CN105591020B - A kind of high-frequency transducer with curve focusing array and preparation method thereof - Google Patents
A kind of high-frequency transducer with curve focusing array and preparation method thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 239000010931 gold Substances 0.000 claims abstract description 18
- 229910052737 gold Inorganic materials 0.000 claims abstract description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000002002 slurry Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- 238000010023 transfer printing Methods 0.000 claims description 12
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 229920000151 polyglycol Polymers 0.000 claims description 6
- 239000010695 polyglycol Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 206010013786 Dry skin Diseases 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 2
- 230000001476 alcoholic effect Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 18
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 238000007639 printing Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920001030 Polyethylene Glycol 4000 Polymers 0.000 description 1
- FYOZFGWYYZDOQH-UHFFFAOYSA-N [Mg].[Nb] Chemical compound [Mg].[Nb] FYOZFGWYYZDOQH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- TZBAVQKIEKDGFH-UHFFFAOYSA-N n-[2-(diethylamino)ethyl]-1-benzothiophene-2-carboxamide;hydrochloride Chemical compound [Cl-].C1=CC=C2SC(C(=O)NCC[NH+](CC)CC)=CC2=C1 TZBAVQKIEKDGFH-UHFFFAOYSA-N 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
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Abstract
The invention discloses a kind of high-frequency transducer with curve focusing array and preparation method thereof, the high-frequency transducer includes curved substrate, the upper surface of the curved substrate is the annular of 60 °~180 ° of radian, all or part of region overlay of the upper surface of the curved substrate has curve focusing array, the bottom of the curve focusing array is the hearth electrode of 4 μm~20 μm of height, 16~256 arc array elements be arrangeding in parallel are provided with the hearth electrode, the bottom of the arc array element is the lead magnesio-niobate lead titanates thick film of 7 μm~100 μm of height, top is height 100nm~300nm gold electrode, and the center of circle of the arc array element is located on the central shaft of the curved substrate upper surface.By the present invention, so as to be prepared for a kind of ultrasonic transducer that array is focused on lead magnesio-niobate lead titanates curved surface thick film, had a good application prospect in high-resolution high-frequency transducer.
Description
Technical field
The invention belongs to high-frequency transducer field, more particularly, to a kind of high frequency with curve focusing array
Ultrasonic transducer and preparation method thereof.
Background technology
Ultrasonic transducer is the device for realizing acoustical signal and electric signal conversion, and the lateral resolution of ultrasonic transducer is by following
Formula determines：
Wherein, R is lateral resolution, and c refers to the velocity of sound in medium, fcCentered on frequency, F#For focal length and aperture size
Ratio, λ are the wavelength of sound wave, and therefore, the ratio of focal length and aperture size is bigger, and lateral resolution is then higher.In aperture size
When certain, focal length is got over hour, and resolution ratio is then higher, and Fig. 1 is the sound field of a member of singly shaking on ultrasonic transducer.Focal length is Jiao
Point is to the distance at array element center, and due to plane focus farther out, focal length is bigger.Therefore, the piezoelectric thick of curved surface can improve high frequency
The lateral resolution of ultrasonic transducer.
The preparation of ultrasonic transducer mean camber aggregation array needs to prepare the piezoelectric thick of plane first in the prior art,
Then being pressed against by the cylinder of stainless steel in curved substrate turns into curved surface piezoelectric thick film, carries out machine cuts afterwards, forms battle array
Row.Such as non-patent literature Cylindrically shaped ultrasonic linear array fabricated using
PIMNT/epoxy 1-3piezoelectric composite(Sensors and Actuators A:Physical
Volume 192,1April 2013, Pages 69-75), because the thickness of array has reached 0.55mm, therefore frequency is relatively low,
Only 2MHz or so.In addition, generally use lead zirconate titanate (PZT) to be used as piezoelectric in present ultrasonic transducer, and the material
The electric field induced strain coefficient of material, and electromechanical coupling factor are all relatively low, it is difficult to meet the needs of most of ultrasonic transducers.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the invention provides a kind of height with curve focusing array
Frequency ultrasonic transducer and preparation method thereof and preparation method thereof, its object is to prepare curve focusing array by transfer printing, from
And strengthen the lateral resolution of ultrasonic transducer, improve its performance.
