CN105602259A - Curable organic polysiloxane composition and application thereof - Google Patents
Curable organic polysiloxane composition and application thereof Download PDFInfo
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- CN105602259A CN105602259A CN201610148000.5A CN201610148000A CN105602259A CN 105602259 A CN105602259 A CN 105602259A CN 201610148000 A CN201610148000 A CN 201610148000A CN 105602259 A CN105602259 A CN 105602259A
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- magnesium
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- organic polysiloxane
- organopolysiloxane composition
- polysiloxane composition
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 23
- 239000000203 mixture Substances 0.000 title claims abstract description 22
- -1 polysiloxane Polymers 0.000 title abstract description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 7
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims abstract description 6
- 239000000347 magnesium hydroxide Substances 0.000 claims abstract description 6
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims abstract description 6
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims abstract description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 claims abstract description 3
- 229960001545 hydrotalcite Drugs 0.000 claims abstract description 3
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims abstract description 3
- 239000001095 magnesium carbonate Substances 0.000 claims abstract description 3
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims abstract description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 12
- 239000011777 magnesium Substances 0.000 claims description 12
- 229910052749 magnesium Inorganic materials 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 6
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000000391 magnesium silicate Substances 0.000 claims 1
- 229910052919 magnesium silicate Inorganic materials 0.000 claims 1
- 235000019792 magnesium silicate Nutrition 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052709 silver Inorganic materials 0.000 abstract description 9
- 239000004332 silver Substances 0.000 abstract description 9
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 abstract description 6
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 229910000037 hydrogen sulfide Inorganic materials 0.000 abstract description 5
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 230000035515 penetration Effects 0.000 abstract description 2
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 abstract 1
- ZADYMNAVLSWLEQ-UHFFFAOYSA-N magnesium;oxygen(2-);silicon(4+) Chemical compound [O-2].[O-2].[O-2].[Mg+2].[Si+4] ZADYMNAVLSWLEQ-UHFFFAOYSA-N 0.000 abstract 1
- 238000004073 vulcanization Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 230000004087 circulation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 101000709029 Toxoplasma gondii Rhomboid-like protease 5 Proteins 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 240000004859 Gamochaeta purpurea Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ACXIAEKDVUJRSK-UHFFFAOYSA-N methyl(silyloxy)silane Chemical compound C[SiH2]O[SiH3] ACXIAEKDVUJRSK-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a curable organic polysiloxane composition. The composition is one or more of magnesium oxide, magnesium hydroxide, magnesium carbonate, hydrotalcite, hydrotalcite-like compounds and britesorb. The organic polysiloxane composition added in a semiconductor of a light-emitting component can be used for effectively inhibiting penetration of hydrogen sulfide or sulfide under the condition that the original light-emitting efficiency is not influenced, so that the silver layer is prevented from being oxidized to achieve the effect of effectively protecting the silver layer, and the effect of resisting vulcanization is improved.
Description
Technical field
The present invention relates to a kind of curable organopolysiloxane composition and the semiconductor device at light-emitting component thereofApplication in part.
Background technology
Contain the organopolysiloxane compound that phenyl-alkyl-thiazolinyl and silicon bond are closed, comprise straight bond structure and Zhi JianStructure. The reaction of Tonghua hydrosilanes, taking organic platinum as catalyst, alkynes ene compound is working time adjusting agent,Suitably appropriate fluorescent material, as light efficiency adjusting agent, forms a kind of curable organopolysiloxane composition,The protection sealant that is applied in widely LED bis-utmost point illuminators is industrial, forms a kind of printing opacity, and refractive index exists1.40～1.57 resinite. The photoelectric coupling effect of light-emittingdiode, sheds by stamen sheet electricity with the form of light,By the effect of electrodeless fluorescent powder, form photoelectric subassembly miscellaneous, be used on demonstration and lighting industry.This photoelectric subassembly, is reflected away light by the silver-plated laminate of bottom, reaches certain photoelectricity usefulness.
