CN105601855A - Foaming phenolic resin composition - Google Patents

Foaming phenolic resin composition Download PDF

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Publication number
CN105601855A
CN105601855A CN201410683803.1A CN201410683803A CN105601855A CN 105601855 A CN105601855 A CN 105601855A CN 201410683803 A CN201410683803 A CN 201410683803A CN 105601855 A CN105601855 A CN 105601855A
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CN
China
Prior art keywords
phenolic resin
resin composition
phenol
formaldehyde
composition according
Prior art date
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Pending
Application number
CN201410683803.1A
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Chinese (zh)
Inventor
袁金付
张宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TIANJIN YUHUI MACHINERY PROCESSING Co Ltd
Original Assignee
TIANJIN YUHUI MACHINERY PROCESSING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by TIANJIN YUHUI MACHINERY PROCESSING Co Ltd filed Critical TIANJIN YUHUI MACHINERY PROCESSING Co Ltd
Priority to CN201410683803.1A priority Critical patent/CN105601855A/en
Publication of CN105601855A publication Critical patent/CN105601855A/en
Pending legal-status Critical Current

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  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)

Abstract

The invention provides a foaming phenolic resin composition. The composition comprises the following components in parts by weight: 100 parts of modified phenolic resin, 1-15 parts of a composite fire retardant, 3-20 parts of a curing agent, and 1-10 parts of a foaming agent. The modified phenolic resin is nanometer SiO2 modified phenolic resin, and the composite fire retardant is prepared by compounding ammonium polyphosphate, pentaerythritol and melamine according to a mass ratio 2-5:0.5-2:1. The nanometer SiO2 modified phenolic resin is uniformly dispersed in the composition, the composite fire retardant has a good synergistic effect, and the flame retardation effect is excellent; and the composition can be applied to preparation of a phenolic resin insulation board.

Description

A kind of foamed phenolic resin composition
Technical field
The invention belongs to phenolic resins field, relate to a kind of foamed phenolic resin composition.
Background technology
Thermosetting phenolic resin can be prepared phenolic resins warming plate through foam process, as external wall heat insulating material for external, has that light weight, thermal conductivity factor are low, the feature of high insulating effect, is a kind of desirable environment-friendly and green insulation material. But in actual use, phenolic resins need to carry out flame-retardant modified. The most frequently used method for modifying flame is to add fire retardant to reach fire prevention object, current fire retardant generally all adds in Foaming of phenolic resin process, there is the poor problem of mixing uniformity, in addition, the flame retardant effect of single fire retardant is not good, add multiple fire retardant, performance cooperative flame retardant performance, can reach best flame retardant effect.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of foamed phenolic resin composition is provided, and in said composition, flame-retardant composition is uniformly dispersed in phenolic resins, and multiple fire retardant synergy is good, flame retardant effect is good, can be applicable to prepare phenolic resins warming plate.
For realizing above-mentioned object, the solution of the present invention is:
A kind of foamed phenolic resin composition, is characterized in that, in weight portion, it consists of:
100 parts of phenol-formaldehyde resin modifieds,
1~15 part of composite flame-retardant agent,
3~20 parts, curing agent,
1~10 part of blowing agent.
Preferably, described phenol-formaldehyde resin modified is nanometer SiO2Phenol-formaldehyde resin modified.
Preferably, the preparation process of described phenol-formaldehyde resin modified comprises: first take whole phenol, Silane coupling agent KH550 and nanometer SiO2, part formaldehyde and oxalic acid add in reactor, stir, heating, in the time that temperature reaches 60~70 DEG C, constant temperature, ultrasonic 30~60min, then adds remaining formaldehyde and oxalic acid, is then slowly warming up to 80~100 DEG C, isothermal reaction 1~2h, and ultrasonic reaction 10~30min, finally adding sodium hydroxide solution to be neutralized to pH value is 7, vacuumizes dehydration, discharging, makes nanometer SiO2Phenol-formaldehyde resin modified.
Preferably, the ratio of described phenol and the amount of substance of formaldehyde is 1:1.2~1.9, described nanometer SiO2The addition mass percent that accounts for phenolic resins be 1~4%.
Preferably, described composite flame-retardant agent is to be formed according to mass ratio 2~5:0.5~2:1 is composite by APP, pentaerythrite and melamine.
Preferably, described curing agent is m-phenylene diamine (MPD).
Preferably, described blowing agent pentane.
Beneficial effect of the present invention:
(1) the invention provides a kind of foamed phenolic resin composition, phenolic resins is nanometer SiO2Phenol-formaldehyde resin modified, prepares process situ at phenolic resins and adds nanometer SiO2, make nanometer SiO2Can be dispersed in phenolic resins, both effects that can be cross-linked with each other, can improve the heat resistance of phenolic resins, are improved by the fire resistance of the foamed phenolic resin composition of its preparation;
(2) the present invention adopts composite flame-retardant agent to reach fire-retardant object, by APP, pentaerythrite with melamine three is composite forms, has given full play to cooperative flame retardant effect, and the fire resistance of foamed phenolic resin composition is further improved;
(3) foamed phenolic resin composition of the present invention can be used for preparing phenolic resins warming plate.
Detailed description of the invention
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further illustrated. Should be appreciated that embodiment described herein, only for explaining the present invention, is not intended to limit the present invention.
Embodiment 1
A kind of foamed phenolic resin composition, composition and weight are:
Nanometer SiO2Phenol-formaldehyde resin modified 100Kg,
Composite flame-retardant agent 10Kg,
M-phenylene diamine (MPD) 13Kg,
Pentane 5Kg.
The preparation process of described phenol-formaldehyde resin modified comprises: first take whole phenol, Silane coupling agent KH550 and nanometer SiO2, part formaldehyde and oxalic acid add in reactor, stir, heating, in the time that temperature reaches 60 DEG C, constant temperature, ultrasonic 30min, then adds remaining formaldehyde and oxalic acid, is then slowly warming up to 90 DEG C, isothermal reaction 1h, and ultrasonic reaction 20min, finally adding sodium hydroxide solution to be neutralized to pH value is 7, vacuumizes dehydration, discharging, makes nanometer SiO2Phenol-formaldehyde resin modified. The ratio of described phenol and the amount of substance of formaldehyde is 1:1.6, described nanometer SiO2The addition mass percent that accounts for phenolic resins be 2%.
To be that APP, pentaerythrite and melamine are composite form described composite flame-retardant agent, and three's mass ratio is 3.5:1.2:1.
Embodiment 2
A kind of foamed phenolic resin composition, composition and weight are:
Nanometer SiO2Phenol-formaldehyde resin modified 100Kg,
Composite flame-retardant agent 8Kg,
M-phenylene diamine (MPD) 15Kg,
Pentane 5Kg.
The preparation process of described phenol-formaldehyde resin modified comprises: first take whole phenol, Silane coupling agent KH550 and nanometer SiO2, part formaldehyde and oxalic acid add in reactor, stir, heating, in the time that temperature reaches 60 DEG C, constant temperature, ultrasonic 40min, then adds remaining formaldehyde and oxalic acid, is then slowly warming up to 90 DEG C, isothermal reaction 1h, and ultrasonic reaction 30min, finally adding sodium hydroxide solution to be neutralized to pH value is 7, vacuumizes dehydration, discharging, makes nanometer SiO2Phenol-formaldehyde resin modified. The ratio of described phenol and the amount of substance of formaldehyde is 1:1.7, described nanometer SiO2The addition mass percent that accounts for phenolic resins be 3%.
To be that APP, pentaerythrite and melamine are composite form described composite flame-retardant agent, and three's mass ratio is 2.5:1:1.
Above-described embodiment is only one of preferred embodiment of the present invention, not limits the scope of the invention with this, therefore: all equivalences of doing according to structure of the present invention, shape, principle change, within all should being covered by protection scope of the present invention.