To achieve the above object, according to one aspect of the present invention, there is provided a kind of high-frequency transducer, including curved surface
Substrate and curve focusing array, the upper surface of the curved substrate are the annular of 60 °~180 ° of radian, the curve focusing battle array
Row are covered in all or part of region of the upper surface of the curved substrate, and the bottom of the curve focusing array is highly 4 μm
~20 μm of hearth electrode, 16~256 parallel arc array elements is provided with the hearth electrode, the arc array element is by it
Bottom level is the gold electrode group that 7 μm~100 μm of lead magnesio-niobate lead titanates thick film and its overhead height are 100nm~300nm
Into, and the arc core of the arc array element is located on the central shaft of the curved substrate upper surface.
Preferably, the material of the curved substrate is piezoelectric ceramics or metal oxide.
Preferably, the width of the arc array element is 24 μm~60 μm, and spacing is 33 μm~76 μm.
Preferably, the material of the hearth electrode is inert metal.
It is another aspect of this invention to provide that additionally provide a kind of preparation method of the high-frequency transducer, the preparation
Method comprises the following steps：
S1. the hearth electrode that height is 4 μm~20 μm, the curved surface lining are prepared in the upper surface of curved substrate using transfer printing
The upper surface at bottom is the annular of 60 °~180 ° of radian；
S2. the lead magnesio-niobate lead titanates thick film that height is 7 μm~100 μm is prepared on hearth electrode using transfer printing；
S3. gold electricity of the height for 100nm~300nm is prepared on the lead magnesio-niobate lead titanates thick film using sputtering method
Pole；
S4. using the laser parallel cutting gold electrode and the lead magnesio-niobate lead titanates thick film, so as to formed 16~
256 arc array elements be arrangeding in parallel so that the bottom of the arc array element is lead magnesio-niobate lead titanates thick film, and top is gold electricity
Pole, and the arc core of the arc array element is located on the central shaft of the curved substrate upper surface.
Preferably, the step S2 is specially：
S21. by the lead magnesio-niobate lead titanates powder that particle diameter is 200nm~500nm be dispersed in 10%~20% it is poly-
In ethylene glycol solution so that the mass ratio of the lead magnesio-niobate lead titanates powder and the polyglycol solution is 7:3~4:1,
Obtain piezoelectricity slurry；
S22. the piezoelectricity slurry is transferred on hearth electrode using transfer printing, it is 5 μm~12 μm that height is formed after drying
Piezoelectric coating, and repeat above step until the Piezoelectric coating be superimposed to required height；
S23.300 DEG C~350 DEG C heating, until the polymer in the Piezoelectric coating is fully thermally decomposed and volatilized；
S24.800 DEG C~1000 DEG C heating make it that the lead magnesio-niobate lead titanates in the Piezoelectric coating is powder sintered.
As it is further preferred that the specific method of the step S22 is, with the shape of the upper surface with the curved substrate
The mould pressure plasma-based material that looks match, transfer them to the upper surface of the curved substrate, 100 DEG C~120 DEG C heat dryings
The Piezoelectric coating that height is 5 μm~12 μm is formed afterwards, and repeats above step until the Piezoelectric coating is superimposed to required height.
As it is further preferred that the material of the mould is silica gel.
As it is further preferred that in the step S21, the lead magnesio-niobate lead titanates powder and the polyethylene glycol
The mass ratio of solution is 2:1~3:1.
As it is further preferred that the time heated in the step S23 is 30min~60min.
In general, by the contemplated above technical scheme of the present invention compared with prior art, due to passing through transfer printing
Curve focusing array is prepared in curved substrate, is had the advantages that：
1st, curve focusing array is directly prepared in the curved substrate of annular, then is cut into arc array element, with existing skill
Pressing in art is compared, by the height reduction of arc array element to less than 100 μm, so as to improve the transverse direction of ultrasonic transducer
Resolution ratio, improve its conversion effect in high frequency；
2nd, common machine cuts are replaced using laser cutting, improves the precision of cutting；
3rd, 10%~20% polyglycol solution is scattered in using lead magnesio-niobate lead titanates powder, so as to be prepared
Lead magnesio-niobate lead titanates thick film, because the material has high electric field induced strain coefficient, and electromechanical coupling factor, with its substitution tradition
Lead zirconate titanate thick film, improve the piezoelectric property, electric field induced strain coefficient and electromechanical coupling factor of ultrasonic transducer.