But the organopolysiloxane structure of the above-mentioned type, no matter refractive index or hardness level have certainGas penetration rate. In large natural environment, or in electronics, electrical equipment, combination of devices thing, have certain alwaysThe hydrogen sulfide of content or sulfide, this kind of sulfide penetrated organopolysiloxane in be everlasting normal temperature or high temperatureCoating, is accumulated on the silver layer of bottom, has formed dark-coloured silver sulfide, makes the assembly of light-emittingdiode graduallyGradually light cannot be reflected away and cause light decay. This kind of phenomenon perplexing diode encapsulation dealer always, and it alsoSeeking better solution always.
Summary of the invention
The object of this invention is to provide a kind of curable organopolysiloxane composition, said composition can beDo not affect under the condition of original light extraction efficiency, can very effective obstruct hydrogen sulfide or the penetrating of sulfide,Avoid silver layer oxidized, play a kind of effectiveness of effective protection silver layer, improved anti-cure efficiency.
For achieving the above object, technical scheme of the present invention is:
A curable organopolysiloxane composition, is characterized in that: described composition also comprises magnesiumInorganic matter, the inorganic content of described magnesium is 0.1～50%wt%, particle size is 0.01～50 micron;
A curable organopolysiloxane composition, the inorganic matter of described magnesium be magnesia, magnesium hydroxide,One or more in magnesium carbonate, hydrotalcite, houghite and magnesium silicate salt;
The inorganic content of described magnesium is 0.1～20%wt%, is preferably 3～10wt%, and particle size is 0.01～20Micron, is preferably 0.1～20 micron;
Having the present invention also aims to provide a kind of answers described curable organopolysiloxane compositionBe used in the method in the semiconductor devices of luminescence component.
In addition, only otherwise damage object of the present invention, the present invention can contain suitable heat stabilizer, pigment,Then auxiliary agent, anti-heavy agent etc. are as optional component.
The technique effect that the present invention obtains is:
(1) compare with the organopolysiloxane composition that does not contain magnesium salts, add respectively 3%, 5%, 10%Magnesium hydroxide, be encapsulated on the assembly of light-emittingdiode, then put into the appearance of closing dress environment sulfur-bearing powder and waterIn device, deposit with the temperature of 85 DEG C. After 7 hours, not hydrogeneous magnesian organopolysiloxane composition groupPart, light emission rate, by 28 lumens, becomes 20 lumens, has decayed nearly 29%; And containing 3%, 5%, 10% hydrogen-oxygenThe organopolysiloxane composition assembly of changing magnesium, light emission rate, by 28 lumens, becomes respectively 27.3 lumens, 27.8Lumen, 28 lumens, decay only has 2.5%, 0.7% and undamped.
(2) the present invention by creatively adding the inorganic matter of magnesium, simultaneously in organopolysiloxane compositionIn conjunction with content and the particle size thereof of preferred magnesium inorganic matter, do not affecting under the condition of original light extraction efficiency,Can very effective obstruct hydrogen sulfide or the penetrating of sulfide, avoid silver layer oxidized, play one veryEffectively the effectiveness of protection silver layer, has improved anti-cure efficiency, adds after the inorganic salts of magnesium, and brightness decay existsBelow 2%. Simultaneously this type of preferred magnesium inorganic matter is in solidification process and have concurrently and prevent expecting of fluorescent material sedimentationLess than technique effect.
Detailed description of the invention
Enforcement project and condition:
1. hot and humid Reflow Soldering: place 24 hours in 85 DEG C and 85%RH case, take out after drying and enter265 DEG C of Reflow Soldering tunnels, 5 minutes two bouts.
2. high temperature ageing: 200 DEG C of heated-air circulation ovens are placed 72 hours.
3. cold cycling :-40 DEG C～100 DEG C single-channel type boards, 20 times circulations/day, totally 10 days.
4. sulfuration: in 20 liters of closed containers (30 centimeters of diameters, 30 centimeters of height), contain into 10 bottomG Cosan and mineral water 300CC face down lamp pearl justifying to be measured to be attached in container head. InsertIn 80 DEG C of circulation constant temperature baking ovens 8 hours. Then take out the corrosion on silver-colored pin on support is clashed clean, then withInspection machine testing brightness (Lv) and colour temperature before special lamp pearl.
5. nude film penetrance: spectrophotometer is at the penetrance % of 420nm (optical path 10mm).
6. hardness: measure in ASTMD2240D mode.
