CN105598088A - COB (chip on board) package cleaning method - Google Patents
COB (chip on board) package cleaning method Download PDFInfo
- Publication number
- CN105598088A CN105598088A CN201610136179.2A CN201610136179A CN105598088A CN 105598088 A CN105598088 A CN 105598088A CN 201610136179 A CN201610136179 A CN 201610136179A CN 105598088 A CN105598088 A CN 105598088A
- Authority
- CN
- China
- Prior art keywords
- microscope base
- cleaning
- plasma
- rinse bath
- carried out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Detergent Compositions (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a COB (chip on board) package cleaning method, comprising the following steps: (1), feeding, inspecting and accepting a microscope base; (2), ultrasonically cleaning the microscope base; (3), cleaning with plasma; (4), dispensing glue to place a chip; (5), baking for solidifying at high temperature; (6), cleaning again with plasma; (7), cleaning and spin drying; (8), detecting. The plasma cleaning step is added based on the prior art; as the microscope base is cleaned with plasma, microscope base coarseness is improved, thereby improving the degree of binding of glue with the microscope base and greatly increasing the yield of products.
Description
Technical field
The present invention relates to a kind of COB encapsulation cleaning method.
Background technology
, more easily there is COB paster and microscope base disengaging in the COB encapsulation that at present COB encapsulation cleaning method makesSituation, has affected the yield that COB encapsulates greatly.
Summary of the invention
Object of the present invention, provides a kind of COB encapsulation cleaning method exactly in order to address the above problem,Effectively promote the yield of COB encapsulation.
The object of the present invention is achieved like this:
A kind of COB encapsulation cleaning method of the present invention, comprises the following steps:
(1) to microscope base receiving inspection neck material;
(2) microscope base is carried out to Ultrasonic Cleaning;
(3) microscope base is put into plasma cleaner and carried out plasma cleaning, wherein plasma cleanerFluid reservoir volume is pressed as 250ml, and number of channels is 1 tunnel, and humidity control range is room temperature to 180 DEG C, streamAmount meter adjustable range is suspended body flowmeter 0.1-1.0L/min;
(4) microscope base after cleaning is carried out to a glue, and COB paster is fitted on microscope base;
(5) microscope base after a glue off-chip is sent into baking box baking, carried out hot setting;
(6) microscope base after having toasted is again put into plasma cleaner and is carried out plasma cleaning;
(7) plasma cleaning is put into two fluid ion driers after complete and is cleaned drying;
(8) detection;
Make COB encapsulation by above-mentioned process;
Ultrasonic Cleaning in step (2) comprises the following steps:
A rinse bath is added to ultraprecise cleaning agent, control 35 DEG C-55 DEG C of fluid temperature, No. three are cleanedGroove adds ultraprecise cleaning agent, controls 40 DEG C ± 5 DEG C of fluid temperature, and No. seven grooves are added to antistatic liquid, controlPharmacy liquid temp is normal temperature;
No. two, No. four to No. six normal temperature pure water rinsings for rinse bath;
No. eight rinse bath drains groove for dewatering, and No. nine rinse baths are hot-air seasoning groove, and temperature is 45 DEG C ± 5 DEG C;
Microscope base is put into a rinse bath and start to clean, clear successively according to an order to No. nine rinse bathsWash, No. one the scavenging period to No. seven rinse baths is every 6 minutes grooves, and No. eight rinse bath scavenging period is3 minutes, No. nine rinse bath scavenging period was 120 minutes;
Hyperacoustic power is 900W, frequency values be set as 28KHZ～40KHZ.
The inventive method has increased plasma cleaning step on the basis of existing technique, because organic matter is mainBe the compound being made up of C and O element, plasma adopts the clean organic matter of electrode discharge, mainly for oneSome active strong, compared with the material of inertia, this type material is not easy to activate with sour, alkali, can utilize electricityIon or living radical in slurry activate material, then material evaporation after ionization; To PlasticMaterial can improve the activity of product surface by plasma, so according to this characteristic, microscope base is carried out etc.After Ion Cleaning, can improve the combination degree of glue and microscope base, thereby significantly improve the stability of product and goodRate.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described.