Brief description of the drawings
Fig. 1 is the lateral resolution schematic diagram of ultrasonic transducer；
Fig. 2 a are the front view of the curved surface PZT substrates of the embodiment of the present invention 1；
Fig. 2 b are the top view of the curved surface PZT substrates of the embodiment of the present invention 1；
Fig. 3 a are the front view of the silica gel mould of the embodiment of the present invention 1；
Fig. 3 b are the side view of the silica gel mould of the embodiment of the present invention 1；
Fig. 4 is that the curved section SEM of the lead magnesio-niobate lead titanates thick film of the embodiment of the present invention 1 is schemed (from the lower left corner to upper right
Angle is respectively：Lead magnesio-niobate lead titanates piezoelectric thick, Pt electrodes, PZT curved substrates)；
Fig. 5 is the overall structure diagram of the embodiment of the present invention 1；
Fig. 6 is the curve focusing array schematic diagram of the embodiment of the present invention 1；
In all of the figs, identical reference is used for representing identical element or structure, wherein：1- curved surfaces Dan Zhen
Member, 2- plane list array elements, the focal area of 3- curved surface list array elements, the focal area of 4- plane list array elements, 5- curved surface list array element wave beams, 6-
Plane list array element wave beam, 11- curved substrates, 12- hearth electrodes, 13- lead magnesio-niobate lead titanates thick films, 14- gold electrodes.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Conflict can is not formed each other to be mutually combined.
One aspect of the present invention, there is provided a kind of high-frequency transducer, including curved substrate and curve focusing battle array
Row, the upper surface of the curved substrate are the annular of 60 °~180 ° of radian, and the curve focusing array is covered in the curved surface lining
All or part of region of the upper surface at bottom, the bottom of the curve focusing array is the hearth electrode of 4 μm~20 μm of height, described
It is all identical that 16~256 width, arc length, radian and height are provided with hearth electrode, and arc core is all located at the curved surface
The arc array element be arrangeding in parallel on the central shaft of substrate top surface, the bottom of the arc array element is highly 7 μm~100 μm
Lead magnesio-niobate lead titanates thick film, top are height 100nm~300nm gold electrode.
Wherein, the material of the curved substrate is piezoelectric ceramics or metal oxide, and the material of the hearth electrode is lazy
Property metal；And the width and spacing of arc array element are related to the wavelength of sound wave, and high-frequency transducer's frequency range is 20MHz
~200MHz, and high-frequency transducer is commonly used in medically, detects tissue and organ, propagation of the sound in human body
Speed is 1540m/s, and arc array element is smaller than being equal to half-wavelength, therefore the width of arc array element is usually 20 μm~50
μm, spacing is usually 30 μm~70 μm；Its length (i.e. arc length corresponding to arc array element) need to meet that radian is wanted more than 60 °
Ask, for example, when the radius of the upper surface of curved substrate is 5mm, the length of arc array element is usually 5mm~15mm.
The preparation method of the ultrasonic transducer comprises the following steps：
S1. the hearth electrode that height is 4 μm~20 μm, the curved surface lining are prepared in the upper surface of curved substrate using transfer printing
The upper surface at bottom is the annular of 60 °~180 ° of radian；
S2. the lead magnesio-niobate lead titanates thick film that height is 7 μm~100 μm is prepared on hearth electrode using transfer printing；
S3. by controlling sputtering power, sputtering pressure and sputtering time, using sputtering method in the lead magnesio-niobate lead titanates
Gold electrode of the height for 100nm~300nm is prepared on thick film as top electrode；Such as utilize radio-frequency sputtering, power 100w, pressure
Strong is 0.5Pa, speed 0.3nm/s, sputtering time 6min, can obtain the gold electrode that thickness is 100nm；
S4. using the parallel cutting gold electrode of laser and the lead magnesio-niobate lead titanates thick film, its depth side cut
To perpendicular with the upper surface of curved substrate, while by controlling clipping time to avoid cutting to hearth electrode, so as to be formed
16~256 sizes are identical and the arc array element that be arranged in parallel so that the bottom of the arc array element is lead magnesio-niobate metatitanic acid
Lead thick film, top is gold electrode, and the arc core of the arc array element is located on the central shaft of the curved substrate upper surface.