Embodiment 1:
By the polymethyl-benzene base silicon resin copolymer that contains silicon bond vinyl, and contain the poly-of silicon bond hydrogen baseMethyl phenyl silicone resin polymer, evenly mixes. Wherein silicon bond contents of ethylene 4.5wt%, silicon bond hydrogenBase content 0.13wt%, silicon bond phenyl content 49wt%. Coordinate upper 1,3-divinyl-1,1,3,3-tetra-The platinum complex of methyl disiloxane is as catalyst. (platinum accounts for general construction weight 3ppm) coordinates 1-acetylene againBasic ring hexanol is as working time adjusting agent. (accounting for general construction weight 150ppm) full and uniform mixing of above compositionAfter, viscosity is 3500cps at 25 DEG C. This thing is evenly divided into three parts, is respectively (A) (B) (C).
(A) be used as blank test;
(B) sneak into magnesium hydroxide (Sigma-AldrichcompanyU.S.A reagent level, the purity of wt3%95％)；
(C) sneak into the above-mentioned magnesium hydroxide of wt5%;
In (A), (B), (C), add respectively again YAG fluorescent material Y959, wt10%. Mixing also vacuum removesAfter bubble, with the positive displacement point gum machine MPP-1 of Japan musashi company, click and enter the three stamen chips that are of a size of 5050In the body support frame of (0.2W × 3) luminous the two poles of the earth (every 8 × 15 lamp beads). Then be introduced into 80 DEG C of hot air circulationIn baking oven, toast one hour, then enter in 150 DEG C of heated-air circulation ovens two hours, take out and put coldly, do follow-upReliability test.
Reliability result：
(every 8 × 15, the average result of totally 120)
Table 1
Separately with (A) (B) (C) do not add fluorescent material, directly make the transparent nude film of 20mm × 50mm × 1mm (thickness)
Table 2
Embodiment 2：
By the polymethyl-benzene base silicon resin copolymer that contains silicon bond vinyl, and the poly-methyl that contains silicon bond hydrogen basePhenyl polysiloxane polymer, all in mixing. Wherein silicon bond contents of ethylene 4.7wt%, silicon bond hydrogen base containAmount 0.14wt%, silicon bond phenyl content 49wt%. Coordinate upper 1,3-divinyl-1,1,3,3-tetramethylThe platinum complex of disiloxane is as catalyst. (platinum accounts for general construction weight 3ppm) coordinates 1-acetylene basic ring againHexanol is as working time adjusting agent. After (accounting for general construction weight 150ppm) full and uniform mixing of above composition,Viscosity is 3500cps at 25 DEG C. This thing is evenly divided into three parts, is respectively (A) (B) (C).
(A) be used as blank test
(B) sneak into magnesia (Sigma-AldrichcompanyU.S.A reagent level, the specific area of wt5%130 ㎡/g, particle diameter < 25 μ m (XRD)).
(C) (Sigma-AldrichcompanyU.S.A.10 μ m) to sneak into the talcum powder of wt5%.
In (A), (B), (C), add respectively again YAG fluorescent material Y959, wt10%.
Mix and froth in vacuum after, with the positive displacement point gum machine MPP-1 of Japan musashi company, click and enter and be of a size ofIn the three luminous the two poles of the earth of stamen chip (0.2W × 3) body support frames of 5050 (every 8 × 15 lamp beads). Then advancedEnter in 80 DEG C of heated-air circulation ovens and toast one hour, then enter in 150 DEG C of heated-air circulation ovens two hours, getGo out to put cold, do the test of follow-up reliability.
Reliability result：
(every 8 × 15, the average result of totally 120)
Table 3
Separately with (A) (B) (C) do not add fluorescent material, directly make the transparent nude film of 20mm × 50mm × 1mm (thickness)
Table 4
From above table, can find out, in organopolysiloxane, add after the inorganic salts of magnesium, putting down before sulfurationAll brightness is uninfluenced, can effectively intercept penetrating of hydrogen sulfide or sulfide simultaneously, avoids silver layer oxidized,Play a kind of effectiveness of very effective protection silver layer, improved anti-cure efficiency, and add the inorganic salts of magnesiumAfter, brightness decay is below 2%.