Claims (7)

1. a foamed phenolic resin composition, is characterized in that, in weight portion, it consists of:
100 parts of phenol-formaldehyde resin modifieds,
1~15 part of composite flame-retardant agent,
3~20 parts, curing agent,
1~10 part of blowing agent.
2. foamed phenolic resin composition according to claim 1, is characterized in that, described phenol-formaldehyde resin modified is nanometer SiO2Phenol-formaldehyde resin modified.
3. foamed phenolic resin composition according to claim 1, is characterized in that, the preparation process of described phenol-formaldehyde resin modified comprises: first take whole phenol, Silane coupling agent KH550 and nanometer SiO2, part formaldehyde and oxalic acid add in reactor, stir, heating, in the time that temperature reaches 60~70 DEG C, constant temperature, ultrasonic 30~60min, then adds remaining formaldehyde and oxalic acid, is then slowly warming up to 80~100 DEG C, isothermal reaction 1~2h, and ultrasonic reaction 10~30min, finally adding sodium hydroxide solution to be neutralized to pH value is 7, vacuumizes dehydration, discharging, makes nanometer SiO2Phenol-formaldehyde resin modified.
4. foamed phenolic resin composition according to claim 3, is characterized in that, the ratio of described phenol and the amount of substance of formaldehyde is 1:1.2~1.9, described nanometer SiO2The addition mass percent that accounts for phenolic resins be 1~4%.
5. foamed phenolic resin composition according to claim 1, is characterized in that, described composite flame-retardant agent is to be formed according to mass ratio 2~5:0.5~2:1 is composite by APP, pentaerythrite and melamine.
6. foamed phenolic resin composition according to claim 1, is characterized in that, described curing agent is m-phenylene diamine (MPD).
7. foamed phenolic resin composition according to claim 1, is characterized in that, described blowing agent pentane.
CN201410683803.1A 2014-11-25 2014-11-25 Foaming phenolic resin composition Pending CN105601855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410683803.1A CN105601855A (en) 2014-11-25 2014-11-25 Foaming phenolic resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410683803.1A CN105601855A (en) 2014-11-25 2014-11-25 Foaming phenolic resin composition

Publications (1)

Publication Number Publication Date
CN105601855A true CN105601855A (en) 2016-05-25

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107266853A (en) * 2017-07-18 2017-10-20 合肥广能新材料科技有限公司 Phenolic foam heat insulation plate and preparation method thereof
CN109651757A (en) * 2019-01-02 2019-04-19 广东明日环保净化有限公司 A kind of preparation method of high-performance modified phenolic resin cold-storage insulation board
CN115612245A (en) * 2022-10-14 2023-01-17 山东北理华海复合材料有限公司 Phenolic resin thermal insulation material and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107266853A (en) * 2017-07-18 2017-10-20 合肥广能新材料科技有限公司 Phenolic foam heat insulation plate and preparation method thereof
CN109651757A (en) * 2019-01-02 2019-04-19 广东明日环保净化有限公司 A kind of preparation method of high-performance modified phenolic resin cold-storage insulation board
CN115612245A (en) * 2022-10-14 2023-01-17 山东北理华海复合材料有限公司 Phenolic resin thermal insulation material and preparation method thereof

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Application publication date: 20160525