Wherein, the transfer printing in step S1 is specifically, the mould to be matched with the pattern of the upper surface with the curved substrate
Tool takes inert metal slurry, and is transferred to the curved substrate surface, 150 DEG C~less than 200 DEG C heating so that molten in slurry
Agent is volatilized completely, then obtains the hearth electrode that height is 4 μm~20 μm in 1150 DEG C~1250 DEG C sintering again.
And the transfer printing in the step S2 is relative complex, it is concretely comprised the following steps：
S21. due to lead magnesio-niobate lead titanates powder proportions it is too high when, piezoelectricity slurry is excessively thick, is unfavorable for bat printing, and gathers
When polymer solution quality is too high, piezoelectricity slurry is diluter, and thick film cannot be molded；Therefore with 7:3~4:1 mass ratio (is preferably 2:1
~3:1) lead magnesio-niobate lead titanates powder is dispersed in 10%~20% polyglycol solution, piezoelectricity slurry is prepared
Material, the particle diameter of the lead magnesio-niobate lead titanates powder is 200nm~500nm, to ensure the lead magnesio-niobate lead titanates thick film formed
It is more uniform；When the concentration of polyglycol solution is too low, stickiness is too small, can not by powder-stuck together, during excessive concentration,
Leave a void bigger after polyethylene glycol volatilization, influence the mechanical performance of ultrasonic transducer；
S22. the mould pressure plasma-based material to be matched with the pattern of the upper surface with the curved substrate, and be transferred to described
Curved substrate surface, 100 DEG C~120 DEG C heat dryings, in order to avoid temperature rise below is too fast, evaporation causes piezoelectricity to vapor rapidly
Thick film cracks, and so as to form the Piezoelectric coating that height is 5 μm~12 μm, and repeats above step until the Piezoelectric coating
It is superimposed to required height；
S23.300 DEG C~350 DEG C heating 0.5h~1h, until the polyethylene glycol in the Piezoelectric coating is thermally decomposed and waved
Hair；
S24.800 DEG C~1000 DEG C heating make it that the lead magnesio-niobate lead titanates in the Piezoelectric coating is powder sintered, obtain
The lead magnesio-niobate lead titanates thick film.
The preparation of the piezoelectric of embodiment 1
Experiment material：
Clean PZT piezoelectric ceramics curved substrates：The height of the PZT curved substrates customized is 7.5mm, and width is
15mm, its inner surface are semi-circumference annular, and its a diameter of 5mm, annular distance of the edge far from edges of substrate is 2.5mm.It is just
View and top view difference are as shown in Figure 2 a and 2 b.PZT curved substrates are passed through into mechanical grinding to remove the portion of surface corrosion
Point, and with deionized water rinsing, 10min is then cleaned by ultrasonic in alcohol, is surpassed in acetone with after deionized water rinsing again
Sound cleans 10min, and then alcohol is cleaned by ultrasonic 10min again, is finally cleaned up, is dried for standby with deionized water again.
Polymer solution：It is 3 according to Macrogol 4000 (PEG-4000) and deionized water quality ratio：20 are mixed in
The polymer solution that magnetic stirrer 20min forms 15% is placed in beaker, after mixing.
S1. hearth electrode is prepared
Prepare silica gel mould, as shown in Figure 3 a, side view is as shown in Figure 3 b for its front view；It is visible on figure, its lower end diameter
Matched just with the semi-circumference annular end of curved substrate inner surface for 5mm semi-circular end, intermediate width 10mm, be highly
15mm rectangular section can be used for controlling the mould.