Claims (4)
1. a curable organopolysiloxane composition, is characterized in that: described composition also comprises magnesiumInorganic matter, the inorganic content of described magnesium is 0.1～50%wt%, particle size is 0.01～50 micron.
2. a kind of curable organopolysiloxane composition as claimed in claim 1, is characterized in that: instituteThe inorganic matter of stating magnesium is magnesia, magnesium hydroxide, magnesium carbonate, hydrotalcite, houghite and magnesium silicate saltIn one or more.
3. a kind of curable organopolysiloxane composition as claimed in claim 1 or 2, is characterized in that:The inorganic content of described magnesium is 0.1～20%wt%, and particle size is 0.01～20 micron.
4. in claim 1-3, the curable organopolysiloxane composition described in any one claim is being sent outApplication in the semiconductor devices of optical assembly.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610148000.5A CN105602259A (en) | 2016-03-15 | 2016-03-15 | Curable organic polysiloxane composition and application thereof |
| JP2017004246A JP2017165943A (en) | 2016-03-15 | 2017-01-13 | Curable organic polysiloxane composition and application thereof |
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| CN201610148000.5A CN105602259A (en) | 2016-03-15 | 2016-03-15 | Curable organic polysiloxane composition and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113686763A (en) * | 2021-07-20 | 2021-11-23 | 华南理工大学 | Evaluation method for vulcanization resistance |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102329501A (en) * | 2010-03-30 | 2012-01-25 | 信越化学工业株式会社 | Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit |
| CN103827216A (en) * | 2011-07-22 | 2014-05-28 | Lg化学株式会社 | Curable composition |
| CN104164197A (en) * | 2013-05-17 | 2014-11-26 | 达兴材料股份有限公司 | Packaging adhesive for light-emitting device and light-emitting device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2092457A1 (en) * | 1992-05-28 | 1993-11-29 | James E. Doin | Oil resistant heat cured elastomer compositions with mixed metal oxides |
| JP2000143808A (en) * | 1998-11-17 | 2000-05-26 | Fuji Kobunshi Kogyo Kk | Heat conductive, electrical insulating silicone gel composition |
| JP2006206816A (en) * | 2005-01-31 | 2006-08-10 | Ge Toshiba Silicones Co Ltd | Room temperature-curable polyorganosiloxane composition |
| DE102005025915A1 (en) * | 2005-06-06 | 2006-12-07 | Wacker Chemie Ag | Crosslinkable compositions based on organosilicon compounds |
| JP5030915B2 (en) * | 2008-09-30 | 2012-09-19 | 信越化学工業株式会社 | Silicone composition for coating and coating film coated with cured film thereof |
| EP2666824B8 (en) * | 2011-01-20 | 2019-09-25 | Dow Toray Co., Ltd. | Use of magnesium compound for improving water resistance of cured silicone rubber |
| JP2013174675A (en) * | 2012-02-24 | 2013-09-05 | Mitsubishi Plastics Inc | Light reflector |
| WO2014092196A1 (en) * | 2012-12-11 | 2014-06-19 | 東レ・ダウコーニング株式会社 | High-refractive index heat-conductive composition of exceptional transparence, heat-conductive grease comprising same, cured heat-conductive material, thermal-softening heat-conductive composition, and applications for same |
| JP5719887B2 (en) * | 2013-07-31 | 2015-05-20 | 住友理工株式会社 | Elastomer molded body and method for producing the same |
| JP2015199811A (en) * | 2014-04-07 | 2015-11-12 | 株式会社カネカ | Curable resin composition for light-emitting diode and package for light-emitting diode |
-
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- 2017-01-13 JP JP2017004246A patent/JP2017165943A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102329501A (en) * | 2010-03-30 | 2012-01-25 | 信越化学工业株式会社 | Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit |
| CN103827216A (en) * | 2011-07-22 | 2014-05-28 | Lg化学株式会社 | Curable composition |
| CN104164197A (en) * | 2013-05-17 | 2014-11-26 | 达兴材料股份有限公司 | Packaging adhesive for light-emitting device and light-emitting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113686763A (en) * | 2021-07-20 | 2021-11-23 | 华南理工大学 | Evaluation method for vulcanization resistance |
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| JP2017165943A (en) | 2017-09-21 |
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