 | 2009-10-07 | 梅县金象铜箔有限公司 | Sealing device for cathode roll and anode groove in production of electrolytic copper foil |
| CN201801614U (en) * | 2010-09-28 | 2011-04-20 | 灵宝华鑫铜箔有限责任公司 | Novel cathode roller foil forming machine |
| CN102002737A (en) * | 2010-11-24 | 2011-04-06 | 山东金宝电子股份有限公司 | Composite additive for producing electrolytic copper foil with high bending resistance and low outline |
Non-Patent Citations (1)
| Title |
|---|
| 何田: "添加剂对电解铜箔组织性能的影响及优化", 《中国优秀硕士学位论文全文数据库工程科技Ⅰ辑》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101935854B (en) | Preparation method of additive for electrolytic copper foil, product and application thereof | |
| CN103187181B (en) | A kind of Studies of Anode Foils for High Voltage Electrolytic Capacitor six grades of chemical synthesizing methods | |
| CN205508637U (en) | Graphite polar plate | |
| CN106350836A (en) | Additive for electrodeposited copper foil and production technology for preparing electrodeposited copper foil for double-shiny battery | |
| CN103834972A (en) | Additive for 4-micrometre carrier-free electrolytic copper foil, preparation method and application thereof | |
| CN107435163A (en) | Horizontal electroplating production line of circuit board | |
| CN206232838U (en) | Mesohigh anode foils electrolytic cell | |
| CN105603501A (en) | Electrolytic copper foil surface treatment additive, preparation method, treatment method and device | |
| CN107541748A (en) | A kind of low copper containing micro-etched waste liquid pretreating process and pretreatment system | |
| CN111020643B (en) | Double-sided smooth copper foil and preparation method and device thereof | |
| CN103233259B (en) | The oxidation processing technique of CTP plate | |
| CN109208040A (en) | A kind of compound additive being used to prepare low roughness electrolytic copper foil | |
| CN104694786B (en) | A kind of aluminium alloy | |
| CN107541760A (en) | A kind of 6 μm of dual light lithium ion battery copper foil modification process and its modifying agent preparation technology | |
| CN203212662U (en) | Auxiliary anode structure capable of preventing main salt from increasing during sulfate coppering | |
| CN206308438U (en) | A kind of equipment of high efficiency flash plate | |
| CN106884193A (en) | The preparation method of alloy plastic combined case | |
| CN107447248A (en) | A kind of pattern electroplating assembly line pair groove | |
| CN210945848U (en) | Electrochemical oil removal device for aluminum alloy tinning | |
| CN106220888A (en) | A kind of microporous polymer electrolyte preparation method of compound ion liquid | |
| CN105274615A (en) | Electrode foil etching device | |
| CN110363723A (en) | Improve the image processing method and device of image boundary effect | |
| CN207294928U (en) | Horizontal electroplating production line of circuit board | |
| CN106868565A (en) | The oxidation treatment method of 7 line aluminium alloys | |
| CN212451734U (en) | Electrolyte stirring device and electrolytic cell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160525 |
|
| WD01 | Invention patent application deemed withdrawn after publication |