The platinum slurry (M-Pt100-1, solid content 82 ± 0.5%) of refrigeration is taken out, and in room temperature condition defrosting 20min,
Then, using the silica gel mould shown in Fig. 3 by the uniform bat printing of platinum slurry to PZT curved substrates, it is only necessary to which bat printing is once.
Sample is put into baking oven, 30min is dried at 200 DEG C, platinum slurry is dried.Sample is taken out afterwards, is put into stove and sinters, and is prepared
Obtain the hearth electrode that thickness is 18 μm.Sintering process is arranged to 1200 DEG C of heating 240min, is then incubated 10min, natural afterwards
It is cooled to room temperature.In pad-printing process, PZT curved substrates best level is placed, and silica gel mould should be vertical after dipping platinum slurry
Bat printing, pressing process strength is uniform, and the hearth electrode avoided the formation of is uneven, so as to influence the performance of ultrasonic transducer.
S21. the configuration of lead magnesio-niobate lead titanates slurry
By particle diameter be 200nm~500nm lead magnesio-niobate lead titanates powder and polymer solution with 1:3 mass ratio mixing
In beaker, the magnetic agitation that 30min is carried out on magnetic stirring apparatus is placed on, it is well mixed to obtain lead magnesio-niobate lead titanates slurry.
S22. lead magnesio-niobate lead titanates thick film is prepared in curved substrate
First, appropriate lead magnesio-niobate lead titanates slurry, vertical bat printing to PZT curved surfaces are dipped using clean silica gel mould
On substrate, uniformly pressed with about 1N~10N strength so that lead magnesio-niobate lead titanates thick film is formed uniformly.Then, will complete to move
The sample of print puts 100 DEG C of drying in an oven, falls the moisture slow evaporation in slurry, avoid in sintering process below because
Vapor rapid evaporation causes thick film to crack.The thickness of the lead magnesio-niobate lead titanates thick film piezoelectric thick film of bat printing is 14
μm or so, repeat the above steps 5 thick films for obtaining 70 μm.
S23 drying samples are sintered.Our temperature-rise period is the first stage to be raised to temperature from 0 DEG C by 60min
300 DEG C, second stage is that 300 DEG C of insulation 30min carry out dumping (allowing PEG4000 to be thermally decomposed) in temperature；
S24. temperature is raised to 900 DEG C from 300 DEG C by 120min, being then incubated 60min when temperature is 900 DEG C burns
Knot, last Temperature fall.The preparation of lead magnesio-niobate lead titanates thick film is completed in PZT curved substrates by this process, it is bent
Pt electrodes and lead magnesio-niobate lead titanates thick film are sequentially formed on the substrate of face from bottom to top, its section SEM is schemed such as Fig. 4 institutes
Show, be respectively from the lower left corner to the upper right corner：Lead magnesio-niobate lead titanates piezoelectric thick, Pt electrodes and PZT curved substrates.
S3. frequency usage radio frequency, sputtering power 100w, sputtering pressure 0.5Pa, sputter rate 0.3nm/s, sputtering time
30min, gold electrode of the thickness for 100nm is finally formed on lead magnesio-niobate lead titanates thick film as top electrode, now in curved surface
Hearth electrode, lead magnesio-niobate lead titanates thick film and top electrode are sequentially formed on substrate from bottom to top, as shown in Figure 5.
S4, with upper surface of the method for laser cutting along curved substrate cut gold electrode and niobium magnesium along camber line from left to right
Lead plumbate lead titanates thick film, by controlling clipping time to avoid cutting to hearth electrode, by controlling laser facula size to control
Width；Top electrode and lead magnesio-niobate lead titanates thick film are cut into the curve focusing being made up of 24 arc be arrangeding in parallel array elements
Array, and the arc core of the arc array element is located on the central shaft of the curved substrate upper surface；The length of arc array element and song
The semi-perimeter of face substrate top surface is equal, and width is 32 μm, and the spacing of arc array element is 50 μm, number of arrays 24, centre frequency
For 30MHz.
S5. wire can from hearth electrode and top electrode extraction wire successively；Wherein, hearth electrode is integral, directly with one
Root wire exports.And top electrode is on each array, respectively from two terminated wires.The array of odd number is ordered as from front to back
From left side lead, the array of even number is ordered as from the right lead, to avoid causing short circuit in one side lead, has connected the top of lead
The schematic top plan view of electrod-array is as shown in Figure 6.
