CN105598603A - Method for adding scaling powder into solder - Google Patents
Method for adding scaling powder into solder Download PDFInfo
- Publication number
- CN105598603A CN105598603A CN201610153475.3A CN201610153475A CN105598603A CN 105598603 A CN105598603 A CN 105598603A CN 201610153475 A CN201610153475 A CN 201610153475A CN 105598603 A CN105598603 A CN 105598603A
- Authority
- CN
- China
- Prior art keywords
- scolder
- scaling powder
- powder
- solder
- scaling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a method for adding scaling powder into solder. The method includes the following steps that the scaling powder and the solder are processed into powder, and powdery scaling powder and powdery solder are obtained; the powdery scaling powder and the powdery solder are mixed and stirred to be even in proportion; the powdery scaling powder and the powdery solder which are mixed and stirred to be even are pre-pressed into extruding ingots; the extruding ingots are finally placed into an extruding machine to be extruded into a solder product. The method is easy to apply and is a processing method in which the scaling powder and the solder are mixed to be even in a powder-mixing mode and then extruded into the solder, in practical use of the solder, splashing of the scaling powder can be avoided, and the method can be used for adding scaling powder into any solder alloy.
Description
Technical field
The present invention relates to scaling powder field, relate in particular to a kind of method of scolder wlding interpolation scaling powder.
Background technology
On market, the technology of scolder interpolation scaling powder has two large classes, and a kind of is to inject and help at the center of scolderSolder flux, the content of the method scaling powder can produce unsettled variation in process of production, and scaling powder is givenMaterial interrupts also cannot discovering, and causes occurring the situation of hollow interruption scaling powder, because scaling powder concentrates onThe center of solder stick, when welding processing is used solder products with varying degrees, the scaling powder at scolder center can produceRaw splashing, impacts user, and then the product quality of impact welding.
Be to be covered with a scaling powder on the surface of scolder, the method bothers and environment is had to pollution very much,And coating poor effect.
Also have in addition a class solder products with varying degrees to cause adopting conventional center because of its special physical characteristicThe mode of injecting is added scaling powder.
Summary of the invention
For the problems referred to above, the invention provides a kind of method of scolder wlding interpolation scaling powder.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of scolder wlding addsThe method that adds scaling powder, is characterized in that: the method for described interpolation scaling powder comprises the steps: elder generationThe material to be processed of scaling powder and scolder is processed into powder, obtains Powdered scaling powder and Powdered scolder;Again Powdered scaling powder and scolder are pressed than row mixing and stirring; Powdered by mixing and stirringScaling powder and scolder are pressed into extrusion ingot in advance; Finally extrusion ingot is put into extruder and be squeezed into solder products with varying degrees.Two steps next also can adopt that special equipment is disposable to be completed precompressed extrusion ingot and be processed into scolderProduct.
Further, under described scaling powder normal temperature, be pressed powder, described scolder is for there being metal scolderOr the powder of lead-free solder alloy and other scolder, described extrusion ingot is pole or square.
Further, described solder products with varying degrees is wire rod, bar or thin slice.
Further, described step is pressed into crowded by the Powdered scaling powder of mixing and stirring and scolder in advanceBriquetting adopts extruder, or adopts special equipment to complete the processing of extrusion ingot and solder products with varying degrees.
From the above-mentioned description to structure of the present invention, compared to the prior art, the present invention has as followsAdvantage:
The method that a kind of scolder wlding of the present invention adds scaling powder, the mode that adopts powder to mix will help welderingAgent and scolder are squeezed into the processing method of scolder again after evenly mixing, scolder can not in actual useProduce the phenomenon that scaling powder splashes, and the present invention can add and help for the product of any solderSolder flux, such as sn-bi alloy, preformed soldering etc.
Brief description of the drawings
The accompanying drawing that forms the application's a part is used to provide a further understanding of the present invention, the present inventionSchematic description and description be used for explaining the present invention, do not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is that a kind of scolder wlding of the present invention adds the schematic flow sheet of the method for scaling powder;
Fig. 2 be a kind of scolder wlding of the present invention method of adding scaling powder prepare schematic diagram.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawingAnd embodiment, the present invention is further elaborated. Should be appreciated that described herein concreteEmbodiment only, in order to explain the present invention, is not intended to limit the present invention.