COB encapsulation cleaning method of the present invention, comprises the following steps:
(1) to microscope base receiving inspection neck material;
(2) microscope base is carried out to Ultrasonic Cleaning;
(3) microscope base is put into plasma cleaner and carried out plasma cleaning, wherein plasma cleanerFluid reservoir volume is pressed as 250ml, and number of channels is 1 tunnel, and humidity control range is room temperature to 180 DEG C, streamAmount meter adjustable range is suspended body flowmeter 0.1-1.0L/min;
(4) microscope base after cleaning is carried out to a glue, and COB paster is fitted on microscope base;
(5) microscope base after a glue off-chip is sent into baking box baking, carried out hot setting;
(6) microscope base after having toasted is again put into plasma cleaner and is carried out plasma cleaning;
(7) plasma cleaning is put into two fluid ion driers after complete and is cleaned drying;
(8) detection;
Make COB encapsulation by above-mentioned process;
Ultrasonic Cleaning in step (2) comprises the following steps:
A rinse bath is added to ultraprecise cleaning agent, control 35 DEG C-55 DEG C of fluid temperature, No. three are cleanedGroove adds ultraprecise cleaning agent, controls 40 DEG C ± 5 DEG C of fluid temperature, and No. seven grooves are added to antistatic liquid, controlPharmacy liquid temp is normal temperature;
No. two, No. four to No. six normal temperature pure water rinsings for rinse bath;
No. eight rinse bath drains groove for dewatering, and No. nine rinse baths are hot-air seasoning groove, and temperature is 45 DEG C ± 5 DEG C;
Microscope base is put into a rinse bath and start to clean, clear successively according to an order to No. nine rinse bathsWash, No. one the scavenging period to No. seven rinse baths is every 6 minutes grooves, and No. eight rinse bath scavenging period is3 minutes, No. nine rinse bath scavenging period was 120 minutes;
Hyperacoustic power is 900W, frequency values be set as 28KHZ～40KHZ.
Because microscope base has passed through plasma cleaning processing, improve the roughness of surface of mirror base, and then improvedThe combination degree of glue and microscope base, improves the yield of product greatly.
Above embodiment is used for illustrative purposes only, but not limitation of the present invention, relevant technologies fieldTechnical staff, without departing from the spirit and scope of the present invention, can also make various conversion or changeType, therefore all technical schemes that are equal to also should belong to category of the present invention, should be limit by each claimFixed.
Claims (1)
1. a COB encapsulation cleaning method, is characterized in that, comprises the following steps:
(1) to microscope base receiving inspection neck material;
(2) microscope base is carried out to Ultrasonic Cleaning;
(3) microscope base is put into plasma cleaner and carried out plasma cleaning, wherein plasma cleanerFluid reservoir volume is pressed as 250ml, and number of channels is 1 tunnel, and humidity control range is room temperature to 180 DEG C, streamAmount meter adjustable range is suspended body flowmeter 0.1-1.0L/min;
(4) microscope base after cleaning is carried out to a glue, and COB paster is fitted on microscope base;
(5) microscope base after a glue off-chip is sent into baking box baking, carried out hot setting;
(6) microscope base after having toasted is again put into plasma cleaner and is carried out plasma cleaning;
(7) plasma cleaning is put into two fluid ion driers after complete and is cleaned drying;
(8) detection;
Make COB encapsulation by above-mentioned process;
Ultrasonic Cleaning in step (2) comprises the following steps:
A rinse bath is added to ultraprecise cleaning agent, control 35 DEG C-55 DEG C of fluid temperature, No. three are cleanedGroove adds ultraprecise cleaning agent, controls 40 DEG C ± 5 DEG C of fluid temperature, and No. seven grooves are added to antistatic liquid, controlPharmacy liquid temp is normal temperature;
No. two, No. four to No. six normal temperature pure water rinsings for rinse bath;
No. eight rinse bath drains groove for dewatering, and No. nine rinse baths are hot-air seasoning groove, and temperature is 45 DEG C ± 5 DEG C;
Microscope base is put into a rinse bath and start to clean, clear successively according to an order to No. nine rinse bathsWash, No. one the scavenging period to No. seven rinse baths is every 6 minutes grooves, and No. eight rinse bath scavenging period is3 minutes, No. nine rinse bath scavenging period was 120 minutes;
Hyperacoustic power is 900W, frequency values be set as 28KHZ～40KHZ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610136179.2A CN105598088A (en) | 2016-03-10 | 2016-03-10 | COB (chip on board) package cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610136179.2A CN105598088A (en) | 2016-03-10 | 2016-03-10 | COB (chip on board) package cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105598088A true CN105598088A (en) | 2016-05-25 |
Family
ID=55978739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610136179.2A Pending CN105598088A (en) | 2016-03-10 | 2016-03-10 | COB (chip on board) package cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105598088A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759389A (en) * | 2019-03-18 | 2019-05-17 | 重庆两江联创电子有限公司 | A kind of cleaning glass method |
| CN110286457A (en) * | 2019-05-31 | 2019-09-27 | 苏州五方光电材料有限公司 | A kind of eyeglass microscope base assembly technology |
-
2016
- 2016-03-10 CN CN201610136179.2A patent/CN105598088A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759389A (en) * | 2019-03-18 | 2019-05-17 | 重庆两江联创电子有限公司 | A kind of cleaning glass method |
| CN110286457A (en) * | 2019-05-31 | 2019-09-27 | 苏州五方光电材料有限公司 | A kind of eyeglass microscope base assembly technology |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160525 |