Embodiment 1 is repeated with identical step, obtains embodiment 2- embodiments 5, its design parameter such as institute of table 1 adjusted
Show.
Table 1
Embodiment 1- embodiments 5 are tested, its centre frequency has brought up to 20MHz~200MHz, ultrasonic transducer
Piezoelectric property, electric field induced strain coefficient and electromechanical coupling factor, be improved compared with prior art.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., all should be included
Within protection scope of the present invention.
Claims (8)
1. a kind of preparation method of high-frequency transducer, it is characterised in that comprise the following steps：
S1. the hearth electrode that height is 4 μm~20 μm is prepared in the upper surface of curved substrate using transfer printing, the curved substrate
Upper surface is the annular of 60 °~180 ° of radian；
S2. the lead magnesio-niobate lead titanates thick film that height is 7 μm~100 μm is prepared on hearth electrode using transfer printing；
S3. the gold electrode that height is 100nm~300nm is prepared on the lead magnesio-niobate lead titanates thick film using sputtering method；
S4. using the parallel cutting gold electrode of laser and the lead magnesio-niobate lead titanates thick film, so as to form 16~256
The arc array element be arrangeding in parallel so that the bottom of the arc array element is lead magnesio-niobate lead titanates thick film, and top is gold electrode, and
The arc core of the arc array element is located on the central shaft of the curved substrate upper surface；
The high-frequency transducer includes curved substrate and curve focusing array, and the curve focusing array is covered in described
All or part of region of the upper surface of curved substrate, the bottom of the curve focusing array are hearth electrode, the hearth electrode it
On be provided with 16~256 parallel arc array elements, the arc array element is that lead magnesio-niobate lead titanates is thick by its bottom level
Film and its gold electrode at top composition, and the arc core of the arc array element is located on the central shaft of the curved substrate upper surface.
2. preparation method as claimed in claim 1, it is characterised in that the step S2 is specially：
S21., the lead magnesio-niobate lead titanates powder that particle diameter is 200nm~500nm is dispersed in 10%~20% poly- second two
In alcoholic solution so that the mass ratio of the lead magnesio-niobate lead titanates powder and the polyglycol solution is 7:3~4:1, obtain
Piezoelectricity slurry；
S22. the piezoelectricity slurry is transferred on hearth electrode using transfer printing, the pressure that height is 5 μm~12 μm is formed after drying
Electrocoat, and above step is repeated until the Piezoelectric coating is superimposed to required height；
S23.300 DEG C~350 DEG C heating, until the polymer in the Piezoelectric coating is fully thermally decomposed and volatilized；
S24.800 DEG C~1000 DEG C heating make it that the lead magnesio-niobate lead titanates in the Piezoelectric coating is powder sintered.
3. preparation method as claimed in claim 2, it is characterised in that the specific method of the step S22 is, with the song
The mould pressure plasma-based material that the pattern of the upper surface of face substrate matches, transfers them to the upper surface of the curved substrate, and 100
DEG C~120 DEG C of heat dryings after to form height be 5 μm~12 μm of Piezoelectric coating, and repeat above step until the piezoelectricity applies
Stacking adds to required height.
4. preparation method as claimed in claim 2, it is characterised in that in the step S21, the lead magnesio-niobate lead titanates
The mass ratio of powder and the polyglycol solution is 2:1~3:1.
5. preparation method as claimed in claim 2, it is characterised in that the time heated in the step S23 be 30min~
60min。
6. preparation method as claimed in claim 1, it is characterised in that the material of the curved substrate is piezoelectric ceramics or gold
Belong to oxide.
7. preparation method as claimed in claim 1, it is characterised in that the width of the arc array element is 20 μm~60 μm,
Away from for 30 μm~70 μm.
8. preparation method as claimed in claim 1, it is characterised in that the material of the hearth electrode is inert metal.
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| US7285897B2 (en) * | 2003-12-31 | 2007-10-23 | General Electric Company | Curved micromachined ultrasonic transducer arrays and related methods of manufacture |
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