Embodiment
Step S101, first scaling powder and scolder are processed into powder, obtain Powdered scaling powder and welderingMaterial;
Step S102, again by Powdered scaling powder and scolder by than row mixing and stirring;
Step S103, the Powdered scaling powder of mixing and stirring and scolder are pressed into extrusion ingot in advance;
Step S104, finally extrusion ingot is put into extruder and be squeezed into solder products with varying degrees.
Concrete implementation step, for first scaling powder being modulated into needed formula requirement, is put at normal temperaturesEnter roller and be processed into tiny powder, then sieve powder. Scolder wlding is processed into powder by powder manufacturing apparatusEnd, sieve powder. Two kinds of powder are proportionally weighed and then mixed respectively, put into cylinder and stirMixing machine the inside stirs. After being stirred, put into Vertical Oil press the inside and be pressed in advance ingot, according to needTo be pressed in advance bar or billet. Again ingot is put into extruder and be squeezed into scolder wire rod or sheet material. Also canTo adopt, special equipment is disposable to be completed precompressed extrusion ingot and is processed into scolder wire rod or sheet material.
The method that a kind of scolder wlding of the present invention adds scaling powder, invention application is simple, adopts powder mixedScaling powder and scolder are evenly mixed the processing method that is squeezed into again scolder afterwards by the mode of closing, and scolder existsIn actual use, can not produce the phenomenon that scaling powder splashes, and the present invention can add for any alloyAdd scaling powder, such as sn-bi alloy etc.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, allAny amendment of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., all should compriseWithin protection scope of the present invention.
Claims (4)
1. scolder wlding adds a method for scaling powder, it is characterized in that: the method for described interpolation scaling powderComprise the steps:
First the material to be processed of scaling powder and scolder is processed into powder, obtains Powdered scaling powder and powderShape scolder;
Again Powdered scaling powder and scolder are pressed than row mixing and stirring;
The Powdered scaling powder of mixing and stirring and scolder are pressed into extrusion ingot in advance;
Finally extrusion ingot is put into extruder and be squeezed into solder products with varying degrees.
2. a kind of method that scolder wlding adds scaling powder according to claim 1, is characterized in that: instituteStating under scaling powder normal temperature is pressed powder, and described scolder is for having metal scolder or lead-free solder alloyAnd the powder of other scolder.
3. a kind of method that scolder wlding adds scaling powder according to claim 1, is characterized in that: instituteStating solder products with varying degrees is wire rod, bar or thin slice.
4. a kind of method that scolder wlding adds scaling powder according to claim 1, is characterized in that: instituteState step the Powdered scaling powder of mixing and stirring and scolder are pressed into extrusion ingot employing extruder in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610153475.3A CN105598603A (en) | 2016-03-18 | 2016-03-18 | Method for adding scaling powder into solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610153475.3A CN105598603A (en) | 2016-03-18 | 2016-03-18 | Method for adding scaling powder into solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105598603A true CN105598603A (en) | 2016-05-25 |
Family
ID=55979221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610153475.3A Pending CN105598603A (en) | 2016-03-18 | 2016-03-18 | Method for adding scaling powder into solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105598603A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5485156A (en) * | 1977-12-20 | 1979-07-06 | Matsushita Electric Ind Co Ltd | Solder |
| CN101947702A (en) * | 2010-09-21 | 2011-01-19 | 北京工业大学 | Novel brazing flux-containing aluminum alloy soldering wire and preparation method thereof |
| CN102248320A (en) * | 2011-07-06 | 2011-11-23 | 东南大学 | Stannum-based composite babbit metal and method for preparing welding wire |
-
2016
- 2016-03-18 CN CN201610153475.3A patent/CN105598603A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5485156A (en) * | 1977-12-20 | 1979-07-06 | Matsushita Electric Ind Co Ltd | Solder |
| CN101947702A (en) * | 2010-09-21 | 2011-01-19 | 北京工业大学 | Novel brazing flux-containing aluminum alloy soldering wire and preparation method thereof |
| CN102248320A (en) * | 2011-07-06 | 2011-11-23 | 东南大学 | Stannum-based composite babbit metal and method for preparing welding wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160525 |
|
| RJ01 | Rejection of invention patent application after publication |